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ITS3, the ALICE Vertex Detector for LHC Run 4 / Krizek, Filip (Rez, Nucl. Phys. Inst.) /ALICE Collaboration
During LHC Long Shutdown 3 (2026–2028), the ALICE Collaboration plans to upgrade the innermost layers of the current Inner Tracking System detector (ITS) with a novel vertex detector ITS3. The concept of this new vertex detector is based on ultra-thin ($< 50 \mu$m), wafer-scale (up to about $10 \times 26$ cm$^{2}$ large) Monolithic Active Pixel Sensors (MAPS) that are fabricated using the 65 nm CMOS process. [...]
2024 - 7 p. - Published in : PoS VERTEX2023 (2024) 033 Fulltext: PDF;
In : 32nd International Workshop on Vertex Detectors (VERTEX 2023), Sestri Levante, Italy, 16 - 20 Oct 2023, pp.033

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(91)

Novel silicon detectors in ALICE at the LHC: The ITS3 and ALICE 3 upgrades / Sanna, Isabella (CERN ; Munich, Tech. U.) /ALICE Collaboration
The ALICE experiment is preparing for the ITS3 upgrade, which is set to take place during the LHC Long Shutdown 3. The aim of this upgrade is to replace the three innermost tracking layers with truly cylindrical wafer-scale Monolithic Active Pixel Sensors (MAPS). [...]
2024 - 4 p. - Published in : EPJ Web Conf. 296 (2024) 08002 Fulltext: PDF;
In : 30th Conference on Ultra-Relativistic Nucleus-Nucleus Collisions (Quark Matter 2023), Houston, Texas, United States of America, 3 - 9 Sep 2023, pp.08002

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(90)

The ALICE Pixel Sensor Upgrade / Lautner, Lukas (CERN ; Munich, Tech. U.) /ALICE Collaboration
The inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. [...]
2023 - 6 p. - Published in : PoS Pixel2022 (2023) 026 Fulltext: PDF;
In : 10th International Workshop on Semiconductor Pixel Detectors for Tracking and Imaging (PIXEL 2022), Santa Fe, USA, 11 - 16 Dec 2022, pp.026

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(89)

ALICE ITS3: A truly cylindrical vertex detector based on bent, wafer-scale stitched CMOS sensors / Liu, Jian (Liverpool U.) /ALICE Collaboration
The new inner tracking system (ITS2) of the ALICE experiment at the LHC, upgraded during the LHC Long Shutdown 2 (2019–2021) with CMOS monolithic active pixel sensors (ALPIDE), is currently taking data and demonstrating excellent performance in the LHC Run 3. A replacement of the three innermost layers of the ITS2, called ITS3, is foreseen during the LHC Long Shutdown 3 (2026–2028) to further improve its tracking precision and efficiency, particularly at very low transverse momentum down to pT = 0.1 GeV/c. [...]
2024 - 5 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 1064 (2024) 169355 Fulltext: PDF;
In : 13th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors, Vancouver, Canada, 3 - 8 Dec 2023, pp.169355

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(72)

The Novel ALICE Inner Tracking System (ITS3) Based on Truly Cylindrical, Wafer-Scale Monolithic Active Pixel Sensors / Šuljić, Miljenko (CERN) /ALICE Collaboration
ALICE is studying replacing its innermost tracking layers during the LHC Long Shutdown 3 with a novel detector that will be as close as 18 mm to the interaction point and will have a target thickness of below 0.05% X0 per layer. To achieve these figures, a wafer-scale Monolithic Active Pixel Sensor in 65 nm technology is being developed. [...]
2021 - 8 p. - Published in : JPS Conf. Proc. 34 (2021) 010011 Fulltext: PDF;
In : 29th International Workshop on Vertex Detectors, Virtual, Japan, 5 - 8 Oct 2020, pp.010011

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(72)

