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02 - Computer Evolution and Performance

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02 - Computer Evolution and Performance

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paradox.aar
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Computer Architecture

Course Code: CSE 360

Presented by
Dr. Md. Nawab Yousuf Ali
Professor, Dept. of CSE
Computer System Architecture
Course Code: CSE360

Lecture - 2
Computer Evolution and Performance
ENIAC – background: The First Generation
• First Generation used Vacuume Tubes
• Electronic Numerical Integrator And Computer
• Developed by Eckert and Mauchly
• At University of Pennsylvania
• Responsible for developing Trajectory tables for
new weapons (without these firing tables, the
new weapons and artillery were useless to
gunners)
• Started 1943
• Finished 1946
• Used until 1955
ENIAC - 1946
ENIAC - details
• The resulting machine was enormous!!!
• Weighting 30 tons
• Occupying 15,000 square feet of floor space (30x50 feet)
• Contains 18,000 vacuum tubes
• 140 kW power consumption when operating
• Capable of 5,000 additions per second
• Decimal number system (not binary); numbers were
represented in decimal form and arithmetic was performed
in the decimal system.
• Memory consists of 20 accumulators, each capable of
holding 10 digits.
Major drawback
• Programming was done manually by plugging and unplugging
cables and setting switches. Data was entered by punched cards.
• Programming for typical calculations took from half an hour to a
day.
von Neumann/Turing
o Von Neumann (mathematician) was a consultant to both ENIAC
and EDVAC (Electronic discrete variable computer) projects
o Proposal of Neumann, EDVAC
o In 1946, Von Neumann began to design a new stored program
computer, referred to as IAS (Institute for Advanced
Studies) computer, at the Princeton Institute for Advanced
Studies
• IAS computer, although not completed until 1952, is prototype of
all subsequent general-purpose computers.

General structure of the IAS computer:


 A main memory which stores both data and instructions
 An arithmetic-logic unit (ALU) capable of operating on binary
data
 A control unit interpreting instructions in memory and causes
them executing
 Input and output equipment operated by control unit
Structure of von Neumann machine
IAS - details
• The memory of the IAS consists of 1000 storage locations, called
words, of 40 binary digits (bits) each (1000 x 40 bit words).

• Both data and instructions are stored here.


