主頁 > CERN Departments > Physics (PH) > EP-R&D Programme on Technologies for Future Experiments > EP-R&D Programme on Technologies for Future Experiments (EP RDET) > Measurements of total ionizing dose effects in TPSCo 65 nm and influence of NMOS bulk bias |
Article | |
Title | Measurements of total ionizing dose effects in TPSCo 65 nm and influence of NMOS bulk bias |
Author(s) | Dorda Martin, A (CERN ; KIT, Karlsruhe, IKP) ; Ballabriga, R (CERN) ; Borghello, G (CERN) ; Campbell, M (CERN) ; Deng, W (CERN ; CCNU, Wuhan, Inst. Part. Phys.) ; Hong, G H (CERN ; Yonsei U.) ; Kremastiotis, I (CERN) ; Snoeys, W (CERN) ; Termo, G (EPFL-ISIC, Lausanne) |
Publication | 2023 |
Number of pages | 8 |
In: | JINST 18 (2023) C02036 |
In: | Topical Workshop on Electronics for Particle Physics 2022 (TWEPP 2022), Bergen, Norway, 19 - 23 Sep 2022, pp.C02036 |
DOI | 10.1088/1748-0221/18/02/C02036 |
Subject category | Detectors and Experimental Techniques |
Project | CERN-EP-RDET |
Abstract | The CERN EP R&D; WP 1.2 aims to develop state-of-art monolithic pixel detectors using modern CMOS processes. The TPSCo 65 nm process is a suitable candidate and its radiation tolerance and sensor performance are therefore being studied. The impact of the back bias on the transistor behavior has also been measured to provide the designers with accurate models. This process shows sensitivity to radiation and degradation mechanisms similar to previously studied 65 nm CMOS technologies, strongly dependent on the geometry of the transistors. This paper presents preliminary characterization results of this technology that can serve as a guideline for designers. |
Copyright/License | publication: © 2023-2024 The Author(s) (License: CC-BY-4.0) |