CMOS Digital Integrated Circuits

Lec 10
Combinational CMOS
Logic Circuits

1 CMOS Digital Integrated Circuits

 Combinational vs. Sequential Logic

In Combinational Out
Combinational
In Logic Out Logic
circuit circuit

State

Combinational Sequential
The output is determined only by The output is determined by
•Current inputs •Current inputs
•Previous inputs

Output = f(In) Output = f(In, Previous In)

2 CMOS Digital Integrated Circuits

 Static CMOS Circuit
• At every point in time (except during the switching transients)
each gate output is connected to either VDD or VSS via a low-
resistive path
• The outputs of the gates assume at all times the value of the
Boolean function, implemented by the circuit (ignoring, once
again, the transient effects during switching periods).
• This is contrasted to the dynamic circuit class, which relies on
temporary storages of signal values on the capacitance of high
impedance circuit nodes.

3 CMOS Digital Integrated Circuits

 Static CMOS
VDD

In1
In2 pMOS
Pull Up Network (PUN)

…
Network
InN
f(In1,In2,…InN)
In1
In2 nMOS
… Network Pull Down Network (PDN)
InN

PUN and PDN are dual logic networks

• The complementary operation of a CMOS gate

» The nMOS network (PDN) is on and the pMOS network
(PUN) is off
» The pMOS network is on and the nMOS network is off.
4 CMOS Digital Integrated Circuits
 NMOS Transistors
Series/Parallel Connection
• Transistors can be thought as a switch controlled by its gate signal
• NMOS switch closes when switch control input is high

A B

Y = X if A and B=AB
X Y

X B Y = X if A OR B=A+B
Y

NMOS Transistors pass a “strong” 0 but a “weak” 1

5 CMOS Digital Integrated Circuits

 PMOS Transistors
Series/Parallel Connection
• PMOS switch closes when switch control input is low

A B

X
Y = X if A AND B = A+B
Y
A

X B
Y Y = X if A OR B = AB

PMOS Transistors pass a “strong” 1 but a “weak” 0

6 CMOS Digital Integrated Circuits

 Threshold Drops

VDD VDD
PUN
S D
VDD

D 0  VDD S 0  VDD - VTn

VGS
CL CL

PDN VDD  0 VDD  |VTp|

VGS
D CL S CL
VDD

S D

7 CMOS Digital Integrated Circuits

 CMOS Logic Style
• PUN is the DUAL of PDN
(can be shown using DeMorgan’s Theorem’s)

A  B  AB
AB  A  B
• The complementary gate is inverting

AND = NAND + INV

8 CMOS Digital Integrated Circuits

 Example Gate: NAND

9 CMOS Digital Integrated Circuits

 CMOS NOR2
Two-Input NOR Gate

IDB,p

IDA,p

ID
IDA,n
IDB,n

10 CMOS Digital Integrated Circuits

 CMOS NOR2
Threshold Calculation (1/3)
• Basic Assumptions
» Both input A and B switch simultaneously (VA = VB)
» The device sizes in each block are identical. (W/L)n,A = (W/L)n,B , and
(W/L)p,A = (W/L)p,B
» The substrate-bias effect for the PMOS is neglected
Vth Calculation
• By definition, VA = VB = Vout = Vth. The two NMOS transistors are
VDD
saturated because VGS = VDS,
ID = IDA,n + IDB,n = kn(Vth-VT,n)2 B IDA,p

 V th  V T ,n  I D
kn IDB,p
• PMOS-B operates in the linear region, and PMOS-A is in A
saturation for Vin = Vout, F
I DB , p 
kp
2
 
2 V DD  V th  V T , p V SDB , p  V 2SDB , p  A IDA,n B IDB,n

kp
I DA, p 
2

V DD  V th  V T , p  V SDB , p 
2

11 CMOS Digital Integrated Circuits

 CMOS NOR2
Threshold Calculation (2/3)
Since IDA,p = IDB,p = ID, we have

V DD  V th  V T , p  2 I D k
p

• Combine the above equations, we obtain

1 kp
V T ,n 
2 kn

V DD  V T , p 
V th ( NOR 2) 
1 kp
1
2 kn
which is different with the expression of Vth(INV)

