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CERN Document Server 2,036 záznamov nájdených  1 - 10ďalšíkoniec  skoč na záznam: Hľadanie trvalo 0.25 sekúnd. 
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Statistical analysis of LHC main interconnection splices room temperature resistance (R-8) results / Heck, S (CERN) ; Scheuerlein, C (CERN)
During the 2008/2009 shutdown the so-called R-8/R-16 room temperature resistance test has been introduced for the quality control of the LHC main interconnection splices. [...]
CERN-ATS-Note-2012-076 TECH. - 2012. - 17 p.
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Resistance of LHC main bus bar splices at room temperature and at 77.4 K / Heck, S (CERN) ; Dufay-Chanat, L (CERN) ; Scheuerlein, Chr (CERN)
As part of the quality control the resistance of newly produced LHC main bus bar splices is now routinely measured at room temperature (RT) in order to conclude on the electrical continuity of the bus bar stabiliser across the splice under operating conditions. [...]
CERN-TE-Note-2009-008. - 2009. - 9 p.
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Nondestructive Testing and Quality Control of the LHC Main Interconnection Splices / Heck, S (CERN) ; Solfaroli, M (CERN) ; Andreassen, O (CERN) ; Thonet, P (CERN) ; Scheuerlein, C (CERN) ; Ballarino, A (CERN) ; Bertinelli, F (CERN) ; Bottura, L (CERN) ; Fessia, P (CERN) ; Tock, J (CERN)
The Large Hadron Collider (LHC) main interconnection splices consist of Rutherford-type cable splice and busbar stabilizer splices. Busbar stabilizer splices have been consolidated during the first long LHC shutdown by soldering additional Cu shunts. [...]
2015 - 8 p. - Published in : IEEE Trans. Appl. Supercond. 25 (2015) 4000108
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Production and Quality Assurance of Main Busbar Interconnection Splices during the LHC 2008-2009 Shutdown. / Bertinelli, F (CERN) ; Bottura, L (CERN) ; Dalin, J-M (CERN) ; Fessia, P (CERN) ; Flora, R H (Fermilab) ; Heck, S (CERN) ; Pfeffer, H (Fermilab) ; Prin, H (CERN) ; Scheuerlein, C (CERN) ; Thonet, P (CERN) et al.
The main busbar interconnection splices of the Large Hadron Collider are assembled by inductive soldering of the Rutherford type cables and the copper profiles of the stabilizer. Following the September 2008 incident, the assembly process and the quality assurance have been improved, with new measurement and diagnostics methods introduced. [...]
CERN-ATS-2011-069.- Geneva : CERN, 2011 - 6 p. - Published in : IEEE Trans. Appl. Supercond. 21 (2011) 1786-1790 Fulltext: PDF; IEEE Published version, local copy: PDF;
In : Applied Superconductivity Conference 2010, Washington, DC, USA, 1 - 6 Aug 2010
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Electrical Resistance of the Solder Connections for the Consolidation of the LHC Main Interconnection Splices / Lutum, R (CERN) ; Heck, S (CERN) ; Scheuerlein, C (CERN)
For the consolidation of the LHC 13 kA main interconnection splices, shunts will be soldered onto each of the 10170 splices. The solder alloy selected for this purpose is Sn60Pb40. [...]
CERN-ATS-2013-027.- Geneva : CERN, 2013 - Published in : IEEE Trans. Appl. Supercond. 23 (2013) 3800404 Fulltext: PDF;
In : Applied Superconductivity Conference 2012: The Next Century of Superconductivity, Portland, OR, USA, 7 - 12 Oct 2012
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Towards a Consolidation of LHC Superconducting Splices for 7 TeV Operation / Bertinelli, F (CERN) ; Catalan Lasheras, N (CERN) ; Fessia, P (CERN) ; Garion, C (CERN) ; Mathot, S (CERN) ; Perin, A (CERN) ; Scheuerlein, C (CERN) ; Sgobba, S (CERN) ; ten Kat, H (CERN) ; Tock, J P (CERN) et al.
Following the analysis of the September 2008 LHC incident, the assembly process and the quality assurance of the main 13 kA interconnection splices were improved, with new measurement and diagnostics methods introduced. During the 2008-2009 shutdown ~5% of these 10 000 splices were newly assembled with these improvements implemented, but essentially maintaining the original design. [...]
CERN-ATS-2010-144.- Geneva : CERN, 2010 - 4 p. Fulltext: PDF; External link: Published version from JACoW
In : 1st International Particle Accelerator Conference, Kyoto, Japan, 23 - 28 May 2010, pp.MOPEB042
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Resistance of Splices in the LHC Main Superconducting Magnet Circuits at 1.9 K / Charifoulline, Zinour (CERN) ; Bednarek, Mateusz Jakub (CERN) ; Denz, Reiner (CERN) ; Le Naour, Sandrine (CERN) ; Scheuerlein, Christian (CERN) ; Siemko, Andrzej (CERN) ; Steckert, Jens (CERN) ; Tock, Jean-Philippe (CERN) ; Verweij, Arjan (CERN) ; Zerlauth, Markus (CERN)
The electrical interconnections between the LHC main magnets are made of soldered joints (splices) of two superconducting Rutherford cables, stabilized by a copper busbar. In 2009, a number of splices was found not properly stabilized and could have suffered a thermal runaway in case of quench at high current. [...]
2018 - 5 p. - Published in : IEEE Trans. Appl. Supercond. 28 (2018) 4003405
In : 25th International Conference on Magnet Technology, Amsterdam, The Netherlands, 27 Aug - 1 Sep 2017, pp.4003405
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Electrical resistance of the solder connections for the consolidation of the LHC main interconnection splices / Lutum, Robin
For the consolidation of the LHC main interconnection splices it is planned to solder shunts onto each of the 10,170 splices [...]
CERN-THESIS-2011-443 - 44 p.

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The RRR of the Cu components of the LHC main bus bar splices / Heck, S (CERN) ; Scheuerlein, Chr (CERN) ; Fessia, P (CERN) ; Principe, R (CERN)
The different LHC main bus bar splice components (bus bar cable, splice U-piece and wedge and bus bar stabilizer) are subjected to different heat treatments (HTs) during bus bar assembly and splice soldering. [...]
CERN-TE-Note-2010-005. - 2010. - 14 p.
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Splice Resistance Measurements in the LHC Main Superconducting Magnet Circuits by the New Quench Protection System / Charifoulline, Z (CERN) ; Dahlerup-Petersen, K (CERN) ; Denz, R (CERN) ; Siemko, A (CERN) ; Steckert, J (CERN)
The interconnections between the LHC main magnets are made of soldered joints (splices) of two superconducting cables stabilized by a copper bus-bar. After the 2008 LHC incident, caused by a defective interconnection, a new layer of high resolution magnet circuit quench protection (nQPS) has been developed and integrated with the existing systems. [...]
CERN-ATS-2012-204.- Geneva : CERN, 2012 - 4 p. - Published in : Conf. Proc.: C1205201 (2012) , pp. THPPD026
Fulltext: PDF; External link: Published version from JaCoW
In : 3rd International Particle Accelerator Conference, New Orleans, LA, USA, 20 - 25 May 2012, pp.3557
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