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Final Year B.Tech. (Winter-2023)

This document describes the process for designing and manufacturing a printed circuit board (PCB) undertaken by a student named Mohamadhashir Mustak Momin for their final year B.Tech project guided by Prof. Supriya Kulkarni. The process involves PCB design using schematic capture software, applying solder paste to the board, using surface mount technology equipment for component placement and reflow soldering, inspection of the board, and final cleaning before shipment.

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Vinayak Deshmukh
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0% found this document useful (0 votes)
55 views9 pages

Final Year B.Tech. (Winter-2023)

This document describes the process for designing and manufacturing a printed circuit board (PCB) undertaken by a student named Mohamadhashir Mustak Momin for their final year B.Tech project guided by Prof. Supriya Kulkarni. The process involves PCB design using schematic capture software, applying solder paste to the board, using surface mount technology equipment for component placement and reflow soldering, inspection of the board, and final cleaning before shipment.

Uploaded by

Vinayak Deshmukh
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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Government College of Engineering, Karad

(An Autonomous Institute of Government of Maharashtra)


Department of Electronics and Telecommunication

Final Year B.Tech. [Winter-2023]

Name of Guide Student Name [Reg.No.]

Prof. Supriya Kulkarni Mohamadhashir Mustak Momin


(20151214)
PCB Design
• Understand the electrical parameters
• Creating the schematic in autodesk fusion.
• Use schematic capture tool to create PCB layout .
• Basic design printed on pcb board.
PCB Assembly (PCBA) Process:
 Applying Solder Paste on the areas of the printed circuit board .
 Automated pick and place machine for SMT components .
 Reflow Soldering .
 QC and Inspection .
Surface mount technology
 YAMAHA Yv100 machine is used for component placement .
 Operation:These systems normally use pneumatic suction cups, attached to a
plotter-like device to allow the cup to be accurately manipulated in three
dimensions.
 systems work together to pick up and correctly place the components onto the
PCB
 They are used for high speed, high precision placing of a broad range of electronic
components, like capacitors, resistors, integrated circuits onto the PCBs
Reflow machine
• Reflow soldering is a process in which a solder paste is used to
temporarily attach one or thousands of tiny electrical components to
their contact pcb circuits.
• The solder paste reflows in a molten state, creating permanent solder
joints.
Through-hole technology:
• leads on the components are inserted through holes drilled in printed
circuit boards (PCB) and soldered to pcb board on the opposite side,
either by manual assembly (hand placement) or by the use of
automated insertion.
Wave Soldering Machine
• Circuit board is passed over a pan of molten solder in which a pump
produces an upwelling of solder that looks like a standing wave.
• Wave soldering is mainly used in soldering of through hole
components.
• Wave Soldering is not suitable surface-mount technology (SMT)
Inspection
• Manual Inspection: the PCB has the small SMT components, so
visually checking the board for any misalignment or faults can result
in fatigue and eye strains for technicians.
• Optical Inspection: automated machine that has the high powered and
high resolution cameras installed at various angles to view the solder
joints from various directions.
light will reflect the solder joints in different angles according to the
quality of solder joints.
Final Cleaning, Finishing and Shipment:
• PCB is tested and declared OK from all aspects.
• clean the unwanted residual flux
• stainless steel based high pressure washing tool using deionized water
is sufficient to clean all types of dirt
• Final PCB is ready for pack up and shipment.

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