V T ,n 
kp

V DD  V T , p 
kn
V th ( INV ) 
kp
1
kn
12 CMOS Digital Integrated Circuits
 CMOS NOR2
Threshold Calculation (3/3)
• If kn = kp and VT,n = |VT,p| , Vth(INV) = VDD/2. However,
V DD  V T ,n
V th ( NOR 2) 
3
Equivalent-Inverter Approach (both inputs are identical)
» The parallel connected nMOS transistors can be represented
by a nMOS transistor with 2kn.
» The series connected pMOS transistors can be represented by
a pMOS transistor with kp/2.
VDD

kp/2

Vin Vout
2kn

13 CMOS Digital Integrated Circuits

 CMOS NOR2
Equivalent-Inverter Approach
• Therefore

V T ,n 
kp
 
V DD  V T , p
4k n
V th ( NOR 2) 
kp
1
4k n
• To obtain a switching threshold voltage of VDD/2 for
simultaneous switching, we have to set VT,n = |VT,p| and kp=4kn

Parasitic Capacitances and Simplified Equivalent Circuit: See

Fig. 7.12 in Kang and Leblebici.
» The total lumped load capacitance is assumed to be equal to
the sum of all internal capacitances in the worst case.

14 CMOS Digital Integrated Circuits

 CMOS NAND2
Two-Input NAND Gate

15 CMOS Digital Integrated Circuits

 CMOS NAND2
Threshold Calculation
• Assume the device sizes in each block are identical, (W/L)n,A =
(W/L)n,B , and (W/L)p,A = (W/L)p,B, and by the similar analysis to
the one developed for the NOR2 gate, we have

V T ,n  2
kp

V DD  V T , p 
kn
V th ( NAND 2) 
k
1 2 p
kn
• To obtain a switching threshold voltage of VDD/2 for simultaneous
switching, we have to set VT,n = |VT,p| and kn=4kp

16 CMOS Digital Integrated Circuits

 Layout of Simple CMOS Logic Gates (1/2)

VDD
VDD

M2
In Out

M1
Out
In

Inverter

GND

17 CMOS Digital Integrated Circuits

 Layout of Simple CMOS Logic Gates (2/2)

VDD
VDD

A B
A

Out

2-input NAND gate

GND

18 CMOS Digital Integrated Circuits

 Stick Diagram (1/2)
• Does not contain any information of dimensions.
• Represent relative positions of transistors
Basic Elements
» Rectangle: Diffusion Area
» Solid Line: Metal Connection
» Circle: Contact
» Cross-Hatched Strip: Polysilicon
VDD VDD

INV NAND2

Out Out

In
GND GND
A B
19 CMOS Digital Integrated Circuits
 Stick Diagram (2/2)

VDD VDD

INV
NAND2

Out Out

In A B
GND GND

20 CMOS Digital Integrated Circuits

 Complex CMOS Gates
Functional Design (1/3)
• OR operations are performed by parallel-connected drivers.
• AND operations are performed by series-connected drivers.
• Inversion is provided by the nature of MOS circuit operation.

• The realization of pull-down network is based on the same basic

design principle examined earlier.
• The pMOS pull-up network must be the dual network of the
nMOS pull-down network.
• One method systematically derives the pull-up network directly
form the pull-down network. This method constructs the dual
graph of the network. The pull-down network graph has nodes for
circuit nodes and arcs for nFETs with the each arc labeled with the
literal on the input to the corresponding nFET.

