PCB Design
PCB Design
PCB Design
• Through-hole technology
• The first PCBs used through-hole technology,
mounting electronic components by leads inserted
through holes on one side of the board and soldered
onto copper traces on the other side. Boards may be
single-sided, with an un plated component side, or
more compact double-sided boards, with components
soldered on both sides
• Surface-mount technology
• Surface-mount technology emerged in the 1960s,
gained momentum in the early 1980s and became
widely used by the mid-1990s. Components were
mechanically redesigned to have small metal tabs or
end caps that could be soldered directly onto the PCB
surface, instead of wire leads to pass through holes.
Etching Process
• Chemical etch
• Chemical etching is usually done with ammonium per sulphate or ferric chloride.
• For PTH (plated-through holes), additional steps of electroless deposition are
done after the holes are drilled, then copper is electroplated to build up the
thickness, the boards are screened, and plated with tin/lead. The tin/lead
becomes the resist leaving the bare copper to be etched away.
Laser/Plasma Etch
• A new process creating new standards and the demise of the chemical
process is plasma etch. In addition to no etch-back, this process also
eliminates imaging, or film error using a direct imaging process, which
transfers the layer image directly to the material.
Design Assembly
1. Film Generation
• Design the Layout of PCB using CAD
(Computer Aided Drafting) software
like EAGLE, PROTEUS, etc.
• Take a print out of one Layer (generally
bottom Layer) Layout with pads and
tracks
• NOTE: Actual size must be printed.
Check the page setting and select A4
type. If the pcb is single layer and you
are printing bottom layer of it, mirror
of the layout is to be printed.
Steps in PCB Design
3. Drill Holes
Steps in PCB Design