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1.
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MuPix & ATLASpix: Architectures and Results
/ Schöning, A. (Heidelberg U.) ; Anders, John (Bern U.) ; Augustin, Heiko (U. Heidelberg (main)) ; Benoit, Mathieu (U. Geneva (main)) ; Berger, Niklaus (Mainz U.) ; Dittmeier, Sebastian (U. Heidelberg (main)) ; Ehrler, Felix (KIT, Karlsruhe) ; Fehr, Armin (Bern U.) ; Golling, Tobias (Geneva U.) ; Sevilla, Sergio Gonzales (Geneva U.) et al.
High Voltage Monolithic Active Pixel Sensors (HV-MAPS) are based on a commercial High Voltage CMOS process and collect charge by drift inside a reversely biased diode. HV-MAPS represent a promising technology for future pixel tracking detectors. [...]
arXiv:2002.07253.-
SISSA, 2020-01-24 - 10 p.
- Published in : PoS Vertex2019 (2020) 024
Fulltext: PoS(Vertex2019)024 - PDF; 2002.07253 - PDF;
In : Vertex 2019: 28th International Workshop on Vertex Detectors, Lopud Island, Croatia, 13 - 18 Oct 2019, pp.024
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2.
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Radiation hard DMAPS pixel sensors in 150 nm CMOS technology for operation at LHC
/ Barbero, M. (Marseille, CPPM) ; Barrillon, Pierre (Marseille, CPPM) ; Bespin, C. (Bonn U.) ; Bhat, S. (Marseille, CPPM) ; Breugnon, Patrick (Marseille, CPPM) ; Caicedo, Ivan (Bonn U.) ; Chen, Z. (Marseille, CPPM) ; Degerli, Y. (IRFU, Saclay) ; Dingfelder, J. (Bonn U.) ; Godiot, Stephanie (Marseille, CPPM) et al.
Monolithic Active Pixel Sensors (MAPS) have been developed since the late 1990s employing silicon substrate with a thin epitaxial layer in which deposited charge is collected by disordered diffusion rather than by drift in an electric field. As a consequence the signal is small and slow, and the radiation tolerance is below the requirements for LHC experiments by factors of 100 to 1000. [...]
arXiv:1911.01119.-
2020-05-22 - 22 p.
- Published in : JINST
Fulltext: PDF;
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3.
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ATLASpix3 : A high voltage CMOS sensor chip designed for ATLAS Inner Tracker
/ Prathapan, Mridula (KIT, Karlsruhe) ; Schimassek, Rudolf (KIT, Karlsruhe) ; Benoit, Mathieu (Geneva U.) ; Casanova, Raimon (Barcelona, IFAE) ; Ehrler, Felix (KIT, Karlsruhe) ; Meneses, Annie (Heidelberg U.) ; Pangaud, Patrick (Marseille, CPPM ; Aix-Marseille U.) ; Sultan, D M S (Geneva U.) ; Vilella, Eva (U. Liverpool (main)) ; Weber, Alena Larissa (Heidelberg U. ; KIT, Karlsruhe) et al.
ATLASpix3 is a 2×2 cm$^2$ high voltage CMOS sensor chip designed to meet the specifications of outer layers of ATLAS inner tracker. It is compatible with the hybrid pixel sensor ASIC RD53A in terms of electronic interface and geometry. [...]
SISSA, 2020 - 5 p.
- Published in : PoS TWEPP2019 (2020) 010
Fulltext: PDF;
In : TWEPP 2019 Topical Workshop on Electronics for Particle Physics, Santiago De Compostela, Spain, 2 - 6 Sep 2019, pp.010
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4.
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Design and Characterization of the CLICTD Pixelated Monolithic Sensor Chip
/ Kremastiotis, Iraklis (KIT - Karlsruhe Institute of Technology (DE)) ; Ballabriga Sune, Rafael (CERN) ; Campbell, Michael (CERN) ; Dannheim, Dominik (CERN) ; Dort, Katharina (Justus-Liebig-Universitaet Giessen (DE)) ; Egidos Plaja, Nuria (University of Barcelona (ES)) ; Kroeger, Jens (Ruprecht Karls Universitaet Heidelberg (DE)) ; Linssen, Lucie (CERN) ; Llopart Cudie, Xavi (CERN) ; Munker, Magdalena (CERN) et al.