21 CMOS Digital Integrated Circuits

 Complex CMOS Gates
Functional Design (2/3)
• To construct a graph and pull-up network from a pull-down
network
» Insert a node in each of the enclosed areas within the pull-down
network graph.
» Place two nodes outside of the network separated by arcs from GND
and OUT.
» Connect pairs of new nodes by drawing an arc through each arc in the
pull-down circuit that lies between the corresponding pairs of areas.
» Draw the resulting pull-up network with a pFET for each of the new
arcs labeled with the same literal as on the nFET from which it came.
• The justification
» The complement of a Boolean expression can be obtained by taking
its dual, replacing ANDs with ORs and ORs with ANDs and
complementing the variables,
» The graphical dual corresponds directly to the algebraic dual.
» Complementation of the variables takes place automatically because
each nFETs is replaced with a pFET.
22 CMOS Digital Integrated Circuits
 Complex CMOS Gates
Functional Design (3/3)
• This method is illustrated by the generation of the pull-up from the
pull-down shown.
OUT
OUT VDD

A 1 B
A B A D
VDD OUT

D C B
C D C
2

OUT
GND

• On the dual graph, which of the two side nodes is labeled VDD or
OUT is functionally arbitrary. The selection may, however, affect
the location of capacitances, and hence, the performance.
23 CMOS Digital Integrated Circuits
 Complex CMOS Gates
Device Sizing in Complex Gates (1/4)
• Method used for sizing NAND and NOR gates also applies to
complex gates
• Most easily transferred by examining all possible paths from
OUT to GND (and from VDD to OUT)
• Suppose that we are dealing with CMOS and the sized inverter
devices use minimum channel lengths and widths Wn and Wp.
• For the pull-down network:
1. Find the length nmax of the longest paths between OUT and through
GND the network. Make the width of the nFETs on these paths
nmaxWn.
In this algorithm, a path is a series of FETs
that does not contain any complementary pair of literals such as X
and X.
2. For next longest paths through the circuit between OUT and GND
consisting of nFETs not yet sized, repeat Step 1.
3. Repeat Step 2 until there are no full paths consisting of unsized
nFETS
24 CMOS Digital Integrated Circuits
 Complex CMOS Gates
Device Sizing in Complex Gates (2/4)
4. For each longest partial path in the circuit consisting of unsized
nFETs, based on the longest path between OUT and GND on
which it lies, find the equivalent Weq required for the partial path.
5. Repeat Step 1 for each longest partial path from Step 4 with OUT
and GND replaced the endpoints of the partial path. Make the
widths of devices on the path equal to nmaxWeq where nmax is the
number of FETs on the partial path.
6. Repeat 4 and 5 for newly generated longest partial paths until all
devices are sized.

25 CMOS Digital Integrated Circuits

 Complex CMOS Gates
Device Sizing in Complex Gates (3/4)
OUT
A

B E

G F
D

GND
• This can be illustrated for the example above. Ln =0.5μ, Wn=5 μ,
in the inverter.
1. A longest path through the network from OUT to GND is A-
B-C-D with nmax=4. Thus, the widths WA, WB, WC, WD are
45=20 μ. This is the only longest path we can find from
26 CMOS Digital Integrated Circuits
 Complex CMOS Gates
Device Sizing in Complex Gates (4/4)
OUT to GND without passing through a sized device.
2. H and G are partial path. But it is important that they are
considered as part of a longest between OUT and GND for
evaluation. Thus, a “split” partial path consisting of H and G
must be considered. Based on the evaluation segments,
Weq =2Wn=10μ. Thus, WH and WG are 110=10 μ.
3. The longest remaining partial path in the circuit is E-F with nmax
= 2. Since this path is in series with A with width 4Wn=20 μ, it
needs to have an equivalent width of Weq determined from:
1 1 1 1 1 1
    
Wn 4W n W eq 5 20 W eq

Weq = 20/3 μ and the widths WE and WF are 220/3 μ=40/3 μ.

Since all devices are sized, we are finished.

