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Unit 1

The document provides an overview of Advanced VLSI with a focus on Application Specific Integrated Circuits (ASICs), detailing their types, design processes, and comparison with standard ICs. It discusses full-custom and semi-custom ASICs, their advantages, and the various programming technologies used in FPGA-based designs. The document also outlines the ASIC design process, including steps from design entry to post-layout simulation.

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0% found this document useful (0 votes)
8 views30 pages

Unit 1

The document provides an overview of Advanced VLSI with a focus on Application Specific Integrated Circuits (ASICs), detailing their types, design processes, and comparison with standard ICs. It discusses full-custom and semi-custom ASICs, their advantages, and the various programming technologies used in FPGA-based designs. The document also outlines the ASIC design process, including steps from design entry to post-layout simulation.

Uploaded by

rohm21ec
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
You are on page 1/ 30

21EC71-Advanced VLSI

Introduction
Introduction to
to ASIC
ASIC

Dr. VENKATESH M
Assistant Professor/ ECE Department
CMR Institute of Technology,Bengaluru

Introduction to ASIC 1
What is this Course all about?
 Course Outline
 Course Calendar

Introduction to ASIC 2
ASIC vs Standard IC
 Standard ICs – ICs sold as Standard Parts
 SSI/LSI/ MSI IC such as MUX, Encoder, Memory Chips, or
Microprocessor IC
 Application Specific Integrated Circuits (ASIC) – A
Chip for Toy Bear, Auto-Mobile Control Chip, Different
Communication Chips [ GRoT: ICs not Found in Data Book]
 Concept Started in 1980s
 An IC Customized to a Particular System or Application –
Custom ICs
 Digital Designs Became a Matter of Placing of Fewer CICs
or ASICs plus Some Glue Logic
 Reduced Cost and Improved Reliability
 Application Specific Standard Parts (ASSP) – Controller
Chip for PC or a Modem
Introduction to ASIC 3
Types of ASICs
 Full-Custom ICs/Fixed ASICs and Programmable ASICs
 Wafer : A circular piece of pure silicon (10-15 cm in dia,
but wafers of 30 cm dia are expected soon-IEEE
micro- Sep/Oct. 1999, pp 34-43)
 Wafer Lot: 5 ~ 30 wafers, each containing hundreds of
chips(dies) depending upon size of the die
 Die: A rectangular piece of silicon that contains one IC
design
 Mask Layers: Each IC is manufactured with successive
mask layers(10 – 15 layers)
 First half-dozen or so layers define transistors
 Other half-dozen or so define Interconnect

Introduction to ASIC 4
Types of ASICs – Cont’d
Cont’d

ASICs

Semi-Custom
Full-Custom ASICs
ASICs

Stnadard-Cell Gate-Array based Praogrammable


based ASICs ASICs ASICs

PLDs FPGA

• Full-Custom ASICs: Possibly all logic cells and all mask layers customized
• Semi-Custom ASICs: all logic cells are pre-designed and some (possibly all)
mask layers customized
Introduction to ASIC 5
Types of ASICs – Cont’d
Cont’d
Full-Custom ASICs
 Include some (possibly all) customized logic cells
 Have all their mask layers customized
 Full-custom ASIC design makes sense only
 When no suitable existing libraries exist or
 Existing library cells are not fast enough or
 The available pre-designed/pre-tested cells consume too much power that a
design can allow or
 The available logic cells are not compact enough to fit or
 ASIC technology is new or/and so special that no cell library exits.
 Offer highest performance and lowest cost (smallest die size) but at the
expense of increased design time, complexity, higher design cost and higher
risk.
 Some Examples: High-Voltage Automobile Control Chips, Ana-Digi
Communication Chips, Sensors and Actuators
Introduction to ASIC 6
Types of ASICs – Cont’d
Cont’d
 Semi-Custom ASICs
 Standard-Cell based ASICs
(CBIC- “sea-bick”)
 Use logic blocks from
standard cell libraries, other
mega-cells, full-custom blocks,
system-level macros(SLMs),
functional standard blocks
(FSBs), cores etc.
 Get all mask layers
customized- transistors and
interconnect
 Manufacturing lead time is
around 8 weeks
 Less efficient in size and
performance but lower in design
cost

