Intel DX58SO Manual

Intel® Desktop Board
DX58SO
Technical Product Specification
October 2008
Order Number: E51290-001US
The Intel® Desktop Board DX58SO may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DX58SO Specification Update.
Revision History
Revision Revision History Date
®
-001 First release of the Intel Desktop Board DX58SO Technical Product October 2008
Specification
This product specification applies to only the standard Intel® Desktop Board DX58SO with BIOS
identifier SOX5810J.86A.
Changes to this specification will be published in the Intel Desktop Board DX58SO Specification
Update before being incorporated into a revision of this document.
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Copyright © 2008, Intel Corporation. All rights reserved.

Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
Intel® Desktop Board DX58SO.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DX58SO and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains

Chapter Description
1 A description of the hardware used on the Intel Desktop Board DX58SO
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
# INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DX58SO Technical Product Specification
Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbits/sec Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description .............................................................. 9

1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 System Memory .............................................................................. 15
1.5.1 Memory Configurations ......................................................... 16
1.6 Intel® X58 Chipset ........................................................................... 18
1.6.1 USB ................................................................................... 18
1.6.2 Serial ATA Interfaces ............................................................ 19
1.7 Discrete eSATA Controller ................................................................. 20
1.7.1 External Serial ATA Support ................................................... 20
1.8 Real-Time Clock Subsystem .............................................................. 20
1.9 Legacy I/O Controller ....................................................................... 21
1.9.1 Consumer Infrared (CIR) ....................................................... 21
1.10 Audio Subsystem............................................................................. 22
1.10.1 Audio Subsystem Software .................................................... 22
1.10.2 Audio Connectors and Headers ............................................... 22
1.10.3 8-Channel (7.1) Audio Subsystem........................................... 23
1.11 LAN Subsystem ............................................................................... 24
1.11.1 Intel® 82567LM Gigabit Ethernet Controller .............................. 24
1.11.2 LAN Subsystem Software....................................................... 25
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 25
1.12 Hardware Management Subsystem .................................................... 26
1.12.1 Hardware Monitoring and Fan Control...................................... 26
1.12.2 Fan Monitoring ..................................................................... 26
1.12.3 Chassis Intrusion and Detection.............................................. 26
1.12.4 Thermal Monitoring .............................................................. 27
1.13 Power Management ......................................................................... 28
1.13.1 ACPI................................................................................... 28
1.13.2 Hardware Support ................................................................ 32
1.14 Onboard Power Button ..................................................................... 36
1.14.1 ENERGY STAR* .................................................................... 37
2 Technical Reference ............................................................ 39
2.1 Memory Resources .......................................................................... 39
2.1.1 Addressable Memory............................................................. 39
2.1.2 Memory Map........................................................................ 41
2.2 Connectors and Headers................................................................... 41
2.2.1 Back Panel Connectors .......................................................... 42
v
2.2.2 Component-side Connectors and Headers ................................ 43

2.3 Jumper Block .................................................................................. 53
2.4 Mechanical Considerations ................................................................ 55
2.4.1 Form Factor......................................................................... 55
2.5 Electrical Considerations ................................................................... 56
2.5.1 Power Supply Considerations ................................................. 56
2.5.2 Fan Header Current Capability................................................ 57
2.5.3 Add-in Board Considerations .................................................. 57
2.6 Thermal Considerations .................................................................... 57
2.7 Reliability ....................................................................................... 60
2.8 Environmental ................................................................................ 60
3 Overview of BIOS Features ................................................. 61
3.1 Introduction ................................................................................... 61
3.2 BIOS Flash Memory Organization ....................................................... 62
3.3 Resource Configuration .................................................................... 62
3.3.1 PCI Autoconfiguration ........................................................... 62
3.4 System Management BIOS (SMBIOS)................................................. 63
3.5 Legacy USB Support ........................................................................ 63
3.6 BIOS Updates ................................................................................. 64
3.6.1 Language Support ................................................................ 64
3.6.2 Custom Splash Screen .......................................................... 65
3.7 BIOS Recovery................................................................................ 65
3.8 Boot Options................................................................................... 66
3.8.1 CD-ROM Boot ...................................................................... 66
3.8.2 Network Boot....................................................................... 66
3.8.3 Booting Without Attached Devices........................................... 66
3.8.4 Changing the Default Boot Device During POST ........................ 66
3.9 Adjusting Boot Speed....................................................................... 67
3.9.1 Peripheral Selection and Configuration..................................... 67
3.9.2 BIOS Boot Optimizations ....................................................... 67
3.10 BIOS Security Features .................................................................... 68
3.11 BIOS Performance Features .............................................................. 69
4 Error Messages and Beep Codes ......................................... 71
4.1 Speaker ......................................................................................... 71
4.2 BIOS Beep Codes ............................................................................ 71
4.3 BIOS Error Messages ....................................................................... 71
4.4 Port 80h POST Codes ....................................................................... 72
5 Regulatory Compliance and Battery Disposal Information .. 77
5.1 Regulatory Compliance..................................................................... 77
5.1.1 Safety Standards.................................................................. 77
5.1.2 European Union Declaration of Conformity Statement ................ 78
5.1.3 Product Ecology Statements................................................... 79
5.1.4 EMC Regulations .................................................................. 83
5.1.5 Product Certification Markings (Board Level)............................. 84
5.2 Battery Disposal Information............................................................. 85
vi
Contents
Figures
Figure 1. Major Board Components............................................................... 11
Figure 2. Block Diagram.............................................................................. 13
Figure 3. Memory Channel and DIMM Configuration ........................................ 17
Figure 4. Back Panel Audio Connector Options................................................ 23
Figure 5. LAN Connector LED Locations ......................................................... 25
Figure 6. Thermal Sensors and Fan Headers .................................................. 27
Figure 7. Locations of Indicator LEDs ............................................................ 35
Figure 8. Location of the Onboard Power Button ............................................. 36
Figure 9. Detailed System Memory Address Map............................................. 40
Figure 10. Back Panel Connectors................................................................. 42
Figure 11. Component-side Connectors and Headers....................................... 43
Figure 12. Connection Diagram for Front Panel Header .................................... 50
Figure 13. Connection Diagram for Front Panel USB Headers............................ 52
Figure 14. Connection Diagram for IEEE 1394a Header.................................... 52
Figure 15. Location of the Jumper Block ........................................................ 53
Figure 16. Board Dimensions ....................................................................... 55
Figure 17. Localized High Temperature Zones ................................................ 58
Tables
Table 1. Feature Summary ............................................................................ 9
Table 2. Components Shown in Figure 1........................................................ 12
Table 3. Supported Memory Configurations.................................................... 16
Table 4. LAN Connector LED States .............................................................. 25
Table 5. Effects of Pressing the Power Switch................................................. 29
Table 6. Power States and Targeted System Power ......................................... 30
Table 7. Wake-up Devices and Events........................................................... 31
Table 8. System Memory Map...................................................................... 41
Table 9. Component-side Connectors and Headers Shown in Figure 11 .............. 44
Table 10. HD Audio Link Header................................................................... 45
Table 11. Front Panel Audio Header .............................................................. 45
Table 12. Serial ATA Connectors .................................................................. 45
Table 13. Chassis Intrusion Header .............................................................. 46
Table 14. Front and Rear Chassis (3-Pin) Fan Headers..................................... 46
Table 15. Processor and Rear Chassis 2 (4-Pin) Fan Headers ............................ 46
Table 16. Auxiliary Front Panel Power/Sleep LED Header ................................. 47
Table 17. Processor Core Power Connector .................................................... 48
Table 18. Main Power Connector .................................................................. 49
Table 19. Auxiliary PCI Express Graphics Power Connector............................... 49
Table 20. Front Panel Header....................................................................... 50
Table 21. States for a One-Color Power LED .................................................. 51
Table 22. States for a Two-Color Power LED .................................................. 51
Table 23. BIOS Setup Configuration Jumper Settings ...................................... 54
Table 24. Recommended Power Supply Current Values.................................... 56
vii
Table 25. Fan Header Current Capability ....................................................... 57

