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Induction

Kaynes Technology is an electronics manufacturing company with global customers in the automotive industry. It produces automotive lighting components and assemblies, such as headlights and taillights. The document describes Kaynes' production processes, including PCB assembly, clearance line processes, quality procedures, and the author's job responsibilities and experience in quality assurance management.

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omprakash8032
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122 views22 pages

Induction

Kaynes Technology is an electronics manufacturing company with global customers in the automotive industry. It produces automotive lighting components and assemblies, such as headlights and taillights. The document describes Kaynes' production processes, including PCB assembly, clearance line processes, quality procedures, and the author's job responsibilities and experience in quality assurance management.

Uploaded by

omprakash8032
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PPTX, PDF, TXT or read online on Scribd
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INDUCTION AT

KAYNES TECHNOLOGY

BY:RAHUL YADAV
QA-Executive
ABOUT KAYNES
Kaynes Technology India Private Ltd, is a leading domestic
player in the Electronics System & Design Manufacturing
Services Space with Global foot print. Branches are listed
here:
TIER 1 CUSTOMERS
India Japan Lighting(IJL)
Continental
Uno minda
Rinder
Mindarika
Lumax
Lucas TVS
END CUSTOMERS
Ford
Mahindra
Honda
Yamaha
Maruti Suzuki
PRODUCTS
Head light assy.
Tail light assy.
DRL assy.
BCU PCBA
IJL PRODUCTS
PART NAME PART IMAGE APPLICATION

YWD Jimmy

YHC DRL XL6

OOP R15

Baleno
YRA
PART NAME PART IMAGE APPLICATION

B9D CLL MT-15

B9D RCL MT-15

B9D 01L FZS-FI

K43H,K2KA HONDA HORNET


PART NAME PART IMAGE APPLICATION

T00A-E

T00A-C Honda city

T00A-D

YTA-DRL,CLL Baleno
PART NAME PART IMAGE APPLICATION

XF3T1-A
Suzuki
Avenis
XF3T1-B
PROCESSES AT KAYNES
Customer Relationship management
New product management
Supply chain management
Warehouse management
Production management
Quality assurance management
Operation management
Human resources management
Asset management
Environment health and safety
PROCESS IN STORE
Material Inward & Inward quality check/control
(1.Custom build & standard build inspection plans)
(2.MRB[Material review board] for suspected material
hold by IQC]
Storage of Material
(1.ESD Bins as per location, for MSL devices
dry chamber is available)

Kitting of Material as per kit list

Material Issue from Store


PCB ASSEMBLY PROCESS
AOI

PCB

Reflow soldering

In Circuit Test

Chip mounting

Screen printing
PCB separation /
router
To Customer post
packing / final
Selective Soldering
assembly…
PCB ASSEMBLY PROCESS
Paste Mixing(for preparedness)
Barcode labeling(for traceability)
Loading(input to smt)
Pcb cleaning(Remove dust particle from pcb)
Screen Printing(solder paste apply on bare pcb)
Solder Paste Inspection(Paste Inspections)
Reflow(To joint pcb pad with components)
Automatic Optical Inspection(Pcb Inspection)
Unloading
Rework(if applicable)
Clearance line/Post SMT process
START

Cable Hand Pcb Testing


FCI/FSI
stuffing soldering

Packing IFM OQC

END
Facility at clearance line
1.Cable Stuffing : Dedicated fixture
is used for separate part for
assembly of wire harness

2.Hande Soldering: hand soldering


used to make soldering of wire with
pcbs.
3.Function Testing: Dedicated zig is used
for separate part for testing the function
of pcbs assembly.

4.IFM: Initial flow management is


implement for verification of glow of
LEDs.

5.Packing/Handling: ESD Pink form ,tray


and bins are used to handle pcb assembly.
MSD (Moisture sensitive devices)
  MSDs are electronic devices encapsulated with plastic compounds and
other organic materials. Moisture from atmospheric humidity will
enter permeable packaging materials by diffusion and preferentially
collect at the dissimilar material interfaces.
Job Responsibility
Conducting morning meeting.
Quality DRM data update.
Quality morning meeting sheet update.
Job set up verification on clearance line.
Patrol audit in ERP.
Red bin analysis.
Monitoring & analysis on SMT defect.
Conducting dock audit before dispatch.
Conducting operator observance in line.
8D preparing for customer complains.
5s monitoring on shop floor.
4M verification.
Good board & bad board validation and preparing for
new products.
Temperature & Humidity verification on floor.
Sales Return part analysis.
Product audit as per plan with control plan.
Handling IPP and ISC product parts.
Currently Monitoring Selective soldering for defects.
QUALITY PROCEDURES:
1.Monitring & measurement of manufacturing process
2.Process validation & revalidation
3.Manufacturing & process audit
4.Layout inspection & function S O

5.Control of NC material P
6.Control of inspection measurement I
C
7.Measurement system analysis
8.Customer complain handling.
PREVIOUS EXPERIANCE
JNJ ELECTRONICS PVT LTD(3 yr)
(A JP Minda Group company)
manufacturing PCBs of speedometer for automotive.
BEAM INFOTECH PVT LTD(2yr)
manufacturing PCBs of head Light for automotive.

Work on IATF 16949:2016 Certification


Work on MACE audit(2018) which is successfully passed and get
Green status.
THANK YOU

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