Unit 1
Unit 1
Introduction
Introduction to
to ASIC
ASIC
Dr. VENKATESH M
Assistant Professor/ ECE Department
CMR Institute of Technology,Bengaluru
Introduction to ASIC 1
What is this Course all about?
Course Outline
Course Calendar
Introduction to ASIC 2
ASIC vs Standard IC
Standard ICs – ICs sold as Standard Parts
SSI/LSI/ MSI IC such as MUX, Encoder, Memory Chips, or
Microprocessor IC
Application Specific Integrated Circuits (ASIC) – A
Chip for Toy Bear, Auto-Mobile Control Chip, Different
Communication Chips [ GRoT: ICs not Found in Data Book]
Concept Started in 1980s
An IC Customized to a Particular System or Application –
Custom ICs
Digital Designs Became a Matter of Placing of Fewer CICs
or ASICs plus Some Glue Logic
Reduced Cost and Improved Reliability
Application Specific Standard Parts (ASSP) – Controller
Chip for PC or a Modem
Introduction to ASIC 3
Types of ASICs
Full-Custom ICs/Fixed ASICs and Programmable ASICs
Wafer : A circular piece of pure silicon (10-15 cm in dia,
but wafers of 30 cm dia are expected soon-IEEE
micro- Sep/Oct. 1999, pp 34-43)
Wafer Lot: 5 ~ 30 wafers, each containing hundreds of
chips(dies) depending upon size of the die
Die: A rectangular piece of silicon that contains one IC
design
Mask Layers: Each IC is manufactured with successive
mask layers(10 – 15 layers)
First half-dozen or so layers define transistors
Other half-dozen or so define Interconnect
Introduction to ASIC 4
Types of ASICs – Cont’d
Cont’d
ASICs
Semi-Custom
Full-Custom ASICs
ASICs
PLDs FPGA
• Full-Custom ASICs: Possibly all logic cells and all mask layers customized
• Semi-Custom ASICs: all logic cells are pre-designed and some (possibly all)
mask layers customized
Introduction to ASIC 5
Types of ASICs – Cont’d
Cont’d
Full-Custom ASICs
Include some (possibly all) customized logic cells
Have all their mask layers customized
Full-custom ASIC design makes sense only
When no suitable existing libraries exist or
Existing library cells are not fast enough or
The available pre-designed/pre-tested cells consume too much power that a
design can allow or
The available logic cells are not compact enough to fit or
ASIC technology is new or/and so special that no cell library exits.
Offer highest performance and lowest cost (smallest die size) but at the
expense of increased design time, complexity, higher design cost and higher
risk.
Some Examples: High-Voltage Automobile Control Chips, Ana-Digi
Communication Chips, Sensors and Actuators
Introduction to ASIC 6
Types of ASICs – Cont’d
Cont’d
Semi-Custom ASICs
Standard-Cell based ASICs
(CBIC- “sea-bick”)
Use logic blocks from
standard cell libraries, other
mega-cells, full-custom blocks,
system-level macros(SLMs),
functional standard blocks
(FSBs), cores etc.
Get all mask layers
customized- transistors and
interconnect
Manufacturing lead time is
around 8 weeks
Less efficient in size and
performance but lower in design
cost
Introduction to ASIC 7
Types of ASICs – Cont’d
Cont’d
Semi-Custom ASICs – Cont’d
Standard-Cell based ASICs
(CBIC- “sea-bick”) – Cont’d
Introduction to ASIC 8
Types of ASICs – Cont’d
Cont’d
Semi-Custom ASICs – Cont’d
Gate Array based ASICs
Introduction to ASIC 9
Types of ASICs – Cont’d
Cont’d
Semi-Custom ASICs – Cont’d
Gate Array based ASICs - Cont’d
Introduction to ASIC 10
Types of ASICs – Cont’d
Cont’d
Semi-Custom ASICs – Cont’d
Programmable ASICs
PLDs - PLDs are low-density devices
which contain 1k – 10 k gates and are
available both in bipolar and CMOS
technologies [PLA, PAL or GAL]
CPLDs or FPLDs or FPGAs -
FPGAs combine architecture of gate arrays
with programmability of PLDs.
User Configurable
Contain Regular Structures -
circuit elements such as AND, OR,
NAND/NOR gates, FFs, Mux, RAMs,
Allow Different Programming
Technologies
Allow both Matrix and Row-
based Architectures
Introduction to ASIC 11
Types of ASICs – Cont’d
Cont’d
Semi-Custom ASICs – Cont’d
Programmable ASICs - Cont’d
Structure of a CPLD / FPGA
Introduction to ASIC 12
Why FPGA-based ASIC Design?
