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Design of Memory Elements

Memory Element Designing

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0% found this document useful (0 votes)
22 views19 pages

Design of Memory Elements

Memory Element Designing

Uploaded by

nmdrafiqj2003
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PPTX, PDF, TXT or read online on Scribd
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Design of memory elements

Memory Basics
DRAM
Realization of DRAM
• 1 Transistor (1T) DRAM cell
• 3 Transistor (3T) DRAM cell
• 4 Transistor (4T) DRAM cell
1T DRAM cell
1T DRAM cell

• Accessed using single NMOS


• Storage is achieved by capacitor
(Vdd or Ground)
• Control Input, word line, WL
• Data I/O : Bit Line

WL BL M1 Cs
1 Vdd ON Charged to Vdd-Vth

0 Vdd OFF Data gets stored on


the capacitor (Hold
Operation)
DRAM Operation
Refresh Rate

• The read-out of the 1T DRAM cell is destructive; read and refresh


operations are necessary for correct operation.
• Unlike 3T cell, 1T cell requires presence of an extra capacitance that
must be explicitly included in the design.
• When writing a “1” into a DRAM cell, a threshold voltage is lost. This
charge loss can be circumvented by bootstrapping the word lines to a
higher value than VDD
3T DRAM Cell

• Reads are non-destructive


• Value stored at node X when writing a “1” = VWWL-Vtn
• BL1 and BL 2 is initially at Vdd
• BL1 is used to perform write and BL 2 is used for read operation
3T DRAM Operation ( Always reads the inverted value)

To Write Logic 1

Operation Data WWL RWL BL1 BL2 M1 X M2 M3


(WS) (RS)

Precharge 1 0 0 Vdd Vdd - - - -


(PC=1)
Write 1 1 0 Vdd Vdd ON Vdd-Vtn ON (Data gets stored on the gate of M2 OFF
Refresh 1 0 0 Vdd Vdd OFF Vdd-Vtn ON (Data gets stored on the gate of M2 OFF
(Hold)
Read 1 0 1 Vdd 0 OFF Vdd-Vtn ON ON
3T DRAM Operation ( Always reads the inverted value)

To Write Logic 0

Operation Data WWL RWL BL1 BL2 M1 X M2 M3


(WS) (RS)

Precharge 1 0 0 Vdd Vdd - - - -


(PC=1)
Write 0 1 0 0 Vdd ON 0 OFF (0 gets stored on the gate of M2) OFF
Refresh 1 0 0 0 Vdd OFF 0 OFF (0 gets stored on the gate of M2) OFF
(Hold)
Read 1 0 1 0 Vdd OFF 0 OFF (0 gets stored on the gate of M2) ON
4T – DRAM Cell – Write Operation

M1 M2 BL BL’ RS CS I/O I/O’ M3 M4 M5 M6 M7 M8


Precharge ON ON Vdd Vdd 0 0 1 0 OFF OFF OFF OFF OFF OFF

Write ON ON 1 0 0 1 1 0 ON ON OFF OFF OFF OFF


Write ON ON 1 0 1 0 1 0 OFF OFF ON ON OFF(0) ON(1)
4T – DRAM Cell – Read Operation

M1 M2 BL BL’ RS CS I/O I/O’ M3 M4 M5 M6 M7 M8


Precharge ON ON Vdd Vdd 0 0 - - OFF OFF OFF OFF OFF(0) ON(1)

Read ON ON 1 0 1 0 - - OFF OFF ON ON OFF(0) ON(1)


Read ON ON 1 0 0 1 1 0 ON ON OFF OFF OFF(0) ON(1)
Realization of SRAM Cell
• Capable of retaining the data as long as the power is applied.
• Does not require any periodic refreshing.
6T SRAM Cell

M1 M2 BL BL’ RS CS I/O I/O’ M3 M4 M5 M6 Inv1 Inv2


Precharge ON ON Vdd Vdd 0 0 1 0 OFF OFF OFF OFF - -

Write ON ON 1 0 0 1 1 0 ON ON OFF OFF - -


Write ON ON 1 0 1 0 1 0 OFF OFF ON ON 0 1

M1 M2 BL BL’ RS CS I/O I/O’ M3 M4 M5 M6 Inv1 Inv2


Precharge ON ON Vdd Vdd 0 0 - - OFF OFF OFF OFF 0 1

Read ON ON 1 0 1 0 - - OFF OFF ON ON 0 1


Read ON ON 1 0 0 1 1 0 ON ON OFF OFF 0 1
Dynamic CMOS Logic - Monotonicity
Dynamic CMOS – Charge Sharing -
Redistribution
Charge Sharing – Solutions :-
1. Static Bleeder
2. Precharge of Internal Nodes

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