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AP64501
3.8V TO 40V INPUT, 5A LOW IQ SYNCHRONOUS BUCK WITH PROGRAMMABLE SOFT-START TIME

Description Pin Assignments

The AP64501 is a 5A, synchronous buck converter with a wide input

voltage range of 3.8V to 40V. The device fully integrates a 45mΩ high- TOP VIEW
side power MOSFET and a 20mΩ low-side power MOSFET to provide
high-efficiency step-down DC-DC conversion.
BST 1 8 SW
The AP64501 device is easily used by minimizing the external
component count due to its adoption of peak current mode control.
VIN 2 7 GND
The AP64501 design is optimized for Electromagnetic Interference EXPOSED PAD
(EMI) reduction. The device has a proprietary gate driver scheme to
9
resist switching node ringing without sacrificing MOSFET turn-on and
turn-off times, which reduces high-frequency radiated EMI noise EN 3 6 COMP
caused by MOSFET switching. AP64501 also features Frequency
Spread Spectrum (FSS) with a switching frequency jitter of ±6%,
which reduces EMI by not allowing emitted energy to stay in any one SS 4 5 FB
frequency for a significant period of time.

The device is available in an SO-8EP package. SO-8EP

Features Typical Application Circuit

 VIN 3.8V to 40V INPUT
VIN BST
 5A Continuous Output Current C3
L
100nF
OUTPUT

3.6μH
0.8V ± 1% Reference Voltage EN SW
VOUT
5V

 25µA Low Quiescent Current (Pulse Frequency Modulation) C4

OPEN
R1
115kΩ
AP64501
 570kHz Switching Frequency C1
10µF FB
C2
3 x 22µF
R2
 Programmable Soft-Start Time 22.1kΩ

 SS COMP
Up to 85% Efficiency at 5mA Light Load
Css R5

 Proprietary Gate Driver Design for Best EMI Reduction 10nF GND 15.8kΩ

C5
C6
33pF
(Optional)

2.7nF
Frequency Spread Spectrum (FSS) to Reduce EMI
 Low-Dropout (LDO) Mode
 Precision Enable Threshold to Adjust UVLO
 Protection Circuitry
VOUT = 5V, L = 3.6μH VOUT = 3.3V, L = 3.3μH
o Undervoltage Lockout (UVLO)
o Output Overvoltage Protection (OVP) 100
o Cycle-by-Cycle Peak Current Limit 90
80
o Thermal Shutdown
Efficiency (%)

70
 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
60
 Halogen and Antimony Free. “Green” Device (Note 3) 50
40
30
20
10
0
0.001 0.010 0.100 1.000 10.000
IOUT (A)

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

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AP64501

Pin Descriptions

Pin Name Pin Number Function

High-Side Gate Drive Boost Input. BST supplies the drive for the high-side N-Channel power MOSFET. A 100nF
BST 1
capacitor is recommended from BST to SW to power the high-side driver.
Power Input. VIN supplies the power to the IC as well as the step-down converter power MOSFETs. Drive VIN with a
VIN 2 3.8V to 40V power source. Bypass VIN to GND with a suitably large capacitor to eliminate noise due to the switching
of the IC. See Input Capacitor section for more details.
Enable Input. EN is a digital input that turns the regulator on or off. Drive EN high to turn on the regulator and low to
EN 3 turn it off. Connect to VIN or leave floating for automatic startup. The EN has a precision threshold of 1.18V for
programing the UVLO. See Enable section for more details.
Soft-start. Place a ceramic capacitor from this pin to ground to program soft-start time. An internal 4μA current
SS 4
source pulls the SS pin to VCC. See Programming Soft-Start Time section for more details.
Feedback sensing terminal for the output voltage. Connect this pin to the resistive divider of the output.
FB 5
See Setting the Output Voltage section for more details.
Compensation. Connect an external RC network to the COMP pin to adjust the loop response. See External Loop
COMP 6
Compensation Design section for more details.
GND 7 Power Ground.
Power Switching Output. SW is the switching node that supplies power to the output. Connect the output LC filter
SW 8
from SW to the output load.
EXPOSED Heat dissipation path of the die. The exposed thermal pad must be electrically connected to GND and must be
9
PAD connected to the ground plane of the PCB for proper operation and optimized thermal performance.

Absolute Maximum Ratings (Note 4) (At TA = +25°C, unless otherwise specified.)

Symbol Parameter Rating Unit

-0.3 to +42.0 (DC)
VIN Supply Pin Voltage V
-0.3 to +45.0 (400ms)
VBST Bootstrap Pin Voltage VSW - 0.3 to VSW + 6.0 V
VEN Enable/UVLO Pin Voltage -0.3 to +42.0 V
VSS Soft-Start Pin Voltage -0.3 to +6.0 V
VFB Feedback Pin Voltage -0.3 to +6.0 V
VCOMP Compensation Pin Voltage -0.3 to +6.0 V
-0.3 to VIN + 0.3 (DC)
VSW Switch Pin Voltage V
-2.5 to VIN + 2.0 (20ns)
TST Storage Temperature -65 to +150 °C
TJ Junction Temperature +160 °C
TL Lead Temperature +260 °C
ESD Susceptibility (Note 5)
HBM Human Body Model 2000 V
CDM Charged Device Model 500 V
Notes: 4. Stresses greater than the Absolute Maximum Ratings specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
5. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices.