ALICE ITS3: the first truly cylindrical inner tracker / Kotliarov, Artem (Rez, Nucl. Phys. Inst. ; CTU, Prague) /ALICE Collaboration
During the next LHC Long Shutdown 3 in 2026--2028, the ALICE Collaboration plans to replace the three innermost layers of the current Inner Tracking System (ITS) with truly cylindrical layers, made of wafer-scale, thin ($< 50~\upmu$m), and bent Monolithic Active Pixel Sensors (MAPS) that will be produced with the 65 nm CMOS imaging process. To fabricate the wafer-scale sensors, a technology, called stitching, is utilized to ``stitch'' small reticles and build sensors up to 300 mm in length in a single wafer. [...]
2024 - 6 p. - Published in : PoS EPS-HEP2023 (2024) 538 Fulltext: PDF;
In : 2023 European Physical Society Conference on High Energy Physics (EPS-HEP2023), Hamburg, Germany, 20 - 25 Aug 2023, pp.538

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(71)

Upgrade of the ALICE Inner Tracking System for LHC Run 4 / Carnesecchi, Francesca (CERN) /ALICE Collaboration
The ALICE experiment is preparing the ITS3, an upgrade of its Inner Tracking System for LHC Run 4. The three innermost layers will be replaced by wafer-scale, truly cylindrical, ultra-thin detector layers, made of Monolithic Active Pixel Sensors. [...]
2024 - 9 p. - Published in : JPS Conf. Proc. 42 (2024) 011018 Fulltext: PDF;
In : The International Workshop on Vertex Detectors (VERTEX 2022), Tateyama, Japan, 24 - 28 Oct 2022, pp.011018

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(70)

ALICE - ITS3 — A bent, wafer-scale CMOS detector / Kluge, A (CERN) /ALICE Collaboration
ALICE is developing the ITS3 (inner tracker system) as upgrade of the inner layers of the presently installed ITS with the aim to improve the pointing resolution by factor of two and to lower the material budget to an unprecedented value of 0.05% $X_{0}$ per layer. Its three layers are based on Monolithic Active Pixel Sensors (MAPS) thinned down to 20–40 $\mu$m. [...]
2022 - 4 p.

In : Vienna Conference on Instrumentation, Online, Online, 21 - 25 Feb 2022, pp.167315

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(68)

Developments of stitched monolithic pixel sensors towards the ALICE ITS3 / Aglieri Rinella, G (CERN) /ALICE Collaboration
The ALICE collaboration is pursuing the development of a novel and considerably improved vertexing detector called ITS3, to replace the three innermost layers of the Inner Tracker System during the LHC Long Shutdown 3. The primary goals are to reduce the material budget to the unprecedented value of 0.05% X0 per layer, and to place the first layer at a radial distance of 18 mm from the interaction point. [...]
2023

In : 15th Pisa Meeting on Advanced Detectors, La Biodola - Isola D'elba, Italy, 22 - 28 May 2022, pp.168018

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Development of a Stitched Monolithic Pixel Sensor prototype (MOSS chip) towards the ITS3 upgrade of the ALICE Inner Tracking system / Vicente Leitao, P (CERN) ; Aglieri Rinella, G (CERN) ; Bugiel, S (Strasbourg, IPHC) ; Cecconi, L (CERN) ; de Melo, J L A (CERN) ; De Robertis, G (INFN, Bari ; Bari U.) ; Deng, W (CERN ; Hua-Zhong Normal U.) ; Dorda Martin, A (CERN ; KIT, Karlsruhe) ; Dorosz, P (CERN) ; Fang, X (Strasbourg, IPHC) et al.
The MOnolithic Stitched Sensor (MOSS) is a development prototype chip towards the ITS3 vertexing detector for the ALICE experiment at the LHC. Designed using a 65 nm CMOS Imaging technology, it aims at profiting from the stitching technique to construct a single-die monolithic pixel detector of 1.4 cm × 26 cm. [...]
2023 - 8 p. - Published in : JINST 18 (2023) C01044
In : Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C01044

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