DP43BF TechProdSpec

Intel® Desktop Board
DP43BF
Technical Product Specification
March 2010
Order Number: E89938-001US
The Intel® Desktop Board DP43BF may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DP43BF Specification Update.
Revision History
Revision Revision History Date
®
-001 First release of the Intel Desktop Board DP43BF Technical Product March 2010
Specification.
This product specification applies to only the standard Intel® Desktop Board DP43BF with BIOS
identifier RKG4310H.86A
Changes to this specification will be published in the Intel Desktop Board DP43BF Specification
Update before being incorporated into a revision of this document.
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to deviate from published specifications. Current characterized errata are available on request.
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Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board DP43BF. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DP43BF and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains

Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DP43BF Technical Product Specification
Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb Gigabit (1,073,741,824 bits)
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.5.1 Memory Configurations ......................................................... 17
1.6 Intel® P43 Express Chipset ............................................................... 19
1.6.2 USB ................................................................................... 19
1.6.3 ATA Support ........................................................................ 20
1.7 Real-Time Clock Subsystem .............................................................. 22
1.8 Legacy I/O Controller ....................................................................... 22
1.8.1 Serial Port ........................................................................... 22
1.9 Audio Subsystem............................................................................. 23
1.9.1 Audio Subsystem Software .................................................... 24
1.9.2 Audio Connectors and Headers ............................................... 24
1.10 LAN Subsystem ............................................................................... 25
1.10.1 Broadcom BCM57788 Gigabit Ethernet Controller ...................... 25
1.10.2 LAN Subsystem Software....................................................... 25
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 26
1.11 Hardware Management Subsystem .................................................... 27
1.11.1 Hardware Monitoring and Fan Control...................................... 27
1.11.2 Fan Monitoring ..................................................................... 27
1.11.3 Chassis Intrusion Detection.................................................... 27
1.11.4 Thermal Monitoring .............................................................. 28
1.12 Power Management ......................................................................... 29
1.12.1 ACPI................................................................................... 29
1.12.2 Hardware Support ................................................................ 32
1.12.3 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 36
2 Technical Reference
2.1 Memory Map................................................................................... 37
2.1.1 Addressable Memory............................................................. 37
2.2 Connectors and Headers................................................................... 40
2.2.1 Back Panel Connectors .......................................................... 41
2.2.2 Component-side Connectors and Headers ................................ 42
2.3 BIOS Configuration Jumper Block....................................................... 52
2.4 Mechanical Considerations ................................................................ 53
2.4.1 Form Factor......................................................................... 53
2.5 Electrical Considerations ................................................................... 54
v
2.5.1 Power Supply Considerations ................................................. 54

2.5.2 Fan Header Current Capability................................................ 54
2.5.3 Add-in Board Considerations .................................................. 55
2.6 Thermal Considerations .................................................................... 55
2.7 Reliability ....................................................................................... 57
2.8 Environmental ................................................................................ 57
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 59
3.2 BIOS Flash Memory Organization ....................................................... 60
3.3 Resource Configuration .................................................................... 60
3.3.1 PCI* Autoconfiguration.......................................................... 60
3.4 System Management BIOS (SMBIOS)................................................. 61
3.5 Legacy USB Support ........................................................................ 62
3.6 BIOS Updates ................................................................................. 63
3.6.1 Language Support ................................................................ 63
3.6.2 Custom Splash Screen .......................................................... 63
3.7 BIOS Recovery................................................................................ 64
3.8 Boot Options................................................................................... 64
3.8.1 Optical Drive Boot ................................................................ 64
3.8.2 Network Boot....................................................................... 64
3.8.3 Booting Without Attached Devices........................................... 65
3.8.4 Changing the Default Boot Device During POST ........................ 65
3.9 Adjusting Boot Speed....................................................................... 65
3.9.1 Peripheral Selection and Configuration..................................... 65
3.9.2 BIOS Boot Optimizations ....................................................... 66
3.10 BIOS Security Features .................................................................... 67
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 69
4.2 BIOS Beep Codes ............................................................................ 69
4.3 Front-panel Power LED Blink Codes .................................................... 70
4.4 BIOS Error Messages ....................................................................... 70
4.5 Port 80h POST Codes ....................................................................... 71
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 77
5.1.1 Safety Standards.................................................................. 77
5.1.2 European Union Declaration of Conformity Statement ................ 78
5.1.3 Product Ecology Statements................................................... 79
5.1.4 EMC Regulations .................................................................. 83
5.1.5 Product Certification Markings (Board Level)............................. 84
5.2 Battery Disposal Information............................................................. 85
vi
Contents
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel and DIMM Configuration ........................................... 18
4. Back Panel Audio Connectors ............................................................ 24
5. LAN Connector LED Locations ............................................................ 26
6. Thermal Sensors and Fan Headers ..................................................... 28
7. Location of the Standby Power Indicator LED ....................................... 35
8. Detailed System Memory Address Map ............................................... 38
9. Back Panel Connectors ..................................................................... 41
10. Component-side Connectors and Headers ........................................... 42
11. Connection Diagram for Front Panel Header ........................................ 48
12. Connection Diagram for Front Panel USB Headers ................................ 50
13. Connection Diagram for IEEE 1394a Header ........................................ 51
14. Location of the BIOS Configuration Jumper Block ................................. 52
15. Board Dimensions ........................................................................... 53
16. Localized High Temperature Zones..................................................... 56
Tables
1. Feature Summary.............................................................................. 9
2. Board Components Shown in Figure 1 ................................................ 12
3. Supported Memory Configurations ..................................................... 16
4. Audio Jack Retasking Support ........................................................... 23
5. LAN Connector LED States ................................................................ 26
6. Effects of Pressing the Power Switch .................................................. 29
7. Power States and Targeted System Power........................................... 30
8. Wake-up Devices and Events ............................................................ 31
9. System Memory Map ....................................................................... 39
10. Component-side Connectors and Headers Shown in Figure 10................ 43
11. Front Panel Audio Header for HD Audio ............................................... 44
12. Front Panel Audio Header for AC ’97 Audio .......................................... 44
13. Serial ATA Connectors ...................................................................... 44
14. Serial Port Header ........................................................................... 44
15. PATA Connector (44-Pin) .................................................................. 45
16. S/PDIF Header ................................................................................ 45
17. Chassis Intrusion Header .................................................................. 46
18. Processor (4-Pin) Fan Header ............................................................ 46
19. Front, Rear, and Auxiliary Chassis Fan Headers.................................... 46
20. Processor Core Power Connector........................................................ 47
21. Main Power Connector...................................................................... 47
22. Front Panel Header .......................................................................... 48
23. States for a One-Color Power LED ...................................................... 49
24. States for a Two-Color Power LED...................................................... 49
25. Alternate Front Panel Power LED Header ............................................. 50
26. BIOS Setup Configuration Jumper Settings.......................................... 52
27. Recommended Power Supply Current Values ....................................... 54
vii
28. Fan Header Current Capability........................................................... 54

