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VLSID Fall10 LowPower

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VLSID Fall10 LowPower

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ajay
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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ELEC 5770-001/6770-001 Fall 2010

VLSI Design
Low Power VLSI Design
Vishwani D. Agrawal
James J. Danaher Professor
Dept. of Electrical and Computer Engineering
Auburn University, Auburn, AL 36849

[email protected]
http://www.eng.auburn.edu/~vagrawal/COURSE/E6770_Fall10/VLSID_Fall2010_LowPower.ppt

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 1


Power Consumption of VLSI Chips

Why is it a concern?

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 2


ISSCC, Feb. 2001, Keynote
“Ten years from now,
microprocessors will run at
10GHz to 30GHz and be capable
of processing 1 trillion operations
per second – about the same
number of calculations that the
world's fastest supercomputer
can perform now.
Patrick P. Gelsinger
Senior Vice President
General Manager
“Unfortunately, if nothing
Digital Enterprise Group changes these chips will produce
INTEL CORP. as much heat, for their
proportional size, as a nuclear
reactor. . . .”

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 3


VLSI Chip Power Density
10000 Sun’s
Surface

Rocket
Power Density (W/cm2)

1000
Nozzle

Nuclear
100
Reacto
r Plate
Hot
8086
10 4004 P6
8008 8085 386 Pentium®
286 486
8080 Source: Intel
1
1970 1980 1990 2000 2010
Year
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 4
Low-Power Design
 Design practices that reduce power
consumption at least by one order of
magnitude; in practice 50% reduction
is often acceptable.
 Low-power design methods:
 Algorithms and architectures
 High-level and software techniques
 Gate and circuit-level methods
 Test power
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 5
Specific Topics in Low-Power
 Power dissipation in CMOS circuits
 Transistor-level methods
 Low-power CMOS technologies
 Energy recovery methods
 Ultra low power logic (subthreshold VDD)
 Circuit and gate level methods
 Logic synthesis
 Dynamic power reduction techniques
 Leakage power reduction
 System level methods
 Microprocessors
 Arithmetic circuits
 Low power memory technology
 Test Power
 Power estimation
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 6
CMOS Logic (Inverter)
VDD

No current flows
from power supply!
Where is power
consumed?

GND

F. M. Wanlass and C. T. Sah, “Nanowatt Logic using Field-


Effect Metal-Oxide-Semiconductor Triodes,” IEEE International
Solid-State Circuits Conference Digest, vol. IV, February 1963,
pp. 32-33.

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 7


Components of Power
 Dynamic, when output changes
 Signal transitions (major component)
 Logic activity
 Glitches

 Short-circuit (small)
 Static, when signal is in steady state
 Leakage (used to be small)
Ptotal = Pdyn + Pstat
= Ptran + Psc + Pstat
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 8
Power of a Transition: Ptran
V
R = Ron
i(t)
vi (t) v(t)

Large C
resistance
Ground

C = Total load capacitance for gate; includes transistor capacitances


of driving gate + routing capacitance + transistor capacitances
of driven gates; obtained by layout analysis.
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 9
Charging of a Capacitor
R

t=0
i(t) v(t)
V C

Charge on capacitor, q(t) = C v(t)

Current, i(t) = dq(t)/dt = C dv(t)/dt


Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 10
i(t) = C dv(t)/dt = [V – v(t)] /R
dv(t) dt
∫ ───── = ∫ ────
V – v(t) RC
–t
ln [V – v(t)] = ── + A
RC
Initial condition, t = 0, v(t) = 0 → A = ln V

–t
v(t) = V [1 – exp(───)]
RC
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 11
–t
v(t) = V [1 – exp( ── )]
RC

dv(t) V –t
i(t) = C ─── = ── exp( ── )
dt R RC

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 12


Total Energy Per Charging
Transition from Power Supply

∞ ∞ V 2
–t
Etrans = ∫ V i(t) dt = ∫ ── exp( ── ) dt
0 0 R RC
2
= CV

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 13


Energy Dissipated Per Transition in
Resistance
∞2 V ∞ 2
– 2t
R ∫ i (t) dt = R ── ∫ exp( ── ) dt
0 R 0
2
RC

1 2
= ─ CV
2

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 14


Energy Stored in Charged Capacitor

∞ ∞ –t V –t
∫ v(t) i(t) dt = ∫ V [1 – exp( ── )] ─ exp( ── ) dt
0 0 RC R RC
1 2
= ─ CV
2