• Each number is represented by a sign bit and a 39-bit value.
• A word may contain two 20-bit instructions (2 x 20 bit instructions)
with each instruction consisting of an 8-bit operation code (opcode)
specifying the operation to be performed and a 12-bit address
designating one of the words in memory (numbered from 0 to 999).
IAS - details
• A more detailed structure diagram as follows:
• Both the control unit and the ALU contain storage locations, called
registers
— Memory Buffer Register (MBR): Contains a word to be stored
in memory or sent to the I/O unit, or is used to receive a word
from memory or from the I/O unit.
— Memory Address Register (MAR): Specifies the address in
memory of the word to be written into or read from the MBR.
— Instruction Register (IR): Contains the 8-bit opcode
instruction being executed.
— Instruction Buffer Register (IBR): Employed to hold
temporarily the right-hand instruction from a word in memory.
— Program Counter (PC): Contains the address of the next
instruction-pair to be fetched from memory.
— Accumulator (AC) and Multiplier Quotient (MQ): Employed to
hold temporarily operands and results of ALU operations, e.g.
the result of multiplying two 40-bit numbers is an 80-bit
number; the most significant 40 bits are stored in the AC and
the least significant bit in the MQ.
Expanded Structure of IAS
Computer
Commercial Computers
• In 1947 - Eckert-Mauchly Computer Corporation
formed commercially.
• First successful commercial computer was
UNIVAC I (Universal Automatic Computer),
which was commissioned by the US Bureau of
Census
• The Eckert-Mauchly Computer Corporation
became part of Sperry-Rand Corporation
• Late 1950s - UNIVAC II had greater memory
capacity and higher performance than the
UNIVAC I.
IBM
• IBM, which was then the major manufacturer of
Punched-card processing equipment, delivered
its first electronic stored-program computer,
the 701, in 1953.
• The 701 was intended primarily for scientific
applications.
• In 1955, the IBM introduced 702 product, which
had a number of hardware features that suited
for business applications
• These were the first of a long series of
700/7000 computers.
The Second Generations: Transistors
• Replacement of vacuum tube by the transistor
• The transistor is smaller, cheaper, and dissipates less heat
• Transistor is a semiconductor device used to amplify or
switch electronic signals.
• A transistor is made of a solid piece of a semiconductor
material, with at least three terminals for connection to an
external circuit.
• A voltage or current applied to one pair of the transistor's
terminals changes the current flowing through another pair
of terminals.
• The transistor was invented at Bell Labs in 1947 and by
the 1950s had launched an electronic revolution.
• Fully transistorized computes were commercially available,
and IBM was again not the first company to deliver the
new technology.
• IBM followed shortly with the 7000 series.
Transistor Based Computers
• The use of transistor defines the second generation of
computers.
• Each new generation is characterized by greater
processing performance, larger memory capacity, and
smaller size than the previous one. (See Table->next
slide)
• The second generation is important for the
appearance of Digital Equipment Corporation (DEC) in
1957.
• DEC delivered its first computer, the PDP-1
• Programmed Data Processor (abbreviated
PDP) was the name of a series of minicomputers
made by Digital Equipment Corporation.
Generations of Computer
IBM 7094
• From the introduction of the 700 series in 1952 to the introduction of the last
member of the 700 series in 1964.
• Product line shows increased performance, increased capacity, and low cost.
• The size of the main memory grew from 2K to 32K words.
• The time to access one word of memory, the memory cycle time, fell from 30µs to
1.4µs.
• The number of opcodes grew from 24 to 185.
• Speed improvements are achieved by improved electronics (e.g., a transistor
implementation is faster than a vacuum tube) and more complex circuitry.
Third Generation: Integrated Circuits
• A single, self-contained transistor is called a discrete
component where transistors are packaged individually
• Throughout the 1950s and early 1960s, electronic equipment
was composed largely of discrete components –
transistors, resistors, capacitors, and so on
• Early second-generation computers contained about 10,000
transistors
• This figure grew to the hundreds of thousands, making the
new manufacture, more powerful machines.
• In 1958, started the era of microelectronics and the
invention of the integrated circuit (transistors are found in
integrated circuits).
• It is the integrated circuits that defines the third generation
of computers.
• Integrated circuit also known as IC, microcircuit,
microchip, silicon chip, or chip
Microelectronics
• Microelectronics means Literally - “small
electronics”
• A computer is made up of gates,
memory cells, and interconnections
• These can be manufactured on a
semiconductor e.g., silicon wafer
• Trend towards the reduction in size in
digital electronic circuits.
Microelectronics: Computer Elements
• Only two fundamental types of components are required:
gates and memory cell
• A gate is a device that implements a simple Boolean or logical
function, such as IF A AND B ARE TRUE THEN C IS TRUE (AND
GATE)
• Such devices are called gates because they control data flow
in the same way that canal gates do.
• The memory cell is a device that can store one bit of data that
is, the device can be in one of two stable states at any time
Microelectronics: Computer Elements
Four basic functions of a computer:
• Data Storage: Provided by memory cells
• Data processing: Provided by gates
• Data movement: The paths between components are
used to move data from memory to memory and from
gates to memory
• Control: A gate will have one or more data inputs plus a
control signal input that activates the gate.
 When the control signal is ON, the gate performs its
functions on the data inputs and produces a data output.
 Similarly, the memory cell will store the bit on its input
lead when the WRITE control signal is ON and
 the memory cell will place the bit on its output lead
when the READ control signal is ON.
Integrated Circuit: Wafer, Chip, and Gate
• A thin wafer of silicon is divided
into a matrix of small areas,
each a few millimeters square.
• The identical circuit pattern is
fabricated in each area, and the
wafer is broken up into chips.
• Each chip consists of many
gates and/or memory cells plus
a number of input and output
attachment points.
• The chip is then packaged that
protects it and provides pins for
attachment to devices beyond
the chip.
• A number of these packages can
then be interconnected on a
printed circuit board to produce
larger and more complex circuits.
Moore’s Law
 Initially, only a few gates or memory cells could be reliably
manufactured and packaged together; these early integrated circuits
are referred to as small-scale integration (SSI).
 It became possible to pack more and more components on the same
chip.
 Increased density of components on chip
• Moore’s law by Gordon Moore – co-founder of Intel
• Number of transistors on a chip will double every year
• Since 1970’s development has slowed a little
— Number of transistors doubles every 18 months
• Cost of a chip has remained almost unchanged
• Higher packing density means shorter electrical paths, giving
higher performance
• The computer becomes smaller, making it more convenient to
place in a variety of environments.
• There is a reduction of power and cooling requirements
• The interconnections on the integrated circuit are much more
reliable. With more circuitry on each chip, there are fewer interchip
connections.
Growth in CPU Transistor Count
IBM System/ 360 series
• By 1964
• Replaced 7000 series
• The industry’s first planned “family” of computers
• The characteristics of a family are as follows:
— Similar or identical instruction sets
— Similar or identical O/S
— Increasing speed (in going from lower to higher
family members)
— Increasing number of I/O ports (in going .....members)
— Increased memory size (in going ....... members)
— Increased cost (in going ....... members)
• Multiplexed switch structure
DEC PDP-8
• PDP-8 from Digital Equipment Corporation
(DEC) in 1964
• First minicomputer
• Did not need air conditioned room
• Small enough to sit on a lab bench
• Cost was $16,000
• Embedded applications & OEM (Original
Equipment Manufacturers)
DEC - PDP-8 Bus Structure

