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Masters Program in Radio Frequency

Design & Technology(RFDT)


(Microelectronics, Signal Processing and Microwaves)

Centre For Applied Research in Electronics


Indian institute of technology, Delhi
About Centre(CARE)

 Established : 1971
 Focus: Coordinated research and training in specialized areas of Electronics
 State of the art system design and test facilities
 Over 30 technology transfers since 1982

Research Groups

Microwave Microelectronics Signal Processing


M.Tech Programme

 Foundation : 2004
 Eligibility : B.Tech/B.E. in Electronics/Communication/Electrical or related areas
 Rigorous process of selection : Based on all India level exam, GATE, candidates are
shortlisted and interviewed by the faculty
 Curriculum impart hands-on training on real-time systems and scenarios
 Project pursued are deliverable products to sponsoring agencies and hardware intensive
Microwave
Research Areas
 Antenna Design
 RFIC and MMIC Courses Offered
  CAD of RF and Microwave devices
TeraHertz components
  RF and Microwave Active Circuits
RF MEMS
  Radiating Systems for RF
EBG Structures
Communications
Facilities  RF and Microwave Measurement System
 TeraHertz VNA and Spectrum analyzer Techniques
till(40GHz)
 Anechoic chamber for antenna testing
and characterization
 MIC fabrication facility
 Advance RF, MEMS and EM simulation
tools
Microelectronics
Research Areas
 Microsystem Design, Integration and Courses Offered
packaging  Fundamentals of Semiconductor
 CMOS photonic devices and sensors  Fabrication Techniques for RF and
 Fabrication techniques for VLSI Microwave Devices
 Quantum devices  Technology of RF and Microwave
Solid State Devices
Facilities
 MOS VLSI
 CMOS silicon sensor fabrication
 MEMS Design and Technology
 Clean room facility(class 100 & class 1000)
 Reactive ion etching and RF sputtering
 MEMS fabrication facility
 Thermal, acoustic, optical and magnetic systems for
non-destructive characterization
Signal Processing
Research Areas
 Hardware and software for low power DSP Courses Offered
systems
 Sensor Array Signal Processing
 Speech and audio processing
 Architectures and Algorithms for DSP
 Detection , localization and target classification Systems
algorithm
 Human and Machine Speech
 Underwater, VLF and RF communication Communication
 Machine Learning and Deep Learning  Sonar Systems Engineering

Facilities
 TI C55x, C67 and OMAP Processor Kits will multicore processors
 Full acoustic anechoic chamber for speech and audio applications
 Studio quality recording facility for audio and speech
 Underwater acoustic tank for real-time underwater experiments
Domain

 Antenna Design  Algorithm Design


 EBG Structures  Active Sonar
 RADAR  Real Time Operating
 System for DSP
RFIC
 Wireless Sensor Network
 RF MEMS
 Speech and Audio
 RFID
Processing
 Uniplanar Structures  Microwave Components
 Transceiver Design upto 140GHz
 Machine and Deep Learning  RF and Underwater
Communication
Activities
Apart from curricular activities, CARE students are involved actively in the IEEE-
MTTS IIT Delhi Student Branch Chapter. Students organize various workshops and
lectures in collaboration with industry and academic personnel that are useful to
keep pace with current trends

Workshops Lectures
 Workshop on COMSOL  Metamaterials
Multiphysics and Intellisuite  Electronic Devices packaging and systems
 Workshop on CST Microwave  Non-reciprocal Photonics with Optomechanical
Studio
Resonator
 Advanced Short Term Course on  ESD Protection for 5G components
Underwater Surveillance
 RF MEMS
 Mathwork workshop
 MMIC based design and implementation of
microwave circuits
Collaborations
INTERNATIONAL NATIONAL
 Continental Automotive(Germany)  Astra Microwave.
 Westminster University  Cadence.
 Agilent Technologies.  ST Microelectronics
 Applied Nanostructures, USA.  BEL.
 Femto CNRS France.  Space Application Centre, Ahmedabad.
 Lockheed Martin USA.  DRDO
 Maxim Semiconductors, USA. (DEAL, LRDE, RCI, NPOL, NSTL, SASE, CABS)
 MEMS Cap, USA.  GAETECH Hyderabad.
 Mitsubishi, Japan.  Honeywell Bangalore.
 NXP Semiconductors, Netherlands  Indian Navy.
 University of Tokyo.  NPMASS.
 Delft Institute of Microelectronics.  Tektronix.
 University of Bath, UK.
Past Recruiters

…………..
CARE Gallery
Contact
Head of Department
Dr Ananjan Basu
Email: [email protected]
Phone: +91-11-26591110
Placement Coordinator
Dr. Mahesh P Abegaonkar
Associate Professor
Email: [email protected]
Phone: +91-11-2659-6281
Student Placement Coordinator
Udit Jain
Email: [email protected]
Phone: +91-8989162401, +91-7999028527

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