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    Creep

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    Nilesh Balkrishna Sunita Apte
    Creep is the slow, permanent deformation of materials under constant stress or prolonged loading at high temperatures. It occurs in three stages: primary, secondary, and tertiary creep. Primary creep decreases over time due to work hardening. Secondary creep exhibits a constant creep rate as strain hardening balances recovery processes. Tertiary creep accelerates until failure. Creep is caused by mechanisms like dislocation glide and climb, diffusion of vacancies, and grain boundary sliding. Design considerations to prevent creep include reducing grain boundaries, using coarse-grained or single crystal materials, changing materials to those with high melting points and precipitation hardening, and accounting for displacement, rupture, or stress relaxation limitations.

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    Creep

    Uploaded by

    Nilesh Balkrishna Sunita Apte
    1K views42 pages
    Creep is the slow, permanent deformation of materials under constant stress or prolonged loading at high temperatures. It occurs in three stages: primary, secondary, and tertiary creep. Primary creep decreases over time due to work hardening. Secondary creep exhibits a constant creep rate as strain hardening balances recovery processes. Tertiary creep accelerates until failure. Creep is caused by mechanisms like dislocation glide and climb, diffusion of vacancies, and grain boundary sliding. Design considerations to prevent creep include reducing grain boundaries, using coarse-grained or single crystal materials, changing materials to those with high melting points and precipitation hardening, and accounting for displacement, rupture, or stress relaxation limitations.

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    Creep is the slow, permanent deformation of materials under constant stress or prolonged loading at high temperatures. It occurs in three stages: primary, secondary, and tertiary creep. Primary creep decreases over time due to work hardening. Secondary creep exhibits a constant creep rate as strain hardening balances recovery processes. Tertiary creep accelerates until failure. Creep is caused by mechanisms like dislocation glide and climb, diffusion of vacancies, and grain boundary sliding. Design considerations to prevent creep include reducing grain boundaries, using coarse-grained or single crystal materials, changing materials to those with high melting points and precipitation hardening, and accounting for displacement, rupture, or stress relaxation limitations.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    1K views42 pages

    Creep

    Uploaded by

    Nilesh Balkrishna Sunita Apte
    Creep is the slow, permanent deformation of materials under constant stress or prolonged loading at high temperatures. It occurs in three stages: primary, secondary, and tertiary creep. Primary creep decreases over time due to work hardening. Secondary creep exhibits a constant creep rate as strain hardening balances recovery processes. Tertiary creep accelerates until failure. Creep is caused by mechanisms like dislocation glide and climb, diffusion of vacancies, and grain boundary sliding. Design considerations to prevent creep include reducing grain boundaries, using coarse-grained or single crystal materials, changing materials to those with high melting points and precipitation hardening, and accounting for displacement, rupture, or stress relaxation limitations.

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    Download as ppt, pdf, or txt
    of 42

    Slide 3

    Creep Failure
    Creep may be defined as
    "Time-dependent permanent
    deformation of a material
    under constant loading at
    high temperatures". Or
    CREEP IS THE SLOW PLASTIC
    DEFORMATION OF METALS UNDER
    CONSTANT STRESSES OR UNDER
    PROLONGED LOADING USUALLY
    AT HIGH TEMPERATURE
    Slide 3
    Creep strength oI a material is the highest stress that
    the material can withstand Ior a speciIied length oI time
    without exceeding the speciIied deIormation at a
    particular temperature.
    Creep-rupture strength oI a material is the highest
    stress that the material can withstand Ior a speciIied
    length oI time without rupture at particular
    temperature.
    Slide 3
    Example
    End oI service liIe oI high
    temp. components in a boiler
    like superheater and reheater
    tubes and headers is usually
    Iailure by creep.
    However, some material like
    Pb, Sn, having low melting
    point show creep at room
    temperature.
    Slide 3
    CREEP TEST
    Slide 3
    Procedure
    The main objective in a creep
    test is to measure how a given metal or
    an alloy will perIorm under constant
    load, at elevated temperatures.
    Specimens Ior creep tests are usually the same as
    Ior conventional test.
    Strain indicator is attached to measure the
    elongation.
    Slide 3
    The specimen is subjected to constant loading or a
    constant stress through a system oI dead weights
    and levers etc.
    A tubular, electrically heated Iurnace is made to Iit
    around the specimen. Elongated ends oI the
    specimen may have a thermocouple in each ends
    Ior temperature measurement.
    Stress, strain, temperature and time are noted
    down and graph is plotted.
    Slide 3
    A typical creep behavior is presented
    in the diagram:
    Slide 3
    STAGES OF CREEP
    Slide 3
    Classical creep curve
    Z- Time-dependenf deformofion: creep
    foiIure (7)
    ferfiory creep
    d1/df
    primory creep
    d1/df
    ndrode Iow
    fime
    s
    f
    r
    o
    i
    n
    secondory creep
    d1/df~consfonf
    f
    f
    (:)
    s
    f
    r
    e
    s
    s
    fime
    :
    fime
    d
    1
    /
    d
    f
    ineIosfic
    eIosfic, reversibIe
    Slide 3
    Andrade's analysis of the competing processes
    Which determine the creep curve
    Slide 3
    ANDRADE EQUATION
    Andrade Iound that the creep curve could be
    represented by the Iollowing empirical
    equation
    e e
    0
    (1t
    1/3
    )e
    (kt)

