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Tackling Low ATPG Test Coverage in Tessent Presentation

The document discusses strategies for improving low ATPG test coverage in Tessent, highlighting the importance of coverage and factors affecting it, such as circuit design and fault categories. It outlines specific issues like pin constraints, black boxes, and test points that can hinder coverage, along with methods to analyze and address these faults. Additionally, it provides miscellaneous details for coverage improvement, including visualizer pin details and simulation events for clock pulses.

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0% found this document useful (0 votes)
117 views12 pages

Tackling Low ATPG Test Coverage in Tessent Presentation

The document discusses strategies for improving low ATPG test coverage in Tessent, highlighting the importance of coverage and factors affecting it, such as circuit design and fault categories. It outlines specific issues like pin constraints, black boxes, and test points that can hinder coverage, along with methods to analyze and address these faults. Additionally, it provides miscellaneous details for coverage improvement, including visualizer pin details and simulation events for clock pulses.

Uploaded by

sbbhatt2049
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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Tackling low ATPG test

coverage in Tessent

The Future, Connected

Disclaimer: The information contained herein is proprietary to eInfochips Limited and may not be used, reproduced or disclosed to others except as specifically permitted in writing by eInfochips Limited. The
recipient of this document, by its retention and use, agrees to protect the same and the information contained therein from loss or theft.
www.einfochips.com
Importance of
Coverage

Factors Affecting Coverage


Agenda
Fault Categories for
Coverage
Improvement

Miscellaneous details
for Coverage
Improvement
Importance of
Coverage
Stuck-At Coverage Manufactured Chips Average used Chips with Faults
99% 1M Chips 1053
95% 1M Chips 5254

• Above table shows how coverage can impact number of chips which are used with
structural faults still exist

Application Stuck-At Coverage Transition Coverage


Normal Applications 97% 85%
Life Critical Applications 99% 90%

• Above table shows the coverage to be targeted based on the chip applications

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Factors Affecting Coverage
Details
• Make design easily testable and manufactural
• Minimum clocks in the design – Ideally one
Synchronous Circuit • No combinational logic should drive set or reset
• Buffers should be used to delay clock
• Logic should not be used to delay clock

Details
• Minimal percentage of design should be of asynchronous part
• Whole asynchronous part should be in a individual block and
isolated
Asynchronous Circuit
• Asynchronous signals should not set/reset flip-flops –
Asynchronous set/reset are taken care by adding gating logic and
controlling other input by top level test pin

4
Factors Affecting Coverage
Details
• There is coverage loss if feedback loops are existing in the circuit
Feedback Loops • If X is propagating in the loop tools considers it as TIEX and
coverage is impacted

Details
• If clocks of flops are not directly controlled/gated with some logic
there is coverage loss
Gated Clocks
• This is taken care by adding mux in the path and directly
propagating clock to the flops

Details
• More pins are been constrained the more coverage loss is
Pins Constraints encountered – It is taken care by reviewing all the constarints and
converting them from ‘C’ to ‘CT’ so fault category changes and
less coverage loss is encountered

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Factors Affecting Coverage
Details
• Black boxes are major source for X propagation or are X
Black Boxes generators – This is the case when atpg models for required block
is not given if all the models are given during atpg no black boxes
are encountered

Details
• There is coverage loss due to the paths which are not targeted in
Path with timing transition patterns
exceptions (at-speed) • False paths which are defined in sdc cannot be checked at
functional frequency

Details
• There is considerable affect of design rule checks on coverage
DRC’s • There are several DRC’s which should be resolved to improve
coverage like : A(RAM), C1 C6 C16 C22(Clock), D1 D12(Design),E10

6
Factors Affecting Coverage
Details
• Test points are either used to improve test coverage or decrease
Test Points pattern count
• In tessent versa test points are used for both the purposes
simultaneously, to increase coverage and decrease pattern count

Details
• Coverage improvement can be done by analyzing majorly three
Fault Categories fault categories : AU - ATPG Untestable, UO – Unobservable and
UC - Uncontrollable. Command to analyze faults in detail is
report_faults -detail

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Fault Category for Coverage Improvement
Details
ATPG Untestable.
Pin Constraint(AU.PC) • Faults in this category are due to pin constraints applied in the
design

ATPG Untestable. Details


Tied Cell(AU.TC) • Faults in this category are due to tied cell in the design
Details
• This category consists of faults with non_scan cells that requires
multiple clock cycles to propagate fault to observation point.
• To target this faults set_pattern_type command is used to get the
ATPG Untestable. current sequential depth targeted by the tool
Sequential(AU.SEQ) • Use analyze_fault –observe <flop number> -display to get the
value of required sequential depth for targeting that flop
• Sequential depth is changed as per requirement and faults in this
category are targeted

8
Fault Category for Coverage Improvement
Details
ATPG Untestable.
Unclassified • There is no specific method to analyze and target this fault
category for coverage improvement. This faults are analyzed using
visualizer and required actions are taken

Details
UnObservable.UO • This contains the nodes which are not observable

Details
UnControllable.UC • This contains the nodes which are not controllable

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Miscellaneous details for Coverage Improvement

Details
• The mentioned format gives pin details in the visualizer
• CV (Constrained) - If the pin is constrained then its value is
defined here or ‘-’ is mentioned if pin is having no constraints
• FV (Forbidden) - If some value is not allowed for the pin then it is
CV/FV/B mentioned here or ‘-’ is mentioned if pin is having no forbidden
value
• B (Blocked) - If the pin value is block for propagation then ‘B’ is
mentioned here or ‘-’ is mentioned if pin is having no blockage

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Miscellaneous details for Coverage Improvement
Details

• In visualizer for the clock pin two possible values are defined ‘101’
or ‘010’ where for both cases the output of flop will differ

2nd Frame
• Post Leading Edge - Transition Occurs
Event • Post Trailing Edge - Holds Value 1st Frame 3rd Frame
Simulation(Clock
Pulses) for DFF and 100 100
• ‘101’ : 1 frame(1) - Transition occurs
st
Latches 2nd frame(0) - Retains its previous value
3rd frame(1) - Transition occurs 101

100 000
• ‘010’ : 1st frame(0) - Retains its previous value
2nd frame(0) - Transition occurs
3rd frame(1) - Retains its previous value 010

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