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Report number CERN-RD53-PUB-24-002
Title RD53 Pixel Readout Integrated Circuits for ATLAS and CMS HL-LHC Upgrades
Author(s)

Alimonti, G. ; Andreazza, A. ; Arteche, F. ; Barbero, M.B. ; Barrillon, P. ; Beccherle, R. ; Bonomelli, G. ; Bilei, G.M. ; Bialas, W. (CERN) ; Bortoletto, D. ; Calderini, G. ; Caratelli, A. (CERN) ; Cassese, A. ; Christiansen, J. (CERN) ; Conti, E. (CERN ; INFN, Perugia) ; Crescioli, F. ; Daas, M. ; Damenti, L. ; D'Auria, S. ; De Canio, F. ; De Robertis, G. ; Demaria, N. ; DeWitt, J. ; Dieter, Y. ; Dimitrievska, A. ; Erdmann, W. ; Esposito, S. (CERN) ; Exarchou, D. (CERN) ; Fougeron, D. ; Gaioni, L. ; Garcia-Sciveres, M. ; Gnani, D. ; Renteria, C. Gozalez ; Grippo, M. ; Guardino, A. ; Hamer, M. ; Heim, T. ; Hemperek, T. ; Hinterkeuser, F. ; Huiberts, S. ; Casas, L.M. Jara (CERN) ; John, J.J. ; Kampkötter, J. ; Karagounis, M. ; Kazas, I. ; Khwaira, Y. ; Kluit, R. ; Koukola, D. (CERN) ; Krieger, A. ; Krüger, H. ; Lalic, J. (CERN) ; Lauritzen, M. ; Licciulli, F. ; Liu, Peilian ; Loddo, F. ; Morillo, E. Lopez ; Lounis, A. ; Luongo, F. ; Manghisoni, M. ; Marconi, S. (CERN ; INFN, Perugia) ; Lasso, F. Marquez ; Marzocca, C. ; Mauer, K. ; Mekkaoui, A. ; Meng, Lingxin ; Menichelli, M. ; Menouni, M. ; Minuti, M. ; Mironova, M. ; Miryala, S. ; Missiroli, M. ; Monteil, E. ; Moustakas, K. ; Chavero, F. Muñoz ; Neue, G. ; Orfanelli, S. (CERN) ; Paccagnella, A. ; Pacher, L. ; Palla, F. ; Pinto, F.R. Palomo ; Papadopoulou, A. ; Paterno, A. ; Petri, A.R. ; Placidi, P. ; Plackett, R. ; Pradas, A. ; Pulli, A. (CERN) ; Raciti, B. ; Ratti, L. ; Re, V. ; Rehman, A. ; Rymaszewski, P. ; Sander, P. ; Solal, M.C. ; Standke, M. ; Stugu, B. ; Thompson, E. ; Traversi, G. ; Vogrig, D. ; Vogt, M. ; Wang, Tianyang ; Yang, Hongtao ; Zdenko, J.

Publication 2025
Imprint 2024-05-23
Number of pages 70
Published in: JINST 20 (2025) P03024
DOI 10.1088/1748-0221/20/03/P03024
Accelerator/Facility, Experiment RD53
Keywords RD53 pixel chip ; ATLAS pixel chip ; CMS pixel chip ; Particle tracking detectors (Solid-state detectors) ; Front-end electronics for detector readout ; VLSI circuits ; Radiation-hard electronics
Abstract The RD53 collaboration has since 2013 developed new hybrid pixel detector chips with 50x50um$^2$ pixels for the HL-LHC upgrades of the ATLAS and CMS experiments at CERN. A common architecture, design and verification framework has been developed to enable final pixel chips with different chip sizes to be designed, verified and tested to handle extreme hit rates of 3GHz/cm$^2$ (12GHz per chip) together with significantly increased trigger rate of 1MHz and efficient readout of up to 5.12Gbits/s per pixel chip. Tolerance to an extremely hostile radiation environment with 1Grad over 10 years and SEU (Single Event Upset) rates of up to 100 upsets per second per chip have been major challenges to make reliable pixel chips for the two main CERN experiments. Three generations of pixel chips, and many specific mixed signal building block and radiation test chips, have been submitted and extensively tested to get to final production chips. The large complex and high rate pixel chips have been developed with a strong emphasis on low power consumption together with a concurrent development and qualification of novel serial powering at chip, module and system level, to minimize detector material budget.
Other source INSPIRE
Copyright/License publication: © 2025 The Author(s) (License: CC-BY-4.0)
Submitted by [email protected]

 


 Záznam vytvorený 2024-05-23, zmenený 2025-05-14


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