| Article | |
| Report number | arXiv:1310.5854 |
| Title | Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors |
| Related title | SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors |
| Author(s) | Andricek, L. (Munich, Max Planck Inst. HLL) ; Beimforde, M. (Munich, Max Planck Inst.) ; Macchiolo, A. (Munich, Max Planck Inst.) ; Moser, H.-G. (Munich, Max Planck Inst.) ; Nisius, R. (Munich, Max Planck Inst.) ; Richter, R.H. (Munich, Max Planck Inst. HLL) ; Terzo, S. (Munich, Max Planck Inst.) ; Weigell, P. (Munich, Max Planck Inst.) |
| Publication | 2014 |
| Imprint | 2013-10-22 |
| Number of pages | 14 |
| Note | Comments: 17 pages, 24 figures 16 pages, 22 figures |
| In: | Nucl. Instrum. Methods Phys. Res., A 758 (2014) 30-43 |
| DOI | 10.1016/j.nima.2014.05.046 |
| Subject category | Detectors and Experimental Techniques ; 7: Transnational access European irradiation facilities ; 7.3: Transnational Access to KIT, Germany |
| Accelerator/Facility, Experiment | CERN LHC ; ATLAS RD50 |
| Abstract | The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper. Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 micrometer thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tunability, charge collection, cluster sizes and hit efficiencies. Targeting at a usage at the high luminosity upgrade of the LHC accelerator called HL-LHC, the results were obtained before and after irradiation up to fluences of $10^{16}$ $\mathrm{n}_{\mathrm{eq}}/\mathrm{cm}^2$ (1 MeV neutrons). |
| Copyright/License | arXiv nonexclusive-distrib. 1.0 |
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Záznam vytvorený 2014-04-04, zmenený 2023-06-29
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