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(ANN11B) Image Blemish 8D (EDX) - 81

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9491350 Dark area 8D report

Date: 2022.07.02

05/01/2024 SENSETEK Confidential P1


D1:Problem Description
Customer OPPO End Customer OPPO
Project Name 9491350 (ANN11B) Failed Units 27 Pcs
Production date 15-11-2022 Lot No. NA
Shipping Date 17-11-2022 Returned Quantity 21
□CCAR , ■Customer Request □RMA Return □Market Return

Failure Description/Background :
25-11-2022- Feedback received
OPPO customer feedback for model ANN11B (9491350) found POG rate is high.

QR–D9491350CAF036250,D9491350CAF003454,D9491350CA8002405,D9491350BBB038147
D9491350CAF005975,D9491350CA8005849,D9491350CA8002366,D9491350CAF052864
D9491350CAF017796,D9491350CAB009007,D9491350CA8017521,D9491350CAB005168
D9491350CAF038594,D9491350CAF008557,D9491350C4V050679,D9491350CA8001702
D9491350CAF021247,D9491350CAB011125,D9491350CAF032256,D9491350CAF021451
D9491350CA8016654

05/01/2024 SENSETEK Confidential P2


D2: Team Members

Team Members

Name Dep. Title Remark

Atul salaria Quality Department CQE Team Leader

Amit Singh Production Department MFG Member

Chakradhar Quality Department PQE Member

Manish Quality Department CQE Member

Sumit PE Department PIE Member

Hamming PE Department PIE Member

05/01/2024 SENSETEK Confidential P3


D3:Containment measures

Temporary action:-
Sr. No. Temporary plan Responsible Execution date Results

The FG warehouse in stock 16k pcs hold for again


vibration test and re-test of POG.
1 Dipendra 25-Nov-2021 Close

Add one more manual testing and one T.V in normal Dipendra
2 25-Nov-2021 Close
process in 45 deg.

05/01/2024 SENSETEK Confidential P4


D4:Cause Analysis
1.Outbond information query:-
For reference provide data According to the feedback sample SN, check the oversite information, confirm that the oversite
information of all modules are pass ,there is no abnormality in MES query.

number QR code MES query results Supporting information


1 PASS
D9491350CAF008557 D9491350CAF00855
D9491350CAF00855
7.xls
7.xls
2 PASS
D9491350CAF036250 D9491350CAF03625
0.xls

3 PASS
D9491350CAF003454 D9491350CAF00345
4.xls

4 PASS
D9491350CA8002405 D9491350CA800240
5.xls

5 D9491350BBB038147 PASS
D9491350BBB03814
7.xls

6 PASS
D9491350CAF005975 D9491350CAF00597
5.xls

7 PASS
D9491350CA8005849 D9491350CA800584
9.xls

8 PASS
D9491350CA8002366 D9491350CA800236
6.xls

05/01/2024 SENSETEK Confidential P5


D4:Cause Analysis
1.2 Outbound information query:-
For reference provide data According to the feedback sample SN, check the oversite information, confirm
that the oversite information of all modules are pass ,there is no abnormality in MES query.

number QR code MES query results Supporting information


9 Pass
D9491350CAF052864 D9491350CAF05286
4.xls

10 Pass
D9491350CAF017796 D9491350CAF01779
6.xls

11
D9491350CAB009007
12 Microsoft Excel
D9491350CA8017521 Worksheet

13
D9491350CAB005168
14
D9491350CAF038594
15
D9491350C4V050679

05/01/2024 SENSETEK Confidential P6


D4:Cause Analysis
1.2 Outbound information query:-
For reference provide data According to the feedback sample SN, check the oversite information, confirm
that the oversite information of all modules are pass ,there is no abnormality in MES query.

number QR code MES query results Supporting information


16 D9491350CA8001702 PASS

17 PASS
D9491350CAF021247
18 PASS
D9491350CAB011125
19 PASS
D9491350CAF032256

20 D9491350CAF021451 PASS

21 D9491350CA8016654 PASS

05/01/2024 SENSETEK Confidential P7


D4:Cause Analysis
2.1 Appearance inspection:-
Perform visual inspection on a microscope. there is no obvious abnormality as physical damage or lens scratch , FPC peel off or other
appearances. The specific pictures are as follows

Top view Top view

#1 #2 #3 #4 #5 #6

#7 #8 #9 #10 #11

05/01/2024 SENSETEK Confidential P8


D4:Cause Analysis
2.2 Appearance inspection:-
Perform visual inspection on a microscope. there is no obvious abnormality as physical damage or lens peel off or other
appearances. The specific pictures are as follows:

#13 #14 #15 #16 #17 #18

#19 #20 #21


Summary: No abnormality was found in the POG module lens and side appearance.

05/01/2024 SENSETEK Confidential P9


D4:Cause Analysis
3.1 Re-test the tooling (Before vibration)
The products returned (Blemish) by customers were reviewed by the production program , all of which showed defect and
failed test, which was consistent with the customer complaint. All of the programs were able to intercept, while the elimination
out of 30 module 22pcs found NG on tester and 8pcs found Pass.

