Intel® Desktop Board DQ45CB: Technical Product Specification

Intel® Desktop Board
DQ45CB
Technical Product Specification
September 2008
Order Number: E42785-001US
The Intel® Desktop Board DQ45CB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DQ45CB Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DQ45CB Technical Product September 2008
Specification.
This product specification applies to only the standard Intel® Desktop Board DQ45CB with BIOS
identifier CBQ4510H.86A.
Changes to this specification will be published in the Intel Desktop Board DQ45CB Specification
Update before being incorporated into a revision of this document.
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Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board DQ45CB. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DQ45CB and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains

Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
# INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DQ45CB Technical Product Specification
Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description .............................................................. 9

1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 System Memory .............................................................................. 15
1.5.1® Memory Configurations ......................................................... 16
1.6 Intel Q45 Express Chipset ............................................................... 18
1.6.1 Intel Q45 Graphics Subsystem ............................................... 18
1.6.2 USB ................................................................................... 21
1.6.3 Serial ATA Interfaces ............................................................ 22
1.7 Real-Time Clock Subsystem .............................................................. 24
1.8 Legacy I/O Controller ....................................................................... 25
1.8.1 Serial Port ........................................................................... 25
1.9 Audio Subsystem............................................................................. 26
1.9.1 Audio Subsystem Software .................................................... 27
1.9.2 Audio Connectors and Headers ............................................... 27
1.10 LAN Subsystem ............................................................................... 28
1.10.1 Intel® 82567LM Gigabit Ethernet Controller .............................. 28
1.10.2 LAN Subsystem Software....................................................... 29
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 29
1.11 Intel® Active Management Technology (Intel® AMT) ............................ 30
1.11.1 Intel AMT Features ............................................................... 30
1.11.2 Intel AMT Software and Drivers .............................................. 32
1.12 Intel® Virtualization Technology (Intel® VT)......................................... 32
1.13 Intel® Trusted Execution Technology (Intel® TXT) ............................... 33
1.14 Intel® Trusted Platform Module (Intel® TPM)........................................ 34
1.15 Hardware Management Subsystem .................................................... 34
1.15.1 Hardware Monitoring and Fan Control...................................... 34
1.15.2 Fan Monitoring ..................................................................... 35
1.15.3 Chassis Intrusion and Detection.............................................. 35
1.15.4 Thermal Monitoring .............................................................. 36
1.16 Power Management ......................................................................... 37
1.16.1 ACPI................................................................................... 37
1.16.2 Hardware Support ................................................................ 40
1.16.3 ENERGY STAR* .................................................................... 44
2 Technical Reference ............................................................ 45
2.1 Memory Map................................................................................... 45
2.1.1 Addressable Memory............................................................. 45
v
2.2 Connectors and Headers................................................................... 48

2.2.1 Back Panel Connectors .......................................................... 49
2.2.2 Component-side Connectors and Headers ................................ 50
2.3 Jumper Block .................................................................................. 59
2.4 Mechanical Considerations ................................................................ 62
2.4.1 Form Factor......................................................................... 62
2.5 Electrical Considerations ................................................................... 63
2.5.1 Power Supply Considerations ................................................. 63
2.5.2 Fan Header Current Capability................................................ 64
2.5.3 Add-in Board Considerations .................................................. 65
2.6 Thermal Considerations .................................................................... 65
2.7 Reliability ....................................................................................... 67
2.8 Environmental ................................................................................ 67
3 Overview of BIOS Features ................................................. 69
3.1 Introduction ................................................................................... 69
3.2 BIOS Flash Memory Organization ....................................................... 70
3.3 Resource Configuration .................................................................... 70
3.3.1 PCI* Autoconfiguration.......................................................... 70
3.4 System Management BIOS (SMBIOS)................................................. 71
3.5 Legacy USB Support ........................................................................ 72
3.6 BIOS Updates ................................................................................. 73
3.6.1 Language Support ................................................................ 73
3.6.2 Custom Splash Screen .......................................................... 73
3.7 BIOS Recovery................................................................................ 74
3.8 Boot Options................................................................................... 75
3.8.1 CD-ROM Boot ...................................................................... 75
3.8.2 Network Boot....................................................................... 75
3.8.3 Booting Without Attached Devices........................................... 75
3.8.4 Changing the Default Boot Device During POST ........................ 75
3.9 Adjusting Boot Speed....................................................................... 76
3.9.1 Peripheral Selection and Configuration..................................... 76
3.9.2 BIOS Boot Optimizations ....................................................... 76
3.10 BIOS Security Features .................................................................... 77
4 Error Messages and Beep Codes ......................................... 79
4.1 Speaker ......................................................................................... 79
4.2 BIOS Beep Codes ............................................................................ 79
4.3 BIOS Error Messages ....................................................................... 79
4.4 Port 80h POST Codes ....................................................................... 80
5 Regulatory Compliance and Battery Disposal Information .. 85
5.1 Regulatory Compliance..................................................................... 85
5.1.1 Safety Standards.................................................................. 85
5.1.2 European Union Declaration of Conformity Statement ................ 86
5.1.3 Product Ecology Statements................................................... 87
5.1.4 EMC Regulations .................................................................. 91
5.1.5 Product Certification Markings (Board Level)............................. 92
vi
Contents
5.2 Battery Disposal Information............................................................. 93
Figures
Figure 1. Major Board Components............................................................... 11
Figure 2. Block Diagram.............................................................................. 13
Figure 3. Memory Channel and DIMM Configuration ........................................ 17
Figure 4. Back Panel Audio Connector Options................................................ 27
Figure 5. LAN Connector LED Locations ......................................................... 29
Figure 6. Thermal Sensors and Fan Headers .................................................. 36
Figure 7. Location of the Standby Power Indicator LED .................................... 44
Figure 8. Detailed System Memory Address Map............................................. 46
Figure 9. Back Panel Connectors .................................................................. 49
Figure 10. Component-side Connectors and Headers....................................... 50
Figure 11. Connection Diagram for Front Panel Header .................................... 56
Figure 12. Connection Diagram for Front Panel USB Headers............................ 58
Figure 13. Connection Diagram for IEEE 1394a Header.................................... 58
Figure 14. Location of the Jumper Block ........................................................ 60
Figure 15. Board Dimensions ....................................................................... 62
Figure 16. Localized High Temperature Zones ................................................ 66
Tables
Table 1. Feature Summary ............................................................................ 9
Table 2. Board Components Shown in Figure 1............................................... 12
Table 3. Supported Memory Configurations.................................................... 15
Table 4. DVI Port Status Conditions .............................................................. 20
Table 5. Audio Jack Retasking Support.......................................................... 26
Table 6. LAN Connector LED States .............................................................. 29
Table 7. Effects of Pressing the Power Switch................................................. 37
Table 8. Power States and Targeted System Power ......................................... 38
Table 9. Wake-up Devices and Events........................................................... 39
Table 10. System Memory Map .................................................................... 47
Table 11. Component-side Connectors and Headers Shown in Figure 10 ............ 51
Table 12. HD Audio Link Header................................................................... 52
Table 13. Front Panel Audio Header for HD Audio ........................................... 52
Table 14. Front Panel Audio Header for AC ’97 Audio....................................... 52
Table 15. Serial ATA Connectors .................................................................. 52
Table 16. Serial Port Header ........................................................................ 53
Table 17. Chassis Intrusion Header .............................................................. 53
Table 18. Front and Rear Chassis (3-Pin) Fan Headers..................................... 53
Table 19. Processor (4-Pin) Fan Header......................................................... 53
Table 20. Auxiliary Front Panel Power/Sleep LED Header ................................. 54
Table 21. Processor Core Power Connector .................................................... 55
Table 22. Main Power Connector .................................................................. 55
Table 23. Front Panel Header....................................................................... 56
Table 24. States for a One-Color Power LED .................................................. 57
vii
Table 25. States for a Two-Color Power LED .................................................. 57