27 CMOS Digital Integrated Circuits

 Complex CMOS Gates
Layout of Complex Gates (1/4)
• Goal: Given a complex CMOS logic gate, how to find a
minimum-area layout.
VDD
D
A
D
A E

E
B C

B C pMOS network

OUT

A B A B

E D C D E C

nMOS network

28 CMOS Digital Integrated Circuits

 Complex CMOS Gates
Layout of Complex Gates (2/4)
Arbitrary ordering of the polysilicon columns:
» The separation between the polysilicon columns must allow for one
diffusion-to-diffusion separation and two metal-to-diffusion
contacts in between
 Consume a considerable amount of extra silicon area
VDD

D S S D S D
pMOS
D S S D

Out
D S
nMOS
D S D S D S S D

GND
A E B D C

29 CMOS Digital Integrated Circuits

 Complex CMOS Gates
Layout of Complex Gates (3/4)
Euler Path Approach
• Objective: To order the inputs such that the diffusion breaks
between input polysilicon strips is minimized, thereby reducing
the width of the layout.
• Definition: An Euler path is an uninterrupted path that traverses
each gate of the graph exactly once.
• Approach:
» Draw the graph for the NMOS and PMOS networks.
» Find a common Euler path through both of the graphs.
• Note that nodes with an odd number of attached edges must be
at the end points of the Euler path.
• Some circuits may not have Euler paths – Do Euler paths for
parts of the circuit in such cases. A circuit constructed using
the dual graph method is more likely to have an Euler path.
» Order the transistor pairs in the layout in the order of the path
from left to right or right to left.
30 CMOS Digital Integrated Circuits
 Complex CMOS Gates
Layout of Complex Gates (4/4)
D
A
A B
nMOS network Common Euler path E pMOS network

E E-D-A-B-C
D C B C

• Euler path successful: Order: E-D-A-B-C

• Do the symbolic layout (stick diagram)
» More compact, simple routing of signals, and consequently, less
parasitic capacitance
VDD

S D D S
pMOS
D S D S S D
Out
D S
nMOS
D S S D S D D S
GND
E D A B C
31 CMOS Digital Integrated Circuits
 Complex CMOS Gates
AOI Gates
• AOI (AND-OR-INVERT): Enable the sum-of-products
realization of a Boolean function in one logic gate.
» The pull-down network consists of parallel branches of
series-connected nMOS driver transistors.
» The corresponding pull-up network can be found using the
dual-graph concept.
VDD
Example: OUT = A1A2A3+B1B2+C1C2C3 Dual pMOS
Pull-up network
A1
A2 OUT
A3
A1
B1 B1 C1
B2
A2
C2
C1
C2
C3 A3
B2 C3

32 CMOS Digital Integrated Circuits

 Complex CMOS Gates
OAI Gates
• OAI (OR-AND-INVERT): Enable the product-of-sums
realization of a Boolean function in one logic gate.
» The pull-down network consists of series branches of
parallel-connected nMOS driver transistors.
» The corresponding pull-up network can be found using the
dual-graph concept.
VDD

OUT = (A1+A2+A3)(B1+B2) C1 Dual pMOS

Pull-up network
A1
A2 OUT
A3
C1
B1
B2
B1 B2

C1
A3 A2 A3

33 CMOS Digital Integrated Circuits

 Complex CMOS Gates
Pseudo-NMOS
• In Pseudo-NMOS, the PMOS network is replaced by a single pFET
with its gate attached to GND. This provides a fixed load such as on
NMOS circuits, hence called pseudo-NMOS.
• Advantage: Eliminate the PMOS network and hence reduce area.
• Disadvantages:
» Back to ratioed design and VOL problems as in NMOS since PFET is
always ON.
» “Non-zero” static power dissipation.
VDD
pMOS transistor
acting as load

OUT

C1

B1 B2

A3 A2 A3

34 CMOS Digital Integrated Circuits

 Ratioed Logic (1/2)
 Ratioless Logic: The logic levels are not dependent upon the relative
device sizes.
 Ratioed Logic: The logic levels are determined by the relative
dimensions of composing transistors

VDD VDD VDD

Resistive Depletion PMOS

Load RL Load VT < 0 Load
VSS
F F F
In1 In1 In1
In2 PDN In2 PDN In2 PDN
In3 In3 In3