• PDP-8 bus, called the Omnibus, consists of 96


separate signal paths, used to carry control,
address, and data signals.
• All system components share a common set of signal
paths, their use must be controlled by the CPU.
• This architecture is highly flexible, allowing modules
to be plugged into the bus to create various
configurations.
Later Generations
• For large scale integration (LSI), more
than 1000 components can be placed on
a single integrated circuit chip.
• For very large scale integration (VLSI),
more than 10,000 components per chip.
• For ultra large scale integration (ULSI),
more than one million components.
Semiconductor Memory
• In 1970, Fairchild produced the first relatively
capacious semiconductor memory.
• This chip, could hold 256 bits of memory.
• It was much faster than core
• It took only 70 billionths of a second to read a bit.
• However, cost per bit was higher than for that of
core.
• Since 1970, semiconductor memory has been through
11 generations: 1K, 4K, 16K, 64K, 256K, 1M, 4M,
16M, 64M, 256M, and 1G.
• Each generation has provided four times the
storage density of the previous generations,
accompanied by declining cost per bit and
declining access time.
Evaluation of Intel Microprocessors
Evaluation of Intel Microprocessors
Microprocessor Speed
• Pipelining: A processor organization in which
the processor consists of a number of stages,
allowing multiple instructions to be
executed concurrently.
• On board cache: A special buffer storage,
smaller and faster than main storage, that is
used to contain a copy of instructions and data
from main memory that are to be needed next
by the processor (to reduce the average time to
access the memory).
• On board L1 & L2 cache
• Branch prediction: A mechanism used by the
processor to predict which branches or groups of
instructions are likely to be processed next.
Microprocessor Speed
• Data flow analysis: The processor analyses
which instructions are dependent on each other’s
results, or data, to create an optimized schedule
of instructions. Instructions are scheduled to be
executed when ready, independent of the original
program order. This prevents unnecessary delay.
• Speculative execution: Using branch prediction
and data flow analysis, some processors
speculatively execute instructions ahead of their
actual appearance in the program execution,
holding the results in temporary locations. This
enables the processor to keep its execution
engines as busy as possible by executing
instructions that likely to be needed.
Performance Balance
• Processor speed increased
• Memory capacity increased
• Memory speed lags behind processor
speed
Logic and Memory Performance Gap
Solutions
• Increase the number of bits retrieved at one time
by making DRAM (Dynamic Random Access
memory) “wider” rather than “deeper” and by
using wide bus data paths
• Change the DRAM interface
—Include “Cache” on the DRAM chip
• Reduce the frequency of memory access by
incorporating
—More complex and efficient cache between the
processor and main memory.
• Increase the interconnection bandwidth between
processors and memory by using
—High speed buses
Handling of I/O Devices
• Computers become faster and more capable, more
sophisticated applications are developed that support
the use of peripherals with intensive I/O demands
• I/O devices create large data throughput
demands
• Processors can handle the data pumped out by
these I/O devices
• Problem is getting data moved between
processor and peripheral.
• Solutions to satisfy I/O demands:
—Caching
—Buffering
—Higher-speed interconnection buses
—More elaborate bus structures
—Multiple-processor configurations
Typical I/O Device Data Rates
Key is Balance
Designers constantly strive to balance the
throughput and processing demands of the:
• Processor components
• Main memory
• I/O devices
• Interconnection structures
The idea is to cope with the following two constantly
evolving factors:
 The rate at which performance is changing in the
various technology areas (processors, buses,
memory, peripherals) differs greatly from one type
of element to another
 New applications and new peripheral devices
constantly change the nature of the demand
Improvements in Chip Organization and
Architecture
• Increase speed of processor
 Fundamentally due to shrinking logic gate size
 More gates, packed more tightly, increasing clock
rate
 With gates closer together, propagation time for
signals reduced, that speeds up the processor)