Table 26. Thermal Considerations for Components.......................................... 59
Table 27. Environmental Specifications ......................................................... 60
Table 28. BIOS Setup Program Menu Bar ...................................................... 62
Table 29. BIOS Setup Program Function Keys ................................................ 62
Table 30. Acceptable Drives/Media Types for BIOS Recovery ............................ 65
Table 31. Boot Device Menu Options............................................................. 66
Table 32. Supervisor and User Password Functions ......................................... 68
Table 33. Beep Codes................................................................................. 71
Table 34. BIOS Error Messages .................................................................... 71
Table 35. Port 80h POST Code Ranges .......................................................... 72
Table 36. Port 80h POST Codes.................................................................... 73
Table 37. Typical Port 80h POST Sequence .................................................... 76
Table 38. Safety Standards ......................................................................... 77
Table 39. Lead-Free Board Markings ............................................................. 82
Table 40. EMC Regulations .......................................................................... 83
Table 41. Product Certification Markings........................................................ 84
viii
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary

Form Factor ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
Processor • Intel® Core™ i7 Processor in an LGA1366 socket
Memory • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz, DDR3 1066 MHz, and DDR3 800 MHz DIMMs
• Support for up to 16 GB of system memory
• Support for non-ECC memory
• XMP version 1.2
Chipset Intel® X58 Chipset, consisting of:
• Intel® X58 I/O Hub (IOH)
• Intel® 82801IJR I/O Controller Hub (ICH10R)
Audio Intel® High Definition Audio subsystem using the Realtek* ALC889 audio codec.
Legacy I/O Control Winbond legacy I/O controller for Consumer Infrared (CIR)
Peripheral • Twelve USB 2.0 ports
Interfaces • Six internal Serial ATA interfaces with RAID support
• Two External Serial ATA (eSATA) ports on back panel with RAID support
• Two IEEE 1394a ports (one on back panel, one front-panel header)
BIOS • Intel® BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available • Support for PCI Local Bus Specification Revision 2.2
PC Technology • Support for PCI Express* Revision 2.0
• Suspend to RAM support
• Wake on PCI, front panel, CIR, and USB ports
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82567LM
Gigabit Ethernet Controller
continued
9
Table 1. Feature Summary (continued)

Expansion • One PCI* Conventional bus add-in card connector (SMBus routed to PCI
Capabilities Conventional bus add-in card connector)
• Two PCI Express 2.0 x16 bus add-in card connectors
• One PCI Express 2.0 x4 bus add-in card connector
• Two PCI Express 1.1 x1 bus add-in card connectors
Hardware Monitor • Hardware monitoring and fan control ASIC
Subsystem • Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan headers using PWM control
• Three fan sense inputs used to monitor fan activity
• Fan speed control using voltage control (3-pin fan headers front and rear)
• Support for Product Environmental Control Interface (PECI)
10
Product Description
1.1.2 Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DX58SO.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
11
Table 2. Components Shown in Figure 1

Item/callout
from Figure 1 Description
A Auxiliary fan
B PCI Express x1 connector
C PCI Express x16 bus add-in card connector (Secondary)
D Front panel audio header
E PCI Conventional bus add-in card connector
F PCI Express x1 bus add-in card connector
G PCI Express x16 bus add-in card connector (Primary)
H PCI Express x4 bus add-in card connector
I Auxiliary PCI Express graphics power connector
J Back panel connectors
K Processor fan header
L Rear fan header
M LGA1366 processor socket
N DIMM Channel A sockets [2]
O DIMM Channel B socket
P DIMM Channel C socket
Q Main power connector
R I/O Hub fan header
S Intel 82X58 IO Hub (IOH)
T Processor core power connector (2 X 4)
U Chassis intrusion header
V Front chassis fan header
W Serial ATA connectors [6]
X Front panel USB headers [2]
Y Battery
Z Intel 82801IJR I/O Controller Hub (ICH10R)
AA IEEE 1394a front panel header
BB Onboard power button
CC BIOS Setup configuration jumper block
DD Auxiliary front panel power LED header
EE Front panel CIR receiver (input) header
FF Back panel CIR emitter (output) header
GG Front panel header
HH High Definition Audio Link header
II SATA power connector
JJ S/PDIF connector
12
Product Description
1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram
13
1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port
• No floppy drive connector
• No serial port
• No PS/2 connectors
1.3 Online Support

To find information about… Visit this World Wide Web site:
®
Intel Desktop Board DX58SO http://www.intel.com/products/motherboard/DX58SO/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop/DX58SO
Available configurations for the http://www.intel.com/products/motherboard/DX58SO/index.htm
Intel Desktop Board DX58SO
Supported processors http://www.intel.com/go/findcpu
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com/
1.4 Processor
The board is designed to support the following processor:
• Intel Core i7 Processor in an LGA1366 socket
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 130 W. The processor listed above is only
supported when falling within the wattage requirements of the Intel Desktop Board
DX58SO. See the Intel web site listed below for the most up-to-date list of supported
processors.
For information about… Refer to:

Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
# INTEGRATOR’S NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 56 for information on power supply requirements for this board.
14
Product Description
1.5 System Memory

The board has four DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM DIMMs
• Three independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 16 GB maximum total system memory. Refer to Section 2.1.1 on page 39 for
information on the total amount of addressable memory.
• Minimum total system memory: 1 GB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1333 MHz, DDR3 1066 MHz, and DDR3 800 MHz SDRAM DIMMs
• XMP version 1.2 performance profile support for memory speeds above 1333 MHz
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
15
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations

DIMM Configuration SDRAM SDRAM Organization Number of SDRAM
(Note 1)
Capacity Density Front-side/Back-side Devices (Note 2)
1024 MB SS 1 Gbit 128 M x 8/empty 8 [9]
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16 [18]
Notes:
1. In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM)
and “SS” refers to single-sided memory modules (containing one row of SDRAM).
2. In the fifth column, the number in brackets specifies the number of SDRAM devices on an ECC DIMM.

Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm
1.5.1 Memory Configurations

The Intel Core i7 Processor supports the following types of memory organization:
• Tri/Dual channel (Interleaved) mode. This mode offers the highest
throughput for real world applications. Interleaving reduces overall memory
latency by accessing the DIMM memory sequentially. Data is spread amongst the
memory modules in an alternating pattern.
• Three independent memory channels give two possible modes of interleaving:
• Tri-channel mode is enabled when identical matched memory modules are
installed in each of the three memory channels (blue connectors).
• Dual channel mode is enabled when two of the blue memory connectors are
populated with matched DIMMs.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the installed memory modules are not matched.
Technology and device width can vary from one channel to the other.
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
Figure 3 illustrates the memory channel and DIMM configuration.
16
Product Description
Figure 3. Memory Channel and DIMM Configuration
17
1.6 Intel® X58 Chipset

The Intel X58 chipset consists of the following devices:
• Intel 82X58 IOH with Direct Media Interface (DMI) interconnect
• Intel 82801IJR I/O Controller Hub (ICH10R)
The IOH component provides interfaces to the processor and the PCI Express graphics
connectors. The ICH10R is a centralized controller for the board’s I/O paths.
For information about Refer to

The Intel X58 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 USB
The board supports up to twelve USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers.
The ICH10R provides the USB controller for all ports. The port arrangement is as
follows:
• Eight ports are implemented with dual stacked back panel connectors adjacent to
the audio connectors
• Four ports are routed to two separate front panel USB headers

The location of the USB connectors on the back panel Figure 10, page 42
The location of the front panel USB headers Figure 11, page 43
18
Product Description
1.6.2 Serial ATA Interfaces

The board provides six Serial ATA (SATA) connectors, which support one device per
connector. The board also provides two red-colored external Serial ATA (eSATA)
connectors on the back panel.
1.6.2.1 Serial ATA Support

The board’s Serial ATA controller offers six independent Serial ATA ports with a
theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed
on each port for a maximum of six Serial ATA devices. A point-to-point interface is
used for host to device connections, unlike Parallel ATA IDE which supports a
master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the

operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows Vista* operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/.

The location of the Serial ATA connectors Figure 11, page 43
1.6.2.2 Serial ATA RAID

The board supports the following RAID (Redundant Array of Independent Drives)
levels via the ICH10R:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS.
Also, during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation.
19
1.7 Discrete eSATA Controller

The board provides a discrete Marvell* controller to support two eSATA connectors on
the back panel.
1.7.1 External Serial ATA Support

The red Serial ATA connectors on the back panel can be used for an external SATA
drive. They can also be used for port replication, which allows the aggregation of
multiple hard drives on each of the eSATA ports. Figure 10 on page 42 shows the
location of the External Serial ATA-compatible SATA ports on the back panel.
The Marvell 88SE621 controller uses the PCI Express bus for data transfer with a
theoretical maximum transfer rate of 3 Gbits/sec per port. These connectors are in
addition to the six SATA connectors of the ICH10R SATA interface.
The discrete SATA interface supports the following RAID levels:
• RAID 0
• RAID 1
NOTE
The Marvell 88SE621 controller supports single drive non-RAID configurations as well
as RAID configurations. For RAID configurations, you must install the RAID drivers by
pressing F6 during operating system installation. See your operating system
installation documentation for more information about installing drivers during the
installation process.

The location of the discrete SATA RAID connectors Figure 11, page 43
1.8 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail Date and Time values will be reset and the user will be
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
20
Product Description
1.9 Legacy I/O Controller

The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.9.1 Consumer Infrared (CIR)

The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista is the supported operating system
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CIR specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel
Desktop Boards for this feature to work.
21
1.10 Audio Subsystem

The board supports the Intel High Definition Audio subsystem based on the Realtek
ALC889 audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output for all back panel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 90 dB
1.10.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.
Obtaining audio software and drivers Section 1.3, page 14
1.10.2 Audio Connectors and Headers

The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
• Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for
front panel audio connectors)
• High Definition (HD) Audio Link header (a 2 x 8-pin header for S/PDIF) used for
HDMI Video cards
• S/PDIF audio connector (1 x 3-pin connector) can be used for HDMI Video cards
that do not work with the HD Audio header
• S/PDIF output between the back panel Optical connector and the internal S/PDIF
header can be selected in BIOS setup
The locations of the front panel audio header, HD Audio Link header, and Figure 11, page 43
S/PDIF audio connector
The signal names of the front panel audio header Table 11, page 45
The back panel audio connectors Section 2.2.1, page 42
22
Product Description
1.10.3 8-Channel (7.1) Audio Subsystem

The 8-channel (7.1) audio subsystem includes the following:
• Intel 82801IJR (ICH10R)
• Realtek ALC889 audio codec
• Microphone input that supports a single dynamic, condenser, or electret
microphone
The back panel audio connectors are configurable through the audio device drivers.
The available configurable audio ports are shown in Figure 4.
Item Description
A Surround left/right channel audio out/Retasking Jack
B Center channel and LFE (subwoofer) audio out
C Line in (Side Channel Surround) audio out/Retasking Jack)
D Line out/Headphone (Stereo)
E Mic in
F S/PDIF Digital Audio Out (Optical)
Figure 4. Back Panel Audio Connector Options

The back panel audio connectors Section 2.2.1, page 42
23
1.11 LAN Subsystem

The LAN subsystem consists of the following:
• Intel 82567LM Gigabit Ethernet Controller (10/100/1000 Mbits/sec)
• Intel 82801IJR (ICH10R)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between ICH10R and the LAN controller
• PCI Conventional bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software