VSS VSS VSS

(a) resistive load (b) depletion load NMOS (c) pseudo-NMOS

Goal: To reduce the number of devices over complementary CMOS

35 CMOS Digital Integrated Circuits
 Ratioed Logic (2/2)

VDD

• N transistors + Load
Resistive
Load • VOH = VDD
RL

• VOL = RPN
VDD
F RPN + RL

In1 • Assymetrical response

In2 PDN
In3 • Static power consumption

• tpL = 0.69 RL CL
VSS

36 CMOS Digital Integrated Circuits

 Active Loads

VDD VDD

Depletion PMOS
Load VT < 0 Load
VSS
F F
In1 In1
In2 PDN In2 PDN
In3 In3

VSS VSS

depletion load NMOS pseudo-NMOS

37 CMOS Digital Integrated Circuits

 Pseudo-NMOS

VDD

F
CL
A B C D

VOH = VDD (similar to complementary CMOS)

 VOL  k p
2
k n  VDD  VTn VOL 
 

2  2
 
VDD  VTp
2


 kp 
VOL  VDD  VT 1  1   (Assuming VT  VTn  |VTp|)
 k n 

Smaller area and load but Static power dissipation!!!

38 CMOS Digital Integrated Circuits
 CMOS Full-Adder Circuit

A B A B Cin S Cout Carry status

0 0 0 0 0 delete
Cin Full Cout
adder 0 0 1 1 0 delete

Sum 0 1 0 1 0 propagate
0 1 1 0 1 propagate
1 0 0 1 0 propagate
1 0 1 0 1 propagate
1 1 0 0 1 generate
1 1 1 1 1 generate

39 CMOS Digital Integrated Circuits

 CMOS Full-Adder Circuit
The Binary Adder
A B

Cin Full
Cout
adder

Sum

Sum = ABCin
= ABCin + ABCin + ABCin + ABCin
= ABC + (A+B+C)Cout
at least two of A, B, and C are zeros
Cout = AB + BCin + ACin

40 CMOS Digital Integrated Circuits

 CMOS Full-Adder Circuit
Express Sum and Carry as a Function of P, G, D
• Define three new variable which ONLY depend on A, B
Generate (G) = AB
Propagate (P) = AB
Delete (D)= A B
Cout(G,P) = G+PCin
Sum(G,P) = PCin
• Can also derive expressions for S and Cout based on D and P.
G = 1: Ensure that the carry bit will be generated
D = 1: Ensure that the carry bit will be deleted
P = 1: Guarantee that an incoming carry will be propagated to
Cout
• Note that G, P and D are only functions of A and B and are not
dependent on Cin
41 CMOS Digital Integrated Circuits
 CMOS Full-Adder Circuit
The Ripple-Carry Adder
• The N-bit adder is constructed by cascading N full-adder circuits.
• The carry bit ripples from one stage to the other.
• The delay through the circuit depends upon the number of logic
stages which need to be traversed, and is a function of the applied
signals.
A0 B0 A1 B1 A2 B2 A3 B3

Ci,0 Co,0 Co,1 Co,2 Co,3

FA FA FA FA
(  Ci,1 )

S0 S1 S2 S3
Worst case delay linear with the number of bits
p = O(N)
adder  (N-1)carry + sum
Goal: Make the fastest possible carry path circuit
42 CMOS Digital Integrated Circuits
 CMOS Full-Adder Circuit
Transistor-Level of One-Bit Full-Adder Circuit
V DD

VDD
Ci A B

A B
A

B
Ci B
V DD
A
X
Ci

Ci A S
Ci

A B B V DD
A B Ci A

Co B

28 transistors
43 CMOS Digital Integrated Circuits
 CMOS Full-Adder Circuit
Inversion Property

A B A B

Ci FA Co Ci FA Co

S S

S(A,B,Ci) = S(A,B,Ci)
Co(A,B,Ci) = Co(A,B,Ci)

