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Calibration of ultra-thin hybrid pixel detector assemblies with Timepix readout ASICs
/ Alipour Tehrani, Niloufar (CERN) ; Arfaoui, Samir (CERN) ; Benoit, Mathieu (Universite de Geneve (CH)) ; Celeste, Damiano (CERN) ; Dannheim, Dominik (CERN) ; Pfleger, Florentina (CERN) ; Redford, Sophie (CERN)
In the framework of vertex detector R&D; for a future Compact Linear Collider, the charac- terisation of ultra-thin hybrid pixel detector assemblies comprising 50 − 300 μm thick silicon sensors and Timepix readout ASICs is underway through beam tests at DESY and CERN. The work presented here supports the beam test data analysis by providing an energy calibra- tion of certain assemblies, so giving access to energy measurements in addition to recorded Time Over Threshold counts. [...]
CLICdp-Note-2015-003.-
Geneva : CERN, 2015 - 43.
Fulltext: PDF;
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Capacitively coupled hybrid pixel assemblies for the CLIC vertex detector
/ Alipour Tehrani, Niloufar (CERN) ; Arfaoui, Samir (CERN) ; Benoit, Mathieu (CERN ; Geneva U.) ; Dannheim, Dominik (CERN) ; Dette, Karola (Tech. U., Dortmund (main)) ; Hynds, Daniel (CERN) ; Kulis, Szymon (CERN) ; Peric, Ivan (KIT, Karlsruhe) ; Petric, Marko (CERN) ; Redford, Sophie (CERN) et al.
The vertex detector at the proposed CLIC multi-TeV linear e+e- collider must have minimal material content and high spatial resolution, combined with accurate time-stamping to cope with the expected high rate of beam-induced backgrounds. One of the options being considered is the use of active sensors implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel ASICs. [...]
CLICdp-Pub-2015-003.-
Geneva : CERN, 2016 - 12.
- Published in : Nucl. Instrum. Methods Phys. Res., A 823 (2016) 1-8
Elsevier Open Access article: PDF; Fulltext: PDF;
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Recent results with HV-CMOS and planar sensors for the CLIC vertex detector
/ Alipour Tehrani, Niloufar (CERN ; ETH, Zurich (main))
/On behalf of the CLICdp collaboration
The physics aims for the future multi-TeV e+e- Compact Linear Collider (CLIC) impose high precision requirements on the vertex detector which has to match the experimental conditions, such as the time structure of the collisions and the presence of beam-induced backgrounds. The principal challenges are: a point resolution of 3μm, 10 ns time stamping capabilities, low mass (⇠0.2% X0 per layer), low power dissipation and pulsed power operation. [...]
CLICdp-Conf-2016-005.-
Geneva : CERN, 2017 - 6.
- Published in : Nucl. Instrum. Methods Phys. Res., A 845 (2017) 1-7
Fulltext: PDF;
In : 14th Vienna Conference on Instrumentation, Vienna, Austria, 15 - 19 Feb 2016, pp.1-7
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Time Resolution Studies with Timepix3 Assemblies with Thin Silicon Pixel Sensors
/ Alipour Tehrani, Niloufar (CERN) ; Dannheim, Dominik (CERN) ; Fiergolski, Adrian (CERN) ; Hynds, Daniel (Nikhef National institute for subatomic physics (NL)) ; Klempt, Wolfgang (CERN) ; Llopart Cudie, Xavi (CERN) ; Munker, Magdalena (CERN) ; Nurnberg, Andreas Matthias (KIT - Karlsruhe Institute of Technology (DE)) ; Pitters, Florian Michael (Austrian Academy of Sciences (AT)) ; Spannagel, Simon (CERN) et al.
Timepix3 is a multi-purpose readout ASIC for hybrid pixel detectors. It can measure time and energy simultaneously by employing time-of-arrival (ToA) and time-over-threshold (ToT) techniques. [...]
arXiv:1901.07007; CLICdp-Pub-2019-001.-
Geneva : CERN, 2019-05-24 - 12 p.
- Published in : JINST 14 (2019) P05022
Fulltext: fulltext1716236 - PDF; CLICdp-Pub-2019-001 - PDF; 1901.07007 - PDF; Fulltext from Publisher: PDF;
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Probing active-edge silicon sensors using a high precision telescope
/ Akiba, K (Rio de Janeiro Federal U.) ; Artuso, M (Syracuse U.) ; van Beveren, V (NIKHEF, Amsterdam) ; van Beuzekom, M (NIKHEF, Amsterdam) ; Boterenbrood, H (NIKHEF, Amsterdam) ; Buytaert, J (CERN) ; Collins, P (CERN) ; Dumps, R (CERN) ; van der Heijden, B (NIKHEF, Amsterdam) ; Hombach, C (Manchester U.) et al.
The performance of prototype active-edge VTT sensors bump-bonded to the Timepix ASIC is presented. Non-irradiated sensors of thicknesses 100–200 μm and pixel-to-edge distances of 50 μm and 100 μm were probed with a beam of charged hadrons with sub-pixel precision using the Timepix telescope assembled at the SPS at CERN. [...]
2015 - 8 p.
- Published in : Nucl. Instrum. Methods Phys. Res., A 777 (2015) 110-117
Elsevier Open Access article: PDF;
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Time and Energy Calibration of Timepix3 Assemblies with Thin Silicon Sensors
/ Pitters, Florian Michael (Austrian Academy of Sciences (AT)) ; Alipour Tehrani, Niloufar (CERN) ; Dannheim, Dominik (CERN) ; Fiergolski, Adrian (CERN) ; Hynds, Daniel (Nikhef National institute for subatomic physics (NL)) ; Klempt, Wolfgang (CERN) ; Llopart Cudie, Xavi (CERN) ; Munker, Magdalena (CERN) ; Nurnberg, Andreas Matthias (KIT - Karlsruhe Institute of Technology (DE)) ; Spannagel, Simon (CERN) et al.
The Timepix3 ASIC is a multi-purpose readout chip for hybrid pixel detectors. It can measure time and energy simultaneously by employing time-of-arrival (ToA) and time-over-threshold (ToT) techniques. [...]
CLICdp-Note-2018-008.-
Geneva : CERN, 2018
Fulltext: PDF;
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Development of novel single-die hybridisation processes for small-pitch pixel detectors
/ Svihra, Peter (CERN) ; Braach, Justus (Hamburg University (DE)) ; Buschmann, Eric (CERN) ; Dannheim, Dominik (CERN) ; Dort, Katharina (Justus-Liebig-Universitaet Giessen (DE)) ; Fritzsch, Thomas (Fraunhofer IZM) ; Kristiansen, H (Conpart) ; Rothermund, M (Fraunhofer IZM) ; Schmidt, Janis Viktor (KIT - Karlsruhe Institute of Technology (DE)) ; Vicente Barreto Pinto, Mateus (Universite de Geneve (CH)) et al.
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D; phase, especially for small-scale applications, such interconnect technologies need to be suitable for the assembly of single dies, typically available from Multi-Project-Wafer submissions. [...]
arXiv:2210.02132; CLICdp-Conf-2022-001.-
Geneva : CERN, 2023-03-15 - 12 p.
- Published in : JINST
Fulltext: CLICdp-Conf-2022-001 - PDF; 2210.02132 - PDF;
In : 23rd International Workshop for Radiation Imaging Detectors, Riva Del Garda, It, 26 - 30 Jun 2022, pp.C03008
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