#1 #2 #3 #4 #5 #6 #7

#8 #10 #11 #13 #14 #15 #18

05/01/2024 SENSETEK Confidential P10


D4:Cause Analysis
3.1 Re-test the tooling (Before vibration)
The products returned (Blemish) by customers were reviewed by the production program , all of which showed defect and
failed test, which was consistent with the customer complaint. All of the programs were able to intercept, while the elimination
out of 30 module 22pcs found NG on tester and 8pcs found Pass.

#20 #21 #23 #25 #26 #27

(#9, #12, #16 #17 #19 OK module


#29 #30 Blemish NG display #20 #22#24 #28 )

05/01/2024 SENSETEK Confidential P11


D4:Cause Analysis
3.2 Re-test the tooling (After vibration)
The first time OK modules (#9, #12, #16 #17 #19 #20 #22#24 #28 ) check the again on tester after transport vibration, no
module is found to POG NG, refer to the following picture:

(#9, #12, #16 #17 #19 #20 #22#24 #28– OK


module)

05/01/2024 SENSETEK Confidential P12


D4:Cause Analysis
4. Disassemble the camera for confirmation
The products tested with blemish defect were disassembled, and it was confirmed that there were foreign
bodies on the IR surface of 22 pieces .

#1 #2 #3 #4 #5 #6

#7 #8 #10 #11 #13 #14

05/01/2024 SENSETEK Confidential P13


D4:Cause Analysis
4. Disassemble the camera for confirmation
The products tested with blemish defect were disassembled, and it was confirmed that there were foreign
bodies on the IR surface of 22 pieces .

#15 #18 #20 #21 #23 #25

#26 #27 #29 #30

05/01/2024 SENSETEK Confidential P14


D4: Cause Analysis

5.1 EDX energy spectrum component analysis:

According to EDX energy spectrum analysis, the foreign bodies of the two modules are confirmed to be most similar to Holder
thread & lens material by comparing the database.

IR glue 6H0D24T10SXE Holder thread


6H0D24R10R94

Summary: EDX report Share separately.

05/01/2024 SENSETEK Confidential P15


D4: Cause Analysis

5.5 Percentage of POG ingredients

Material Dust free DA glue


Qty Defect ratio shoes 5% IR glue
description Small sheet 5% 14%
5%
IR glue 3 13.64% Silk screen
5%
Lens material 3 13.64% Linker
Lens mate-
rial
Chip material 4 18.18% 5% 14%

Chip glue 1 4.55% Connector


IR material 3 13.64% 5%

Capacitance 1 4.55%
Chapter head 1 4.55%
Connector 1 4.55% Chapter
head
Linker 1 4.55% 5%
Silk screen 1 4.55% Capacitance
5% Chip mate-
Small sheet 1 4.55% rial
18%
Dust free shoes 1 4.55% IR material
14% Chip glue
DA glue 1 4.55% 5%
Total 22

05/01/2024 SENSETEK Confidential P16


D4: Cause Analysis

Lens/GA/chip cleaning post after washing:

• Cotton swabs have exposed fibers


before they are used

• Cotton swabs have exposed fibers


before they are used
• 2VI/3VI Both swabs and dust-free
sticks exist at the inspection station

05/01/2024 SENSETEK Confidential P17


D4: Cause Analysis

Lens/GA/chip cleaning post after washing:

Before improvement: Clean


After improvement: only dust-free
with a combination of dust-
free sticks/cotton swabs sticks exist for cleaning

05/01/2024 SENSETEK Confidential P18


D4: Cause Analysis

Lens/GA/chip cleaning post after washing:

• Dust-free stick is not used, • Dust-free stick is used 3 times


no fiber exposed without fiber exposure

• Use the dust-free stick 5 • Dust-free stick uses 10


times to expose the fibers fiber exposures
• Summary: According to the dust-free stick wiping verification, less than 3 times, there will be no fluffing, 5 or
more times will have the risk of fluffing and hair removal. Red glue stick treatment), define the service life of
the dust-free stick as 1 time.

05/01/2024 SENSETEK Confidential P19


D5:Corrective Actions

Machine cleaning
process :

Before improvement : After improvement process

Remark : QC team Check dust particle twice a day in FOL floor

05/01/2024 SENSETEK Confidential P20


D5:Corrective Actions
India FOL HDM production process:
shock Centrifugal
Plasma 2VI
lens wash Lens
Lens+Holder Lens+Holder
assembly +Holder Tray
HDM bake change
FPC board
carrier plate Plasma Centrifugal
1VI 3VI
board washing