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AP64501

Thermal Resistance (Note 6)

Symbol Parameter Rating Unit

θJA Junction to Ambient SO-8EP 45 °C/W
θJC Junction to Case SO-8EP 5 °C/W
Note: 6. Test condition for SO-8EP: Device mounted on FR-4 substrate, four-layer PC board, 2oz copper, with minimum recommended pad layout.

Recommended Operating Conditions (Note 7) (At TA = +25°C, unless otherwise specified.)

Symbol Parameter Min Max Unit

VIN Supply Voltage 3.8 40 V
VOUT Output Voltage 0.8 VIN V
TA Operating Ambient Temperature Range -40 +85 °C
TJ Operating Junction Temperature Range -40 +125 °C
Note: 7. The device function is not guaranteed outside of the recommended operating conditions.

Electrical Characteristics (At TA = +25°C, VIN = 12V, unless otherwise specified. Min/Max limits apply across the recommended
ambient temperature range, -40°C to +85°C, and input voltage range, 3.8V to 40V, unless otherwise specified.)

Symbol Parameter Test Conditions Min Typ Max Unit

ISHDN Shutdown Supply Current VEN = 0V — 1 3 μA
IQ Quiescent Supply Current VEN = Floating, VFB = 1.0V — 25 — μA
VIN Undervoltage Rising Threshold — — 3.5 3.7 V
UVLO
VIN Undervoltage Hysteresis — — 400 — mV
RDS(ON)1 High-Side Power MOSFET On-Resistance (Note 8) — — 45 — mΩ
RDS(ON)2 Low-Side Power MOSFET On-Resistance (Note 8) — — 20 — mΩ
IPEAK_LIMIT HS Peak Current Limit (Note 8) — 6.8 8 9.2 A
IVALLEY_LIMIT LS Valley Current Limit (Note 8) — — 9 — A
IPFMPK PFM Peak Current Limit — — 950 — mA
IZC Zero Cross Current Threshold — — 0 — mA
fSW Oscillator Frequency — 510 570 630 kHz
tON_MIN Minimum On-Time — — 100 — ns
VFB Feedback Voltage CCM 792 800 808 mV
VEN_H EN Logic High Threshold — — 1.18 1.25 V
VEN_L EN Logic Low Threshold — 1.03 1.09 — V
VEN = 1.5V — 5.5 — μA
IEN EN Input Current
VEN = 1V 1 1.5 2 μA
tSS Soft-Start Time CSS = 10nF — 4 — ms
TSD Thermal Shutdown (Note 8) — — 160 — °C
THys Thermal Shutdown Hysteresis (Note 8) — — 25 — °C
Note: 8. Compliance to the datasheet limits is assured by one or more methods: production test, characterization, and/or design.

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AP64501

Ordering Information

AP64501 XX - X

Package Packing

SP: SO-8EP 13: Tape & Reel

Tape and Reel

Orderable Device Package Code
Quantity Part Number Suffix
AP64501SP-13 SP 4000 -13

Marking Information

SO-8EP

(Top View)

8 7 6 5

Logo
YY : Year : 19, 20, 21~
Part Number AP64501 WW : Week : 01~52; 52
represents 52 and 53 week
YY WW X X E
X X : Internal Code
E : SO-8EP
1 2 3 4

Device Comparison Table

Output HS / LS Switching Ambient

Part VIN VOUT IQ Key
Current RDS(ON) Frequency Temperature Package
Name (V) (V) (μA) Features
(A) (mΩ) (kHz) (°C)
Prog. FSW,
AP64350 3.8 to 40 0.8 to VIN 3.5 75 / 45 100 to 2200 22 Ext. Sync, -40 to +85 SO-8EP
Ext. Comp
Prog. SS,
AP64351 3.8 to 40 0.8 to VIN 3.5 75 / 45 570 22 -40 to +85 SO-8EP
Ext. Comp
Prog. FSW,
AP64352 3.8 to 40 0.8 to VIN 3.5 75 / 45 100 to 2200 22 Ext. Sync, -40 to +85 SO-8EP
Ext. SS
Prog. FSW,
AP64500 3.8 to 40 0.8 to VIN 5.0 45 / 20 100 to 2200 25 Ext. Sync, -40 to +85 SO-8EP
Ext. Comp
Prog. SS,
AP64501 3.8 to 40 0.8 to VIN 5.0 45 / 20 570 25 -40 to +85 SO-8EP
Ext. Comp

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AP64501

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