A novel monolithic pixelated sensor and readout chip, the CLIC Tracker Detector (CLICTD) chip, is presented. The CLICTD chip was designed targeting the requirements of the silicon tracker development for the experiment at the Compact Linear Collider (CLIC), and has been fabricated in a modified 180 nm CMOS imaging process with charge collection on a high-resistivity p-type epitaxial layer. [...]
CLICdp-Pub-2020-003.-
Geneva : CERN, 2020 - 12.
- Published in : IEEE Trans. Nucl. Sci. 67 (2020) 2263-2272
Fulltext: PDF;
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5.
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A high-voltage pixel sensor for the ATLAS upgrade
/ Perić, Ivan (KIT, Karlsruhe) ; Prathapan, Mridula (KIT, Karlsruhe) ; Augustin, Heiko (Heidelberg U.) ; Benoit, Mathieu (U. Geneva (main)) ; Mohr, Raimon Casanova (Barcelona, IFAE) ; Dannheim, Dominik (CERN) ; Ehrler, Felix (KIT, Karlsruhe) ; Messaoud, Fadoua Guezzi (U. Geneva (main)) ; Kiehn, Moritz (U. Geneva (main)) ; Nürnberg, Andreas (KIT, Karlsruhe) et al.
High Voltage CMOS (HVCMOS) pixel sensors have been proposed for upgrade of the ATLAS experiment and for the tracking detectors at future colliders. They are implemented in commercial HVCMOS technologies, which makes the production cost effective when compared to hybrid pixel detectors. [...]
Elsevier, 2019 - 5 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 924 (2019) 99-103
In : 11th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors (HSTD11) in conjunction with 2nd Workshop on SOI Pixel Detectors (SOIPIX2017) at OIST, Okinawa, Japan, Okinawa, Japan, 10 - 15 Dec 2017, pp.99-103
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6.
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Radiation hard Depleted Monolithic Active Pixel Sensors with high-resistivity substrates
/ Terzo, Stefano (Barcelona, IFAE) ; Benoit, Mathieu (CERN) ; Cavallaro, Emanuele (Barcelona, IFAE) ; Casanova, Raimon (Barcelona, IFAE) ; Foerster, Fabian (Barcelona, IFAE) ; Grinstein, Sebastian (Barcelona, IFAE) ; Iacobucci, Giuseppe (Barcelona, IFAE) ; Peric, Ivan (KIT, Karlsruhe) ; Puigdengoles, Carles (Barcelona, IFAE) ; Vilella, Eva (Liverpool U.)
High Voltage/High resistivity Depleted Monolithic Active Pixel Sensors (HV/HR-DMAPS) is a technology which is becoming of great interest for high energy physics applications.With respect to hybrid pixel detectors the monolithic approach offers the main advantages of reduced material budget and production costs due to the absence of the bump bonding process. This aspect is important especially when large areas need to be covered as in the tracking detectors of the LHC experiments. [...]
SISSA, 2019 - 5 p.
- Published in : PoS TWEPP2018 (2019) 125
In : Topical Workshop on Electronics for Particle Physics, Antwerp, Belgique, 17 - 21 Sep 2018, pp.125
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7.
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Design of a HVCMOS pixel sensor ASIC with on-chip readout electronics for ATLAS ITk Upgrade
/ Prathapan, Mridula (KIT, Karlsruhe) ; Barrillon, Pierre (Marseille, CPPM) ; Benoit, Mathieu (CERN) ; Casanova, Raimon (Barcelona, IFAE) ; Ehrler, Felix (KIT, Karlsruhe) ; Pangaud, Patrick (Marseille, CPPM) ; Pusti, Sourav (IIT Research Inst., Annapolis) ; Schimassek, Rudolf (KIT, Karlsruhe) ; Vilella, Eva (Liverpool U.) ; Weber, Alena Larissa (Heidelberg U.) et al.