    Where e strain, t time,


    and k constants
    e
    0
    Instantaneous strain
    Slide 3
    Creep
    %ime
    Stress
    Strain
    Slide 3
    Primary creep
    The primary creep has decreasing creep rate because oI
    work hardening process resulting Irom deIormation.
    The primary creep is essentially similar in its
    mechanism to delayed elasticity or the elastic aIter
    eIIect and as is recoverable by unloading the specimen.
    Slide 3
    Secondary creep
    In Secondary creep, the strain increases linearly with
    time. From design point oI view, this region is the most
    important one Ior parts designed Ior long service liIe
    because it comprises the longest creep duration. The
    main creep test result is the slope oI this region which
    is known as the steady-state creep rate ('cs). During this
    stage oI creep, there is a balance between strain
    hardening due to deIormation and soItening due to
    recovery processes similar to those occurring during
    the annealing oI metals at elevated temperature.
    Slide 3
    Slide 3
    Tertiary creep
    II the stress is suIIiciently high and temperature is also
    high, there is a tertiary stage in which the creep rate
    accelerates until Iracture occurs. It is more probably the
    result oI structural changes occurring in the metal.
    Slide 3
    Mechanisms oI Creep
    Slide 3
    Mechanisms oI Creep
    High rates oI diIIusion permit reshaping oI crystals
    to relieve stress
    DiIIusion signiIicant at both grain boundaries and in
    the bulk
    High energy and weak bonds allow dislocations to
    'climb around structures that pin them at lower
    temperature
    Slide 3
    Dependency of CREEP
    Slide 3
    Stress Rupture Curve
    (Applied stress vs. time to rupture)
    Slide 3
    Dependency of CREEP
    Slide 3
    MECHANISM OF CREEP
    DISLOCATION GLIDE
    Dislocation is created in the metal during the process
    oI plastic deIormation. Mechanism oI the creep is
    related to the glide oI dislocation leading to slip. When
    the stress is applied to he given specimen at the given
    temperature those dislocation which are impeded by a
    smallest barriers will be able to surmount them by the
    process oI thermal activation in a short time but the
    more diIIicult barrier will be overcome by the
    dislocation in much longer time.
    Slide 3
    DISLOCATION CLIMB
    Slide 3
    DISLOCATION CLIMB
    At high temperature (as is viscous creep) atomic
    moment permit the dislocation to climb, jog or even
    be annihilated. Sessile dislocation is blocking the
    motion oI other in its slip plane and the result oI the
    dislocation will be pile-up. the climb oI the leading
    slip dislocation over the sessile dislocation has permit
    all slip dislocation to advanced and deIormation by
    slip to continue.
    Slide 3
    DIFFUSION OF VACANCIES
    Slide 3
    DIFFUSION OF VACANCIES
    In this mechanism, grain boundary act as a Iree source
    and sink oI vacancies. The mechanism depends in the
    migration Irom one side oI the grain to another. Fig
    shows WXYZ is under a stress P, the atom are
    transIerred Irom Iaces XY and WZ. To the Iace WX
    and ZY, along the path shows, and the grain creeps in
    the direction oI the stress. To transport atom in this
    way it involves creating vacancies on the Iaces WX and
    ZY and destroying them on the other Iace.
    Slide 3
    CREEP DUE TO GRAIN BOUNDRIES
    Grain boundary sliding during creep has been inIerred
    Irom the observation oI steps at the boundary. AIter
    the small amount oI sliding at the boundary interIace,
    movement will be arrested by protuberances. The
    grains are then locked and the rate oI slip will be
    determined by rate oI plastic Ilow in protuberances.
    Slide 3
    CREEP FRACTURE
    At low temp. grain boundaries are stronger and at
    higher temp. it becomes weak as compared to
    grains.the temp. at which the strength oI grain
    boundary is equal to the strength oI grain is called
    equicohesive strength.
    Material always Iail at weak region by initiating crack.
    When crack occurred below equicohesive temperature,
    Iracture is transgranular or transcrystalline i.e the crack
    moves through the grains.when crack occurred above
    equicohesive temp.Iracture is intergranular or
    intercrystalline and it move along grain the boundries.
    Slide 3
    CREEP FRACTURE
    Two type oI Iracture occurs
    1.Transgranular Iracture or transcrystalline i.e the crack
    moves through the grains
    2. Intergranular Iracture. or intercrystalline i.e it move
    along grain the boundaries
    Slide 3
    %ransgranular fracture
    1.Transgranular Iracture
    Slide 3
    CREEP FRACTURE
    Two type oI Iracture occurs
    1.Transgranular Iracture or
    transcrystalline i.e the crack
    moves through the grains
    2. Intergranular Iracture. or
    intercrystalline i.e it move
    along grain the boundaries
    (as shown in Iig.)
    ntergranular fracture
    Slide 3
    Threshold Ior Creep
    The Critical Temperature Ior Creep is 40 oI the
    Melting Temperature.
    II T ~ 0.40 T
    M
    Creep Is Likely
    amlpe
    Will Lead Creep at Room
    %emperature?
    %