LAN software and drivers http://downloadcenter.intel.com
1.11.1 Intel® 82567LM Gigabit Ethernet Controller

The Intel 82567LM Gigabit Ethernet Controller supports the following features:
• PCI Express link
• 10/100/1000 IEEE 802.3 compliant
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
24
Product Description
1.11.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

Obtaining LAN software and drivers http://downloadcenter.intel.com
1.11.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 4 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 4. LAN Connector LED States

LED LED Color LED State Condition
Off LAN link is not established.
Link Green On LAN link is established.
Blinking LAN activity is occurring
Off 10 Mbits/sec data rate is selected.
Data Rate Green/Yellow Green 100 Mbits/sec data rate is selected.
Yellow 1000 Mbits/sec data rate is selected.
25
1.12 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.12.1 Hardware Monitoring and Fan Control

The features of the hardware monitoring and fan control include:
• Fan speed control controllers and sensors provided by the Hardware Monitoring
and Fan Control ASIC
• Thermal sensors in the processor, 82X58 IOH, and 82801IJR ICH10R
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.1 V, and
+VCCP) to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the
fan speed or switch the fans on or off as needed
1.12.2 Fan Monitoring

Fan monitoring can be implemented using Intel® Desktop Control Center or third-party
software.

The functions of the fan headers Section 1.13.2.2, page 33
1.12.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.

The location of the chassis intrusion header Figure 11, page 43
26
Product Description
1.12.4 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Auxiliary rear chassis fan
B Processor fan
C Rear fan
D Thermal diode, located on processor die
E IOH fan
F Thermal diode, located on the IOH die
G Front chassis fan
H Thermal diode, located on the ICH10R die
Figure 6. Thermal Sensors and Fan Headers
27
1.13 Power Management

Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan headers
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB
⎯ Power Management Event signal (PME#) wake-up support
⎯ PCI Express WAKE# signal support
1.13.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 7 on page 31)
• Support for a front panel power and sleep mode switch
28
Product Description
Table 5 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 5. Effects of Pressing the Power Switch

If the system is in this …and the power switch is
state… pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than six seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than six seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)
1.13.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
29
Table 6 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 6. Power States and Targeted System Power

Processor Targeted System
Global States Sleeping States States Device States Power (Note 1)
G0 – working S0 – working C0 – working D0 – working Full power > 30 W
state state.
G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – 5 W < power < 52.5 W
state stopped grant device
specification
specific.
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W (Note 2)
state RAM. Context except for
saved to RAM. wake-up logic.
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W (Note 2)
state disk. Context except for
saved to disk. wake-up logic.
G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W (Note 2)
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system.
mechanical off system. wake-up logic, Service can be performed
AC power is except when safely.
disconnected provided by
from the battery or
computer. external source.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
30
Product Description
1.13.1.2 Wake-up Devices and Events

Table 7 lists the devices or specific events that can wake the computer from specific
states.
Table 7. Wake-up Devices and Events

These devices/events can wake up the computer… …from this state
(Note 1)
LAN S1, S3, S4, S5
(Note 1)
PME# signal S1, S3, S4, S5
Power switch S1, S3, S4, S5
RTC alarm S1, S3, S4, S5
USB S1, S3
WAKE# S1, S3, S4, S5
Consumer IR S1, S3 (S4 and S5)(Note 2)
Note 1: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option
to Power On will enable a wake-up event from LAN in the S5 state.
Note 2: Wake from S4 and S5 is optional by the specification.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
31
1.13.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• PME# signal wake-up support
• WAKE# signal wake-up support
• Wake from Consumer IR
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
1.13.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.

The location of the main power connector Figure 11, page 43
The signal names of the main power connector Table 18, page 49
32
Product Description
1.13.2.2 Fan Headers

The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 or S1 state.
• The fans are off when the board is off or in the S3, S4, or S5 state.
• Each fan header is wired to a fan tachometer input of the hardware monitoring and
fan control ASIC, except the fan header located at J7TH (item R on Figure 1,
page 11)
• All fan headers support closed-loop fan control that can adjust the fan speed or
switch the fan on or off as needed
• All fan headers have a +12 V DC connection
• 4-pin fan headers are controlled by Pulse Width Modulation
• 3-pin fan headers (front and rear) are modulated by voltage control
The location of the fan headers Figure 11, page 43
The location of the fan headers and sensors for thermal monitoring Figure 6, page 27
The signal names of the fan headers Section 0, page 42
1.13.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby
current when implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
• The PCI Express WAKE# signal
• The PCI bus PME# signal for PCI 2.3 compliant LAN designs
⎯ By Ping
⎯ Magic Packet
• The onboard LAN subsystem
• Wake from CIR
33
1.13.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 7 on page 31 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.
1.13.2.5 Wake from USB

USB bus activity wakes the computer from ACPI S1 or S3 states.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.13.2.6 PME# Signal Wake-up Support

When the PME# signal on the PCI Conventional bus is asserted, the computer wakes
from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in the BIOS).
1.13.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S1, S3, S4, or S5 state.
34
Product Description
1.13.2.8 +5 V Standby Power Indicator LED and Additional LEDs

The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power
indicator LED on the board.
CAUTION
If AC power has been switched off and the standby power indicators are still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
In addition to the standby power indicator, the board contains two LEDs that indicate
the following:
• The Processor LED indicates an elevated temperature on the processor that could
effect performance
• The Voltage Regulator LED indicates an elevated temperature in the processor
voltage regulator circuit that could effect performance
Figure 7 shows the location of these additional LEDs.
Item Description
A Voltage Regulator LED (Red)
B Standby power indicator LED (Green)
C Processor LED (Red)
D Hard drive activity LED (Green)
Figure 7. Locations of Indicator LEDs
35
1.14 Onboard Power Button

The board provides a power button that can be used to turn the computer on or off.
This button is intended for use at integration facilities to remove standby power before
making changes to the system configuration, or for testing purposes.
The power button on the front panel is recommended for all other instances of turning
the computer on or off. To turn the computer off using the onboard power button,
keep the button pressed down for three seconds. Figure 8 shows the location of the
onboard power button.
Figure 8. Location of the Onboard Power Button
CAUTION
Electrostatic discharge (ESD) can damage components. The onboard power button
should be used only at an ESD workstation using an antistatic wrist strap and a
conductive foam pad. If such a station is not available, some ESD protection can be
provided by wearing an antistatic wrist strap and attaching it to a metal part of the
computer chassis.
36
Product Description
1.14.1 ENERGY STAR*

In 2007, the US Department of Energy and the US Environmental Protection Agency
revised the ENERGY STAR* requirements. Intel has worked directly with these two
governmental agencies to define the new requirements. Currently this Intel Desktop
Board meets the new Category C requirements when using the appropriate
peripherals.

ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
37
38
2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory

The board utilizes 16 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM
(total system memory). On a system that has 16 GB of system memory installed, it is
not possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
• BIOS/SPI Flash device (16 Mbit)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• Front side bus interrupts (17 MB)
• PCI Express configuration space (256 MB)
• IOH base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express add-in cards (256 MB)
The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. Figure 9 shows a schematic of
the system memory map. All installed system memory can be used when there is no
overlap of system addresses.
39
Figure 9. Detailed System Memory Address Map
40
Technical Reference
2.1.2 Memory Map

Table 8 lists the system memory map.
Table 8. System Memory Map

Address Range (decimal) Address Range (hex) Size Description
1024 K - 16777216 K 100000 - 3FFFFFFFF 16382 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the PCI
Conventional bus). Dependent on
video adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
2.2 Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel
and front panel USB, as well as IEEE 1394a.
The other internal connectors and headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors or headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB or 1394 header single wire connectors may
eventually overload the overcurrent protection and cause damage to the board.
This section describes the board’s connectors. The connectors can be divided into
these groups:
• Back panel I/O connectors
• Component-side I/O connectors and headers (see page 43)
41
2.2.1 Back Panel Connectors

Figure 10 shows the location of the back panel connectors for the board.
Item Description
A eSATA ports
B USB ports
C USB ports
D IEEE-1394a connector
E USB ports
F LAN
G USB ports
H Center channel and LFE (subwoofer) audio out/Retasking Jack G
I Surround left/right channel audio out/Retasking Jack H
J Audio line in/(Side Surround) audio out/Retasking Jack C
K Front left/right channel audio out/Two channel audio line out/Retasking
Jack D
L Mic in
M Digital audio out optical
Figure 10. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
42
Technical Reference
2.2.2 Component-side Connectors and Headers

Figure 11 shows the locations of the component-side connectors and headers.
Figure 11. Component-side Connectors and Headers
Table 9 lists the component-side connectors and headers identified in Figure 11.
43
Table 9. Component-side Connectors and Headers Shown in Figure 11

Item/callout
from Figure 11 Description
A Auxiliary fan header
B PCI Express x1 connector
C PCI Express x16 bus add-in card connector
D Front panel audio header
E PCI Conventional bus add-in card connector
F PCI Express x1 bus add-in card connector
G PCI Express x16 bus add-in card connector
H PCI Express x4 bus add-in card connector
I Auxiliary PCI Express graphics power connector
J Processor fan header
K Rear fan header
L Main power connector
M I/O Hub fan header
N Processor core power connector (2 X 4)
O Chassis intrusion header
P Front chassis fan header
Q Serial ATA connectors [6]
R Front panel USB header
S Front panel USB header
T IEEE 1394a front panel header
U Auxiliary front panel power LED header
V Front panel CIR receiver (input) header
W Back panel CIR emitter (output) header
X Front panel header
Y High Definition Audio Link header
Z SATA connector
AA S/PDIF connector
44
Technical Reference
2.2.2.1 Signal Tables for the Connectors and Headers
Table 10. HD Audio Link Header

Pin Signal Name Pin Signal Name
1 BCLK 2 Ground
3 RST# 4 3.3 VCC
5 SYNC 6 Ground
7 SDO 8 3.3 VCC
9 SDI0 10 +12 V
11 SDI1 12 Key (no pin)
13 Aud RSVD 14 3.3 V STBY
15 Aud RSVD 16 Ground
Table 11. Front Panel Audio Header

1 [Port 2] Left channel 2 Ground
3 [Port 2] Right channel 4 PRESENCE# (Dongle present)
5 [Port 1] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 12. Serial ATA Connectors

Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
45
Table 13. Chassis Intrusion Header

Pin Signal Name
1 Intruder
2 Ground
Table 14. Front and Rear Chassis (3-Pin) Fan Headers

Pin Signal Name
1 Control (Note)
2 +12 V
3 Tach
Note: These fan headers use voltage variance control for fan speed.
Table 15. Processor and Rear Chassis 2 (4-Pin) Fan Headers

Pin Signal Name
1 Ground (Note)
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Note: These fan headers use Pulse Width Modulation control for fan speed.
Table 20. Back Panel CIR Emitter (Output) Header

Pin Signal Name
1 Emitter out 1
2 Emitter out 2
3 Ground
4 Key (no pin)
5 Jack detect 1
6 Jack detect 2
Table 21. Front Panel CIR Receiver (Input) Header

Pin Signal Name
1 Ground
2 LED
3 NC
4 Learn-in
5 5 V standby
6 VCC
7 Key (no pin)
8 CIR Input
46
Technical Reference
2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:
• PCI Express 2.0 x16: two PCI Express 2.0 x16 connectors supporting
simultaneous transfer speeds up to 8 GB/sec of peak bandwidth per direction and
up to 16 GB/sec concurrent bandwidth.
• PCI Express 2.0 x4: one PCI Express 2.0 x4 connector (implemented using a x4
physical connector capable of accepting a x16 card). The x4 interface supports
simultaneous transfer speeds up to 250 MB/sec of peak bandwidth per direction
and up to 5 GB/sec concurrent bandwidth.
• PCI Express 1.1 x1: two PCI Express 1.1 x1 connectors. The x1 interface
supports simultaneous transfer speeds up to 250 MB/sec of peak bandwidth per
direction and up to 2 GB/sec concurrent bandwidth.
• PCI Conventional (rev 2.3 compliant) bus: one PCI Conventional bus add-in card
connector. The SMBus is routed to the PCI Conventional bus connector. PCI
Conventional bus add-in cards with SMBus support can access sensor data and
other information residing on the board.
Note the following considerations for the PCI Conventional bus connector:
• The PCI Conventional bus connector is bus master capable.
• SMBus signals are routed to the PCI Conventional bus connector. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the
board. The specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
⎯ The SMBus data line is connected to pin A41.
2.2.2.3 Auxiliary Front Panel Power/Sleep LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 16. Auxiliary Front Panel Power/Sleep LED Header

Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
47
2.2.2.4 Power Supply Connectors