Choice is based on Many
Factors ; Requirement FPGA/FPLD Discrete Logic Custom Logic
Speed Speed
Time
Future Modification
Future Modifications
Inventory
Inventory Risk Development Tools
Cost
Introduction to ASIC 13
Different Categorizations of FPGAs
Based on Functional Unit/Logic
Cell Structure
Transistor Pairs
Basic Logic Gates: NAND/NOR
MUX
Look –up Tables (LUT)
Wide-Fan-In AND-OR Gates
Programming Technology
Anti-Fuse Technology
SRAM Technology
EPROM Technology
Gate Density
Chip Architecture (Routing Style)
Introduction to ASIC 14
Different Types of Logic Cells
Introduction to ASIC 15
Different Types
Types of
of Logic
Logic Cells
Cells –– Cont’d
Cont’d
Xilinx XC4000 CLB Structure
Introduction to ASIC 16
Different Types
Types of
of Logic
Logic Cells
Cells –– Cont’d
Cont’d
Actel Act Logic Module Structure
Use Antifuse Programming Tech.
Based on Channeled GA Architecture
Logic Cell is MUX which can be configured as multi-input logic gates
Introduction to ASIC 17
Different Types
Types of
of Logic
Logic Cells
Cells –– Cont’d
Cont’d
Altera Flex / Max Logic
Element Structure
Flex 8k/10k Devices – SRAM Based LUTs, Logic
Elements (LEs) are similar to those used in XC5200
FPGA
Introduction to ASIC 18
Different Types
Types of
of Logic
Logic Cells
Cells –– Cont’d
Cont’d
To SUMMARIZE, FPGAs from
various vendors differ in their
Architecture (Row Based or Matrix
Based Routing Mechanism)
Gate Density (Cap. In Equiv. 2- Input
NAND Gates)
Introduction to ASIC 19
Programming Technologies
Technologies
Three Programming Technologies
The Antifuse Technology
Static RAM Technology
EPROM and EEPROM Technology
Introduction to ASIC 20
Programming Technologies –– Cont’d
Cont’d
The Antifuse Technology
Invented at Stanford and developed
by Actel
Opposite to regular fuse Technology
Normally an open circuit until a
programming current (about 5 mA)
is forced through it
Two Types: [a] [b]
Introduction to ASIC 21
Programming Technologies –– Cont’d
Cont’d
Static RAM Technology
SRAM cells are used for
As Look-Up Tables (LUT) to
implement logic (as Truth Tables)
As embedded RAM blocks (for
buffer storage etc.)
As control to routing and
configuration switches
Advantages
Allows In-System Programming
(ISP)
Suitable for Reconfigurable HW
Disadvantages
Volatile – needs power all the time /
use PROM to download configuration
data
Introduction to ASIC 22
Programming Technologies –– Cont’d
Cont’d
EPROM and EEPROM Technology-
Introduction to ASIC 23
Programming Technologies –– Cont’d
Cont’d
Summary Sheet
Introduction to ASIC 24
Chip Architecture or Routing
Routing Style
Style
Introduction to ASIC 25
Chip
Chip Architecture
Architecture or
or Routing
Routing Style
Style –– Cont’d
Cont’d
Introduction to ASIC 26
Chip
Chip Architecture
Architecture or
or Routing
Routing Style
Style –– Cont’d
Cont’d
Trade-off between Longer and Shorter Tracks Explained Through Example
Introduction to ASIC 27
ASIC
ASIC Design
Design Process
Process
S-1 Design Entry: Schematic entry
or HDL description
S-2: Logic Synthesis: Using
Verilog HDL or VHDL and
Synthesis tool, produce a netlist-
logic cells and their interconnect
detail
S-3 System Partitioning: Divide a
large system into ASIC sized pieces
S-4 Pre-Layout Simulation: Check
design functionality
S-5 Floorplanning: Arrange netlist
blocks on the chip
S-6 Placement: Fix cell locations in
a block
S-7 Routing: Make the cell and
block interconnections
S-8 Extraction: Measure the
interconnect R/C cost
S-9 Post-Layout Simulation
Introduction to ASIC 28
ASIC Design Process – Cont’d
Cont’d
Altera FPGA Design Flow – A Self-Contained System that does
all from Design Entry, Simulation, Synthesis, and Programming of Altera Devices
Introduction to ASIC 29
ASIC Design Process – Cont’d
Cont’d
Xilinx FPGA Design Flow – Allows Third-Party Design Entry SW,
Accepts their generated netlist file as an input
Use Pin2xnf and wir2xnf SW to
convert the netlist file to .XNF
xnfmap and xnfmerge programs
convert .xnf files to create a
unified netlist file (Nand/Nor Gates)
.MAP file are generated
map2lca program does fitters job,
produces un-routed .LCA file
apr or ppr SW does the routing
job, post-layout netlist generated
makebits SW generates BIT files
Introduction to ASIC 30