Table 26. BIOS Setup Configuration Jumper Settings ...................................... 61
Table 27. Recommended Power Supply Current Values.................................... 64
Table 28. Fan Header Current Capability ....................................................... 64
Table 29. Thermal Considerations for Components.......................................... 66
Table 30. Intel® Desktop Board DQ45CB Environmental Specifications............... 67
Table 31. BIOS Setup Program Menu Bar ...................................................... 70
Table 32. BIOS Setup Program Function Keys ................................................ 70
Table 33. Acceptable Drives/Media Types for BIOS Recovery ............................ 74
Table 34. Boot Device Menu Options............................................................. 75
Table 35. Supervisor and User Password Functions ......................................... 77
Table 36. Beep Codes................................................................................. 79
Table 37. BIOS Error Messages .................................................................... 79
Table 38. Port 80h POST Code Ranges .......................................................... 80
Table 39. Port 80h POST Codes.................................................................... 81
Table 40. Typical Port 80h POST Sequence .................................................... 84
Table 41. Safety Standards ......................................................................... 85
Table 42. Lead-Free Board Markings ............................................................. 90
Table 43. EMC Regulations .......................................................................... 91
Table 44. Product Certification Markings........................................................ 92
viii
1 Product Description
1.1 Overview
1.1.1 Feature Summary

Table 1 summarizes the major features of the Intel Desktop Board DQ45CB.
Table 1. Feature Summary

Form Factor Micro-ATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
Processor Support for the following:
• Intel® Core™2 Quad processor in an LGA775 socket
• Intel® Core™2 Duo processor in an LGA775 socket
• Intel® Pentium® Dual-Core processor in an LGA775 socket
• Intel® Celeron® Dual-Core processor in an LGA775 socket
• Intel® Celeron® processor 400 Sequence in an LGA775 socket
Memory • Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 800 MHz or DDR2 667 MHz DIMMs
• Support for up to 8 GB of system memory using DDR2 800 MHz or DDR2
667 MHz DIMMs
Chipset Intel® Q45 Express Chipset, consisting of:
• Intel® 82Q45 Graphics and Memory Controller Hub (GMCH)
• Intel® 82801JDO I/O Controller Hub (ICH10DO)
Audio 5.1-channel audio subsystem using the ADI AD1882 high definition audio codec
Video Intel® Graphics Media Accelerator 4500 (Intel® GMA 4500) onboard graphics
subsystem
Legacy I/O Control Legacy I/O controller for serial port header
Peripheral • Twelve USB 2.0 ports: six back panel connectors and six front panel headers
Interfaces • Two IEEE-1394a interfaces: one back panel connector and one front-panel
header
• Six Serial ATA (3 Gbps) interfaces, including one red-colored external Serial
ATA (eSATA) interface on the back panel
• One serial port header (may require specialized chassis or cable for use)
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82567LM
Gigabit Ethernet Controller
BIOS • Intel® BIOS (resident in the SPI Flash device)
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
continued
9
Table 1. Feature Summary (continued)

Instantly Available • Support for PCI* Local Bus Specification Revision 2.3
PC Technology • Support for PCI Express* Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, USB ports, LAN
Expansion • One PCI Express x16 bus add-in card connector
Capabilities • Two PCI Express x1 bus add-in card connectors
• One PCI Conventional bus connector
Hardware Monitor • Intel® Quiet System Technology implemented through the Intel® Management
Subsystem Engine (Intel® ME) in ICH10DO
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Three fan sense inputs used to monitor fan activity
10
Product Description
1.1.2 Board Layout

Figure 1 shows the location of the major components.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
11
Table 2. Board Components Shown in Figure 1

Item/callout
from Figure 1 Description
A Front panel audio header
B PCI Conventional bus add-in card connector
C PCI Express x1 connector
D PCI Express x16 connector
E PCI Express x1 connector
F Rear chassis fan connector
G Back panel connectors
H Processor core power connector (2 X 2)
I Serial port header
J LGA775 processor socket
K Processor fan header
L DIMM Channel A sockets
M DIMM Channel B sockets
N Main Power connector (2 X 12)
O Front chassis fan header
P Chassis intrusion header
Q Battery
R Auxiliary front panel power LED header
S Front panel header
T BIOS Setup configuration jumper block
U Serial ATA connectors [5]
V Speaker
W Intel 82801JDO I/O Controller Hub (ICH10DO)
X Front panel USB header
Y Intel 82Q45 GMCH
Z Front panel USB header
AA Front panel USB header
BB IEEE-1394a header
CC High Definition Audio Link header
12
Product Description
1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas.
Figure 2. Block Diagram
13
1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port
• No floppy drive connector
• No parallel ATA IDE connector
• No serial port on the back panel
• The serial port header is located near the processor socket and may require a
specialized chassis or cabling solution to use
1.3 Online Support

To find information about… Visit this World Wide Web site:
Intel® Desktop Board DQ45CB http://www.intel.com/products/motherboard/DQ45CB/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop
Available configurations for the Intel http://www.intel.com/products/motherboard/DQ45CB/index.htm
Desktop Board DQ45CB
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
1.4 Processor
The board is designed to support the following processors:
• Intel Core 2 Quad processor in an LGA775 socket
• Intel Core 2 Duo processor in an LGA775 socket
• Intel Pentium Dual-Core processor in an LGA775 socket
• Intel Celeron Dual-Core processor in an LGA775 socket
• Intel Celeron processor Sequence 400 in an LGA775 socket
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W. The processors listed above are only
supported when falling within the wattage requirements of the board. See the Intel
web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:

Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
# INTEGRATOR’S NOTE
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.2.2.4, page 55
14
Product Description
1.5 System Memory

The board has four DIMM sockets and support the following memory features:
• 1.8 V DDR2 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR2 SDRAM DIMMs
• Dual channel interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 8 GB maximum total system memory using DDR2 800 MHz or DDR2 667 MHz
DIMMs; refer to Section 2.1.1 on page 45 for information on the total amount of
addressable memory.
• Minimum recommended total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 800 MHz or DDR2 667 MHz SDRAM DIMMs
• DDR2 667 MHz DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP)
• DDR2 800 MHz DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3. Supported Memory Configurations

Smallest usable Largest usable Maximum capacity
DIMM (one x16 DIMM (one x8 with four identical
DIMM SDRAM Single-sided Double-sided x8 Double-sided
Type Technology DIMM) DIMM) DIMMs
DDR2 667 512 Mbit 256 MB 1 GB 4 GB
DDR2 667 1 Gbit 512 MB 2 GB 8 GB
DDR2 800 512 Mbit 256 MB 1 GB 4 GB
DDR2 800 1 Gbit 512 MB 2 GB 8 GB

Tested Memory http://support.intel.com/support/motherboards/desktop/sb/
CS-025414.htm
15
1.5.1 Memory Configurations

The Intel 82Q45 GMCH supports the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/
cs-011965.htm
16
Product Description
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels
are black.
Figure 3. Memory Channel and DIMM Configuration
# INTEGRATOR’S NOTE
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated. This is a requirement of the
Intel® Management Engine.
17
®
1.6 Intel Q45 Express Chipset
The Intel Q45 Express chipset consists of the following devices:
• Intel 82Q45 Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
• Intel 82801JDO I/O Controller Hub (ICH10DO)
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D, and display capabilities. The ICH10DO is a centralized controller
for the board’s I/O paths.
The chipset supports the following features:
• Onboard Graphics
• Dynamic Video Memory Technology
• USB
• Serial ATA
The Intel Q45 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 Intel Q45 Graphics Subsystem

