Presented by:

Nitish Ghosal
Amit Rai

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The objective of the module is to introduce micro-
and nano -electromechanical systems with special
emphasis on the development, processing,
applications, and materials that are currently in use
to produce MEMS/NEMS.

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 Introduction
 Brief History
 Electromechanical Systems
 MEMS
 Current Applications
 NEMS and Nanotechnology
 Impact of Miniaturization
 Challenges and Possibilities
 References

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 Figure 5.1: Jonathan Swift.
Courtesy Sandia National Laboratories, SUMMiT™ Technologies, www.sandia.gov/mstc.

Figure 5.1: Drive gear chain and linkages, with a grain of

pollen (top right) and coagulated red blood cells (lower right,
top left) to demonstrate scale.

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Introduction, Continued

Figure 5.2: The Scale of Things.

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 Introduction, Continued
Definition and Terms
 MST - Microsystems Technology (European)
 MEMS - Microelectromechanical Systems
(U.S.)
 Manmade devices created using compatible
microfabrication techniques that are capable
of
 Converting physical stimuli, events and parameters to
electrical, mechanical & optical signals
 Performing actuation, sensing and other functions

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Introduction, Continued

Image Courtesy of Sandia National Laboratories, SUMMiTTM Technologies, www.mems.sandia.gov

Figure 5.3: Spider mite with legs on a mirror drive assembly.

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 Brief History
1962 Silicon Integrated piezo actuators BY O.N. Tufte et al.
1967 Anisotropic deep silicon etching H.A. Waggener
1967 The resonant gate transistor by H. Nathanson, et.al
1972 National Semiconductor - Pressure Sensor
1979 Thermal inkjet technology is invented at HP laboratories
1982 “Silicon as a Mechanical Material” K. Peterson
1982 Liga Process (KFIK, Germany)
1983 “Infinitesimal Machinery” R. Feynman
1983 Silicon Micromechanical devices – J.B.Angel etc.
1983 Integrated Pressure Sensor – Honeywell
1985 Airbag Crash Sensor
1987 Dr. Hornbeck Digital Micromirror Device or DMD (DLP by Texas
Instruments)
Later in 1990s micromachining begins leveraging microelectronics
industry
1993 Accelerometer integrated with electronics Analog devices
1994 DRIE Etching (Bosch process is patented)
1999 Optical network switch - Lucent

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 Electromechanical Systems
Functional Block Diagram

Figure 5.4: Electromechanical Systems functional block diagram.

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 MEMS
Microstructure Fabrication
 Materials
 Crystallography – Forms of Silicon
 Amorphous
 Polycrystalline
 Crystalline
 “Miller Planes”

Figure 5.5: Miller Indices, Direction Examples

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 MEMS, Continued
Microstructure Fabrication, Continued
-Structural layer
-Sacrificial layer

 Pattern definition
 Photolithography
deposit
 Deposition
 Oxidation, chemical-vapor
deposition, ion implantation
pattern  Removal
 Etching, evaporation

Figure 5.6: Microstructure Fabrication

etch
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Microstructure Fabrication, Continued
Processing Techniques
 Deep Reactive Ion Etching (DRIE)
 Surface Micromachining
 LIGA process – Lithography / Electroplating / Molding
 SUMMIT process

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 MEMS, Continued
MEMS Advantages
The advantages of MEMS devices include
• Size
• High sensitivity
• Low noise
• Reduced cost
• Batch Processing
The applications for MEMS are so far reaching that a multi-billion
dollar market is forecast. Key industry applications include
transportation, telecommunications and healthcare.