29. Thermal Considerations for Components ............................................. 56
30. Intel Desktop Board DP43BF Environmental Specifications..................... 57
31. BIOS Setup Program Menu Bar.......................................................... 60
32. BIOS Setup Program Function Keys.................................................... 60
33. Acceptable Drives/Media Types for BIOS Recovery ............................... 64
34. Boot Device Menu Options ................................................................ 65
35. Supervisor and User Password Functions............................................. 67
36. BIOS Beep Codes ............................................................................ 69
37. Front-panel Power LED Blink Codes .................................................... 70
38. BIOS Error Messages ....................................................................... 70
39. Port 80h POST Code Ranges.............................................................. 71
40. Port 80h POST Codes ....................................................................... 72
41. Typical Port 80h POST Sequence........................................................ 75
42. Safety Standards............................................................................. 77
43. Lead-Free Board Markings ................................................................ 82
44. EMC Regulations ............................................................................. 83
45. Product Certification Markings ........................................................... 84
viii
1 Product Description
1.1 Overview
1.1.1 Feature Summary

Table 1 summarizes the major features of Intel Desktop Board DP43BF.
Table 1. Feature Summary

Form Factor ATX (9.60 inches by 11.60 inches [243.84 millimeters by 294.64 millimeters])
Processor Support for the following:
• Intel® Core™2 Quad processor Q6000/Q8000/Q9000 Series in an LGA775
socket
• Intel® Core™2 Duo processor E4000/E6000/E7000/E8000 Series in an LGA775
socket
• Intel® Pentium® Dual-Core processor E2000/E5000 Series in an LGA775 socket
• Intel® Celeron® Dual-Core processor 400/1000 Series in an LGA775 socket
• Intel® Xeon® processor 3000/X3000 Series in an LGA775 socket
Memory • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for up to 8 GB of system memory using non-ECC DDR3 800, 1066, or
1333 (OC) MHz DIMMs
Chipset Intel® P43 Express Chipset, consisting of:
• Intel® 82P43 Graphics and Memory Controller Hub (MCH)
• Intel® 82801JIR I/O Controller Hub (Intel ICH10R)
Audio 10-channel (7.1 + 2) audio subsystem using Realtek ALC888S-VC high definition
audio codec
Legacy I/O Control ITE IT8721F based legacy I/O controller for hardware management and serial and
PS/2* ports
Peripheral • Twelve USB 2.0 ports:
Interfaces ― Six ports are implemented with stacked back panel connectors
― Six ports are routed to three separate front panel headers
• Two IEEE 1394a ports:
― One back panel port
― One front panel header
• Five internal Serial ATA (SATA) interfaces
• One external Serial ATA (eSATA) interface
• One Parallel ATA (PATA) connector
• One serial port header
• PS/2 keyboard/mouse ports on the back panel
continued
9
Table 1. Feature Summary

LAN Support Gigabit (10/100/1000 Mb/s) LAN subsystem using the Broadcom* BCM57788
Gigabit Ethernet Controller
BIOS • Intel® BIOS (resident in the SPI Flash device)
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available • Support for PCI* Local Bus Specification Revision 2.3
PC Technology • Support for PCI Express* Revision 1.1
• Suspend to RAM support
• Wake on PCI, PCI Express, PS/2 devices, serial port, front panel, USB ports,
and LAN
Expansion • One PCI Express 2.0 x16 bus add-in card connector
Capabilities • Two PCI Express 1.0 x1 bus add-in card connectors
• Four Conventional PCI bus add-in card connectors
Hardware Monitor • Voltage sense to detect out of range power supply voltages
Subsystem • Thermal sense to detect out of range thermal values
• Three fan headers
• Three fan sense inputs used to monitor fan activity
10
Product Description
1.1.2 Board Layout

Figure 1 shows the location of the board’s major components.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
11
Table 2. Board Components Shown in Figure 1

Item/callout
from Figure 1 Description
A Conventional PCI bus add-in card connector
B S/PDIF audio header
C Conventional PCI bus add-in card connector
D Conventional PCI bus add-in card connector
E Conventional PCI bus add-in card connector
F Speaker
G PCI Express x1 connector
H PCI Express x16 connector
I Conventional PCI bus add-in card connector
J Battery
K Back panel connectors
L Front panel IEEE 1394a header
M Processor core power connector (2 x 2)
N Rear chassis fan header
O LGA775 processor socket
P Intel 82P43 MCH
Q Processor fan header
R DIMM Channel A sockets
S DIMM Channel B sockets
T BIOS setup configuration jumper block
U Front panel header
V Alternate front panel Power LED header
W Main power connector (2 x 12)
X Parallel ATA connector
Y Front chassis fan header
Z Standby power LED
AA Intel 82801JIR I/O Controller Hub (Intel ICH10R)
BB Auxiliary chassis fan header
CC Serial ATA connectors (5)
DD Front panel USB headers
EE Intel® High Definition Audio Link header
FF Chassis intrusion header
GG Serial port header
HH Front panel audio header
12
Product Description
1.1.3 Block Diagram

Figure 2 is a block diagram of the board’s major functional areas.
Figure 2. Block Diagram
13
1.2 Legacy Considerations

This board differs from other Intel® Desktop Board products, with specific changes
including (but not limited to) the following:
• No floppy drive connector
• No parallel port connector on the back panel
• No serial port connector on the back panel
1.3 Online Support

To find information about… Visit this World Wide Web site:
Intel Desktop Board DP43BF http://www.intel.com/products/motherboard/DP43BF/index.htm
Desktop Board Support http://www.intel.com/support/motherboards/desktop
Available configurations for the Intel http://www.intel.com/products/motherboard/DP43BF/index.htm
Desktop Board DP43BF
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
14
Product Description
1.4 Processor
The board is designed to support the following processors:
• Intel® Core™2 Quad processor Q6000/Q8000/Q9000 Series in an LGA775 socket
• Intel® Core™2 Duo processor E4000/E6000/E7000/E8000 Series in an LGA775
socket
• Intel® Pentium® Dual-Core processor E2000/E5000 Series in an LGA775 socket
• Intel® Celeron® Dual-Core processor 400/1000 Series in an LGA775 socket
• Intel® Xeon® processor 3000/X3000 Series in an LGA775 socket
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W. The processors listed above are only
supported when falling within the wattage requirements of the board. See the Intel
web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:

Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
Use only ATX12V-compliant power supplies.
For information about Refer to

Power supply connectors Section 2.2.2.3, page 47
15
1.5 System Memory

The board has four DIMM sockets and supports the following memory features:
• 1.8 V DDR3 800 MHz, DDR3 1066 MHz, and DDR3 1333 (OC) MHz SDRAM DIMMs
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 8 GB maximum total system memory (with 2 Gb memory technology). Refer to
Section 2.1.1 on page 37 for information on the total amount of addressable
memory.
• Minimum total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations