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 15


Transition Power
 Gate output rising transition
2
 Energy dissipated in pMOS transistor = CV /2
 Energy stored in capacitor = CV 2/2

 Gate output falling transition


2
 Energy dissipated in nMOS transistor = CV /2
2
 Energy dissipated per transition = CV /2
 Power dissipation:
2
Ptrans = Etrans α fck = α fck CV /2
α = activity factor
fck = clock frequency
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 16
Components of Power
 Dynamic
 Signal transitions
 Logic activity
 Glitches

 Short-circuit
 Static Ptotal = Pdyn + Pstat
 Leakage
= Ptran + Psc + Pstat

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 17


Short Circuit Power of a Transition: Psc

VDD

isc(t)
vi (t) vo(t)

CL

Ground

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 18


Short-Circuit Power
 Increases with rise and fall times of input.
 Decreases for larger output load
capacitance; large capacitor takes most of
the current.
 Small, about 5-10% of dynamic power
dissipated in charging and discharging of
the output capacitance.
 Becomes zero when VDD ≤ Vthn + Vthp

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 19


Components of Power
 Dynamic
 Signal transitions
 Logic activity
 Glitches

 Short-circuit
 Static
 Leakage

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 20


Static (Leakage) Power
 Leakage power as a fraction of the total power
increases as clock frequency drops. Turning
supply off in unused parts can save power .
 For a gate it is a small fraction of the total power;
it can be significant for very large circuits.
 Static power increases as feature size is scaled
down; controlling leakage is an important aspect
of transistor design and semiconductor process
technology.

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 21


CMOS Gate Power
vi (t)
V
R = Ron
i(t) i(t)
vi (t) v(t)

Large C
resistance isc(t)

Ground
Leakage
current

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture time 22


Some Examples

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 23


Energy Saving by Voltage Reduction
VDD = 0.9V, 500MHz VDD = 0.3V, 5MHz
Battery
size Battery lifetime Battery lifetime
Efficiency Efficiency
% x103 x10 11 % x103 x10 11
AHr seconds cycles seconds cycles
1.2 93 1.263 7.03 100+ 1234 48.60
3.6 103 4.198 22.80 100+ 3894
seven-times 150.30
 70 million gate circuit, 45nm CMOS bulk PTM.
 Lithium-ion battery.
 Ref.: M. Kulkarni and V. D. Agrawal, “A Tutorial on Battery
Simulation – Matching Power Source to Electronic
System,” Proc. VLSI Design and Test Symp., July 2010.
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 24
State Encoding for a Counter
 Two-bit binary counter:
 State sequence, 00 → 01 → 10 → 11 → 00
 Six bit transitions in four clock cycles
 6/4 = 1.5 transitions per clock

 Two-bit Gray-code counter


 State sequence, 00 → 01 → 11 → 10 → 00
 Four bit transitions in four clock cycles
 4/4 = 1.0 transition per clock

 Gray-code counter is more power efficient.


G. K. Yeap, Practical Low Power Digital VLSI Design, Boston:
Kluwer Academic Publishers (now Springer), 1998.

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 25


Binary Counter: Original Encoding
a
Present
Next state
state A
b
a b A B B
0 0 0 1
0 1 1 0
1 0 1 1
1 1 0 0

A  ab  a b CK
CLR
B  ab  ab
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 26
Binary Counter: Gray Encoding
Present a
Next state
state A
a b A B
B
0 0 0 1 b
0 1 1 1
1 0 0 0
1 1 1 0

A  ab  ab CK
CLR
B  a b  ab
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 27
Three-Bit Counters
Binary Gray-code
State No. of toggles State No. of toggles
000 - 000 -
001 1 001 1
010 2 011 1
011 1 010 1
100 3 110 1
101 1 111 1
110 2 101 1
111 1 100 1
000 3 000 1
Av. Transitions/clock = 1.75 Av. Transitions/clock = 1
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 28
N-Bit Counter: Toggles in Counting Cycle
 Binary counter: T(binary) = 2(2N – 1)
 Gray-code counter: T(gray) = 2N
 T(gray)/T(binary) = 2N-1/(2N – 1) → 0.5
Bits T(binary) T(gray) T(gray)/T(binary)
1 2 2 1.0
2 6 4 0.6667
3 14 8 0.5714
4 30 16 0.5333
5 62 32 0.5161
6 126 64 0.5079
∞ - - 0.5000
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 29
Transition
FSM State Encoding
probability
based on 0.6 0.6
PI statistics
11 01
0.3 0.3
0.1 0.1
0.4 0.4
00 01 00 11
0.1 0.9 0.1 0.9
0.6 0.6
Expected number of state-bit transitions:

2(0.3+0.4) + 1(0.1+0.1) = 1.6 1(0.3+0.4+0.1) + 2(0.1) = 1.0


State encoding can be selected using a power-based cost function.