    327 HC 600 HK
    %
    ROO
    23 HC 296 HK
    Slide 3
    Creep Example
    Will Lead Products Creep at Room Temperature?
    T
    M
    327 HC 600 HK
    T
    ROOM
    23 HC 296 HK
    100 x 296 / 600 49.3 Will Creep
    Slide 3
    How Do We Deal With Creep
    ?
    1. Reduce the eIIect oI grain boundaries
    2. Use coarse grain structure because surIace to
    volume ration is smaller as compare to Iine
    grain.
    3. Use Single Crystals
    Slide 3
    Stress Rupture in Single Crystals
    CSX-4 & C 6 (yellow) are
    Single Crystals
    Advanced aterials & Processes
    April 995
    Slide 3
    How Do We Deal With Creep ?
    1. Reduce the eIIect oI grain
    boundaries
    Use Single Crystals
    2. Change Materials
    3. Change Operating Conditions
    Slide 3
    CREEP RESISTANT MATERIAL
    It should have high melting point. This is because
    the creep becomes signiIicant above 0.4 Tm. II the
    melting point is higher, the material can be used at
    higher service temperature without appreciable creep
    deIormation.
    It should have coarse grain structure. The grain
    boundary becomes quasi-viscous at creep
    temperature. Since in coarse grain structure, grain
    boundary area is less, less amounts oI quasi-viscous
    region is Iormed with a less tendency to Ilow,
    reducing the creep deIormation.
    Slide 3
    CREEP RESISTANT MATERIAL
    It should be precipitation hardenable. It should have
    Iine insoluble precipitates at the operating
    temperature. The precipitates particle should not
    coarsen at this temperature.
    Dispersion hardening improves creep resistance. In
    dispersion hardening, hard insoluble particles oI
    second phase are uniIormly distributed in Iinely
    divided Iorm in the metal matrix. These particles do
    not allow moving the grain boundaries and hence
    reduce the creep deIormation.
    Slide 3
    CREEP RESISTANT MATERIAL
    t should have high oidation
    resistance ie the oide film should
    follow either a logarithmic or a cubic
    law of growth it improves creep
    resistance
    ilm thickness
    time
    Linear
    parabolic
    logarithmic
    cubic law
    Slide 3
    DESIGN CONSIDERATION
    Slide 3
    DESIGN CONSIDERATION
    Displacement-limited applications in which precise
    dimensions or small clearances must be maintained
    such as in turbine rotors in jet engines) (Figure 1a).
    Rupture-limited applications in which precise
    dimensions are not essential but Iracture must be
    avoided such as in high-pressure steam tubes and
    pipes (Figure 1b).
    Stress-relaxation-limited applications in which an
    initial tension relaxes with time such as in suspended
    cables and tightened bolts (1c)

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