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CERN Document Server 5 записей найдено  Поиск длился 2.20 секунд. 
1.
RD53 pixel chips for the ATLAS and CMS Phase-2 upgrades at HL-LHC / Loddo, F (INFN, Bari) ; Andreazza, A (Milan U. ; INFN, Milan) ; Arteche, F (Sao Paulo, Inst. Tech. Aeronautics) ; Barbero, M B (Marseille, CPPM) ; Barillon, P (Marseille, CPPM) ; Beccherle, R (INFN, Pisa) ; Bilei, G M (INFN, Perugia ; Perugia U.) ; Bjalas, W (CERN) ; Bonaldo, S (INFN, Padua ; Padua U.) ; Bortoletto, D (Oxford U.) et al.
The Phase-2 upgrades at the High-Luminosity LHC of ATLAS and CMS experiments at CERN will require a new tracker with readout electronics operating in extremely harsh radiation environment (1 Grad), high hit rate (3.5 GHz/cm2) and high data rate readout (5 Gb/s). The RD53 collaboration is a joint effort between the ATLAS and CMS to qualify the chosen 65 nm CMOS technology in high radiation environment and develop the pixel readout chips of both experiments. [...]
FERMILAB-PUB-24-0469-PPD.- 2024 - 5 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 1067 (2024) 169682
In : PSD13: The 13th International Conference on Position Sensitive Detectors, Oxford, United Kingdom, 3 - 9 Sep 2023, pp.169682
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2.
RD53 analog front-end processors for the ATLAS and CMS experiments at the High-Luminosity LHC / RD53 Collaboration
This work discusses the design and the main results relevant to the characterization of analog front-end processors in view of their operation in the pixel detector readout chips of ATLAS and CMS at the High-Luminosity LHC. The front-end channels presented in this paper are part of RD53A, a large scale demonstrator designed in a 65 nm CMOS technology by the RD53 collaboration.The collaboration is now developing the full-sized readout chips for the actual experiments. [...]
SISSA, 2020 - 9 p. - Published in : PoS Vertex2019 (2020) 021 Fulltext from Publisher: PDF;
In : Vertex 2019: 28th International Workshop on Vertex Detectors, Lopud Island, Croatia, 13 - 18 Oct 2019, pp.021
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3.
BDAQ53, a versatile pixel detector readout and test system for the ATLAS and CMS HL-LHC upgrades / Daas, Michael (Bonn U.) ; Dieter, Yannick (Bonn U.) ; Dingfelder, Jochen (Bonn U.) ; Frohne, Markus (Bonn U.) ; Giakoustidis, Georgios (Bonn U.) ; Hemperek, Tomasz (Bonn U.) ; Hinterkeuser, Florian (Bonn U.) ; Hügging, Fabian (Bonn U.) ; Janssen, Jens (Bonn U.) ; Krüger, Hans (Bonn U.) et al.
BDAQ53 is a readout system and verification framework for hybrid pixel detector readout chips of the RD53 family. These chips are designed for the upgrade of the inner tracking detectors of the ATLAS and CMS experiments. [...]
arXiv:2005.11225.- 2021-01-11 - 6 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 986 (2021) 164721 Fulltext: PDF;
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4.
RD53A: a large scale prototype for HL-LHC silicon pixel detector phase 2 upgrades / RD53 collaboration
The Phase 2 upgrades of silicon pixel detectors at HL-LHC experiments feature extreme require- ments, such as: 50x50 μm pixels, high rate (3 GHz/cm2), unprecedented radiation levels (1 Grad), high readout speed and serial powering. As a consequence a new readout chip is required. [...]
SISSA, 2019 - 5 p. - Published in : PoS TWEPP2018 (2019) 157
In : Topical Workshop on Electronics for Particle Physics, Antwerp, Belgique, 17 - 21 Sep 2018, pp.157
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5.
Design implementation and test results of the RD53A, a 65 nm large scale chip for next generation pixel detectors at the HL-LHC / Marconi, S (Marseille, CPPM) ; Barbero, M B (Marseille, CPPM) ; Fougeron, D (Marseille, CPPM) ; Godiot, S (Marseille, CPPM) ; Menouni, M (Marseille, CPPM) ; Pangaud, P (Marseille, CPPM) ; Rozanov, A (Marseille, CPPM) ; Breugnon, P (Marseille, CPPM) ; Bomben, M (Paris U., VI-VII) ; Calderini, G (Paris U., VI-VII) et al.
The RD53A large scale pixel demonstrator chip has been developed in 65 nm CMOS technology by the RD53 collaboration, in order to face the unprecedented design requirements of the pixel 2 phase upgrades of the CMS and ATLAS experiments at CERN. This prototype chip is designed to demonstrate that a set of challenging specifications can be met, such as: high granularity (small pixels of 50×50 or 25× 100 µm2) and large pixel chip size (~2x2 cm2), high hit rate (3 GHz/cm2), high readout speed, very high radiation levels (500 Mrad - 1 Grad) and operation with serial powering. [...]
2019 - 4 p. - Published in : 10.1109/NSSMIC.2018.8824486
In : 2018 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC 2018), Sydney, Australia, 10 - 17 Nov 2018, pp.8824486
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Смотрите также: похожие имена автора
1 Dieter, Yannick
2 Dieter, Yannick Manuel
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