Introduction to ASIC 7
Types of ASICs – Cont’d
Cont’d
 Semi-Custom ASICs – Cont’d
 Standard-Cell based ASICs
(CBIC- “sea-bick”) – Cont’d

Introduction to ASIC 8
Types of ASICs – Cont’d
Cont’d
 Semi-Custom ASICs – Cont’d
 Gate Array based ASICs

Introduction to ASIC 9
Types of ASICs – Cont’d
Cont’d
 Semi-Custom ASICs – Cont’d
 Gate Array based ASICs - Cont’d

Introduction to ASIC 10
Types of ASICs – Cont’d
Cont’d
 Semi-Custom ASICs – Cont’d
 Programmable ASICs
 PLDs - PLDs are low-density devices
which contain 1k – 10 k gates and are
available both in bipolar and CMOS
technologies [PLA, PAL or GAL]
 CPLDs or FPLDs or FPGAs -
FPGAs combine architecture of gate arrays
with programmability of PLDs.
User Configurable
 Contain Regular Structures -
circuit elements such as AND, OR,
NAND/NOR gates, FFs, Mux, RAMs,
Allow Different Programming
Technologies
 Allow both Matrix and Row-
based Architectures

Introduction to ASIC 11
Types of ASICs – Cont’d
Cont’d
 Semi-Custom ASICs – Cont’d
 Programmable ASICs - Cont’d
 Structure of a CPLD / FPGA

Introduction to ASIC 12
Why FPGA-based ASIC Design?
 Choice is based on Many
Factors ; Requirement FPGA/FPLD Discrete Logic Custom Logic
 Speed Speed

 Gate Density Gate Density

 Development Time Cost

 Prototyping and Development Time

Simulation Time Prototyping and Sim.

 Manufacturing Lead Manufacturing

Time
Future Modification
 Future Modifications
Inventory
 Inventory Risk Development Tools

 Cost

Very Effective Adequate Poor

Introduction to ASIC 13
Different Categorizations of FPGAs
 Based on Functional Unit/Logic
Cell Structure
 Transistor Pairs
 Basic Logic Gates: NAND/NOR
 MUX
 Look –up Tables (LUT)
 Wide-Fan-In AND-OR Gates
 Programming Technology
 Anti-Fuse Technology
 SRAM Technology
 EPROM Technology
 Gate Density
 Chip Architecture (Routing Style)

Introduction to ASIC 14
Different Types of Logic Cells

Introduction to ASIC 15
Different Types
Types of
of Logic
Logic Cells
Cells –– Cont’d
Cont’d
 Xilinx XC4000 CLB Structure

Introduction to ASIC 16
Different Types
Types of
of Logic
Logic Cells
Cells –– Cont’d
Cont’d
 Actel Act Logic Module Structure
 Use Antifuse Programming Tech.
 Based on Channeled GA Architecture
 Logic Cell is MUX which can be configured as multi-input logic gates

The Actel ACT 2 and ACT 3 Logic Modules. (a) The C-


Module for combinational logic. (b) The ACT 2 S-Module.
(c) The ACT 3 S-Module. (d) The equivalent circuit
(without buffering) of the SE (sequential element). (e) The
sequential element configured as a positive-edge–triggered
D flip-flop. (Source: Actel.)

Introduction to ASIC 17
Different Types
Types of
of Logic
Logic Cells
Cells –– Cont’d
Cont’d
 Altera Flex / Max Logic
Element Structure
Flex 8k/10k Devices – SRAM Based LUTs, Logic
Elements (LEs) are similar to those used in XC5200
FPGA

The Altera MAX architecture. (a) Organization of logic and


interconnect. (b) A MAX family LAB (Logic Array Block).
(c) A MAX family macrocell. The macrocell details vary
between the MAX families—the functions shown here are
closest to those of the MAX 9000 family

Introduction to ASIC 18
Different Types
Types of
of Logic
Logic Cells
Cells –– Cont’d
Cont’d
To SUMMARIZE, FPGAs from
various vendors differ in their
 Architecture (Row Based or Matrix
Based Routing Mechanism)
 Gate Density (Cap. In Equiv. 2- Input
NAND Gates)