The board has the following power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and
24 unconnected.
• Processor core power – a 2 x 4 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
• Auxiliary PCI Express graphics power – a 1 x 4 connector. This connector
provides the required additional power when using high power (75 W or greater)
add-in cards in either or both the Secondary PCI Express x16 (electrical x8) and
the PCI Express x16 (electrical x4) bus add-in card connectors. See Figure 1 for
location.
• “SATA style” power connector – an additional power connector for
supplemental power which can be used in addition to or in place of the Auxiliary
PCI Express graphics power connector.
CAUTION
If high power (75 W or greater) add-in cards are installed in either or both the
Secondary PCI Express x16 and the PCI Express x4 bus add-in card connectors, the
Auxiliary PCI Express graphics power connector must be used. Failure to do so may
cause damage to the board and the add-in cards.
Table 17. Processor Core Power Connector

1 Ground 2 +12 V
3 Ground 4 +12 V
5 Ground 6 +12 V
7 Ground 8 +12 V
48
Technical Reference
Table 18. Main Power Connector

1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V (Note) 23 +5 V (Note)
12 2 x 12 connector detect (Note) 24 Ground (Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
Table 19. Auxiliary PCI Express Graphics Power Connector

Pin Signal Name
1 +12 V
2 1 x 4 connector detect
3 Ground
4 +5 V

Power supply considerations Section 2.5.1 on page 56
49
2.2.2.5 Front Panel Header

This section describes the functions of the front panel header. Table 20 lists the signal
names of the front panel header. Figure 12 is a connection diagram for the front panel
header.
Table 20. Front Panel Header

In/ In/
Pin Signal Out Description Pin Signal Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED 2 HDR_BLNK_GRN Out Front panel green
pull-up to +5 V LED
3 HDA# Out Hard disk active 4 HDR_BLNK_YEL Out Front panel yellow
LED LED
Reset Switch On/Off Switch
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
Figure 12. Connection Diagram for Front Panel Header
2.2.2.5.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
• A Serial ATA hard drive or optical drive connected to an onboard Serial ATA
connector
• A Parallel ATA IDE hard drive or optical drive connected to an onboard Parallel ATA
IDE connector
50
Technical Reference
2.2.2.5.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.5.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 21 shows the
possible states for a one-color LED. Table 22 shows the possible states for a two-color
LED.
Table 21. States for a One-Color Power LED

LED State Description
Off Power off/sleeping
Steady Green Running
Table 22. States for a Two-Color Power LED

LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 21 and Table 22 are suggested colors only. Actual LED
colors are chassis-specific.
2.2.2.5.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
51
2.2.2.6 Front Panel USB Headers

Figure 13 is a connection diagram for the front panel USB headers.
• The +5 V DC power on the USB headers is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 13. Connection Diagram for Front Panel USB Headers
2.2.2.7 Front Panel IEEE 1394a Header

Figure 14 is a connection diagram for the IEEE 1394a header.
• The +12 V DC power on the IEEE 1394a header is fused.
• The IEEE 1394a header provides one IEEE 1394a port.
Figure 14. Connection Diagram for IEEE 1394a Header
52
Technical Reference
2.3 Jumper Block

CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 15 shows the location of the jumper block. The 3-pin jumper block determines
the BIOS Setup program’s mode. Table 23 describes the jumper settings for the three
modes: normal, configure, and recovery. When the jumper is set to configure mode
and the computer is powered-up, the BIOS compares the processor version and the
microcode version in the BIOS and reports if the two match.
Figure 15. Location of the Jumper Block
53
Table 23. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration
Normal 1-2 The BIOS uses current configuration information and
passwords for booting.
3 2 1
Configure 2-3 After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
Note that this Configure mode is the only way to clear the
3 2 1
BIOS/CMOS settings. Press F9 (restore defaults) while in
Configure mode to restore the BIOS/CMOS settings to their
default values.
Recovery None The BIOS attempts to recover the BIOS configuration. A

recovery CD or flash drive is required.
3 2 1
54
Technical Reference
2.4 Mechanical Considerations
2.4.1 Form Factor

The board is designed to fit into an ATX-form-factor chassis. Figure 16 illustrates the
mechanical form factor for the board. Dimensions are given in inches [millimeters].
The outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by
243.84 millimeters]. Location of the I/O connectors and mounting holes are in
compliance with the ATX specification.
Figure 16. Board Dimensions
55
2.5 Electrical Considerations

2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a system consisting of a supported 130 W processor (see section 1.4
on page 14 for a list of supported processors), 1 GB DDR3 RAM, one high end video
card, one hard disk drive, one optical drive, and all board peripherals enabled, the
minimum recommended power supply is 460 W. Table 24 lists the recommended
power supply current values.
Table 24. Recommended Power Supply Current Values

Output Voltage 3.3 V 5V 12 V1 12 V2 -12 V 5 VSB
Current 22 A 20 A 16 A 16 A 0.3 A 1.5 A

Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/sb
/CS-026472.htm
56
Technical Reference
2.5.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 25 lists the current capability of the fan headers.
Table 25. Fan Header Current Capability

Fan Header Maximum Available Current
Processor fan 2.0 A
Front chassis fan 1.5 A
IOH Fan 3.5 A (direct connect 12 V rail)
Rear chassis fan 1.5 A
Auxiliary rear chassis fan 2.0 A
2.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from
the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board
(all six expansion slots filled) must not exceed the system’s power supply +5 V
maximum current or 14 A in total.
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
57
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 17) can reach a temperature of up to 85 oC in
an open chassis.
Figure 17 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel 82X58 IOH
D Intel 82801IJR ICH10R
Figure 17. Localized High Temperature Zones
58
Technical Reference
Table 26 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 26. Thermal Considerations for Components

Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82X58 IOH 105 oC (under bias)

Intel 82801IJR (ICH10R) 105 oC (under bias)

Processor datasheets and specification updates Section 1.3, page 14
59
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is
84,330.82646 hours.
2.8 Environmental
Table 27 lists the environmental specifications for the board.
Table 27. Environmental Specifications

Parameter Specification
Temperature
Non-Operating -40 °C to +70 °C
Operating 0 °C to +55 °C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
60
3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as SOX5810J.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main Advanced Performance Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 53 shows how to put the board in configure mode.
61
Table 28 lists the BIOS Setup program menu features.
Table 28. BIOS Setup Program Menu Bar

Maintenance Main Advanced Performance Security Power Boot Exit
Clears Displays Configures Configures Sets Configures Selects Saves or
passwords and processor advanced Memory, Bus passwords power boot discards
displays and memory features and Processor and management options changes to
processor configuration available overrides security features and Setup
information through the features power supply program
chipset controls options
Table 29 lists the function keys available for menu screens.
Table 29. BIOS Setup Program Function Keys

BIOS Setup Program
Function Key Description
<←> or <→> Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓> Selects an item (Moves the cursor up or down)
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 16 Mbit (2048 KB)
flash memory device.
3.3 Resource Configuration

3.3.1 PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.
62
Overview of BIOS Features
3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel Integrator
Toolkit.
63
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.
3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
• Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb
/CS-022312.htm.
3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English. Additional
languages are available in the Integrator’s Toolkit utility. Check the Intel website for
details.
64
3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is
available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.