44 CMOS Digital Integrated Circuits

 CMOS Full-Adder Circuit
Minimize Critical Path by Reducing Inverting Stages (1/2)
Even cell Odd cell
A0 B0 A1 B1 A2 B2 A3 B3

Ci,0 Co,0 Co,1 Co,2 Co,3

FA FA FA FA

S0 S1 S2 S3

A0 B0 A1 B1 A2 B2 A3 B3

Ci,0 Co,0 Co,1 Co,2 Co,3

FA FA FA FA

S0 S1 S2 S3
45 CMOS Digital Integrated Circuits
 CMOS Full-Adder Circuit
Minimize Critical Path by Reducing Inverting Stages (2/2)
Even cell Odd cell
A0 B0 A1 B1 A2 B2 A3 B3

Ci,0 Co,0 Co,1 Co,2 Co,3

FA' FA' FA' FA'

S0 S1 S2 S3

*FA' is a full adder without the inverter in the carry path.

Exploit Inversion Property
•The number of inverting stages in the carry path is reduced.
•The only disadvantage is that it need different cells for the even and old slices.

46 CMOS Digital Integrated Circuits

 CMOS Full-Adder Circuit
A Better Structure: The Mirror Adder (1/3)
• Carry Generation Circuitry
» Carry-inverting gate is eliminated Cout(G,P) = G+PCin
» PDN and PUN networks are not dual Sum(G,P) = PCin
• D or G is high  C0 is set to VDD or GND
• P is high  the incoming carry is propagated to C0
VDD

VDD VDD A

A B B A B Ci B
Kill
"0"-Propagate A Ci
Co
Ci S
A Ci
"1"-Propagate Generate
A B B A B Ci A

B
24 transistors
47 CMOS Digital Integrated Circuits
 CMOS Full-Adder Circuit
The Mirror Adder (2/3)
• Only need 24 transistors.
• NMOS and PMOS chains are completely symmetrical. This
guarantees identical rising and falling time if the NMOS and
PMOS devices are properly sized.
• A maximum of two series transistors can be observed in the
carry generation circuitry.
• The critical issue is to minimize the capacitance at node C0.
• Capacitance at node C0
» 4 diffusion capacitances
» 2 internal gate capacitances
» 6 gate capacitances in the connecting adder cell
 A total 12 gate capacitances (Assume Cdiffusion  Cgate)
• The transistors connected to Ci are placed closest to the output.
• Only the transistors in the carry stage have to be optimized for
speed. All transistors in the sum gate can be minimum-size.

48 CMOS Digital Integrated Circuits

 CMOS Full-Adder Circuit
The Mirror Adder (3/3) Ci
Co
Ci
B

A A
B A
B
A Ci
VDD
B

A B Ci B A Ci Co Ci A B

Co

GND Stick Diagram

49 CMOS Digital Integrated Circuits

 Pass Transistors
• The pass transistor is an nFET used as a switch-like element to
connect logic and storage.
VC = 1
VC

Vin Vout VC = 0

• Used in NMOS; sometimes used in CMOS to reduce cost.

• The voltage on the gate, VC, determines whether the pass
transistor is “open” or “closed” as a switch.
» If VC = H, it is “closed” and connects Vout to Vin.
» If VC = L, it is “open” and Vout is not connected to Vin.
• Consider Vin = L and Vin = H with VC = H. With Vin = L, the pass
transistor is much like a pull-down transistor in an inverter or
NAND gate. So Vout, likewise, becomes L. But, for Vin = H, the
output becomes the effective source of the FET. When VGS =
VDD-VOUT=VTn , the nFET cuts off. The H level is VOUT = VDD-
VTn.
50 CMOS Digital Integrated Circuits
 Transmission Gates (Pass Gates) (1/2)
• With body effect, for VDD = 5V, the value on Vout can be around
3.0 to 3.5 V. This reduced level diminishes NMH and the current
drive for the gate or gates driven by the pass transistor.
• For both NMOS and CMOS, the lack of current drive slows
circuit operation and NMH can be particularly problematic. As a
consequence, in CMOS, a pFET is added to form a
transmission gate.
Transmission Gates
• Symbols:
C
C

