1592406140985_conduction and Fin Ppt
1592406140985_conduction and Fin Ppt
1592406140985_conduction and Fin Ppt
the block.
dx = thickness of the body in the direction
of the flow.
k = constant of proportionality and is
known as thermal conductivity of
material.
• The –ve sign of k is to take care of
decreasing temperature along with the
direction of heat flow.
Qx dx
x
t
kx ( dy.dz ) .d dx
x x
t
kx
dx.dy.dz.d
x x
• Likewise the heat accumulation in the
control volume due to heat flow along y-
and z-directions will be: -
t
ky dx.dy.dz.d .............(iv)
y y
t
kz dx.dy.dz.d .............(v)
Z Z
• Sum of heat accumulations as prescribed
by equations (i), (ii) and (iii) gives the total
heat stored in the elemental volume due to
heat flow along all the co-ordinate axes.
Heat efflux
Heat stored in the element due to flow of
heat in the radial direction.
dQr Qr Q ( r dr )
(Qr ) dr
r
t
k ( rd .dz ) .d dr
r r
t
k ( dr.d .dz ) r. d
r r
2t t
k ( dr.d .dz ) r. 2 d
r r
2t 1 t
k ( dr.rd .dz ) 2 . d
r r r
(b) Tangential direction (r—z plane):
Heat flow in tangential direction.
Heat influx
Heat efflux
• Heat stored in the element due to flow in
the tangential direction,
(c) Axial direction
Heat flow in Axial direction.
Heat influx
t
Qz k (r.d .dr ) d
z
Heat efflux
Q ( z dz ) Qz (Qz )dz
z
Heat stored in the element due to heat flow
in
axial direction
dQz Qz Q ( z dz )
t
k (r.d .dr ) d dz
z z
2
t
k (dr.d .dz ) 2 .d
z
Net heat accumulated in the element
Where,
δ= Thickness of the plane wall
A=cross sectional area of the plane wall
K= thermal conductivity of wall material
t1,t2= temperature at two faces 1 and 2 of the
wall
• For one directional steady state heat flow
with no internal heat generation the
equation reduces to
I =V/R……………………………(i)
from Fourier’s law of heat transfer
• As potential difference across a resistance
makes the current to flow similarly
temperature difference across a solid
makes the heat to flow. Obviously there is
a one- one correspondence between the
flow of electric current and heat i.e.,
• Electric current is analogous to thermal
heat flow rate
• Electrical voltage corresponds to thermal
temperature difference.
• Comparing equations (1) and (ii) electric
resistance is analogous to quantity dx/kA.
This quantity is called thermal resistance.
• So, Thermal Resistance R = dx/kA.
CONTACT THERMAL RESISTANCE
• In composite wall calculation of heat flow
are made on the assumption that:
1) The contact between the adjacent layer is
perfect.
2) At the interface temperature is continuous.
• We can see from the graph (Fig. 2.16) between R’ and ‘r’
that when r < rc, thermal resistance decreases with
increase in r upto r i.e., heat transfer rate increases.
• r > rc, thermal resistance increases with increase in ‘r’
i.e., heat transfer decreases
EXTENDED SURFACES
where
GENERAL EQUATION OF FIN
• Equations (4) and (5) provide a general form of
the energy equation for one- dimensional heat
dissipation from an extended surface. For a
given fin, the parameter m is constant provided
the convective film coefficient h is constant over
the entire surface and the thermal conductivity k
is constant within the considered temperature
range.
• Then the general solution of this linear,
homogeneous second order differential equation
is of the form
HEAT DISSIPATION FROM AN INFINITELY
LONG FIN
• The relevant boundary conditions are
• Temperature at the base of fin equals the
temperature of the surface to which the fin is
attached.
• Recalling that
Case II: Heat Dissipation from a Fin Insulated at
the Tip:
• The fin is of any finite length with the end
insulated and so no heat is transferred from the
tip.
• Therefore, the relevant boundary conditions are
• Further