DIMM Configuration SDRAM SDRAM Organization Number of SDRAM
(Note)
Capacity Density Front-side/Back-side Devices
1024 MB SS 1 Gbit 1 Gb x8/empty 8
2048 MB DS 1 Gbit 1 Gb x8/1 Gb x8 16
2048 MB SS 2 Gbit 2 Gb x8/empty 8
4096 MB DS 2 Gbit 2 Gb x8/2 Gb x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
16
Product Description
1.5.1 Memory Configurations

The Intel 82P43 MCH supports the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/
cs-011965.htm
17
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
18
Product Description
1.6 Intel® P43 Express Chipset

The Intel P43 Express chipset consists of the following devices:
• Intel 82P43 Memory Controller Hub (MCH) with Direct Media Interface (DMI)
interconnect
• Intel 82801JIR I/O Controller Hub (ICH10R)
The MCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The ICH10R is a centralized controller for the board’s I/O paths.
The chipset supports the following features:
• USB
• Serial ATA
• Parallel ATA
The Intel P43 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1.1 PCI Express x16 Graphics

The MCH also supports an add-in discrete graphics card through the PCI Express 2.0
graphics connector.
• PCI Express 2.0 x16:
⎯ Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (500 MB/s total). Maximum theoretical bandwidth on interface of
4 GB/s in each direction simultaneously, for an aggregate of 8 GB/s when
operating in x16 mode.
⎯ Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (1000 MB/s total). Maximum theoretical bandwidth on interface of
8 GB/s in each direction simultaneously, for an aggregate of 16 GB/s when
operating in x16 mode.
PCI Express technology http://www.pcisig.com
1.6.2 USB
The board supports up to twelve USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers.
The Intel ICH10R provides the USB controller for all ports. The port arrangement is as
follows:
• Six ports are implemented with stacked back panel connectors
• Six ports are routed to three separate front panel USB headers
The location of the USB connectors on the back panel Figure 9, page 41
The location of the front panel USB headers Figure 10, page 42
19
1.6.3 ATA Support

The board provides seven ATA interface connectors:
• One PATA connector that supports two devices
• Five SATA connectors that support one device per connector
• One eSATA connector
1.6.3.1 PATA Interface

The discrete PATA controller has one bus-mastering PATA interface that is accessible
through a 44-pin connector. The PATA interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/s.
• Ultra DMA: DMA protocol on ATA bus supporting host and target throttling and
transfer rates of up to 33 MB/s.
• ATA-66: DMA protocol on ATA bus supporting host and target throttling and
transfer rates of up to 66 MB/s. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
• ATA-100: DMA protocol on ATA bus allows host and target throttling. The
controller’s ATA-100 logic can achieve read transfer rates up to 100 MB/s and write
transfer rates up to 88 MB/s.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The PATA interface also supports ATAPI devices (such as optical drives) and ATA
devices using the transfer modes.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector
(ECHS) translation modes. The drive reports the transfer rate and translation mode to
the BIOS.

The location of the PATA connector Figure 10, page 42
20
Product Description
1.6.3.2 SATA Interfaces

The board provides six SATA connectors through the PCH, which support one device
per connector:
• Five internal SATA connectors (black)
• One eSATA connector (red) on the back panel for external connectivity
The Intel ICH10R SATA controller provides independent SATA ports with a theoretical
maximum transfer rate of 3 Gb/s per port. A point-to-point interface is used for host
to device connections.
For compatibility, the underlying SATA functionality is transparent to the operating

system. The SATA controller supports IDE and AHCI (Microsoft Windows Vista* only)
configuration and can operate in both legacy and native modes. In legacy mode,
standard ATA I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode,
standard Conventional PCI bus resource steering is used. Native mode is the
preferred mode for configurations using the Windows* XP and Windows Vista
operating systems.

Obtaining AHCI driver Section 1.3, page 14
The location of the SATA connectors Figure 10, page 42
1.6.3.2.1 Serial ATA RAID
The board supports the Intel® Matrix Storage Technology which provides the following
RAID (Redundant Array of Independent Drives) levels:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
1.6.3.2.2 Intel® Rapid Recover Technology
The board incorporates the Intel® Rapid Recover Technology (Intel® RRT). Intel®
Rapid Recover Technology is a feature of Intel® Matrix Storage Manager. It uses
RAID 1 (mirroring) functionality to copy data from a designated master drive to a
designated recovery drive. The master drive data can be copied to the recovery drive
either continuously or on request.
When using the continuous update policy, changes made to the data on the master
drive while the recovery drive is disconnected or offline are automatically copied to the
recovery drive when it is reconnected. When using the on request update policy, the
master drive data can be restored to a previous state by copying the data on the
recovery drive back to the master drive.

® ®
Intel Matrix Storage and Intel Rapid Recovery Technology http://www.intel.com/design/chipsets/
matrixstorage_sb.htm
21
1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
1.8 Legacy I/O Controller

The Legacy I/O controller provides the following features:
• One serial port header
• PS/2-style keyboard/mouse interfaces
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• Conventional PCI bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1 Serial Port

The board has one serial port header located on the component side of the board. The
serial port supports data transfers at speeds up to 115.2 kb/s with BIOS support.

The location of the serial port header Figure 10, page 42
The signal names of the serial port header Table 14, page 44
22
Product Description
1.9 Audio Subsystem

The audio subsystem consists of the following:
• Intel 82801JIR (Intel ICH10R)
• Realtek ALC888S-VC audio codec
The audio subsystem supports the following audio connectors and headers:
• S/PDIF header
• Front panel audio header with support for Intel® High Definition Audio (Intel® HD
Audio) and AC ‘97 audio
• Back panel audio connectors
NOTE
Systems built with an AC ‘97 audio front panel will not be able to obtain the Microsoft
Windows Vista logo.
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Retasking Support

Micro- Head- Front Side Rear Center/
Audio Jack phone phones Speaker Line In Surround Surround Sub
FP Green Default Ctrl panel
FP Pink Default
Rear Blue Ctrl panel Default Ctrl panel
Rear Green Ctrl panel Default
Rear Pink Default
Rear Black Default
Rear Orange Default
23
1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

Obtaining audio software and drivers Section 1.2, page 14
1.9.2 Audio Connectors and Headers

The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors and headers are configurable through the audio
device drivers. The available configurable back panel audio connectors are shown in
Figure 4.
Item Description
A Rear surround
B Center channel and LFE (subwoofer) audio out
C S/PDIF digital audio out (optical)
D Headphones/line in/side surround
E Mic in
F Headphones/front speaker
Figure 4. Back Panel Audio Connectors