 Basic Cell Structure


 Programming Technology
Vendor/ Product Architechture Capacity Basic Cell Programming Technology
Actel Gate Array 2-8 k MUX Antifuse
QuickLogic Matrix 1.2-1.8 k MUX Antifuse
Xilinx Matrix 2-10 k RAM Block SRAM
Altera Extended PLA 1- 5 k PLA EPROM
Concurrent Matrix 3-5 k XOR, AND SRAM
Plessy SOG 2-40 k NAND SRAM

Introduction to ASIC 19
Programming Technologies
Technologies
 Three Programming Technologies
The Antifuse Technology
Static RAM Technology
EPROM and EEPROM Technology

Introduction to ASIC 20
Programming Technologies –– Cont’d
Cont’d
 The Antifuse Technology
Invented at Stanford and developed
by Actel
Opposite to regular fuse Technology
Normally an open circuit until a
programming current (about 5 mA)
is forced through it
Two Types: [a] [b]

Actel’s PLICE [Programmable


Low-Impedance Circuit Element]- A
High-Resistance Poly-Diffusion
Antifuse
QuickLogic’s Low-Resistance [c] [d]

metal-metal antifuse [ViaLink]


technology Actel Antifuse [b] Actel Antifuse Resistance [c] QuickLogic
Direct metal-2-metal connections
Antifuse [d] QL Antifuse Resistance
Higher programming currents
reduce antifuse resistance
Disadvantages:
Unwanted Long Delay
OTP Technology

Introduction to ASIC 21
Programming Technologies –– Cont’d
Cont’d
 Static RAM Technology
 SRAM cells are used for
As Look-Up Tables (LUT) to
implement logic (as Truth Tables)
As embedded RAM blocks (for
buffer storage etc.)
As control to routing and
configuration switches

 Advantages
Allows In-System Programming
(ISP)
Suitable for Reconfigurable HW

 Disadvantages
Volatile – needs power all the time /
use PROM to download configuration
data
Introduction to ASIC 22
Programming Technologies –– Cont’d
Cont’d
 EPROM and EEPROM Technology-

 EPROM Cell is almost as small as Antifuse


 Floating-Gate Avalanche MOS (FAMOS) Tech.
Under normal voltage, transistor is on
With Programming Voltage applied, we can turn it off (configuration) to
implement our logic
Exposure to UV lamp (one hour) we can erase the programming
Use EEPROM for quick reconfiguration, also, ISP possible

Introduction to ASIC 23
Programming Technologies –– Cont’d
Cont’d
 Summary Sheet

Introduction to ASIC 24
Chip Architecture or Routing
Routing Style
Style

Introduction to ASIC 25
Chip
Chip Architecture
Architecture or
or Routing
Routing Style
Style –– Cont’d
Cont’d

Introduction to ASIC 26
Chip
Chip Architecture
Architecture or
or Routing
Routing Style
Style –– Cont’d
Cont’d
 Trade-off between Longer and Shorter Tracks Explained Through Example

Introduction to ASIC 27
ASIC
ASIC Design
Design Process
Process
S-1 Design Entry: Schematic entry
or HDL description
S-2: Logic Synthesis: Using
Verilog HDL or VHDL and
Synthesis tool, produce a netlist-
logic cells and their interconnect
detail
S-3 System Partitioning: Divide a
large system into ASIC sized pieces
S-4 Pre-Layout Simulation: Check
design functionality
S-5 Floorplanning: Arrange netlist
blocks on the chip
S-6 Placement: Fix cell locations in
a block
S-7 Routing: Make the cell and
block interconnections
S-8 Extraction: Measure the
interconnect R/C cost
S-9 Post-Layout Simulation

Introduction to ASIC 28
ASIC Design Process – Cont’d
Cont’d
 Altera FPGA Design Flow – A Self-Contained System that does
all from Design Entry, Simulation, Synthesis, and Programming of Altera Devices

Introduction to ASIC 29
ASIC Design Process – Cont’d
Cont’d
 Xilinx FPGA Design Flow – Allows Third-Party Design Entry SW,
Accepts their generated netlist file as an input
 Use Pin2xnf and wir2xnf SW to
convert the netlist file to .XNF
 xnfmap and xnfmerge programs
convert .xnf files to create a
unified netlist file (Nand/Nor Gates)
.MAP file are generated
 map2lca program does fitters job,
produces un-routed .LCA file
 apr or ppr SW does the routing
job, post-layout netlist generated
 makebits SW generates BIT files
Introduction to ASIC 30

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