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 MEMS, Continued
MEMS Economy

Worldwide MEMS Markets

2002 2007
(in Millions of $)
Microfluidics 1401 2241

Optical MEMS 702 1826

RF MEMS 39 249

Other actuators 117 415

Inertial sensors 819 1826

Pressure sensors 546 917

Other sensors 273 830

Total 3900 8300

Figure 5.7: Worldwide MEMS Market (2002 vs. 2007)

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 Current Applications
 Accelerometers
 Micro Optical Electro Mechanical Systems (MOEMS)
 Digital Mirror Devices (DMD) used in Projection Devices
 Deformable mirrors
 Optical Switches
 Inkjet Print heads (Microfluidics)
 Pressure Sensors
 Gyrometers
 Magnetic RW heads for hard drives
  Seismic Activities - Thermal transfer

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Current Applications, Continued
Biomedical
 Micro-arrayed biosensors
 Virus detection
 DNA Chip PCR (Polymerase Chain Reaction)
 Neuron probes (nerve damage/repair)
 Retina/Cochlear Implants
 Micro Needles
 ChemLab
 Micro Fluidic Pumps
- Insulin Pump (drug delivery)

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Current Applications, Continued
Detection systems

 Hand held detectors – biological & chemical microsensors

 Chem’s Lab on a Chip (security applications)
 Micro and Radio Frequency (RF) Switches
 RFID Technologies
 Modern“bar-coding” system increasingly used on toll roads
and materials handling applications
 Data Storage Systems
 IBMMillipede storage system – AFM tip writes data bit by
melting a depression into polymer mediaum and reads data by
sensing depressions.
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 NEMS and Nanotechnology

 Nanotechnology
 manipulation of matter at
the nanometer scale.
 Nanomaterials
 Started with carbon.
 Behavior depends on
morphology.

Figure 5.8: Eight allotropes of carbon:

Diamond, graphite, lonsdaleite, C60, C540,
C70, amorphous carbon and carbon nanotube

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 NEMS and Nanotechnology,
Continued
 Quantum dots
 Nanowires
 Quantum films

Figure 5.9: Quantum Dots.

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 NEMS and Nanotechnology,
Continued
Nano Fabrication
• Electrostatic manipulation
• Moving one electron or molecule at a time
• Patterning
• Dip Pen Lithography
• Electron Beam Lithography
• Self assembly

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 NEMS and Nanotechnology,
Continued
Merging of technologies
 Cantilever Sensors
 Mass Storage
 (IBM)Millipede chip
 Nanochip

 Molecular Electronics
 Transistors
 Memory cells
 Nanowires
 Nanoswitches

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 NEMS and Nanotechnology,
Continued
Merging of technologies
Selective chemical
Cantilever sensors are essentially layer
MEMS cantilevers with chemical
arrays attached. The cantilevers,
cantilever
acting much like tuning forks,
have a natural frequency of
vibration which changes as more
mass is attached (nano function). Reacting compound

The change in frequency is

sensed by the MEMS device
indicating a measurable presence
in the system of particular
reacting compound.
Figure 5.10: Cantilever sensor

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 Impact of Miniaturization
 Potential Positive Impacts
 Reduction of disease.
 Job opportunities in new fields.
 Low-cost energy.
 Cost reductions with improved efficiencies.
 Improved product and building materials.
 Transportation improvements
 Potential Negative Impacts
 Material toxicity
 Non-biodegradable materials.
 Unanticipated consequences.
 Job losses due to increased manufacturing efficiencies.

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 Challenges and Possibilities
 Fundamental and applied research
 Engineering and technological developments
 High Fidelity Modeling
 High Yield / Low Cost Fabrication
 “Molecular manufacturing”

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 Gad-el-Hak, M. MEMS, Design and Fabrication,
Second Edition. (2005)
 Lyshevski, S., MEMS and NEMS, CRC Press LLC.
(2002)
 Maluf, N. and Williams, K., An Introduction to
Micromechanical Systems Engineering, Second
Edition, Artechouse, Inc. (2004)
 Microsytems, Same-Tec 2005 Preconference
Workshop, July 25 &26, 2005.
 Taylor and Francis, MEMS Introductory Course,
Sandia National Laboratories, June 13-15, 2006.
 What is MEMS technology? MEMS and
Nanotechnology Clearinghouse.
http://www.memsnet.org/mems/what-is.html.
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