Respons Complet
Process Reason Improve strategy 4VI
ible e time
CCM
Using the board mold, the fingers contaminate the chip by 55% when
FPC board Cancel manual pasting and use pasting machine to reduce pollution of manual pasting; machine pasting 5% Vishesh 6 月 24 日
manually picking the FPC board ;
Cancel the manual platen and use the platen press plate instead; the machine platen is 24% dirty
Manually press the board on the board fixture, resulting in 75% of chip
Plate (At present, a carrier plate is being placed at the bottom of the platen to place the hollow fixture block, in Vishesh 6 月 24 日
pollution;
order to reduce the contact pollution of the platen machine chip)

1. Unify the domestic CCD setting parameters, and adjust the colour to dark green for the best (consistent
1. The spotlight of the CCD cleaning spotlight is not adjusted well, and the
with domestic ones);
display colour is not uniform, resulting in some dirty display, not obvious
2. The maintenance of the dust flow table is planned to be completed before 6/21;
1VI cleaning loss; Shekar 6 月 20 日
3. Staff training, in training, it is expected to be assessed on 6/24
2. The wind speed of the dust flow typhoon is not up to the standard and needs
3. Swap the 1VI and plasma processes (plasma in 1VI first), which can better clean the dust from the plasma
to be repaired
by 1VI.

1. Use a special washing machine or a specified time period to wash the repaired products to avoid mixing
Centrifugal During centrifugal washing, hydrogen peroxide is not used for cleaning with normal products; Shekar
6 月 18 日
washing maintenance products, resulting in secondary pollution of normal products. 2. When the repaired products are washed by the washing machine, use hydrogen peroxide to clean the Vishesh
washing machine and confirm that there is no pollution. Only normal products can be washed with water.

1. The spotlight of the CCD cleaning spotlight is not adjusted well, and the
1. Unify the domestic CCD setting parameters, and adjust the colour to dark green for the best (consistent
display colour is not uniform, resulting in some dirty display, not obvious
with domestic ones);
3VI cleaning loss; Shekar 6 月 24 日
2. The maintenance of the dust flow table is planned to be completed before 6/23;
2. The wind speed of the dust flow typhoon is not up to the standard and needs
3. Staff training, in training, it is expected to be assessed on 6/24
to be repaired
1. Use sticky film around the feeding port and inside the machine;
The dust at the feeding port exceeds the standard, and the risk of dust falling at Shekar
HDM 2. Add a sticky dust partition between each carrier plate of the feeding clip; 6 月 18 日
the feeding port is 1.25%; Vishesh
3. Staff training, in training, it is expected to be assessed on 6/24

05/01/2024 SENSETEK Confidential P21


D6:Effect confirmed

FAE should follow up the on-line effect.

PE and PQE will Track online data and follow up on-line effect.

EOL QC team also monitor and verify Effectiveness of improved machine.

FOL QC team check the machine cleaning twice a shift.

FOL IPQC team monitor the cleaning process, when op swab stick change or not after 3time using.

05/01/2024 SENSETEK Confidential P22


D7:Preventive Actions vivo AF263 LHA
LHA Normal production Manual
3VI Wash Plasma Wash Upload
process clean
FOL 4VI Bake LHA
F
2VI Wash Plasma
Vibration
Before manual cleaning

F 8in1 T 4in1 Scan


EOL Vibration focus Vibration OTP
4VI Film &Pack

LHA Repair production


process Mark Remove Remove Manual Change Scan
Repair Dot
Upload
Holder Glue Clean Tray in Mes

Manual
3VI Wash Plasma Upload
clean

FOL 4VI Bake LHA

Wash Plasma F
2VI Vibration

EOL F
Vibration
8in1
focus
T
Vibration
4in1
OTP
T
Vibration
Manual
Check
4VI Film
Scan
&Pack

Remark : The marked stations with red are extra process for LHA normal process, others are same as repair process

05/01/2024 SENSETEK Confidential P23


D7:Preventive Actions

 Flow chart of connecting water washing and moving line(The Process Flow Diagram)

WSG-0035-22H

Magazine material Turn off the


transphar Connected Start rotation Manipulator swing Spray water
to cleaning water spray

Automatic
shipping to Manipulator swing
Stop running High-speed dry
Manual
cleaning

05/01/2024 SENSETEK Confidential P24


D7:Preventive Actions

Long-term measures

 IPQC will audit improved process on every hour , if any issue found he will report to the QC leader and related
departments.

 We will arrange daily audit and check improved process is follow or not.

 We will add one extra process in normal process, we do washing incoming material before the manual cleaning

 Change the washing method

05/01/2024 SENSETEK Confidential P25


D8:Drive Wide & Drill Deep Team and individual recognition

Final meeting of the 8-D team:

 During the concluding discussion, the problem solving team makes a critical assessment of all 8D steps and tasks, and
we receive how we will prevent this in the future.

 The 8-D report is officially closed.

 Joint efforts by the team have been accepted by the observers and we hope that such problem will not reoccur in future.

 The completed 8D report is archived.

Final conclusion of 8-D activities related to this problem:

 We are not repeated such type of issue in future, and result will shown in our next shipment.

05/01/2024 SENSETEK Confidential P26


Thank You !!!

05/01/2024 SENSETEK Confidential P27

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