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1.
Test Beam Data Analysis for a Timepix3 Readout Chip / Williams, Morag
The vertex and tracker detector R&D for a future linear collider (CLICdp) aims at developing new silicon sensor technologies. [...]
CERN-STUDENTS-Note-2016-175.
- 2016
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2.
Time Resolution Studies with Timepix3 Assemblies with Thin Silicon Pixel Sensors / Alipour Tehrani, Niloufar (CERN) ; Dannheim, Dominik (CERN) ; Fiergolski, Adrian (CERN) ; Hynds, Daniel (Nikhef National institute for subatomic physics (NL)) ; Klempt, Wolfgang (CERN) ; Llopart Cudie, Xavi (CERN) ; Munker, Magdalena (CERN) ; Nurnberg, Andreas Matthias (KIT - Karlsruhe Institute of Technology (DE)) ; Pitters, Florian Michael (Austrian Academy of Sciences (AT)) ; Spannagel, Simon (CERN) et al.
Timepix3 is a multi-purpose readout ASIC for hybrid pixel detectors. It can measure time and energy simultaneously by employing time-of-arrival (ToA) and time-over-threshold (ToT) techniques. [...]
arXiv:1901.07007; CLICdp-Pub-2019-001.- Geneva : CERN, 2019-05-24 - 12 p. - Published in : JINST 14 (2019) P05022 Fulltext: fulltext1716236 - PDF; CLICdp-Pub-2019-001 - PDF; 1901.07007 - PDF; Fulltext from Publisher: PDF;
3.
Evaluation of Fine-Pitch Hybrid Silicon Pixel Detector Prototypes for the CLIC Vertex Detector in Laboratory and Test-Beam Measurements / Williams, Morag Jean
The Compact Linear Collider (CLIC) is a concept for a high-energy, high-luminosity e+e−linear collider for precision measurements of Standard Model processes and to search for new phenomena, proposed to be built after the lifetime of the upgraded Large Hadron Collider [...]
CERN-THESIS-2020-338 - 186 p.

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4.
Development of novel single-die hybridisation processes for small-pitch pixel detectors / Svihra, Peter (CERN) ; Braach, Justus (Hamburg University (DE)) ; Buschmann, Eric (CERN) ; Dannheim, Dominik (CERN) ; Dort, Katharina (Justus-Liebig-Universitaet Giessen (DE)) ; Fritzsch, Thomas (Fraunhofer IZM) ; Kristiansen, H (Conpart) ; Rothermund, M (Fraunhofer IZM) ; Schmidt, Janis Viktor (KIT - Karlsruhe Institute of Technology (DE)) ; Vicente Barreto Pinto, Mateus (Universite de Geneve (CH)) et al.
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D; phase, especially for small-scale applications, such interconnect technologies need to be suitable for the assembly of single dies, typically available from Multi-Project-Wafer submissions. [...]
arXiv:2210.02132; CLICdp-Conf-2022-001.- Geneva : CERN, 2023-03-15 - 12 p.
- Published in : JINST Fulltext: CLICdp-Conf-2022-001 - PDF; 2210.02132 - PDF;
In : 23rd International Workshop for Radiation Imaging Detectors, Riva Del Garda, It, 26 - 30 Jun 2022, pp.C03008
5.
User Manual for the Corryvreckan Test Beam Data Reconstruction Framework, Version 1.0 / Spannagel, Simon (University of Glasgow (GB)) ; Williams, Morag Jean (University of Glasgow (GB)) ; Kroeger, Jens (Ruprecht Karls Universitaet Heidelberg (DE)) /CLICdp Collaboration
Test beam data reconstruction is a task that requires a large amount of flexibility due to the heterogeneous data acquisition environments found in these experiments. Often, detectors with different readout schemes such as triggered, frame-based or data driven approaches are combined in a single setup. [...]
arXiv:1912.00856; CLICdp-Note-2019-006.- Geneva : CERN, 2019 - 87 p. Fulltext: 1912.00856 - PDF; CLICdp-Note-2019-006 - PDF;
6.
Design and Characterization of the CLICTD Pixelated Monolithic Sensor Chip / Kremastiotis, Iraklis (KIT - Karlsruhe Institute of Technology (DE)) ; Ballabriga Sune, Rafael (CERN) ; Campbell, Michael (CERN) ; Dannheim, Dominik (CERN) ; Dort, Katharina (Justus-Liebig-Universitaet Giessen (DE)) ; Egidos Plaja, Nuria (University of Barcelona (ES)) ; Kroeger, Jens (Ruprecht Karls Universitaet Heidelberg (DE)) ; Linssen, Lucie (CERN) ; Llopart Cudie, Xavi (CERN) ; Munker, Magdalena (CERN) et al.
A novel monolithic pixelated sensor and readout chip, the CLIC Tracker Detector (CLICTD) chip, is presented. The CLICTD chip was designed targeting the requirements of the silicon tracker development for the experiment at the Compact Linear Collider (CLIC), and has been fabricated in a modified 180 nm CMOS imaging process with charge collection on a high-resistivity p-type epitaxial layer. [...]
CLICdp-Pub-2020-003.- Geneva : CERN, 2020 - 12. - Published in : IEEE Trans. Nucl. Sci. 67 (2020) 2263-2272 Fulltext: PDF;
7.
Timepix3 performance in power pulsing operation / Perez Codina, Estel (CERN) /CLICdp collaboration
The physics aims at the proposed CLIC linear $\mathrm{e^+e^-}$ collider impose challenging requirements on the performance of the detector system. In particular for the vertex detector the principal challenge is building an ultra-low mass ($\sim$0.2% X$_0$ per layer) detector that can provide a single point resolution of a few micrometers as well as 10ns time slicing capabilities. [...]
CLICdp-Conf-2019-002.- Geneva : CERN, 2019 - 6. - Published in : PoS VERTEX2018 (2019) 059 Fulltext from publisher: PDF; Preprint: PDF;
In : The 27th International Workshop on Vertex Detectors, Chennai, India, 21 - 26 Oct 2018, pp.059
8.