The Intel Q45 Express chipset contains two separate, mutually exclusive graphics
options. Either the Intel Graphics Media Accelerator 4500 (Intel GMA 4500) graphics
controller (contained within the 82Q45 GMCH) is used, or a PCI Express x16 add-in
card can be used. When a PCI Express x16 add-in card is installed, the Intel GMA
4500 graphics controller is disabled.
1.6.1.1 Intel® Graphics Media Accelerator 4500 Graphics

Controller
The Intel GMA 4500 graphics controller features the following:
• High quality texture engine
⎯ DirectX10* and OpenGL* 2.0 compliant
⎯ Shader Model 4.0
• 3D Graphics Rendering enhancements
⎯ 1.6 dual texture GigaPixel/sec max fill rate
⎯ 16-bit and 32-bit color
⎯ Vertex cache
• Video
⎯ Hi-Definition playback (partial hardware acceleration for MPEG-2, full hardware
acceleration for VC1 and AVC)
⎯ Dynamic Video Memory Technology (DVMT) 5.0 uses system memory
depending on the OS and the amount of memory installed
18
Product Description
• Display
⎯ Supports digital and analog displays up to 2048 x 1536 at 75 Hz refresh
(QXGA); also supports 1920 x 1080 resolution for full High Definition video
playback quality
⎯ Dual independent display support
1.6.1.2 Dynamic Video Memory Technology (DVMT 5.0)

DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. The amount of system memory
allocated to DVMT varies depending on the amount of total system memory installed
as well as the operating system being used. For Windows Vista, a minimum of 128 MB
can be allocated to DVMT and a maximum of over 2 GB can be allocated to DVMT with
the correct amount of memory installed. DVMT returns system memory back to the
operating system when the additional system memory is no longer required by the
graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.6.1.3 Configuration Modes

The video modes supported by this board are based on the Extended Display
Identification Data (EDID) modes of the monitor to which the system is connected.
Standard monitors are assumed.
19
1.6.1.4 Digital Visual Interface (DVI)

The DVI-I port supports both digital and analog DVI displays. The maximum
supported resolution is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI port is
compliant with the DVI 1.0 specification.
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI-D port is compliant with the DVI
1.0 specification.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
DVI ports will behave as described in Table 4.
Table 4. DVI Port Status Conditions

PCI Express x16 connector status DVI Digital (DVI-D) DVI Analog (DVI-I)
port status port status(Note)
No add-in card installed Enabled Enabled (DVI and VGA)
Non-video PCI Express x1 add-in card Enabled Enabled (DVI and VGA)
installed
PCI Express x4, x8, or 16 add-in card Disabled Enabled (VGA only)
installed
ADD2 or MEC card installed Disabled Enabled (DVI and VGA)
Note: DVI analog output can also be converted to VGA via a DVI-VGA converter.
NOTE
DVI analog output can also be converted to VGA via a DVI-VGA converter.
1.6.1.5 Advanced Digital Display (ADD2/MEC/ADD2+) Card

Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
400 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC/ADD2+
card is detected, the Intel GMA 4500 graphics controller is enabled and the PCI
Express x16 connector is configured for SDVO mode. SDVO mode enables the SDVO
ports to be accessed by the ADD2/MEC/ADD2+ card. An ADD2/MEC/ADD2+ card can
either be configured to support simultaneous display or can be configured to support
dual independent display as an extended desktop configuration with different color
depths and resolutions with DVI analog output only. ADD2/MEC/ADD2+ cards can be
designed to support the following configurations:
• Low Voltage Differential Signaling (LVDS)
• Single device operating in dual channel mode
• HDTV output
• HDMI support (when used with the HD Audio Link header)
20
Product Description
1.6.1.6 PCI Express x16 Graphics

The GMCH also supports add in discrete graphics card via the PCI Express 2.0 graphics
connector.
• PCI Express 2.0 x16:
⎯ Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (500 MB/s total). Maximum theoretical bandwidth on interface of
4 GB/s in each direction simultaneously, for an aggregate of 8 GB/s when
operating in x16 mode.
direction (1000 MB/s total). Maximum theoretical bandwidth on interface of
8 GB/s in each direction simultaneously, for an aggregate of 16 GB/s when

PCI Express technology http://www.pcisig.com
1.6.2 USB
The board supports up to 12 USB 2.0 ports, supports UHCI and EHCI, and uses UHCI-
and EHCI-compatible drivers.
The ICH10DO provides the USB controller for all ports. The port arrangement is as
follows:
• Six ports are implemented with stacked back panel connectors
• Six ports are routed to three separate front panel USB headers
The location of the USB connectors on the back panel Figure 9, page 49
The location of the front panel USB headers Figure 10, page 50
21
1.6.3 Serial ATA Interfaces

The board provides five Serial ATA (SATA) connectors, which support one device per
connector. The board also provides one red-colored external Serial ATA (eSATA)
connector on the back panel.
1.6.3.1 Serial ATA Support

The board’s Serial ATA controller offers six independent Serial ATA ports with a
theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed
on each port for a maximum of six Serial ATA devices. A point-to-point interface is
used for host to device connections, unlike Parallel ATA IDE which supports a
master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the

operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows Vista operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/.

The location of the Serial ATA connectors Figure 10, page 50
1.6.3.2 Serial ATA RAID

The board supports the Intel® Matrix Storage Technology which provides the following
RAID (Redundant Array of Independent Drives) levels:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
1.6.3.3 Intel® Rapid Recover Technology

The board incorporates the Intel® Rapid Recover Technology (Intel® RRT). Intel®
Rapid Recover Technology is a feature of Intel® Matrix Storage Manager. It uses RAID
1 (mirroring) functionality to copy data from a designated master drive to a
designated recovery drive. The master drive data can be copied to the recovery drive
either continuously or on request.
When using the continuous update policy, changes made to the data on the master
drive while the recovery drive is disconnected or offline are automatically copied to the
recovery drive when it is reconnected. When using the on request update policy, the
22
Product Description
master drive data can be restored to a previous state by copying the data on the
recovery drive back to the master drive.

Intel® Matrix Storage and Intel® Rapid Recovery Technology http://www.intel.com/desi
gn/chipsets/matrixstorage
_sb.htm
23
1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on. If the battery is removed or exhausted, the Intel TPM
data will be deleted in accordance to Trusted Computing Group guidelines. Please read
the user guide and back-up Intel TPM keys and data before removing the coin-cell
battery.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
24
Product Description
1.8 Legacy I/O Controller

The I/O controller provides the following features:
• One serial port header
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1 Serial Port

The board has one serial port header located on the component side of the board. The
serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.