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 30


FSM: Clock-Gating
 Moore machine: Outputs depend only on
the state variables.
 If a state has a self-loop in the state transition
graph (STG), then clock can be stopped
whenever a self-loop is to be executed.
Xi/Zk
Si
Sk Xk/Zk

Clock can be stopped


Sj Xj/Zk when (Xk, Sk) combination
occurs.

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 31


Clock-Gating in Moore FSM
PI

Combinational
logic PO

Flip-flops
Clock
activation Latch
logic L. Benini and G. De Micheli,
Dynamic Power Management,
CK Boston: Springer, 1998.

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 32


Bus Encoding for Reduced Power
 Example: Four bit bus
 0000 → 1110 has three transitions.
 If bits of second pattern are inverted, then 0000 →
0001 will have only one transition.
 Bit-inversion encoding for N-bit bus:
N
after inversion encoding
Number of bit transitions

N/2

0
0 N/2 N
Number of bit transitions
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 33
Bus-Inversion Encoding Logic

Received data
Sent data

Bus register
Polarity
M. Stan and W. Burleson, “Bus-
decision
Polarity bit Invert Coding for Low Power I/O,”
logic
IEEE Trans. VLSI Systems, vol. 3, no.
1, pp. 49-58, March 1995.
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 34
Clock-Gating in Low-Power Flip-Flop

D D Q

CK

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 35


S5378 with Gated-Clock FF
 2958 gates, 179 flip-flops
 TSMC025 CMOS
 1,000 random vectors, clock period 50ns
 Simulation by Powersim*
Power (microwatts)
Flip- Combinational logic
flops
used Short- Static Clock Flip-flops Total
Transitions
circuit (leakage)

Normal 95.4 14.1 0.13 220.3 751.6 1,081.5


Gated 133.5 23.1 0.13 118.9 32.5 308.0
* J. D. Alexander, “Simulation Based Power Estimation for Digital CMOS
Technologies,” Master’s Thesis, Auburn University, Dec. 2008.
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 36
Books on Low-Power Design (1)
 L. Benini and G. De Micheli, Dynamic Power Management Design Techniques and
CAD Tools, Boston: Springer, 1998.
 T. D. Burd and R. A. Brodersen, Energy Efficient Microprocessor Design, Boston:
Springer, 2002.
 A. Chandrakasan and R. Brodersen, Low-Power Digital CMOS Design, Boston:
Springer, 1995.
 A. Chandrakasan and R. Brodersen, Low-Power CMOS Design, New York: IEEE
Press, 1998.
 J.-M. Chang and M. Pedram, Power Optimization and Synthesis at Behavioral and
System Levels using Formal Methods, Boston: Springer, 1999.
 M. S. Elrabaa, I. S. Abu-Khater and M. I. Elmasry, Advanced Low-Power Digital
Circuit Techniques, Boston: Springer, 1997.
 R. Graybill and R. Melhem, Power Aware Computing, New York: Plenum
Publishers, 2002.
 S. Iman and M. Pedram, Logic Synthesis for Low Power VLSI Designs, Boston:
Springer, 1998.
 J. B. Kuo and J.-H. Lou, Low-Voltage CMOS VLSI Circuits, New York: Wiley-
Interscience, 1999.
 J. Monteiro and S. Devadas, Computer-Aided Design Techniques for Low Power
Sequential Logic Circuits, Boston: Springer, 1997.
 S. G. Narendra and A. Chandrakasan, Leakage in Nanometer CMOS
Technologies, Boston: Springer, 2005.
 W. Nebel and J. Mermet, Low Power Design in Deep Submicron Electronics,
Boston: Springer, 1997.
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 37
Books on Low-Power Design (2)
 N. Nicolici and B. M. Al-Hashimi, Power-Constrained Testing of VLSI Circuits,
Boston: Springer, 2003.
 V. G. Oklobdzija, V. M. Stojanovic, D. M. Markovic and N. Nedovic, Digital System
Clocking: High Performance and Low-Power Aspects, Wiley-IEEE, 2005.
 M. Pedram and J. M. Rabaey, Power Aware Design Methodologies, Boston:
Springer, 2002.
 C. Piguet, Low-Power Electronics Design, Boca Raton: Florida: CRC Press, 2005.
 J. M. Rabaey and M. Pedram, Low Power Design Methodologies, Boston:
Springer, 1996.
 S. Roudy, P. K. Wright and J. M. Rabaey, Energy Scavenging for Wireless Sensor
Networks, Boston: Springer, 2003.
 K. Roy and S. C. Prasad, Low-Power CMOS VLSI Circuit Design, New York: Wiley-
Interscience, 2000.
 E. Sánchez-Sinencio and A. G. Andreaou, Low-Voltage/Low-Power Integrated
Circuits and Systems – Low-Voltage Mixed-Signal Circuits, New York: IEEE
Press, 1999.
 W. A. Serdijn, Low-Voltage Low-Power Analog Integrated Circuits,
Boston:Springer, 1995.
 S. Sheng and R. W. Brodersen, Low-Power Wireless Communications: A
Wideband CDMA System Design, Boston: Springer, 1998.
 G. Verghese and J. M. Rabaey, Low-Energy FPGAs, Boston: springer, 2001.
 G. K. Yeap, Practical Low Power Digital VLSI Design, Boston:Springer, 1998.
 K.-S. Yeo and K. Roy, Low-Voltage Low-Power Subsystems, McGraw Hill, 2004.
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 38
Books Useful in Low-Power Design
 A. Chandrakasan, W. J. Bowhill and F. Fox, Design of High-
Performance Microprocessor Circuits, New York: IEEE Press,
2001.
 R. C. Jaeger and T. N. Blalock, Microelectronic Circuit Design,
Third Edition, McGraw-Hill, 2006.
 S. M. Kang and Y. Leblebici, CMOS Digital Integrated Circuits,
New York: McGraw-Hill, 1996.
 E. Larsson, Introduction to Advanced System-on-Chip Test
Design and Optimization, Springer, 2005.
 J. M. Rabaey, A. Chandrakasan and B. Nikolić, Digital Integrated
Circuits, Second Edition, Upper Saddle River, New Jersey:
Prentice-Hall, 2003.
 J. Segura and C. F. Hawkins, CMOS Electronics, How It Works,
How It Fails, New York: IEEE Press, 2004.
 N. H. E. Weste and D. Harris, CMOS VLSI Design, Third Edition,
Reading, Massachusetts: Addison-Wesley, 2005.

