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Amit Training Notes

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0% found this document useful (0 votes)
23 views18 pages

Amit Training Notes

Uploaded by

SHINCHAN IS LIVE
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Training Notes

By – Amit Kumar
About Company
 SYRMA SGS works on the assembly of PCB.

Bare PCB PCB Components


TWO TYPES OF TECHNOLOGY

 SURFACE MOUNT TECHNOLOGY.  MANUAL INSERTION TECHNOLOGY


MACHINES IN SMT

 PCB LOADER - A loaded magazine is


set up in the PCB loader. After PCB
pushed by the Pusher and that PCB will
Load on the Conveyor. Through the
conveyor the PCB will in enter into the
PCB Cleaner.
PCB CLEANER:-
The machine which is used to clean the
Dust and moisture present on the PCB.
Dust is removed by Air Pressure.
SCREEN PRINTER:-
The machine which is used to applied
the Solder Paste on the Bare PCB.
The Solder Paste firstly applied on the
Stencil and through the stencil pattern
the solder paste is applied on the Bare
PCB with the help of Squeeze.

 STENCIL:- it is a thin steel


sheet in which patterns are
made according to the PCB
model.
 Squeeze:-It is a sliding blade
which spread the paste on the
stencil. Two types of Squeeze on
basis of angles 45deg. and
60deg.
SPI:-
 SPI stands for “Solder Paste Inspection”.
 It is used for inspection the solder that
solder paste applied Good or Not.
Pick and place:-
 It is used for mounting the
components on the surface of the
PCB .
 The component stick to the nozzle
by the vaccum pressure and place
the components by air pressure .

NOZZLE – It is used to stick


component and placed on the PCB.

Feeder:-It Is used to feed the


Component reel.

Head:- It works on principle of vaccum


and Air. It picks the required Nozzles
according to the PCB Model.
Reflow Oven-
Thermal processing of solder for electronics
manufacturing takes place in a reflow
oven. Depending on the length and
throughput of the oven there may be 8 or
less, or 12 or more zones. This is used to
melt the solder paste and set the
components correctly and the after heating,
cooling zone cool down the temperature of
PCB and set the position of the Components.
AOI-
AOI stands for “Auto Optical
Inspection”. AOI is used in SMT for
inspection of PCB that every component
position is “good or not” and also solder
paste position.
Offline Machines in SMT
LASER MACHINE X RAY MACHINE
 It is used for scan the Bar codes  It is used for checking the internal
that means it is also for the effect inside the shield. We use X
inspection. ray Machine.
Nozzles And Feeders
Types Of Nozzles Types Of Feeders
 0.2(Magenta)  8mm
 0.3(Grey)  12mm
 0.6(Dark Green)  16mm
 0.7(Blue)  24mm
 0.8(White)  32mm
 1(pink)  44mm
 1.1(Brown)  56mm
 1.8(Sky Blue)  72mm
 1.3(Light green)
 2.5(Purple)
Types Of Head
Type- Component Placement per Hour
 H01  4200
 H02  5500
 H04  6500
 H08  10500
 V12  26000
 H24S  35000
 H24  37500
Machines In MI
 Radial Machine:- Mainly we need
manpower for stuffing the big
components manually so to reduce the
need of manpower and time we have
Radial machine. This machine
automatically detect the position and
put the component on their right
position.
Wave Soldering Machine
After Insertion Of components PCB
Passes through the Wave Soldering
Machine. This machine applied solder
on the bottom of the PCB and solder
the components.
It has three Sections:-
1.Fluxer Unit
2. Preheating Zone
3.Soldering Unit
Flux Type:-
1.Tamura(0.815 to 0.829)
2.AlpHA RF 800 (0.791 to 0.797)
Selective Soldering-
This Machine is very similar to the Wave
Soldering Machine But the Major
Difference is that in wave soldering
machine the whole component gets
solder but in this Machine we can solder
selective components with the help of
the program.
Coating Machine-
In this machine a layer of coating
material is applied with the help of the
nozzle spray on the required Area. This
coating helps to prevent the PCB from
Dust and Moisture And increase the life
Cycle of the PCB.
Router machine-
Router is used to separate PCB from the
panel by A cutter or Drilling Process.

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