(ANN11B) Image Blemish 8D (EDX) - 81
(ANN11B) Image Blemish 8D (EDX) - 81
(ANN11B) Image Blemish 8D (EDX) - 81
Date: 2022.07.02
Failure Description/Background :
25-11-2022- Feedback received
OPPO customer feedback for model ANN11B (9491350) found POG rate is high.
QR–D9491350CAF036250,D9491350CAF003454,D9491350CA8002405,D9491350BBB038147
D9491350CAF005975,D9491350CA8005849,D9491350CA8002366,D9491350CAF052864
D9491350CAF017796,D9491350CAB009007,D9491350CA8017521,D9491350CAB005168
D9491350CAF038594,D9491350CAF008557,D9491350C4V050679,D9491350CA8001702
D9491350CAF021247,D9491350CAB011125,D9491350CAF032256,D9491350CAF021451
D9491350CA8016654
Team Members
Temporary action:-
Sr. No. Temporary plan Responsible Execution date Results
Add one more manual testing and one T.V in normal Dipendra
2 25-Nov-2021 Close
process in 45 deg.
3 PASS
D9491350CAF003454 D9491350CAF00345
4.xls
4 PASS
D9491350CA8002405 D9491350CA800240
5.xls
5 D9491350BBB038147 PASS
D9491350BBB03814
7.xls
6 PASS
D9491350CAF005975 D9491350CAF00597
5.xls
7 PASS
D9491350CA8005849 D9491350CA800584
9.xls
8 PASS
D9491350CA8002366 D9491350CA800236
6.xls
10 Pass
D9491350CAF017796 D9491350CAF01779
6.xls
11
D9491350CAB009007
12 Microsoft Excel
D9491350CA8017521 Worksheet
13
D9491350CAB005168
14
D9491350CAF038594
15
D9491350C4V050679
17 PASS
D9491350CAF021247
18 PASS
D9491350CAB011125
19 PASS
D9491350CAF032256
20 D9491350CAF021451 PASS
21 D9491350CA8016654 PASS
#1 #2 #3 #4 #5 #6
#7 #8 #9 #10 #11
#1 #2 #3 #4 #5 #6 #7
#1 #2 #3 #4 #5 #6
According to EDX energy spectrum analysis, the foreign bodies of the two modules are confirmed to be most similar to Holder
thread & lens material by comparing the database.
Capacitance 1 4.55%
Chapter head 1 4.55%
Connector 1 4.55% Chapter
head
Linker 1 4.55% 5%
Silk screen 1 4.55% Capacitance
5% Chip mate-
Small sheet 1 4.55% rial
18%
Dust free shoes 1 4.55% IR material
14% Chip glue
DA glue 1 4.55% 5%
Total 22
Machine cleaning
process :
Respons Complet
Process Reason Improve strategy 4VI
ible e time
CCM
Using the board mold, the fingers contaminate the chip by 55% when
FPC board Cancel manual pasting and use pasting machine to reduce pollution of manual pasting; machine pasting 5% Vishesh 6 月 24 日
manually picking the FPC board ;
Cancel the manual platen and use the platen press plate instead; the machine platen is 24% dirty
Manually press the board on the board fixture, resulting in 75% of chip
Plate (At present, a carrier plate is being placed at the bottom of the platen to place the hollow fixture block, in Vishesh 6 月 24 日
pollution;
order to reduce the contact pollution of the platen machine chip)
1. Unify the domestic CCD setting parameters, and adjust the colour to dark green for the best (consistent
1. The spotlight of the CCD cleaning spotlight is not adjusted well, and the
with domestic ones);
display colour is not uniform, resulting in some dirty display, not obvious
2. The maintenance of the dust flow table is planned to be completed before 6/21;
1VI cleaning loss; Shekar 6 月 20 日
3. Staff training, in training, it is expected to be assessed on 6/24
2. The wind speed of the dust flow typhoon is not up to the standard and needs
3. Swap the 1VI and plasma processes (plasma in 1VI first), which can better clean the dust from the plasma
to be repaired
by 1VI.
1. Use a special washing machine or a specified time period to wash the repaired products to avoid mixing
Centrifugal During centrifugal washing, hydrogen peroxide is not used for cleaning with normal products; Shekar
6 月 18 日
washing maintenance products, resulting in secondary pollution of normal products. 2. When the repaired products are washed by the washing machine, use hydrogen peroxide to clean the Vishesh
washing machine and confirm that there is no pollution. Only normal products can be washed with water.
1. The spotlight of the CCD cleaning spotlight is not adjusted well, and the
1. Unify the domestic CCD setting parameters, and adjust the colour to dark green for the best (consistent
display colour is not uniform, resulting in some dirty display, not obvious
with domestic ones);
3VI cleaning loss; Shekar 6 月 24 日
2. The maintenance of the dust flow table is planned to be completed before 6/23;
2. The wind speed of the dust flow typhoon is not up to the standard and needs
3. Staff training, in training, it is expected to be assessed on 6/24
to be repaired
1. Use sticky film around the feeding port and inside the machine;
The dust at the feeding port exceeds the standard, and the risk of dust falling at Shekar
HDM 2. Add a sticky dust partition between each carrier plate of the feeding clip; 6 月 18 日
the feeding port is 1.25%; Vishesh
3. Staff training, in training, it is expected to be assessed on 6/24
PE and PQE will Track online data and follow up on-line effect.
FOL IPQC team monitor the cleaning process, when op swab stick change or not after 3time using.
Manual
3VI Wash Plasma Upload
clean
Wash Plasma F
2VI Vibration
EOL F
Vibration
8in1
focus
T
Vibration
4in1
OTP
T
Vibration
Manual
Check
4VI Film
Scan
&Pack
Remark : The marked stations with red are extra process for LHA normal process, others are same as repair process
Flow chart of connecting water washing and moving line(The Process Flow Diagram)
WSG-0035-22H
Automatic
shipping to Manipulator swing
Stop running High-speed dry
Manual
cleaning
Long-term measures
IPQC will audit improved process on every hour , if any issue found he will report to the QC leader and related
departments.
We will arrange daily audit and check improved process is follow or not.
We will add one extra process in normal process, we do washing incoming material before the manual cleaning
During the concluding discussion, the problem solving team makes a critical assessment of all 8D steps and tasks, and
we receive how we will prevent this in the future.
Joint efforts by the team have been accepted by the observers and we hope that such problem will not reoccur in future.
We are not repeated such type of issue in future, and result will shown in our next shipment.