The location of the serial port header Figure 10, page 50
The signal names of the serial port header Table 16, page 53
25
1.9 Audio Subsystem

The onboard audio subsystem consists of the following:
• Intel 82801JDO (ICH10DO)
• ADI AD1882 audio codec
• Back panel audio connectors
• Component-side audio headers:
⎯ Intel® High Definition Audio front panel header
⎯ HD audio link header
The audio subsystem supports the following features:
• A dynamic range of 95 dB
• 5.1 channel audio (using the back panel audio connectors)
• Independent multi-streaming stereo (using the Intel High Definition Audio front
panel header).
NOTE
Systems built with an AC 97 front panel will not be able to obtain the Microsoft
Windows Vista* logo.
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 5. Audio Jack Retasking Support

Supports Supports Supports Supports Supports Supports
Audio Jack Micro- Line out? Head- Line in? Rear Center/
phone? phones? Surround? LFE?
Front panel – Green No Yes Yes No No No
Front panel – Pink Yes No No No No No
Back panel – Blue No No No Yes Yes No
Back panel – Green No Yes Yes No No No
Back panel – Pink Yes No No No No Yes
26
Product Description
1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

Obtaining audio software and drivers Section 1.2, page 14
1.9.2 Audio Connectors and Headers

The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable audio ports are shown in Figure 4.
Item Description
A Line in
B Line out
C Mic in
Figure 4. Back Panel Audio Connector Options

The location of the front panel audio header Figure 10, page 50
The signal names of the front panel audio header Table 13, page 52
The location of the HD Audio Link header Figure 10, page 50
The signal names of the HD Audio Link header Table 12, page 52
The back panel audio connectors Section 2.2.1, page 49
27
1.10 LAN Subsystem

The LAN subsystem consists of the following:
• Intel 82567LM Gigabit Ethernet Controller (10/100/1000 Mbits/sec)
• Intel 82801JDO (ICH10DO)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between ICH10DO and the LAN controller
• PCI Conventional bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software

LAN software and drivers http://downloadcenter.intel.com
1.10.1 Intel® 82567LM Gigabit Ethernet Controller

The Intel 82567LM Gigabit Ethernet Controller supports the following features:
• PCI Express link
• 10/100/1000 IEEE 802.3 compliant
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
• Intel® Active Management Technology (Intel® AMT) 5.0
28
Product Description
1.10.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

Obtaining LAN software and drivers Section 1.2, page 14
1.10.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 6 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 6. LAN Connector LED States

LED LED Color LED State Condition
Off LAN link is not established.
Link Green On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/sec data rate is selected.
Data Rate Green/Yellow Green 100 Mbits/sec data rate is selected.
Yellow 1000 Mbits/sec data rate is selected.
29
1.11 Intel® Active Management Technology

(Intel® AMT)
Intel® Active Management Technology (Intel® AMT) offers IT organizations tamper-
resistant and persistent management capabilities. Specifically, Intel AMT is a
hardware-based solution that uses out of band communication to manage access to
client systems in addition to offering encrypted and persistent asset management and
remote diagnostics and/or recovery capabilities for networked platforms. With Intel
AMT, IT organizations can easily get accurate platform information, and can perform
remote updating, diagnostics, debugging and repair of a system, regardless of the
state of the operating system or the power state of the system.
The Intel Active Management Technology subsystem consists of:

• ARC4 micro-controller embedded in the Intel Q45 Graphics and Memory Controller
Hub (GMCH)
• Intel 82801JDO Controller Hub (ICH10DO)
• Intel 82567LM Gigabit (10/100/1000 Mbits/sec) Ethernet LAN controller
• Channel A DIMM(s)
• BIOS/SPI Flash (32 Mbits)
• On-board Intel AMT status LED
NOTE
Software with Intel AMT capability is required to take advantage of Intel AMT platform
management capabilities.
1.11.1 Intel AMT Features

The key features of Intel AMT include:
• Secure Out of Band (OOB) system management that allows remote management
of PCs regardless of system power or operating system state.
⎯ SSL 3.1/TLS encryption
⎯ HTTP authentication
⎯ TCP/IP
⎯ HTTP web GUI
⎯ XML/SOAP API
⎯ Web Services for Management (WS-MAN) protocol support
• Remote troubleshooting and recovery that can significantly reduce desk-side visits
and potentially increasing efficiency of IT technical staff.
⎯ Client Initiated Remote Access (CIRA)
⎯ System event log
⎯ IDE Redirection (IDE-R) or PXE boot: remote CD or network drive boot
⎯ Serial over LAN
⎯ OOB diagnostics
⎯ Remote control
30
Product Description
⎯ Operating system repair

• Proactive alerting that decreases downtime and minimizes time to repair.
⎯ Programmable policies
⎯ Operating system lock-up alert
⎯ Boot failure alert
⎯ Hardware failure alerts
• Third party non-volatile storage that prevents users from removing critical
inventory, remote control, or virus protection agents.
⎯ Nonvolatile storage for agents
⎯ Tamper-resistant
• Remote hardware and software asset tracking that eliminates time-consuming
manual inventory tracking, which also reduces asset accounting costs.
⎯ E-Asset Tag
⎯ HW/SW inventory
• System Defense 2 - In addition to the in-bound and out-bound packet filtering of
the previous generation, System Defense 2 is an Intel AMT feature that uses
advanced heuristics to help protect against the propagation of worms through the
use of preset packet filters. The number of new connections made to a specific port
or IP address are counted over a specific time window. If a preset threshold is
exceeded, it will alert the Management Console and suspend the client’s network
activity until the system can be remediated.
• Remote Configuration or Zero Touch Configuration (ZTC) minimizes the cost to
deploy Intel AMT by eliminating the need for IT personnel to touch each client
system prior to configuration. ZTC consists of a single OEM BIOS/Firmware image
that provides the Intel AMT client with information to authenticate connections and
allows it to remotely perform a secure setup procedure. IT departments must
acquire an appropriate Intel AMT-trusted certificate as well as use a remote
management application that supports ZTC.

Intel Active Management Technology http://www.intel.com/g
o/iamt
31
1.11.2 Intel AMT Software and Drivers

Intel AMT software and drivers are available from Intel’s World Wide Web site. The
package consists of two separate drivers: one for the Management Engine Interface
(MEI) and one for the Local Manageability Service (LMS) plus Serial over LAN (SoL).

Obtaining Intel AMT software and drivers Section 1.3, page 14
1.12 Intel® Virtualization Technology (Intel® VT)

Intel® Virtualization Technology (Intel® VT) consists of technology components that
support virtualization of platforms based on Intel processors, thereby enabling the
running of multiple operating systems and applications in independent partitions. Each
partition behaves like a virtual machine (VM) and provides isolation and protection
across partitions. This hardware-based virtualization solution, along with virtualization
software, enables multiple usages such as server consolidation, activity partitioning,
workload isolation, embedded management, legacy software migration, and disaster
recovery.
• Intel Virtualization Technology (Intel VT)

Hardware support for processor virtualization enables simple, robust and reliable
VMM software. VMM software relies on hardware support on operational details for
the handling of events, exceptions, and resources allocated to virtual machines.
• Intel Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d)
Intel VT-d provides additional performance, security and flexibility by providing the
VMM with the following capabilities:
⎯ I/O device assignment: for flexibly assigning I/O devices to VMs and extending
the protection and isolation properties of VMs for I/O operations.
⎯ DMA remapping: for supporting independent address translations for Direct
Memory Accesses (DMA) from devices.
⎯ Interrupt remapping: for supporting isolation and routing of interrupts from
devices and external interrupt controllers to appropriate VMs.
⎯ Reliability: for recording and reporting to system software DMA and interrupt
errors that may otherwise corrupt memory or impact VM isolation.
NOTE
Intel VT requires the use of a processor with Intel VT support. Additionally, a third
party VMM may also be required.
32
Product Description

Intel Virtualization Technology http://www.intel.com/technology/virtualizati
on/index.htm
1.13 Intel® Trusted Execution Technology

(Intel® TXT)
Intel® Trusted Execution Technology (Intel® TXT) is a highly versatile set of hardware
extensions to Intel® processors and chipsets that, with appropriate software, enhance
the platform security capabilities. Intel TXT will provide a hardware-based security
foundation that will help enable greater levels of protection for information stored,
processed and exchanged on the PC.
Intel Trusted Execution Technology capabilities include:
• Protected execution and memory spaces where sensitive data can be processed out
of view of any other software.
• Sealed storage shields encryption keys and other data from attack while in use or
stored.
• Attestation enables a system to provide assurance that it has correctly invoked the
Intel Trusted Execution Technology environment, as well as enable a verified
measurement of the software running in the protected space.
• Measured launch capability to help:
⎯ Reduce IT support costs with improved services
⎯ Enable decentralized or remote computing
⎯ Verify platform configuration with a higher level of assurance
• Memory protection to help:
⎯ Enhance protection of system resources
⎯ Increase confidentiality and integrity of data
⎯ Improve assurance of data transfers and resources
⎯ Improve protection of sensitive information
These Intel Trusted Execution Technology capabilities enable more secure platforms to
address the increasing frequency and sophistication of software-based attacks.
NOTE
Intel TXT requires the use of a processor with Intel TXT support. Additionally, third
party software may also be required.