ATLASpix is a series of monolithic High Voltage CMOS (HVCMOS) sensor chips that are engineered to meet the requirements of outer layers of ATLAS ITk pixel tracker for HL-LHC upgrade. They are large collection electrode designs on high resistive wafers to ensure high detection efficiency and radiation tolerance. [...]
SISSA, 2019 - 5 p.
- Published in : PoS TWEPP2018 (2019) 074
In : Topical Workshop on Electronics for Particle Physics, Antwerp, Belgique, 17 - 21 Sep 2018, pp.074
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8.
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Performance of CMOS pixel sensor prototypes in ams H35 and aH18 technology for the ATLAS ITk upgrade
/ Kiehn, Moritz (Geneva U.) ; Di Bello, Francesco Armando (Geneva U.) ; Benoit, Mathieu (Geneva U.) ; Casanova Mohr, Raimon (Barcelona, IFAE) ; Chen, Hucheng (Brookhaven Natl. Lab.) ; Chen, Kai (Brookhaven Natl. Lab.) ; D.M.S., Sultan (Geneva U.) ; Ehrler, Felix (Geneva U. ; KIT, Karlsruhe, IPE) ; Ferrere, Didier (Geneva U.) ; Frizell, Dylan (U. Oklahoma, Norman) et al.
Pixel sensors based on commercial high-voltage CMOS processes are an exciting technology that is considered as an option for the outer layer of the ATLAS inner tracker upgrade at the High Luminosity LHC. Here, charged particles are detected using deep n-wells as sensor diodes with the depleted region extending into the silicon bulk. [...]
arXiv:1807.05953.-
2019-04-21 - 4 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 924 (2019) 104-107
Fulltext: PDF; Preprint (v.3, 8 June 2020): PDF;
In : 11th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors (HSTD11) in conjunction with 2nd Workshop on SOI Pixel Detectors (SOIPIX2017) at OIST, Okinawa, Japan, Okinawa, Japan, 10 - 15 Dec 2017, pp.104-107
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9.
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Status of HVCMOS Developments for ATLAS
/ Peric, Ivan (KIT) ; Blanco, Roberto (KIT) ; Casanova Mohr, Raimon (IFAE) ; Ehrler, Felix (KIT) ; Guezzi Messaoud, Fadoua (UNIGE) ; Kramer, Christian (KIT) ; Leys, Richard (KIT) ; Prathapan, Mridula (KIT) ; Schimassek, Rudolf (KIT) ; Schoning, Andre (UHEI) et al.
This paper describes the status of the developments made by ATLAS HVCMOS and HVMAPS collaborations. We have proposed two HVCMOS sensor concepts for ATLAS pixels—the capacitive coupled pixel detector (CCPD) and the monolithic detector. [...]
AIDA-2020-PUB-2017-005.-
Geneva : CERN, 2017
- Published in : JINST 12 (2017) C02030
Fulltext: PDF;
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10.
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Design and standalone characterisation of a capacitively coupled HV-CMOS sensor chip for the CLIC vertex detector
/ Kremastiotis, I. (CERN ; KIT, Karlsruhe) ; Ballabriga Sune, Rafael (CERN) ; Campbell, Michael (CERN) ; Dannheim, Dominik (CERN) ; Fiergolski, Adrian (CERN) ; Hynds, Daniel (CERN) ; Kulis, Szymon (CERN) ; Peric, Ivan (KIT - Karlsruhe Institute of Technology (DE))
/CLICdp Collaboration
The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively Coupled Pixel Detector (C3PD) is an active High-Voltage CMOS sensor, designed to be capacitively coupled to the CLICpix2 readout chip. [...]
arXiv:1706.04470; CLICDP-PUB-2017-001.-
Geneva : CERN, 2017-09-12 - 13 p.
- Published in : JINST 12 (2017) P09012
Fulltext: 10.1088_1748-0221_12_09_P09012 - PDF; CLICDP-PUB-2017-001 - PDF; arXiv:1706.04470 - PDF; CLICDP-PUB-2017-001_2 - PDF; CLICdp-Pub-2017-001 - PDF;
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