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Test results of the first 3D-IC prototype chip developed in the framework of HL-LHC/ATLAS hybrid pixel upgrade
/ Pangaud, P (CNRS) ; Arutinov, D (UBONN) ; Barbero, M (CNRS) ; Bompard, F (CNRS) ; Breugnon, P (CNRS) ; Clemens, J C (CNRS) ; Fougeron, D (CNRS) ; Garcia-Sciveres, M (LBNL) ; Godiot, S (CNRS) ; Hemperek, T (UBONN) et al.
To face new challenges brought by the upgrades of the Large Hadron Collider at
CERN and of the ATLAS pixels detector, for which high spatial resolution, very good signal to
noise ratio and high radiation hardness is needed, 3D integrated technologies are investigated. In the years to come, the Large Hadron Collider will be upgraded to Higher Luminosity (HL-LHC).
The ATLAS pixel detector needs to handle this new challenging environment. [...]
AIDA-PUB-2014-014.-
Geneva : CERN, 2014
- Published in : JINST 9 (2014) C02031
In : Topical Workshop on Electronics for Particle Physics, Perugia, Italy, 23 - 27 Sep 2013, pp.C02031
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2.
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Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC
/ Aruntinov, D (UBONN) ; Barbero, M (UBONN) ; Gonella, L (UBONN) ; Hemperek, T (UBONN) ; Hügging, F (UBONN) ; Krüger, H (UBONN) ; Wermes, N (UBONN) ; Breugnon, P (CPPM) ; Chantepie, B (CPPM) ; Clemens, J.C (CPPM) et al.
3D technologies are investigated for the upgrade of the ATLAS pixel detector at the HL-LHC. R&D; focuses on both, IC design in 3D, as well as on post-processing 3D technologies such as Through Silicon Via (TSV). [...]
AIDA-PUB-2013-018.-
Geneva : CERN, 2013
- Published in : Nucl. Instrum. Methods Phys. Res., A 731 (2013) 97-102
Fulltext: PDF;
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3.
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Status and perspectives of pixel sensors based on 3D vertical integration
/ Re, V (INFN Pavia and University of Bergamo)
This paper reviews the most recent developments of 3D integration in the field of silicon pixel sensors and readout integrated circuits. This technology may address the needs of future high energy physics and photon science experiments by increasing the electronic functional density in small pixel readout cells and by stacking various device layers based on different technologies, each optimized for a different function. [...]
AIDA-PUB-2014-011.-
Geneva : CERN, 2014
- Published in : Nucl. Instrum. Methods Phys. Res., A 765 (2014) 47-52
Fulltext: PDF;
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4.
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3D electronics for hybrid pixel detectors – TWEPP-09
/ Godiot, S (Marseille, CPPM) ; Barbero, (Bonn U.) ; Chantepie, B (Marseille, CPPM) ; Clémens, J C (Marseille, CPPM) ; Fei, R (Marseille, CPPM) ; Fleury, J (LBL, Berkeley) ; Fougeron, D (Marseille, CPPM) ; Garcia-Sciveres, M (LBL, Berkeley) ; Hemperek, T (Bonn U.) ; Karagounis, M (Bonn U.) et al.
Future hybrid pixel detectors are asking for smaller pixels in order to improve spatial resolution and to deal with an increasing counting rate. Facing these requirements is foreseen to be done by microelectronics technology shrinking. [...]
CERN, 2009
Published version from CERN: PDF;
In : Topical Workshop on Electronics for Particle Physics, Paris, France, 21 - 25 Sep 2009, pp.220 (CERN-2009-006)
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5.
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HV/HR-CMOS sensors for the ATLAS upgrade—concepts and test chip results
/ Liu, J (Marseille, CPPM ; Shandong U.) ; Backhaus, M (CERN ; Bonn U.) ; Barbero, M (Marseille, CPPM) ; Bates, R (Glasgow U.) ; Blue, A (Glasgow U.) ; Bompard, F (Marseille, CPPM) ; Breugnon, P (Marseille, CPPM) ; Buttar, C (Glasgow U.) ; Capeans, M (CERN) ; Clemens, J C (Marseille, CPPM) et al.
/HV CMOS
In order to extend its discovery potential, the Large Hadron Collider (LHC) will have a major upgrade (Phase II Upgrade) scheduled for 2022. The LHC after the upgrade, called High-Luminosity LHC (HL-LHC), will operate at a nominal leveled instantaneous luminosity of 5× 10(34) cm(−)(2) s(−)(1), more than twice the expected Phase I . [...]
2015
- Published in : JINST 10 (2015) C03033
Fulltext: PDF; IOP Open Access article: PDF;
In : 16th International Workshop on Radiation Imaging Detectors, Trieste, Italy, 22 - 26 Jun 2014, pp.C03033
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7.
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Pixel front-end development in 65 nm CMOS technology
/ Havránek, M (UBONN, FNSPE) ; Hemperek, T (UBONN) ; Kishishita, T (UBONN) ; Krüger, H (UBONN) ; Wermes, N (UBONN)
Luminosity upgrade of the LHC (HL-LHC) imposes severe constraints on the detector tracking systems in terms of radiation hardness and capability to cope with higher hit rates. One possible way of keeping track with increasing luminosity is the usage of more advanced technologies. [...]
AIDA-PUB-2014-016.-
Geneva : CERN, 2014
- Published in : JINST 9 (2014) C01003
Fulltext: PDF;
In : Topical Workshop on Electronics for Particle Physics, Perugia, Italy, 23 - 27 Sep 2013, pp.C01003
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8.
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Radiation-hard Active Pixel Sensors for HL-LHC Detector Upgrades based on HV/HR-CMOS Technology
/ Feigl, Simon (CERN) ; Peric, Ivan (Heidelberg U.) ; Backhaus, M (CERN) ; Barbero, M (Marseille, CPPM) ; Bompard, F (Marseille, CPPM) ; Breugnon, P (Marseille, CPPM) ; Clemens, J C (Marseille, CPPM) ; Liu, J (Marseille, CPPM) ; Muenstermann, D (Geneva U.) ; Pangaud, P (Marseille, CPPM) et al.
SISSA, 2014
- Published in : PoS TIPP2014 (2014) 280
Fulltext: PDF; External link: Published version from PoS
In : International Conference on Technology and Instrumentation in Particle Physics 2014, Amsterdam, Netherlands, 2 - 6 Jun 2014, pp.280
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