Intel TXT http://www.intel.com/technology/security/index.ht
m?iid=tech_product+txt
33
1.14 Intel® Trusted Platform Module (Intel® TPM)

The Intel® Trusted Platform module (Intel® TPM) 1.2 component is specifically
designed to enhance platform security above-and-beyond the capabilities of today’s
software by providing a protected space for key operations and other security critical
tasks. Using both hardware and software, the Intel TPM protects encryption and
signature keys at their most vulnerable stages—operations when the keys are being
used unencrypted in plain-text form. The Intel TPM is specifically designed to shield
unencrypted keys and platform authentication information from software-based
attacks.
The Intel TPM 1.2 module on this board has been integrated into the Intel® 82801JDO
Controller Hub (ICH10DO).
NOTE
The Intel TPM uses the coin cell battery to maintain its monotonic counters. One major
function of the monotonic counters is for anti-replay protection of the internal Intel
TPM data. If the battery is removed or exhausted, the Intel TPM data will be deleted in
accordance to Trusted Computing Group guidelines. Please read the user guide and
back-up Intel TPM keys and data before removing the coin battery.
1.15 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.15.1 Hardware Monitoring and Fan Control

The features of the hardware monitoring and fan control include:
• Intel Quiet System Technology, delivering acoustically-optimized thermal
management
• Fan speed control controllers and sensors integrated into the ICH10DO
• Remote thermal diode sensor for ambient temperature sensing
• Thermal sensors in the processor, 82Q45 GMCH, and 82801JDO ICH10DO
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 V, +1.125 V, and
+VCCP) to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the
fan speed according to thermal conditions
34
Product Description
1.15.2 Fan Monitoring

Fan monitoring can be implemented using Intel® Desktop Utilities or third-party
software.

The functions of the fan headers Section 1.16.2.2, page 41
1.15.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.

The location of the chassis intrusion header Figure 10, page 50
35
1.15.4 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan
B Thermal diode, located on processor die
C Remote thermal sensor
D Processor fan
E Front chassis fan
F Thermal diode, located on the ICH10DO die
G Thermal diode, located on the GMCH die
Figure 6. Thermal Sensors and Fan Headers
NOTE
The minimum thermal reporting threshold for the GMCH is 66 °C. The GMCH thermal
sensor will display 66 °C until the temperature rises above this point.
36
Product Description
1.16 Power Management

Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan headers
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB (S1 and S3 only)
⎯ Power Management Event signal (PME#) wake-up support
1.16.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with the board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 9 on page 39)
• Support for a front panel power and sleep mode switch
Table 7 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 7. Effects of Pressing the Power Switch

If the system is in this …and the power switch
state… is pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than four seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than four seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)
37
1.16.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 8 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 8. Power States and Targeted System Power

Global Processor Targeted System
States Sleeping States States Device States Power (Note 1)
G0 – working S0 – working C0 – working D0 – working Full power > 50 W
state state.
G0 – idle state S0 – idle state C3 – sleep D0 Full power < 50 W
G0 – idle state S0 – idle state C4 – deep D0 Full power < 50 W
sleep
G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – 5 W < power < 50 W
state stopped grant device
specification
specific.
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 4.7 W (Note 2)
state RAM. Context except for
saved to RAM. wake-up logic.
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 2.7 W (Note 2)
state disk. Context except for
saved to disk. wake-up logic.
G2/S5 S5 – Soft off. No power D3 – no power Power < 2.7 W (Note 2)
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system.
mechanical off. system. wake-up logic, Service can be performed
AC power is except when safely.
disconnected provided by
from the battery or
computer. external source.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system inclusive of Wake
on LAN allowance of 0.7 W. Intel MEI is assumed to be in Wake on LAN mode.
38
Product Description
1.16.1.2 Wake-up Devices and Events

Table 9 lists the devices or specific events that can wake the computer from specific
states.
Table 9. Wake-up Devices and Events

These devices/events can wake up the computer… …from this state
LAN S1, S3, S4, S5 (Note)
PME# signal S1, S3, S4, S5 (Note)
Power switch S1, S3, S4, S5
RTC alarm S4, S5
Serial port S1, S3
USB S1, S3
WAKE# signal S1, S3, S4, S5
Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to
Power On will enable a wake-up event from LAN in the S5 state.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
39
1.16.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB (S1 and S3 only)
• PME# signal wake-up support
• WAKE# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB technologies from an ACPI state requires an operating
system that provides full ACPI support.
1.16.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.

The location of the main power connector Figure 10, page 50
The signal names of the main power connector Table 22, page 55
40
Product Description
1.16.2.2 Fan Headers

The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 state.
• The fans are off when the board is off or in the S3, S4, or S5 state.
• The processor fan header is wired to a fan tachometer input. The front and rear fan
headers each have independent tachometer input to the hardware monitoring and
fan control device. All fan headers support closed-loop fan control that can adjust
the fan speed according to thermal conditions.
• All fan headers have a +12 V DC connection.
The locations of the fan headers and thermal sensors Figure 6, page 36
The signal names of the processor fan header Table 19, page 53
The signal names of the chassis fan headers Table 18, page 53
1.16.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line from the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing LAN wake capabilities can damage the power
supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
• The PCI Express WAKE# signal
• The PCI bus PME# signal for PCI 2.3 compliant LAN designs
⎯ By Ping
⎯ Magic Packet
• The onboard LAN subsystem
41
1.16.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line from the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 9 on page 39 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.3 compliant add-in cards and drivers.
42
Product Description
1.16.2.5 Wake from USB

USB bus activity wakes the computer from ACPI S1 and S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB
and support in the OS.
1.16.2.6 PME# Signal Wake-up Support

When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.16.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S1, S3, S4, or S5 state.
1.16.2.8 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power
indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
43
Figure 7. Location of the Standby Power Indicator LED
1.16.3 ENERGY STAR*

In 2007, the US Department of Energy and the US Environmental Protection Agency
revised the ENERGY STAR* requirements. Intel has worked directly with these two
governmental agencies to define the new requirements. The Intel Desktop Board
DQ45CB meets the Category A requirements.

ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
44
2 Technical Reference
2.1 Memory Map
2.1.1 Addressable Memory

The board utilizes 8 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total
system memory). On a system that has 8 GB of system memory installed, it is not
possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
• BIOS/ SPI Flash (32 Mbits)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• Front side bus interrupts (17 MB)
• PCI Express configuration space (256 MB)
• GMCH base address registers, internal graphics ranges, PCI Express ports (up to
512 MB)
• Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express add-in cards
• Base graphics memory support (1 MB or 8 MB)
• Intel® Management Engine Interface (Intel® MEI) single channel (8 MB) or dual
channel (16 MB)
45
The amount of installed memory that can be used will vary based on add-in cards,
BIOS settings, and operating system installed. Figure 8 shows a schematic of the
system memory map. All installed system memory can be used when there is no
overlap of system addresses.
Figure 8. Detailed System Memory Address Map
46
Technical Reference
Table 10 lists the system memory map.
Table 10. System Memory Map

