CERN Accelerating science

Published Articles
Report number AIDA-PUB-2013-021
Title SEU tolerant memory design for the ATLAS pixel readout chip
Author(s) Menouni, M (CPPM) ; Arutinov, D (UBONN) ; Backhaus, M (UBONN) ; Barbero, M (CPPM) ; Beccherle, R (INFN) ; Breugnon, P (CPPM) ; Caminada, L (LPNL) ; Dube, S (LPNL) ; Darbo, G (INFN) ; Fleury, J (LPNL) ; Fougeron, D (CPPM) ; Garcia-Sciveres, M (LPNL) ; Gensolen, F (CPPM) ; Gnani, D (LPNL) ; Gonella, L (UBONN) ; Gromov, V (NIKHEF) ; Hemperek, T (UBONN) ; Jensen, F (LPNL) ; karagounis, M (UBONN) ; Kluit, R (NIKHEF) ; Krüger, G (UBONN) ; Kruth, A (UBONN) ; Lu, Y (LPNL) ; Mekkaoui, A (LPNL) ; Rozanov, A (CPPM) ; Schipper, J.D (NIKHEF) ; Zivkovic, V (NIKHEF)
Publication 2013
Imprint 2013-02-12
In: JINST 8 (2013) C02026
In: Topical Workshop on Electronics for Particle Physics, Oxford, UK, 17 - 21 Sep 2012, pp.C02026
DOI 10.1088/1748-0221/8/02/C02026
Subject category Detectors and Experimental Techniques ; 3: Microelectronics and interconnection technology ; 3.3: Shareable IP Blocks for HEP
Accelerator/Facility, Experiment CERN LHC ; ATLAS
Abstract The FE-I4 chip for the B-layer upgrade is designed in a 130 nm CMOS process. For this design, configuration memories are based on the DICE latches where layout considerations are followed to improve the tolerance to SEU. Tests have shown that DICE latches for which layout approaches are adopted are 30 times more tolerant to SEU than the standard DICE latches. To prepare for the new pixel readout chip planned for the future upgrades, a prototype chip containing 512 pixels has been designed in a 65 nm CMOS process and a new approach is adopted for SEU tolerant latches. Results in terms of SEU and TID tolerance are presented.
Copyright/License publication: © 2013-2024 IOP (License: OA without any specific licence)

Corresponding record in: Inspire
Email contact: [email protected]


 記錄創建於2015-03-05,最後更新在2022-08-10


IOP Open Access article:
Download fulltext
PDF