• Increase size and speed of caches between


processors and main memory
 Cache access times drop significantly
• Change to processor organization and architecture
that
— Increase the effective speed of instruction execution
— Parallelism
Intel Microprocessor Performance
Strategies to increase performance –
Since 1980
Firstly, Increased Cache Capacity
• Typically two or three levels of cache
between processor and main memory
• Chip density increased
 More cache memory on chip
 Faster cache access
• Pentium chip devoted about 10% of on-
chip area to a cache
• Pentium 4 devotes about 50%
Strategies to increase performance –
Since 1980
Secondly, More Complex Execution
Logic
• Enable parallel execution of instructions
• Pipeline works:
 Different stages of execution of different
instructions at same time along pipeline
• Superscalar allows multiple pipelines
within single processor
 Instructions that do not depend on one
another can be executed in parallel
Pentium Evolution (1)
• 8080
 The world’s first general purpose microprocessor
 8 bit machine, 8-bit data path and addresses 1MB of
memory using 20-bit address bus
 Used in first personal computer – Altair
• 8086
 much more powerful,16 bit machine and 16-bit data
path and addresses 1 MB of memory using 20-bit
address bus
 instruction cache, prefetch few instructions before they
are executed
• 80286
— 16 bit machine, 16-bit data path and addresses 16MB of
memory using 24-bit address bus
• 80386
— 32 bit machine, 32-bit data path
— Support for multitasking
*High speed memory internal to the CPU
Pentium Evolution (2)
• 80486
 Sophisticated and powerful cache and
sophisticated instruction pipelining
 built in math co-processor, relieving of complex
math operations from the main CPU
• Pentium
 Intel introduces the Superscalar technology
 Allows multiple instructions executed in parallel
• Pentium Pro
 Increased superscalar organization
 Aggressive use of register renaming
 branch prediction
 data flow analysis
 speculative execution
Pentium Evolution (3)
• Pentium II
 Incorporated Intel MMX (Multimedia Extension)
technology
 designed to process graphics, video & audio data
efficiently
• Pentium III
 Incorporates additional floating point instructions for 3D
graphics software
• Pentium 4
 Incorporated additional floating point and multimedia
enhancements
• Itanium
 64 bit
• Itanium 2
 Hardware enhancements to increase speed
PowerPC Family (1)
• The following are the principal members of the PowerPC
family:
• 601:
— 32-bit machine, quickly to market
• 603:
— 32-bit, Low-end desktop and portable
— Comparable machine in performance with 601
— Lower cost and more efficient implementation
• 604:
— 32-bit machine, Desktop and low-end servers
— Much more advanced superscalar design
— Greater performance
• 620:
— 64-bit architecture, including 64-bit registers and data
paths
— Desktop and low-end servers
PowerPC Family (2)
• 740/750:
—Also known as G3 processor
—Integrates two levels of cache on main
processor chip
• G4:
—Increases parallelism and internal speed of the
processor chip
• G5:
—Improvements in parallelism and internal
speed
—64-bit organization
Key Points
The evaluation of computers has been characterized by increasing processor speed,
decreasing computer size, increasing memory size, and increasing I/O capacity and speed.
One factor responsible for the great increase in processor speed is the shrinking size of
microprocessor components; this reduces the distance between components and hence
increases speed.
However, the true gains in speed in recent years have come from pipelining, parallel
execution techniques, and use of speculative execution techniques. The reason is keep the
processor busy as much of the time as possible.
A critical issue in computer system design is balancing the performance. As we see, the
processor speed has increased more rapidly than memory access time. A variety of
techniques is used to compensate for this mismatch, including caches, wider data paths from
memory to processor, and more intelligent memory chips.

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