The location of the front panel audio header Figure 10, page 42
The signal names of the front panel audio header Table 11, page 44
24
Product Description
1.10 LAN Subsystem

The LAN subsystem consists of the following:
• Broadcom BCM57788 Gigabit Ethernet Controller (10/100/1000 Mb/s)
• Intel 82801JIR (Intel ICH10R)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between Intel ICH10R and the LAN controller
• Conventional PCI bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software

LAN software and drivers http://downloadcenter.intel.com
1.10.1 Broadcom BCM57788 Gigabit Ethernet Controller

The Broadcom BCM57788 Gigabit Ethernet Controller supports the following features:
• PCI Express link
• 10/100/1000 IEEE 802.3 compliant
• Compliant to IEEE 802.3x flow control support
• 802.1p
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Wake-on-LAN (WOL) support meeting ACPI requirements
• Full device driver compatibility
• PCI Express power management support
1.10.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

Obtaining LAN software and drivers Section 1.2, page 14
25
1.10.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 5. LAN Connector LED States
LED Color State Condition
N/A Off LAN link is not established
Link (A) On LAN link is established

Green
Blinking LAN activity occurring
N/A Off 10 Mb/s data rate
Speed (B) Green On 100 Mb/s data rate
Yellow On 1000 Mb/s data rate
26
Product Description
1.11 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.11.1 Hardware Monitoring and Fan Control

The features of the hardware monitoring and fan control include:
• Fan speed control controllers and sensors integrated into the Intel ICH10R
• Remote thermal diode sensor for ambient temperature sensing
• Thermal sensors in the processor, Intel 82P43 MCH, and Intel 82801JIR (Intel
ICH10R)
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 V, +1.125 V, and
+VCCP) to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the
fan speed according to thermal conditions
1.11.2 Fan Monitoring

Fan monitoring can be implemented using Intel® Desktop Utilities or third-party
software.

The functions of the fan headers Section 1.12.2.2, page 33
1.11.3 Chassis Intrusion Detection

The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.

The location of the chassis intrusion header Figure 10, page 42
27
1.11.4 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan header
B Thermal diode, located on the processor die
C Thermal diode, located on the MCH die
D Processor fan header
E Front chassis fan header
F Thermal diode, located on the Intel ICH10R die
G Auxiliary chassis fan header
Figure 6. Thermal Sensors and Fan Headers
NOTE
The minimum thermal reporting threshold for the MCH is 66 °C. The MCH thermal
sensor will display 66 °C until the temperature rises above this point.
28
Product Description
1.12 Power Management

Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan headers
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB (S1 and S3 only)
⎯ Power Management Event signal (PME#) wake-up support
⎯ WAKE# signal wake-up support
⎯ Wake from PS/2 device
⎯ Wake from serial port
1.12.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with the board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 8 on page 31)
• Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch

If the system is in this …and the power switch
state… is pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than four seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than four seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)
29
1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 7 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 7. Power States and Targeted System Power

Global Processor Targeted System
States Sleeping States States Device States Power (Note 1)
G0 – working S0 – working C0 – working D0 – working Full power > 50 W
state state.
G0 – idle state S0 – idle state C3 – sleep D0 Full power < 50 W
G0 – idle state S0 – idle state C4 – deep D0 Full power < 50 W
sleep
G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – 5 W < power < 50 W
state stopped grant device
specification
specific.
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 4.7 W (Note 2)
state RAM. Context except for
saved to RAM. wake-up logic.
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 2.7 W (Note 2)
state disk. Context except for
saved to disk. wake-up logic.
G2/S5 S5 – Soft off. No power D3 – no power Power < 2.7 W (Note 2)
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system.
mechanical off. system. wake-up logic, Service can be performed
AC power is except when safely.
disconnected provided by
from the battery or
computer. external source.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system inclusive of Wake
on LAN allowance of 0.7 W. Intel Management Engine Interface (Intel MEI) is assumed to be in Wake on
LAN mode.
30
Product Description
1.12.1.2 Wake-up Devices and Events

Table 8 lists the devices or specific events that can wake the computer from specific
states.
Table 8. Wake-up Devices and Events

These devices/events can wake up the computer… …from this state
LAN S1, S3, S4, S5
PME# signal S1, S3, S4, S5
Power switch S1, S3, S4, S5
RTC alarm S1, S3, S4, S5
Serial port S1, S3
USB S1, S3
WAKE# signal S1, S3, S4, S5
PS/2 port S1, S3, S4, S5
Notes:
• S4 implies operating system support only.
• USB ports are turned off during S4/S5 states.
• The PCI Express WAKE# signal is controlled by the enable/disable option in the BIOS.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
31
1.12.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB (S1 and S3 only)
• Power Management Event signal (PME#) wake-up support
• WAKE# signal wake-up support
• Wake from PS/2 devices
• Wake from serial port
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB technologies from an ACPI state requires an operating
system that provides full ACPI support.
1.12.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.

The location of the main power connector Figure 10, page 42
The signal names of the main power connector Table 21, page 47
32
Product Description
1.12.2.2 Fan Headers

The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 state.
• The fans are off when the board is off or in the S3, S4, or S5 state.
• The processor fan header is wired to a fan tachometer input. The front and rear fan
headers each have independent tachometer input to the hardware monitoring and
fan control device. All fan headers support closed-loop fan control that can adjust
the fan speed according to thermal conditions.
• All fan headers have a +12 V DC connection.
• The system fan headers support auto-detection for 4-pin and 3-pin system fans. If
a 4-pin system fan is detected, PWM control is used. If a 3-pin fan is detected,
linear voltage control is used.
The locations of the fan headers and thermal sensors Figure 6, page 28
The signal names of the fan headers Table 18, page 46
1.12.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line from the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing LAN wake capabilities can damage the power
supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
• The PCI Express WAKE# signal
• The PCI bus PME# signal for PCI 2.3 compliant LAN designs
⎯ By Ping
⎯ Magic Packet
• The onboard LAN subsystem
33
1.12.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line from the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 8 on page 31 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.3 compliant add-in cards and drivers.
1.12.2.5 Wake from USB

USB bus activity wakes the computer from ACPI S1 or S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB
and support in the operating system.
1.12.2.6 PME# Signal Wake-up Support

When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in the BIOS).
1.12.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S1, S3, S4, or S5 state.
1.12.2.8 Wake from PS/2 Devices

PS/2 device activity wakes the computer from an ACPI S1, S3, S4, or S5 state. When
the computer is in an S4 state, any key can be used to wake the computer provided a
supported operating system is installed. When the computer is in the S5 state, the
only PS/2 activity that will wake the computer is the either the alt-PrtScrn key
combination or the “Power” key that is available on some keyboards. The BIOS can be
used to toggle between either of the key combinations.
34
Product Description
1.12.2.9 Wake from Serial Port