Intel® Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/
Additional Intel® software tools http://developer.intel.com/products/motherboard/DX58SO/t
ools.htm
and
http://developer.intel.com/design/motherbd/software.htm
3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 30 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 30. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?
CD-ROM drive connected to the Parallel ATA interface Yes
CD-ROM drive connected to the Serial ATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No
Legacy diskette drive (with a 1.44 MB diskette) connected to the No
legacy diskette drive interface

BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/
cs-023360.htm
65
3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a diskette drive, hard
drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for
the diskette drive to be the first boot device, the hard drive second, and the ATAPI
CD-ROM third. If enabled, the last default boot device is the network.
3.8.1 CD-ROM Boot

Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM
format specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-
ROM is listed as a boot device. Boot devices are defined in priority order. Accordingly,
if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot
from the next defined drive.
3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse
3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices (as set in the BIOS setup program’s
Boot Device Priority Submenu). Table 31 lists the boot device menu options.
Table 31. Boot Device Menu Options

Boot Device Menu Function Keys Description
<↑> or <↓> Selects a default boot device
<Enter> Exits the menu, saves changes, and boots from the selected
device
<Esc> Exits the menu without saving changes
66
3.9 Adjusting Boot Speed

These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Optimized BIOS boot parameters
3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” less than
eight seconds, that minimize hard drive startup delays.
• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
• Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.
• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
• In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay
feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup
program).
67
3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
• The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 32 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 32. Supervisor and User Password Functions

Password Password
Password Supervisor to Enter During
Set Mode User Mode Setup Options Setup Boot
Neither Can change all Can change all None None None
options (Note) options (Note)
Supervisor Can change all Can change a Supervisor Password Supervisor None
only options limited number
of options
User only N/A Can change all Enter Password User User
options Clear User Password
Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or
and user set options limited number Enter Password user user
of options
Note: If no password is set, any user can change all Setup options.
68
3.11 BIOS Performance Features

The BIOS includes the following options to provide custom performance enhancements
when using Intel Core i7 Processors.
• Processor frequency adjustment
• Processor voltage adjustment
• Memory clock adjustments
• Memory voltage adjustments
• QPI Bus voltage adjustment
• VTT voltage adjustment
69
70
4 Error Messages and Beep Codes
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information
during POST.

The location of the onboard speaker Figure 1, page 11
4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS displays an error
message describing the problem (see Table 33).
Table 33. Beep Codes

Type Pattern Frequency
Memory error Three long beeps 1280 Hz
Thermal warning Four alternating beeps: High tone: 2000 Hz
High tone, low tone, high tone, low tone Low tone: 1600 Hz
4.3 BIOS Error Messages

Table 34 lists the error messages and provides a brief description of each.
Table 34. BIOS Error Messages

Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
71
4.4 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the
BIOS:
• Table 35 lists the Port 80h POST code ranges
• Table 36 lists the Port 80h POST codes themselves
• Table 37 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 35. Port 80h POST Code Ranges

Range Category/Subsystem
00 – 0F Debug codes: Can be used by any PEIM/driver for debug.
10 – 1F Host Processors: 1F is an unrecoverable CPU error.
20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 – 3F Recovery: 3F indicated recovery failure.
40 – 4F Reserved for future use.
50 – 5F I/O Busses: PCI, USB, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 – 6F Reserved for future use (for new busses).
70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error.
80 – 8F Reserved for future use (new output console codes).
90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 – AF Reserved for future use (new input console codes).
B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 – CF Reserved for future use.
D0 – DF Boot device selection.
E0 – FF E0 – EE: Miscellaneous codes. See Table 36.
EF: boot/S3 resume failure.
F0 – FF: FF processor exception.
72
Error Messages and Beep Codes
Table 36. Port 80h POST Codes

POST Code Description of POST Operation
Host Processor
10 Power-on initialization of the host processor (Boot Strap Processor)
11 Host processor cache initialization (including APs)
12 Starting Application processor initialization
13 SMM initialization
Chipset
21 Initializing a chipset component
Memory
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
24 Programming timing parameters in the memory controller and the DIMMs
25 Configuring memory
26 Optimizing memory settings
27 Initializing memory, such as ECC init
29 Memory testing completed
PCI Bus
50 Enumerating PCI busses
51 Allocating resources to PCI bus
52 Hot Plug PCI controller initialization
53 – 57 Reserved for PCI Bus
USB
58 Resetting USB bus
59 Reserved for USB
ATA/ATAPI/SATA
5A Resetting PATA/SATA bus and all devices
5B Reserved for ATA
SMBus
5C Resetting SMBus
5D Reserved for SMBus
Local Console
70 Resetting the VGA controller
71 Disabling the VGA controller
72 Enabling the VGA controller
Remote Console
78 Resetting the console controller
79 Disabling the console controller
7A Enabling the console controller
continued
73
Table 36. Port 80h POST Codes (continued)

Keyboard (USB)
90 Resetting keyboard
91 Disabling keyboard
92 Detecting presence of keyboard
93 Enabling the keyboard
94 Clearing keyboard input buffer
95 Instructing keyboard controller to run Self Test (PS/2 only)
Mouse (USB)
98 Resetting mouse
99 Disabling mouse
9A Detecting presence of mouse
9B Enabling mouse
Fixed Media
B0 Resetting fixed media
B1 Disabling fixed media
B2 Detecting presence of a fixed media (IDE hard drive detection etc.)
B3 Enabling/configuring a fixed media
Removable Media
B8 Resetting removable media
B9 Disabling removable media
BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC Enabling/configuring a removable media
BDS
Dy Trying boot selection y (y=0 to 15)
PEI Core
E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2 Permanent memory found
E1, E3 Reserved for PEI/PEIMs
DXE Core
E4 Entered DXE phase
E5 Started dispatching drivers
E6 Started connecting drivers
continued
74
Error Messages and Beep Codes
Table 36. Port 80h POST Codes (continued)

DXE Drivers
E7 Waiting for user input
E8 Checking password
E9 Entering BIOS setup
EB Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
F4 Entering Sleep state
F5 Exiting Sleep state
F8 EFI boot service ExitBootServices ( ) has been called
F9 EFI runtime service SetVirtualAddressMap ( ) has been called
FA EFI runtime service ResetSystem ( ) has been called
PEIMs/Recovery
30 Crisis Recovery has initiated per user request
31 Crisis Recovery has initiated by software (corrupt flash)
34 Loading recovery capsule
35 Handing off control to the recovery capsule
3F Unable to recover
75
Table 37. Typical Port 80h POST Sequence

POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI busses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
92 Detecting the presence of the keyboard
28 Testing memory
E7 Waiting for user input
01 INT 19
00 Ready to boot
76
5 Regulatory Compliance and Battery
Disposal Information
5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop
Board DX58SO:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings
5.1.1 Safety Standards

Intel Desktop Board DX58SO complies with the safety standards stated in Table 38
when correctly installed in a compatible host system.
Table 38. Safety Standards

Standard Title
CSA/UL 60950-1, First Edition Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1:2006, Second Information Technology Equipment – Safety - Part 1: General
Edition Requirements (European Union)
IEC 60950-1:2005, Second Information Technology Equipment – Safety - Part 1: General
Edition Requirements (International)
77
5.1.2 European Union Declaration of Conformity

Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel®
Desktop Board DX58SO is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and
2006/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC a
2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC & 2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC & 2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC
kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC & 2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC & 2006/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC και 2006/95/EC.
Magyar E termék megfelel a 2004/108/EC és 2006/95/EC Európai Irányelv
előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC & 2006/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC &
2006/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC un 2006/95/EC
noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC ir 2006/95/EC
nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC u 2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC & 2006/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC
& 2006/95/EC.
78
Regulatory Compliance and Battery Disposal Information
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC a 2006/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in
2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &
2006/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar.
5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作
恰当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
79
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, à savoir les produits concernés, les adresses
disponibles, les instructions d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in
tel/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponíveis, as instruções de envio, os termos e condições, etc.
80
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology
Web sayfasına gidin.
5.1.3.3 Lead Free Desktop Board

This Intel Desktop Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six
materials. One of the six restricted materials is lead.
This Intel Desktop Board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance
and/or reliability. This Intel Desktop Board is referred to as “Lead-free second level
interconnect.” The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it
requires different product marking and controlled substance information. The required
mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as
the number of years for which controlled listed substances will not leak or chemically
deteriorate while in the product.
Table 39 shows the various forms of the “Lead-Free 2nd Level Interconnect” mark as it
appears on the board and accompanying collateral.
81
Table 39. Lead-Free Board Markings

Description Mark
nd
Lead-Free 2 Level Interconnect:
This symbol is used to identify
electrical and electronic
assemblies and components in
which the lead (Pb) concentration
level in the desktop board
substrate and the solder
connections from the board to the or
components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).
or
82
5.1.4 EMC Regulations

Intel Desktop Board DX58SO complies with the EMC regulations stated in Table 40
when correctly installed in a compatible host system.
Table 40. EMC Regulations

Regulation Title
FCC 47 CFR Part 15, Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio
Subpart B Frequency Devices. (USA)
ICES-003 Issue 4 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
(Class B)
EN55022:2006 Limits and methods of measurement of Radio Interference Characteristics
(Class B) of Information Technology Equipment. (European Union)
EN55024:1998 Information Technology Equipment – Immunity Characteristics Limits and
(Class B) methods of measurement. (European Union)
EN55022:2006 Australian Communications Authority, Standard for Electromagnetic
(Class B) Compatibility. (Australia and New Zealand)
CISPR 22:2005 Limits and methods of measurement of Radio Disturbance Characteristics of
+A1:2005 +A2:2006 Information Technology Equipment. (International)
(Class B)
CISPR 24:1997 Information Technology Equipment – Immunity Characteristics – Limits and
+A1:2001 +A2:2002 Methods of Measurement. (International)
(Class B)
VCCI V-3/2007.04, Voluntary Control for Interference by Information Technology Equipment.
V-4/2007.04, Class B (Japan)
Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.
83
Korean Class B statement translation: this is household equipment that is certified to

comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.
5.1.5 Product Certification Markings (Board Level)

Intel Desktop Board DX58SO has the product certification markings shown in Table
41:
Table 41. Product Certification Markings

Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel desktop boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment. Includes

Intel name and DX58SO model designation.
CE mark. Declaring compliance to European Union (EU) EMC directive and

Low Voltage directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum

Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code
number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea MIC (Ministry of Information and Communication) mark. Includes

adjacent MIC certification number: CPU-DX58SO (B)
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.

Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique V-0

UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.
84
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
85
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYAZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
86
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей
должна проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
87
88

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Intel® Desktop Board

Order Number: E51290-001US

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,

* Other names and brands may be claimed as the property of others.

Copyright © 2008, Intel Corporation. All rights reserved.

What This Document Contains

Notes, Cautions, and Warnings

Other Common Notation

1 Product Description .............................................................. 9

2.2.2 Component-side Connectors and Headers ................................ 43

Table 25. Fan Header Current Capability ....................................................... 57

Table 1. Feature Summary

Processor • Intel® Core™ i7 Processor in an LGA1366 socket

Table 1. Feature Summary (continued)

1.1.2 Board Layout

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

1.1.3 Block Diagram

Figure 2. Block Diagram

1.2 Legacy Considerations

1.3 Online Support

For information about… Refer to:

1.5 System Memory

Table 3 lists the supported DIMM configurations.

Table 3. Supported Memory Configurations

For information about… Refer to:

1.5.1 Memory Configurations

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

1.6 Intel® X58 Chipset

For information about Refer to

For information about Refer to

1.6.2 Serial ATA Interfaces

1.6.2.1 Serial ATA Support

For compatibility, the underlying Serial ATA functionality is transparent to the

For information about Refer to

1.6.2.2 Serial ATA RAID

1.7 Discrete eSATA Controller

1.7.1 External Serial ATA Support

For information about Refer to

1.8 Real-Time Clock Subsystem

1.9 Legacy I/O Controller

1.9.1 Consumer Infrared (CIR)

1.10 Audio Subsystem

1.10.1 Audio Subsystem Software

1.10.2 Audio Connectors and Headers

1.10.3 8-Channel (7.1) Audio Subsystem

Figure 4. Back Panel Audio Connector Options

For information about Refer to

1.11 LAN Subsystem

For information about Refer to

1.11.1 Intel® 82567LM Gigabit Ethernet Controller

1.11.2 LAN Subsystem Software

For information about Refer to

1.11.3 RJ-45 LAN Connector with Integrated LEDs

Figure 5. LAN Connector LED Locations

Table 4. LAN Connector LED States

1.12 Hardware Management Subsystem

1.12.1 Hardware Monitoring and Fan Control