| Article | |
| Title | ALICE ITS3: the first truly cylindrical inner tracker |
| Author(s) | Kotliarov, Artem (Rez, Nucl. Phys. Inst. ; CTU, Prague) |
| Collaboration | ALICE Collaboration |
| Publication | 2024 |
| Number of pages | 6 |
| In: | PoS EPS-HEP2023 (2024) 538 |
| In: | 2023 European Physical Society Conference on High Energy Physics (EPS-HEP2023), Hamburg, Germany, 20 - 25 Aug 2023, pp.538 |
| DOI | 10.22323/1.449.0538 |
| Subject category | Detectors and Experimental Techniques |
| Accelerator/Facility, Experiment | CERN LHC ; ALICE |
| Abstract | During the next LHC Long Shutdown 3 in 2026--2028, the ALICE Collaboration plans to replace the three innermost layers of the current Inner Tracking System (ITS) with truly cylindrical layers, made of wafer-scale, thin ($< 50 \upmu$m), and bent Monolithic Active Pixel Sensors (MAPS) that will be produced with the 65 nm CMOS imaging process. To fabricate the wafer-scale sensors, a technology, called stitching, is utilized to ``stitch'' small reticles and build sensors up to 300 mm in length in a single wafer. The upgrade aims to decrease the material budget of the innermost layers from the present 0.35\% of $X_{0}$/layer to 0.05\% of $X_{0}$/layer, essentially reducing it to the silicon contribution only. The upgraded ITS will improve the pointing resolution in the transverse plane by a factor of 2 and increase the reconstruction efficiency for low-$p_{\text{T}}$ tracks. The construction of this detector encompasses many cutting-edge R&D; efforts, for instance, production and characterization of the MAPS in the 65 nm CMOS process, fabrication of the stitched wafer-scale MAPS, and development of an ultra-light detector mechanics and a new air cooling system. This contribution provides a brief overview of the ALICE ITS3 detector and the R&D; achievements, mentioned above. |
| Copyright/License | CC-BY-NC-ND-4.0 |
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Record created 2024-06-05, last modified 2024-06-06