Serial port activity wakes the computer from an ACPI S1 or S3 state.
1.12.2.10 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power
indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 7. Location of the Standby Power Indicator LED
35
1.12.3 ENERGY STAR* 5.0, e-Standby, and ErP

Compliance
The US Department of Energy and the US Environmental Protection Agency have
continually revised the ENERGY STAR requirements. Intel has worked directly with
these two governmental agencies in the definition of new requirements.
Intel Desktop Board DP43BF meets the following program requirements in an
adequate system configuration, including appropriate selection of an efficient power
supply:
• Energy Star v5.0, category B
• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive 2009 (ErP)

ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/
Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/
pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainable-product-
policy/ecodesign/index_en.htm
36
2 Technical Reference
2.1 Memory Map
2.1.1 Addressable Memory

The board utilizes 8 GB of addressable system memory. Typically the address space
that is allocated for Conventional PCI bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total
system memory). On a system that has 8 GB of system memory installed, it is not
possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
• BIOS/ SPI Flash (32 Mb)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• Front side bus interrupts (17 MB)
• PCI Express configuration space (256 MB)
• MCH base address registers, internal graphics ranges, PCI Express ports (up to
512 MB)
• Memory-mapped I/O that is dynamically allocated for Conventional PCI and PCI
Express add-in cards
• Base graphics memory support (1 MB or 8 MB)
• Intel MEI single channel (8 MB) or dual channel (16 MB)
37
The amount of installed memory that can be used will vary based on add-in cards,
BIOS settings, and operating system installed. Figure 8 shows a schematic of the
system memory map. All installed system memory can be used when there is no
overlap of system addresses.
Figure 8. Detailed System Memory Address Map
38
Technical Reference
Table 9 lists the system memory map.
Table 9. System Memory Map

Address Range (decimal) Address Range (hex) Size Description
1024 K - 8388608 K 100000 - 3FFFFFFFF 8191 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the Conventional
PCI bus). Dependent on video
adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
39
2.2 Connectors and Headers
CAUTION
Only the following connectors have overcurrent protection: Back panel and front panel
USB, PS/2, and IEEE 1394a.
The other internal connectors/headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors/headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB or IEEE 1394 header single wire connectors
may eventually overload the overcurrent protection and cause damage to the board.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
This section describes the board’s connectors and headers. The connectors and
headers can be divided into these groups:
• Back panel I/O connectors (see page 41)
• Component-side connectors and headers (see page 42)
40
Technical Reference
2.2.1 Back Panel Connectors

Figure 9 shows the location of the back panel connectors.
Item Description
A PS/2 keyboard/mouse port
B PS/2 keyboard/mouse port
C eSATA connector
D USB ports (2)
E IEEE 1394a connector
F USB ports (2)
G LAN
H USB ports (2)
I Rear surround
J Center channel and LFE (subwoofer) audio out
K S/PDIF digital audio out (optical)
L Headphones/line in/side surround
M Headphones/front speaker
N Mic in
Figure 9. Back Panel Connectors
NOTES
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
41
2.2.2 Component-side Connectors and Headers

Figure 10 shows the locations of the component-side connectors and headers.
Figure 10. Component-side Connectors and Headers
42
Technical Reference
Table 10 lists the component-side connectors and headers identified in Figure 10.
Table 10. Component-side Connectors and Headers Shown in Figure 10

Item/callout
from Figure 10 Description
A Conventional PCI bus add-in card connector
B S/PDIF header
C Conventional PCI bus add-in card connector
D Conventional PCI bus add-in card connector
E Conventional PCI bus add-in card connector
F PCI Express x1 connector
G PCI Express x16 connector
H PCI Express x1 connector
I Front panel IEEE 1394a header
J Processor core power connector (2 x 2)
K Rear chassis fan header
L Processor fan header
M Front panel header
N Alternate front panel Power LED header
O Main power connector (2 x 12)
P Parallel ATA connector
Q Front chassis fan header
R Auxiliary chassis fan header
S Serial ATA connectors (5)
T Front panel USB header
U Front panel USB header
V Front panel USB header
W Intel High Definition Audio Link header
X Chassis intrusion header
Y Serial port header
Z Front panel audio header
43
2.2.2.1 Signal Tables for the Connectors and Headers
Table 11. Front Panel Audio Header for HD Audio

Pin Signal Name Pin Signal Name
1 [Port 1] Left channel 2 Ground
3 [Port 1] Right channel 4 PRESENCE# (Dongle present)
5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 12. Front Panel Audio Header for AC ’97 Audio

1 MIC 2 AUD_GND
3 MIC_BIAS 4 AUD_GND
5 FP_OUT_R 6 FP_RETURN_R
7 N/A 8 Key (no pin)
9 FP_OUT_L 10 FP_RETURN_L
Table 13. Serial ATA Connectors

Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
Table 14. Serial Port Header

1 DCD (Data Carrier Detect) 2 RXD# (Receive Data)
3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready)
5 Ground 6 DSR (Data Set Ready)
7 RTS (Request to Send) 8 CTS (Clear to Send)
9 RI (Ring Indicator) 10 Key (no pin)
44
Technical Reference
Table 15. PATA Connector (44-Pin)

1 #Reset 2 GND
3 Data 7 4 Data 8
5 Data 6 6 Data 9
7 Data 5 8 Data 10
9 Data 4 10 Data 11
11 Data 3 12 Data 12
19 GND 20 Key (no pin)
21 DMA Request 22 GND
23 #IOW 24 GND
25 #IOR 26 GND
27 IO Chrdy 28 Cable Select
29 DMA Acknowledge 30 GND
31 IRQ14 32 #IOCS16
33 Addr 1 34 Passed Diagnostics
35 Addr 0 36 Addr 2
37 #CS0 (1F0-1F7) 38 #CS1 (3f6-3f7)
39 #Active (LED driver) 40 GND
41 +5V_DC (logic) 42 +5V_DC (motor)
43 GND 44 Type (GND = ATA)
Table 16. S/PDIF Header

Pin Signal Name
1 Ground
2 S/PDIF out
3 Key (no pin)
4 +5 VDC
45
Table 17. Chassis Intrusion Header

Pin Signal Name
1 Intruder#
2 Ground
Table 18. Processor (4-Pin) Fan Header

Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Table 19. Front, Rear, and Auxiliary Chassis Fan Headers