A B A B

C
C
Circuit Popular Usage
51 CMOS Digital Integrated Circuits
 Transmission Gates (2/2)

• Operation
» C is logic high  Both transistors are turned on and provide
a low-resistance current path between nodes A and B.
» C is logic low  Both transistors will be off, and the path
between nodes A and B will be open circuit. This condition
is called the high-impedance state.
• With the parallel pFET added, it can transfer a full VDD from A
to B (or B to A). It can also charge driven capacitance faster.
• The substrates of NMOS and PMOS are connected to ground
and VDD, respectively. Therefore, the substrate-bias effect must
be taken into account.

52 CMOS Digital Integrated Circuits

 Transmission Gates
DC Analysis (1/3)
• Vin = VDD, VC = VDD, and node B is connected to a capacitor, which
represents capacitive loading of the subsequent logic stages.
0V

ID ISD,p
Vin=VDD Vout
IDS,n

VDD
• The nMOS transistor, VDS,n=VDD–Vout, and VGS,n=VDD–Vout. Thus,
» Turn off: If Vout > VDD – VT,n
» Saturation: If Vout < VDD – VT,n
• The pMOS transistor, VDS,p=Vout–VDD, and VGS,p= –VDD. Thus,
» Saturation: If Vout < |VT,p |
» Linear: If Vout > |VT,p |
53 CMOS Digital Integrated Circuits
 Transmission Gates
DC Analysis (2/3)
Region 1 Region 2 Region 3

nMOS: saturation nMOS: saturation nMOS: cut-off

pMOS: saturation pMOS: linear reg. pMOS: linear reg.

Vout
0V |VT,p| (VDD-VT,n ) VDD
• The current flowing through the transmission gate is equal to
ID = IDS,n + ISD,p
• The equivalent resistance for each transistor can be represented as
Req,n = (VDD-Vout)/IDS,n
Req,p = (VDD-Vout)/ IDS,p
and
Req = Req,n ║ Req,p

54 CMOS Digital Integrated Circuits

 Transmission Gates
DC Analysis (3/3)
The values of Req,n and Req,p
• Region 1 2(V DD  V out )
R eq ,n  2
k n V DD  V out  V T ,n 
2(V DD  V out )
R eq , p 
k p V DD  | V T , p |
2

• Region 2
2(V DD  V out )
Req ,n  2
k n V DD  V out  V T ,n 
2
Req , p 
k p 2V DD  | V T , p |  V DD  V out 
• Region 3
2
Req , p 
k p 2V DD  | V T , p |  V DD  V out 
55 CMOS Digital Integrated Circuits
 Resistance of Transmission Gate
R
Req,n
Req,p

Req,n║ Req,p
Vout
0 VDD-VT,n VDD
• The parallel combination of the pFET and the nFET result in an
equivalent resistance that is roughly constant. This constant value,
Req, can be used in series with an ideal switch controlled by C and
C to model the transmission gate. See p. 311 of the text book.
• The implementation of CMOS transmission gates in logic circuit
design usually results in compact circuit structures which may even
require a smaller number of transistors.

56 CMOS Digital Integrated Circuits

 Applications of Transmission Gate
Example: XOR
B

B
M2

AB A
A
AB F
M1 M3/M4
B

Only need 6 transistors

57 CMOS Digital Integrated Circuits

 Applications of Transmission Gate
Example: Multiplexer

AS
A
S F = AS+BS

B BS

58 CMOS Digital Integrated Circuits

 Applications of Transmission Gate
Examples: Transmission Gate Full Adder
Generate (G) = AB
Propagate (P) = Cout(G,P) =
AB P VDD
G+PCin
Ci Sum(G,P) =
VDD
A PCin
P S Sum Generation
A A P Ci
A P
B B VDD
VDD A
P
P Co Carry Generation
Ci Ci Ci
A
P
Setup
Similar delays for sum and carry
59 CMOS Digital Integrated Circuits