Address Range Address Range
(decimal) (hex) Size Description
1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the PCI bus).
Dependent on video adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
47
2.2 Connectors and Headers
CAUTION
Only the following connectors have overcurrent protection: Back panel and front panel
USB, as well as IEEE 1394a.
The other internal connectors/headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors/headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
This section describes the board’s connectors and headers. The connectors and
headers can be divided into these groups:
• Back panel I/O connectors (see page 49)
• Component-side connectors and headers (see page 50)
48
Technical Reference
2.2.1 Back Panel Connectors

Figure 9 shows the location of the back panel connectors.
Item Description
A DVI-I output
B DVI-D output
C IEEE-1394a
D USB ports [2]
E USB ports [2]
F eSATA port
G LAN
H USB ports [2]
I Audio line in
J Mic in
K Audio line out
Figure 9. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
49
2.2.2 Component-side Connectors and Headers

Figure 10 shows the locations of the component-side connectors and headers.
Figure 10. Component-side Connectors and Headers
50
Technical Reference
Table 11 lists the component-side connectors and headers identified in Figure 10.
Table 11. Component-side Connectors and Headers Shown in Figure 10

Item/callout
from Figure 10 Description
A Front panel audio header
B PCI Conventional bus add-in card connector
C PCI Express x1 connector
D PCI Express x16 connector
E PCI Express x1 connector
F Rear chassis fan connector
G Processor core power connector (2 X 2)
H Serial port header
I Processor fan header
J Main power connector (2 X 12)
K Front chassis fan header
L Chassis intrusion header
M Auxiliary front panel power LED header
N Front panel header
O Serial ATA connectors [5]
P Front panel USB header
Q Front panel USB header
R Front panel USB header
S IEEE-1394a header
T High Definition Audio Link header
51
2.2.2.1 Signal Tables for the Connectors and Headers
Table 12. HD Audio Link Header

Pin Signal Name Pin Signal Name
1 BCLK 2 Ground
3 RST# 4 DVDD IO
5 SYNC 6 Ground
7 SDO 8 3.3 V DVDD CORE
9 SDI0 10 +12 V
11 SDI1 12 Key (no pin)
13 Not connected 14 3.3 V DUAL
15 Not connected 16 Ground
Table 13. Front Panel Audio Header for HD Audio

1 [Port 1] Left channel 2 Ground
3 [Port 1] Right channel 4 PRESENCE# (Dongle present)
5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 14. Front Panel Audio Header for AC ’97 Audio

1 MIC 2 AUD_GND
3 MIC_BIAS 4 AUD_GND
5 FP_OUT_R 6 FP_RETURN_R
7 AUD_5V 8 KEY (no pin)
9 FP_OUT_L 10 FP_RETURN_L
Table 15. Serial ATA Connectors

Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
52
Technical Reference
Table 16. Serial Port Header

1 DCD (Data Carrier Detect) 2 RXD# (Receive Data)
3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready)
5 Ground 6 DSR (Data Set Ready)
7 RTS (Request to Send) 8 CTS (Clear to Send)
9 RI (Ring Indicator) 10 Key (no pin)
Table 17. Chassis Intrusion Header

Pin Signal Name
1 Intruder
2 Ground
Table 18. Front and Rear Chassis (3-Pin) Fan Headers

Pin Signal Name
1 Control
2 +12 V
3 Tach
Table 19. Processor (4-Pin) Fan Header

Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
53
2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:
• PCI Express x16:
direction (500 MB/s total). Maximum theoretical bandwidth on interface of 4
GB/s in each direction simultaneously, for an aggregate of 8 GB/s when operating in
x16 mode.
direction (1000 MB/s total). Maximum theoretical bandwidth on interface of 8
GB/s in each direction simultaneously, for an aggregate of 16 GB/s when
• PCI Express x1: two PCI Express x1 connectors. The x1 interface supports
simultaneous transfer speeds up to 250 Mbytes/sec of peak bandwidth per
direction and up to 500 MBytes/sec concurrent bandwidth
• PCI Conventional (rev 2.3 compliant) bus: one PCI Conventional bus add-in card
connector. PCI Conventional bus add-in cards with SMBus support can access
sensor data and other information residing on the board.
Note the following considerations for the PCI Conventional bus connectors:
• The PCI Conventional bus connector is bus master capable.
• SMBus signals are routed to the PCI Conventional bus connector. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the
board. The specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
⎯ The SMBus data line is connected to pin A41.
2.2.2.3 Auxiliary Front Panel Power/Sleep LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 20. Auxiliary Front Panel Power/Sleep LED Header

Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
54
Technical Reference
2.2.2.4 Power Supply Connectors

The board has the following power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24
unconnected.
• Processor core power – a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
Table 21. Processor Core Power Connector

1 Ground 2 Ground
3 +12 V 4 +12 V
Table 22. Main Power Connector

1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V (Note) 23 +5 V (Note)
12 2 x 12 connector detect (Note) 24 Ground (Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

Power supply considerations Section 2.5.1, page 63
55
2.2.2.5 Front Panel Header

This section describes the functions of the front panel header. Table 23 lists the signal
names of the front panel header. Figure 11 is a connection diagram for the front panel
header.
Table 23. Front Panel Header

In/ In/
Pin Signal Out Description Pin Signal Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED 2 HDR_BLNK_GRN Out Front panel green
pull-up to +5 V LED
3 HDA# Out Hard disk active 4 HDR_BLNK_YEL Out Front panel yellow
LED LED
Reset Switch On/Off Switch

5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected

9 +5 V Power 10 N/C Not connected
Figure 11. Connection Diagram for Front Panel Header
56
Technical Reference
2.2.2.5.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
• A Serial ATA hard drive connected to an onboard Serial ATA connector
• A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector
2.2.2.5.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.5.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 24 shows the
possible states for a one-color LED. Table 25 shows the possible states for a two-color
LED.
Table 24. States for a One-Color Power LED

LED State Description
Off Power off/sleeping
Steady Green Running
Table 25. States for a Two-Color Power LED

LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 24 and Table 25 are suggested colors only. Actual LED
colors are chassis-specific.
2.2.2.5.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
57
2.2.2.6 Front Panel USB Headers

Figure 12 is a connection diagram for the front panel USB headers.
• The +5 V DC power on the USB headers is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 12. Connection Diagram for Front Panel USB Headers
2.2.2.7 Front Panel IEEE 1394a Header

Figure 13 is a connection diagram for the IEEE 1394a header.
• The +12 V DC power on the IEEE 1394a header is fused.
• The IEEE 1394a header provides one IEEE 1394a port.
Figure 13. Connection Diagram for IEEE 1394a Header
58
Technical Reference
2.3 Jumper Block

CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 14 shows the location of the jumper block. The jumper determines the BIOS
Setup program’s mode.
59
Table 26 lists the jumper settings for the three modes: normal, configure, and
recovery. When the jumper is set to configure mode and the computer is powered-up,
the BIOS compares the processor version and the microcode version in the BIOS and
reports if the two match.
Figure 14. Location of the Jumper Block
60
Technical Reference
Table 26. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration
Normal 1-2 The BIOS uses current configuration information and
passwords for booting.
Configure 2-3 After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
Recovery None The BIOS attempts to recover the BIOS configuration. See
Section 3.7 for more information on BIOS recovery.
61
2.4 Mechanical Considerations
2.4.1 Form Factor

The board is designed to fit into an ATX-form-factor chassis. Figure 15 illustrates the
mechanical form factor for the board. Dimensions are given in inches [millimeters].
The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters]. Location of the I/O connectors and mounting holes are in
compliance with the ATX specification.
Figure 15. Board Dimensions
62
Technical Reference
2.5 Electrical Considerations

2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a system consisting of a supported 65 W processor (see Section 1.4
on page 14 for a list of supported processors), 1 GB DDR2 RAM, one hard disk drive,
one optical drive, and all board peripherals enabled, the minimum recommended
power supply is 90 W.
63
Table 26 lists the recommended power supply current values.
Table 27. Recommended Power Supply Current Values