Pin 4-Wire Support Pin 3-Wire Support
1 Ground 3 Ground
2 +12 V 2 FAN_POWER
3 FAN_TACH 1 FAN_TACH
4 FAN_CONTROL N/A N/A
2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:
• PCI Express 2.0 x16: one PCI Express 2.0 x16 connector supporting simultaneous
transfer speeds up to 8 GB/s of peak bandwidth per direction and up to 16 GB/s
concurrent bandwidth.
• PCI Express 1.1 x1: two PCI Express 1.1 x1 connectors. The x1 interface
supports simultaneous transfer speeds up to 250 MB/s of peak bandwidth per
direction and up to 2 GB/s concurrent bandwidth.
• Conventional PCI (rev 2.3 compliant) bus: four Conventional PCI bus add-in card
connectors.
Note the following considerations for the Conventional PCI bus connectors:
• The Conventional PCI bus connectors are bus master capable.
• SMBus signals are routed to the Conventional PCI bus connectors. This enables
Conventional PCI bus add-in boards with SMBus support to access sensor data on
the desktop board. The specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
⎯ The SMBus data line is connected to pin A41.
46
Technical Reference
2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and
24 unconnected.
• Processor core power – a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
Table 20. Processor Core Power Connector

1 Ground 2 Ground
3 +12 V 4 +12 V
Table 21. Main Power Connector

1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V (Note) 23 +5 V (Note)
12 2 x 12 connector detect (Note) 24 Ground (Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

Power supply considerations Section 2.5.1, page 54
47
2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 22 lists the signal
names of the front panel header. Figure 11 is a connection diagram for the front panel
header.
Table 22. Front Panel Header

In/ In/
Pin Signal Out Description Pin Signal Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED 2 HDR_BLNK_GRN Out Front panel green
pull-up to +5 V LED
3 HDA# Out Hard disk active 4 HDR_BLNK_YEL Out Front panel yellow
LED LED
Reset Switch On/Off Switch
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
Figure 11. Connection Diagram for Front Panel Header
48
Technical Reference
2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
• A Serial ATA hard drive connected to an onboard Serial ATA connector
• A Parallel ATA hard drive connected to an onboard Parallel ATA connector
2.2.2.4.2 Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.4.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 23 shows the
possible states for a one-color LED. Table 24 shows the possible states for a two-color
LED.
Table 23. States for a One-Color Power LED

LED State Description
Off Power off/sleeping
Steady Green Running
Table 24. States for a Two-Color Power LED

LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 23 and Table 24 are suggested colors only. Actual LED
colors are chassis-specific.
2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
49
2.2.2.5 Alternate Front Panel Power LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 25. Alternate Front Panel Power LED Header

Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
2.2.2.6 Front Panel USB Headers

Figure 12 is a connection diagram for the front panel USB headers.
NOTE
• The +5 V DC power on the USB headers is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 12. Connection Diagram for Front Panel USB Headers
50
Technical Reference
2.2.2.7 Front Panel IEEE 1394a Header

Figure 13 is a connection diagram for the IEEE 1394a header.
NOTE
• The +12 V DC power on the IEEE 1394a header is fused.
• The IEEE 1394a header provides one IEEE 1394a port.
Figure 13. Connection Diagram for IEEE 1394a Header
51
2.3 BIOS Configuration Jumper Block

CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 14 shows the location of the BIOS configuration jumper block. The jumper
determines the BIOS Setup program’s mode. Table 26 lists the jumper settings for the
three modes: normal, configure, and recovery. When the jumper is set to configure
mode and the computer is powered-up, the BIOS compares the processor version and
the microcode version in the BIOS and reports if the two match.
Figure 14. Location of the BIOS Configuration Jumper Block
Table 26. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration
Normal 1-2 The BIOS uses current configuration information and passwords
for booting.
Configure 2-3 After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
Recovery None The BIOS attempts to recover the BIOS configuration. See
Section 3.7 for more information on BIOS recovery.
52
Technical Reference
2.4 Mechanical Considerations
2.4.1 Form Factor

The board is designed to fit into an ATX-form-factor chassis. Figure 15 illustrates the
mechanical form factor for the board. Dimensions are given in inches [millimeters].
The outer dimensions are 9.60 inches by 11.60 inches [243.84 millimeters by
294.64 millimeters]. Location of the I/O connectors and mounting holes are in
compliance with the ATX specification.
Figure 15. Board Dimensions
53
2.5 Electrical Considerations

2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a system consisting of a supported 65 W processor (see Section 1.4
on page 15 for a list of supported processors), 1 GB DDR2 RAM, one hard disk drive,
one optical drive, and all board peripherals enabled, the minimum recommended
power supply is 135W. Table 27 lists the recommended power supply current values.
Table 27. Recommended Power Supply Current Values

Output Voltage 3.3 V 5V 12 V1 12 V2 -12 V 5 VSB
Current 2.38 A 3.17 A 5.92 A 2.95 A 0.04 A 0.64 A
2.5.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 28 lists the current capability of the fan headers.
Table 28. Fan Header Current Capability

Fan Header Maximum Available Current
Processor fan 2.0 A
Front chassis fan 1.5 A
Rear chassis fan 1.5 A
Auxiliary chassis fan 1.5 A
54
Technical Reference
2.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (all three
expansion slots filled) must not exceed 8 A.
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 16) can reach a temperature of up to 85 oC in
an open chassis.
55
Figure 16 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel 82P43 MCH
D Intel 82801JIR (Intel ICH10R)
Figure 16. Localized High Temperature Zones
Table 29 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 29. Thermal Considerations for Components

Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82P43 MCH 103 oC (under bias)

Intel 82801JIR (Intel ICH10R) 112 oC (under bias)
56
Technical Reference

Processor datasheets and specification updates Section 1.2, page 14
Intel P43 Express chipset datasheets, specification updates, http://www.intel.com/products/chip
and design guides sets/index.htm
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332,
Method I Case 1 50% electrical stress, 40 ºC ambient. The MTBF prediction is used to
estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 40 ºC. The Intel Desktop Board
DP43BF MTBF is 426,167.42 hours.
2.8 Environmental
Table 30 lists the environmental specifications for the board.
Table 30. Intel Desktop Board DP43BF Environmental Specifications

Parameter Specification
Temperature
Non-Operating -20 °C to +70 °C at 95% humidity
Operating 0 °C to +50 °C at 90% humidity
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product weight (pounds) Free fall (inches) Velocity change
(inches/second²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
57
58
3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as RKG4310H.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 52 shows how to put the board in configure mode.
59
Table 31 lists the BIOS Setup program menu features.
Table 31. BIOS Setup Program Menu Bar

Maintenance Main Advanced Security Power Boot Exit
Clears Displays Configures Sets Configures Selects boot Saves or
passwords and processor advanced passwords power options discards
displays and memory features and security management changes to
processor configuration available features features and Setup
information through the power supply program
chipset controls options
Table 32 lists the function keys available for menu screens.
Table 32. BIOS Setup Program Function Keys

BIOS Setup Program
Function Key Description
<←> or <→> Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓> Selects an item (Moves the cursor up or down)
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 32 Mb (4096 KB)
flash memory device.
3.3 Resource Configuration

3.3.1 PCI* Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.
60
Overview of BIOS Features
3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
61
3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel® Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.
62
3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
• Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.
• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB drive), or an optical drive.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb/
CS-022312.htm.
3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the
Intel web site for details.
3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit or Intel®
Integrator Assistant that are available from Intel can be used to create a custom
splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.

Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/
®
Additional Intel software tools http://developer.intel.com/products/motherboard/DP43BF/tools.htm
and
http://developer.intel.com/design/motherbd/software.htm
63
3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 33 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 33. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?
Optical drive connected to the Serial ATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No
Legacy diskette drive (with a 1.44 MB diskette) connected to the No
legacy diskette drive interface

BIOS recovery http://support.intel.com/support/motherboards/desktop/
sb/CS-023360.htm
3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical
drive, removable drive, or the network. The default setting is for the optical drive to
be the first boot device, the hard drive second, removable drive third, and the network
fourth.
3.8.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable
CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the
optical drive is listed as a boot device. Boot devices are defined in priority order.
Accordingly, if there is not a bootable CD in the optical drive, the system will attempt
to boot from the next defined drive.
3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
64
3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that, after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse
3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices (as set in the BIOS setup program’s
Boot Device Priority Submenu). Table 34 lists the boot device menu options.
Table 34. Boot Device Menu Options

Boot Device Menu Function Keys Description
<↑> or <↓> Selects a default boot device
<Enter> Exits the menu, saves changes, and boots from the selected
device
<Esc> Exits the menu without saving changes
3.9 Adjusting Boot Speed

These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Optimized BIOS boot parameters
3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” in less than
eight seconds that minimizes hard drive startup delays.
• Select an optical drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
• Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
65
3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.
• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
• In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced
Menu in the Drive Configuration Submenu of the BIOS Setup program).
66
3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
• The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 35 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 35. Supervisor and User Password Functions

Password Password
Password Supervisor to Enter During
Set Mode User Mode Setup Options Setup Boot
Neither Can change all Can change all None None None
options (Note) options (Note)
Supervisor Can change all Can change a Supervisor Password Supervisor None
only options limited number
of options
User only N/A Can change all Enter Password User User
options Clear User Password
Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or
and user set options limited number Enter Password user user
of options
Note: If no password is set, any user can change all Setup options.
67
68
4 Error Messages and Beep Codes
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information
during POST.

The location of the onboard speaker Figure 1, page 11
4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s
speaker to beep an error message describing the problem (see Table 36).
Table 36. BIOS Beep Codes

Type Pattern Frequency
Processor initialization One 0.5 second beep when the CPU initialization 3270 Hz
complete process completes.
POST complete One 0.5 second beep when POST completes. 3270 Hz
BIOS update in progress None
Video error On-off (0.5 seconds each) two times, then 3270 Hz
3.0 second pause (off), entire pattern repeats When no VGA option ROM is
(beeps and pause) until the system is powered found.
off.
Memory error On-off (0.5 seconds each) three times, then 1280 Hz
3.0 second pause (off), entire pattern repeats
(beeps and pause) until the system is powered
off.
Thermal trip warning On-off (0.5 seconds each) four times, then 1280 Hz
(beeps and pause) until the sixteenth beep, then
ends.
69
4.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error message describing the problem (see Table 37).
Table 37. Front-panel Power LED Blink Codes

Type Pattern Note
Processor initialization On when the system powers up, then off for
complete 0.5 seconds.
POST complete On when the system powers up, then off for
0.5 seconds.
BIOS update in progress Off when the update begins, then on for
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
Video error On-off (0.5 seconds each) two times, then When no VGA option ROM is
3.0 second pause (off), entire pattern repeats found.
(blink and pause) until the system is powered
off.
Memory error On-off (0.5 seconds each) three times, then
(blinks and pause) until the system is powered
off.
Thermal trip warning On-off (0.5 seconds each) four times, then
(blinks and pause) until the sixteenth blink, then
ends.
4.4 BIOS Error Messages

Whenever a recoverable error occurs during POST, the BIOS displays an error
message describing the problem. Table 38 lists the error messages and provides a
brief description of each.
Table 38. BIOS Error Messages

Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
70
Error Messages and Beep Codes
4.5 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the
BIOS:
• Table 39 lists the Port 80h POST code ranges
• Table 40 lists the Port 80h POST codes themselves
• Table 41 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 39. Port 80h POST Code Ranges

Range Category/Subsystem
00 – 0F Debug codes: Can be used by any PEIM/driver for debug.
10 – 1F Host Processors: 1F is an unrecoverable CPU error.
20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 – 3F Recovery: 3F indicated recovery failure.
40 – 4F Reserved for future use.
50 – 5F I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 – 6F Reserved for future use (for new busses).
70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error.
80 – 8F Reserved for future use (new output console codes).
90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 – AF Reserved for future use (new input console codes).
B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 – CF Reserved for future use.
D0 – DF Boot device selection.
E0 – FF E0 – EE: Miscellaneous codes. See Table 40.
EF: Boot/S3 resume failure.
F0 – FF: FF processor exception.
71
Table 40. Port 80h POST Codes

POST Code Description of POST Operation
Host Processor
10 Power-on initialization of the host processor (Boot Strap Processor)
11 Host processor cache initialization (including APs)
12 Starting Application processor initialization
13 SMM initialization
Chipset
21 Initializing a chipset component
Memory
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
24 Programming timing parameters in the memory controller and the DIMMs
25 Configuring memory
26 Optimizing memory settings
27 Initializing memory, such as ECC init
28 Testing memory
PCI Bus
50 Enumerating PCI busses
51 Allocating resources to PCI bus
52 Hot Plug PCI controller initialization
53 – 57 Reserved for PCI Bus
USB
58 Resetting USB bus
59 Reserved for USB
ATA/ATAPI/SATA
5A Resetting PATA/SATA bus and all devices
5B Reserved for ATA
SMBus
5C Resetting SMBus
5D Reserved for SMBus
Local Console
70 Resetting the VGA controller
71 Disabling the VGA controller
72 Enabling the VGA controller
Remote Console
78 Resetting the console controller
79 Disabling the console controller
7A Enabling the console controller
continued
72
Table 40. Port 80h POST Codes (continued)

Keyboard (PS/2 or USB)
90 Resetting keyboard
91 Disabling keyboard
92 Detecting presence of keyboard
93 Enabling the keyboard
94 Clearing keyboard input buffer
95 Instructing keyboard controller to run Self Test (PS/2 only)
Mouse (PS/2 or USB)
98 Resetting mouse
99 Disabling mouse
9A Detecting presence of mouse
9B Enabling mouse
Fixed Media
B0 Resetting fixed media
B1 Disabling fixed media
B2 Detecting presence of a fixed media (IDE hard drive detection etc.)
B3 Enabling/configuring a fixed media
Removable Media
B8 Resetting removable media
B9 Disabling removable media
BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC Enabling/configuring a removable media
BDS
Dy Trying boot selection y (y=0 to 15)
PEI Core
E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2 Permanent memory found
E1, E3 Reserved for PEI/PEIMs
DXE Core
E4 Entered DXE phase
E5 Started dispatching drivers
E6 Started connecting drivers
continued
73
Table 40. Port 80h POST Codes (continued)