CERN-PHOTO-201702-048
© 2017-2024 CERN
The Timepix3 chip developed at CERN and silicon wafer
Knowledge Transfer technologies : photos 1 to 3: T [...]
23-02-2017
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9.
The LHCb Vertex Detector Upgrade. The prototypes study with the Timepix3 Telescope
Reference: Poster-2019-688
Created: 2019. -1 p
Creator(s): Rachwal, Bartlomiej

A dedicated irradiation programme with a particle beam followed by detailed studies are essential for proper evaluation of detector prototypes and predict their performance after accumulating the predicted particle fluence at the end of their lifetime. In order to perform precise measurements with the LHCb VELO (Vertex Locator) detector prototypes a dedicated high-resolution pixel beam telescope was developed based on 8 Timepix3 detector planes. This telescope has been taking data at CERN in the PS and SPS facilities since 2014. The Timepix3 can operate in a trigger less mode (data driven readout) with very precise timestamps. The data produced by the telescope can easily incorporate the signals from the Device Under Test (DUT) and in particular for Timepix3 devices the analysis is straight forward. The offline analysis compares the performance after irradiation with several fluences of protons or neutrons from 2 to 8 $\times 10^{15}$ 1-MeV $n_{eq}/cm^2$ ; different silicon substrates (n-on-p or n-on-n), distances from last pixel to the edge, guard rings designs and different vendors. Charge collection efficiencies, track resolution, eta correction are of particular interest as function of fluence. The presentation will describe the detailed LHCb VELO upgrade design choices as well as with some highlights of the Timepix3 Telescope operational performance.

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VIII International Course "Detectors and Electronics for High Energy Physics, Astrophysics, Space Applications and Medical Physics"
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10.
Time and Energy Calibration of Timepix3 Assemblies with Thin Silicon Sensors / Pitters, Florian Michael (Austrian Academy of Sciences (AT)) ; Alipour Tehrani, Niloufar (CERN) ; Dannheim, Dominik (CERN) ; Fiergolski, Adrian (CERN) ; Hynds, Daniel (Nikhef National institute for subatomic physics (NL)) ; Klempt, Wolfgang (CERN) ; Llopart Cudie, Xavi (CERN) ; Munker, Magdalena (CERN) ; Nurnberg, Andreas Matthias (KIT - Karlsruhe Institute of Technology (DE)) ; Spannagel, Simon (CERN) et al.
The Timepix3 ASIC is a multi-purpose readout chip for hybrid pixel detectors. It can measure time and energy simultaneously by employing time-of-arrival (ToA) and time-over-threshold (ToT) techniques. [...]
CLICdp-Note-2018-008.- Geneva : CERN, 2018 Fulltext: PDF;

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