Output Voltage 3.3 V 5V 12 V1 12 V2 -12 V 5 VSB
Current 3.71 A 7.89 A 3.03 A 8.16 A 0.05 A 1.28 A
2.5.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 28 lists the current capability of the fan headers.
Table 28. Fan Header Current Capability

Fan Header Maximum Available Current
Processor fan 2.0 A
Front chassis fan 1.5 A
Rear chassis fan 1.5 A
64
Technical Reference
2.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (all three
expansion slots and the PCI Express x16 connector filled) must not exceed 8 A.
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 16) can reach a temperature of up to 85 oC in
an open chassis.
65
Figure 16 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel 82801JDO (ICH10DO)
D Intel 82Q45 GMCH
Figure 16. Localized High Temperature Zones
Table 29 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 29. Thermal Considerations for Components

Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82Q45 GMCH 103 oC (under bias)

Intel 82801JDO (ICH10DO) 112 oC (under bias)
66
Technical Reference

Processor datasheets and specification updates Section 1.2, page 14
Intel Q45 Express chipset datasheets, specification updates, http://www.intel.com/pro
and design guides ducts/chipsets/index.htm
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The Intel Desktop Board
DQ45CB MTBF is 102,310 hours.
2.8 Environmental
Table 30 lists the environmental specifications for the board.
Table 30. Intel® Desktop Board DQ45CB Environmental Specifications

Parameter Specification
Temperature
Non-Operating -20 °C to +70 °C at 95% humidity
Operating 0 °C to +50 °C at 90% humidity
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product weight (pounds) Free fall (inches) Velocity change
(inches/sec²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
67
68
3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as CBQ4510H.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 59 shows how to put the board in configure mode.
69
Table 31 lists the BIOS Setup program menu features.
Table 31. BIOS Setup Program Menu Bar

Maintenance Main Advanced Security Power Boot Exit
Clears Displays Configures Sets Configures Selects boot Saves or
passwords and processor advanced passwords power options discards
displays and memory features and security management changes to
processor configuration available features features and Setup
information through the power supply program
chipset controls options
Table 32 lists the function keys available for menu screens.
Table 32. BIOS Setup Program Function Keys

BIOS Setup Program
Function Key Description
<←> or <→> Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓> Selects an item (Moves the cursor up or down)
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes an 32 Mbit
(4096 KB) flash memory device.
3.3 Resource Configuration

3.3.1 PCI* Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.
70
Overview of BIOS Features
3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
71
3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.
72
3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
• Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb/
CS-022312.htm.
3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English. Additional
languages are available in the Integrator’s Toolkit utility. Check the Intel website for
details.
3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel® Integrator’s Toolkit or Intel®
Integrator Assistant that are available from Intel can be used to create a custom
splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.

Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/
®
Additional Intel software tools http://developer.intel.com/products/motherboard/DQ45CB/tools.htm
and
http://developer.intel.com/design/motherbd/software.htm
73
3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 33 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 33. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?
CD-ROM drive connected to the Parallel ATA interface Yes
CD-ROM drive connected to the Serial ATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No
Legacy diskette drive (with a 1.44 MB diskette) connected to the No
legacy diskette drive interface

BIOS recovery http://support.intel.com/support/motherboards/desktop/
sb/CS-023360.htm
74
3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a diskette drive, hard
drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for
the diskette drive to be the first boot device, the hard drive second, and the ATAPI
CD-ROM third. If enabled, the last default boot device is the network.
3.8.1 CD-ROM Boot

Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM
format specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-
ROM is listed as a boot device. Boot devices are defined in priority order. Accordingly,
if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot
from the next defined drive.
3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse
3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices (as set in the BIOS setup program’s
Boot Device Priority Submenu). Table 34 lists the boot device menu options.
Table 34. Boot Device Menu Options

Boot Device Menu Function Keys Description
<↑> or <↓> Selects a default boot device
<Enter> Exits the menu, saves changes, and boots from the selected
device
<Esc> Exits the menu without saving changes
75
3.9 Adjusting Boot Speed

These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Optimized BIOS boot parameters
3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” less than
eight seconds, that minimize hard drive startup delays.
• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
• Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.
• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
• In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced
Menu in the Drive Configuration Submenu of the BIOS Setup program).
76
3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
• The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 35 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 35. Supervisor and User Password Functions

Password Password
Password Supervisor to Enter During
Set Mode User Mode Setup Options Setup Boot
Neither Can change all Can change all None None None
options (Note) options (Note)
Supervisor Can change all Can change a Supervisor Password Supervisor None
only options limited number
of options
User only N/A Can change all Enter Password User User
options Clear User Password
Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or
and user set options limited number Enter Password user user
of options
Note: If no password is set, any user can change all Setup options.
77
78
4 Error Messages and Beep Codes
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information
during POST.

The location of the onboard speaker Figure 1, page 11
4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s
speaker to beep an error message describing the problem (see Table 36).
Table 36. Beep Codes

Type Pattern Frequency
Memory error Three long beeps 1280 Hz
Thermal warning Four alternating beeps: High tone: 2000 Hz
High tone, low tone, high tone, low tone Low tone: 1600 Hz
4.3 BIOS Error Messages

Whenever a recoverable error occurs during POST, the BIOS displays an error
message describing the problem. Table 37 lists the error messages and provides a
brief description of each.
Table 37. BIOS Error Messages

Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
79
4.4 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the
BIOS:
• Table 38 lists the Port 80h POST code ranges
• Table 39 lists the Port 80h POST codes themselves
• Table 40 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 38. Port 80h POST Code Ranges

Range Category/Subsystem
00 – 0F Debug codes: Can be used by any PEIM/driver for debug.
10 – 1F Host Processors: 1F is an unrecoverable CPU error.
20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 – 3F Recovery: 3F indicated recovery failure.
40 – 4F Reserved for future use.
50 – 5F I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 – 6F Reserved for future use (for new busses).
70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error.
80 – 8F Reserved for future use (new output console codes).
90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 – AF Reserved for future use (new input console codes).
B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 – CF Reserved for future use.
D0 – DF Boot device selection.
E0 – FF E0 – EE: Miscellaneous codes. See Table 39.
EF: boot/S3 resume failure.
F0 – FF: FF processor exception.
80
Error Messages and Beep Codes
Table 39. Port 80h POST Codes

POST Code Description of POST Operation
Host Processor
10 Power-on initialization of the host processor (Boot Strap Processor)
11 Host processor cache initialization (including APs)
12 Starting Application processor initialization
13 SMM initialization
Chipset
21 Initializing a chipset component
Memory
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
24 Programming timing parameters in the memory controller and the DIMMs
25 Configuring memory
26 Optimizing memory settings
27 Initializing memory, such as ECC init
28 Testing memory
PCI Bus
50 Enumerating PCI busses
51 Allocating resources to PCI bus
52 Hot Plug PCI controller initialization
53 – 57 Reserved for PCI Bus
USB
58 Resetting USB bus
59 Reserved for USB
ATA/ATAPI/SATA
5A Resetting PATA/SATA bus and all devices
5B Reserved for ATA
SMBus
5C Resetting SMBus
5D Reserved for SMBus
Local Console
70 Resetting the VGA controller
71 Disabling the VGA controller
72 Enabling the VGA controller
Remote Console
78 Resetting the console controller
79 Disabling the console controller
7A Enabling the console controller
continued
81
Table 39. Port 80h POST Codes (continued)