DXE Drivers
E7 Waiting for user input
E8 Checking password
E9 Entering BIOS setup
EB Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
F4 Entering Sleep state
F5 Exiting Sleep state
F8 EFI boot service ExitBootServices ( ) has been called
F9 EFI runtime service SetVirtualAddressMap ( ) has been called
FA EFI runtime service ResetSystem ( ) has been called
PEIMs/Recovery
30 Crisis Recovery has initiated per user request
31 Crisis Recovery has initiated by software (corrupt flash)
34 Loading recovery capsule
35 Handing off control to the recovery capsule
3F Unable to recover
74
Table 41. Typical Port 80h POST Sequence

POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI busses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
92 Detecting the presence of the keyboard
28 Testing memory
E7 Waiting for user input
01 INT 19
00 Ready to boot
75
76
5 Regulatory Compliance and Battery
Disposal Information
5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop
Board DP43BF:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings
5.1.1 Safety Standards

Intel Desktop Board DP43BF complies with the safety standards stated in Table 42
when correctly installed in a compatible host system.
Table 42. Safety Standards

Standard Title
CSA/UL 60950-1, First Edition Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1:2006, Second Information Technology Equipment – Safety - Part 1: General
Edition Requirements (European Union)
IEC 60950-1:2005, Second Information Technology Equipment – Safety - Part 1: General
Edition Requirements (International)
77
5.1.2 European Union Declaration of Conformity

Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel®
Desktop Board DP43BF is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and
2006/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC a
2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC & 2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC & 2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC
kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC & 2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC & 2006/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC και 2006/95/EC.
Magyar E termék megfelel a 2004/108/EC és 2006/95/EC Európai Irányelv
előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC & 2006/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC &
2006/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC un 2006/95/EC
noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC ir 2006/95/EC
nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC u 2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC & 2006/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC
& 2006/95/EC.
78
Regulatory Compliance and Battery Disposal Information
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC a 2006/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in
2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &
2006/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar.
5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作
恰当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
79
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, à savoir les produits concernés, les adresses
disponibles, les instructions d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in
tel/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponíveis, as instruções de envio, os termos e condições, etc.
80
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology
Web sayfasına gidin.
5.1.3.3 Lead Free Desktop Board

This Desktop Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six
materials. One of the six restricted materials is lead.
This Desktop Board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance
and/or reliability. This Desktop Board is referred to as “Lead-free second level
interconnect.” The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it
requires different product marking and controlled substance information. The required
mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as
the number of years for which controlled listed substances will not leak or chemically
deteriorate while in the product.
Table 43 shows the various forms of the “Lead-Free 2nd Level Interconnect” mark as it
appears on the board and accompanying collateral.
81
Table 43. Lead-Free Board Markings
Description Mark
nd
Lead-Free 2 Level Interconnect:
This symbol is used to identify
electrical and electronic
assemblies and components in
which the lead (Pb) concentration
level in the desktop board
substrate and the solder
connections from the board to the or
components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).
or
82
5.1.4 EMC Regulations

Intel Desktop Board DP43BF complies with the EMC regulations stated in Table 44
when correctly installed in a compatible host system.
Table 44. EMC Regulations

Regulation Title
FCC 47 CFR Part 15, Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio
Subpart B Frequency Devices. (USA)
ICES-003 Issue 4 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022:2006 Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024:1998 Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022:2006 Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22:2005 Limits and methods of measurement of Radio Disturbance Characteristics of
+A1:2005 +A2:2006 Information Technology Equipment. (International)
CISPR 24:1997 Information Technology Equipment – Immunity Characteristics – Limits and
+A1:2001 +A2:2002 Methods of Measurement. (International)
VCCI V-3/2007.04, Voluntary Control for Interference by Information Technology Equipment.
V-4/2007.04 (Japan)
KN-22, KN-24 Korean Communications Commission – Framework Act on
Telecommunications and Radio Waves Act (South Korea)
CNS 13438:2006 Bureau of Standards, Metrology and Inspection (Taiwan)
Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.
83
Korean Class B statement translation: this is household equipment that is certified to

comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.
5.1.5 Product Certification Markings (Board Level)

Intel Desktop Board DP43BF has the product certification markings shown in Table 45.
Table 45. Product Certification Markings

Description Mark
UL joint US/Canada Recognized Component mark.
FCC Declaration of Conformity logo mark for Class B equipment.
CE mark. Declaring compliance to European Union (EU) EMC directive and

Low Voltage directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum

Management (NZ RSM) C-tick mark.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea KCC (Korean Communications Commission) mark.
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Printed wiring board manufacturer’s recognition mark. Consists of a unique V-0

UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.
84
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
85
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYAZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
86
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей
должна проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
87
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Intel® Desktop Board

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,

* Other names and brands may be claimed as the property of others.

Copyright © 2010, Intel Corporation. All rights reserved.

What This Document Contains

Notes, Cautions, and Warnings

Other Common Notation

2.5.1 Power Supply Considerations ................................................. 54

28. Fan Header Current Capability........................................................... 54

1.1.1 Feature Summary

Table 1. Feature Summary

Table 1. Feature Summary

1.1.2 Board Layout

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

Table 2. Board Components Shown in Figure 1

1.1.3 Block Diagram

Figure 2. Block Diagram

1.2 Legacy Considerations

1.3 Online Support

For information about… Refer to:

For information about Refer to

1.5 System Memory

Table 3 lists the supported DIMM configurations.

Table 3. Supported Memory Configurations

1.5.1 Memory Configurations

For information about… Refer to:

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

1.6 Intel® P43 Express Chipset

1.6.1.1 PCI Express x16 Graphics

1.6.3 ATA Support

1.6.3.1 PATA Interface

For information about Refer to

1.6.3.2 SATA Interfaces

For compatibility, the underlying SATA functionality is transparent to the operating

For information about Refer to

1.6.3.2.1 Serial ATA RAID

For information about Refer to

1.7 Real-Time Clock Subsystem

1.8 Legacy I/O Controller

1.8.1 Serial Port

For information about Refer to

1.9 Audio Subsystem

Table 4. Audio Jack Retasking Support

1.9.1 Audio Subsystem Software

For information about Refer to

1.9.2 Audio Connectors and Headers

Figure 4. Back Panel Audio Connectors

For information about Refer to

1.10 LAN Subsystem

For information about Refer to

1.10.1 Broadcom BCM57788 Gigabit Ethernet Controller

1.10.2 LAN Subsystem Software

For information about Refer to

1.10.3 RJ-45 LAN Connector with Integrated LEDs

Figure 5. LAN Connector LED Locations

Table 5. LAN Connector LED States