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 39


Problem: Bus Encoding
A 1-hot encoding is to be used for reducing the capacitive power
consumption of an n-bit data bus. All n bits are assumed to be
independent and random. Derive a formula for the ratio of power
consumptions on the encoded and the un-coded buses. Show that
n ≥ 4 is essential for the 1-hot encoding to be beneficial.

Reference: A. P. Chandrakasan and R. W. Brodersen, Low Power


Digital CMOS Design, Boston: Kluwer Academic Publishers, 1995,
pp. 224-225. [Hint: You should be able to solve this problem
without the help of the reference.]

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 40


Solution: Bus Encoding
Un-coded bus: Two consecutive bits on a wire can be 00, 01, 10 and
11, each with a probability 0.25. Considering only the 01 transition,
which draws energy from the supply, the probability of a data pattern
consuming CV 2 energy on a wire is ¼. Therefore, the average per
pattern energy for all n wires of the bus is CV 2n/4.

Encoded bus: Encoded bus contains 2n wires. The 1-hot encoding


ensures that whenever there is a change in the data pattern, exactly
one wire will have a 01 transition, charging its capacitance and
consuming CV 2 energy. There can be 2n possible data patterns and
exactly one of these will match the previous pattern and consume no
energy. Thus, the per pattern energy consumption of the bus is 0 with
probability 2–n, and CV 2 with probability 1 – 2–n. The average per
pattern energy for the 1-hot encoded bus is CV 2(1 – 2–n).

Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 41


Solution: Bus Encoding (Cont.)
Power ratio = Encoded bus power / un-coded bus power
= 4(1 – 2–n)/n → 4/n for large n
For the encoding to be beneficial, the above power ratio should be
less than 1. That is, 4(1 – 2–n)/n ≤ 1, or 1 – 2–n ≤ n/4, or n/4 ≥ 1
(approximately) → n ≥ 4.
The following table shows 1-hot encoded bus power ratio as a
function of bus width:

n 4(1 – 2–n)/n n 4(1 – 2–n)/n


1 2.0000 8 0.4981
2 1.5000 16 0.2500 = 1/4
3 1.1670 32 1/8
4 0.9375 64 1/16
Fall 2010, Nov 16 ELEC5770-001/6770-001 Guest Lecture 42

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