Keyboard (PS/2 or USB)
90 Resetting keyboard
91 Disabling keyboard
92 Detecting presence of keyboard
93 Enabling the keyboard
94 Clearing keyboard input buffer
95 Instructing keyboard controller to run Self Test (PS/2 only)
Mouse (PS/2 or USB)
98 Resetting mouse
99 Disabling mouse
9A Detecting presence of mouse
9B Enabling mouse
Fixed Media
B0 Resetting fixed media
B1 Disabling fixed media
B2 Detecting presence of a fixed media (IDE hard drive detection etc.)
B3 Enabling/configuring a fixed media
Removable Media
B8 Resetting removable media
B9 Disabling removable media
BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC Enabling/configuring a removable media
BDS
Dy Trying boot selection y (y=0 to 15)
PEI Core
E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2 Permanent memory found
E1, E3 Reserved for PEI/PEIMs
DXE Core
E4 Entered DXE phase
E5 Started dispatching drivers
E6 Started connecting drivers
continued
82
Error Messages and Beep Codes
Table 39. Port 80h POST Codes (continued)

DXE Drivers
E7 Waiting for user input
E8 Checking password
E9 Entering BIOS setup
EB Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
F4 Entering Sleep state
F5 Exiting Sleep state
F8 EFI boot service ExitBootServices ( ) has been called
F9 EFI runtime service SetVirtualAddressMap ( ) has been called
FA EFI runtime service ResetSystem ( ) has been called
PEIMs/Recovery
30 Crisis Recovery has initiated per user request
31 Crisis Recovery has initiated by software (corrupt flash)
34 Loading recovery capsule
35 Handing off control to the recovery capsule
3F Unable to recover
83
Table 40. Typical Port 80h POST Sequence

POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI busses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
92 Detecting the presence of the keyboard
28 Testing memory
E7 Waiting for user input
01 INT 19
00 Ready to boot
84
5 Regulatory Compliance and Battery
Disposal Information
5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop
Board DQ45CB:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings
5.1.1 Safety Standards

Intel Desktop Board DQ45CB complies with the safety standards stated in Table 41
when correctly installed in a compatible host system.
Table 41. Safety Standards

Standard Title
CSA/UL 60950-1, First Edition Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1:2006, Second Information Technology Equipment – Safety - Part 1: General
Edition Requirements (European Union)
IEC 60950-1:2005, Second Information Technology Equipment – Safety - Part 1: General
Edition Requirements (International)
85
5.1.2 European Union Declaration of Conformity

Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel®
Desktop Board DQ45CB is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and
2006/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC a
2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC & 2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC & 2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC
kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC & 2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC & 2006/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC και 2006/95/EC.
Magyar E termék megfelel a 2004/108/EC és 2006/95/EC Európai Irányelv
előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC & 2006/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC &
2006/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC un 2006/95/EC
noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC ir 2006/95/EC
nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC u 2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC & 2006/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC
& 2006/95/EC.
86
Regulatory Compliance and Battery Disposal Information
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC a 2006/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in
2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &
2006/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar.
5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作
恰当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
87
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, à savoir les produits concernés, les adresses
disponibles, les instructions d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in
tel/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponíveis, as instruções de envio, os termos e condições, etc.
88
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology
Web sayfasına gidin.
5.1.3.3 Lead Free Desktop Board

This Desktop Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six
materials. One of the six restricted materials is lead.
This Desktop Board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance
and/or reliability. This Desktop Board is referred to as “Lead-free second level
interconnect.” The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it
requires different product marking and controlled substance information. The required
mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as
the number of years for which controlled listed substances will not leak or chemically
deteriorate while in the product.
Table 42 shows the various forms of the “Lead-Free 2nd Level Interconnect” mark as it
appears on the board and accompanying collateral.
89
Table 42. Lead-Free Board Markings

Description Mark
nd
Lead-Free 2 Level Interconnect:
This symbol is used to identify
electrical and electronic
assemblies and components in
which the lead (Pb) concentration
level in the desktop board
substrate and the solder
connections from the board to the or
components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).
or
90
5.1.4 EMC Regulations

Intel Desktop Board DQ45CB complies with the EMC regulations stated in Table 43
when correctly installed in a compatible host system.
Table 43. EMC Regulations

Regulation Title
FCC 47 CFR Part 15, Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio
Subpart B Frequency Devices. (USA)
ICES-003 Issue 4 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
(Class B)
EN55022:2006 Limits and methods of measurement of Radio Interference Characteristics
(Class B) of Information Technology Equipment. (European Union)
EN55024:1998 Information Technology Equipment – Immunity Characteristics Limits and
(Class B) methods of measurement. (European Union)
EN55022:2006 Australian Communications Authority, Standard for Electromagnetic
(Class B) Compatibility. (Australia and New Zealand)
CISPR 22:2005 Limits and methods of measurement of Radio Disturbance Characteristics of
+A1:2005 +A2:2006 Information Technology Equipment. (International)
(Class B)
CISPR 24:1997 Information Technology Equipment – Immunity Characteristics – Limits and
+A1:2001 +A2:2002 Methods of Measurement. (International)
(Class B)
VCCI V-3/2007.04, Voluntary Control for Interference by Information Technology Equipment.
V-4/2007.04, Class B (Japan)
Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.
91
Korean Class B statement translation: this is household equipment that is certified to

comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.
5.1.5 Product Certification Markings (Board Level)

Intel Desktop Board DQ45CB has the product certification markings shown in Table
44:
Table 44. Product Certification Markings

Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel desktop boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment. Includes

Intel name and DQ45CB model designation.
CE mark. Declaring compliance to European Union (EU) EMC directive and

Low Voltage directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum

Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code
number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea MIC (Ministry of Information and Communication) mark. Includes

adjacent MIC certification number: CPU-DQ45CB (B)
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.

Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique V-0

UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.
92
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
93
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYAZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
94
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей
должна проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
95
96

Intel® Desktop Board DQ45CB: Technical Product Specification

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Intel® Desktop Board

Order Number: E42785-001US

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,

* Other names and brands may be claimed as the property of others.

Copyright © 2008, Intel Corporation. All rights reserved.

What This Document Contains

Notes, Cautions, and Warnings

Other Common Notation

1 Product Description .............................................................. 9

2.2 Connectors and Headers................................................................... 48

5.2 Battery Disposal Information............................................................. 93

Table 25. States for a Two-Color Power LED .................................................. 57

1.1.1 Feature Summary

Table 1. Feature Summary

Table 1. Feature Summary (continued)

1.1.2 Board Layout

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

Table 2. Board Components Shown in Figure 1

1.1.3 Block Diagram

Figure 2. Block Diagram

1.2 Legacy Considerations

1.3 Online Support

For information about… Refer to:

1.5 System Memory

Table 3. Supported Memory Configurations

For information about… Refer to:

1.5.1 Memory Configurations

For information about… Refer to:

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

1.6.1 Intel Q45 Graphics Subsystem

1.6.1.1 Intel® Graphics Media Accelerator 4500 Graphics

1.6.1.2 Dynamic Video Memory Technology (DVMT 5.0)

1.6.1.3 Configuration Modes

1.6.1.4 Digital Visual Interface (DVI)

Table 4. DVI Port Status Conditions

1.6.1.5 Advanced Digital Display (ADD2/MEC/ADD2+) Card

1.6.1.6 PCI Express x16 Graphics

For information about Refer to

1.6.3 Serial ATA Interfaces

1.6.3.1 Serial ATA Support

For compatibility, the underlying Serial ATA functionality is transparent to the

For information about Refer to

1.6.3.2 Serial ATA RAID

1.6.3.3 Intel® Rapid Recover Technology

For information about Refer to

1.7 Real-Time Clock Subsystem

1.8 Legacy I/O Controller

1.8.1 Serial Port

For information about Refer to

1.9 Audio Subsystem

Table 5. Audio Jack Retasking Support

1.9.1 Audio Subsystem Software

For information about Refer to

1.9.2 Audio Connectors and Headers