Dec50143 - Cmos Integrated Circuit Design & Fabrication
Dec50143 - Cmos Integrated Circuit Design & Fabrication
b. Microelectronics
◦ Ceramic
◦ Plastics
IC packaging technology:
its involves the use of leads on the components that are inserted
into holes drilled in printed circuit board (PCB)
PDIP
CERDIP
c. Pin Grid Array (PGA)
PLCC PQFP
Plastic Leaded Chip Carrier Plastic Quad Flat Pack
QFN LCC
Quad Flat No Leads Package Leadless Chip Carrier
c. Ball Grid Array (BGA)
◦ Lead (Pb)
◦ Mercury (Hg)
◦ Cadmium (Cd)
◦ Hexavalent chromium (Cr6+)
◦ Polybrominated biphenyls (PBB)
◦ Polybrominated diphenyl ether (PBDE)
◦ Bis(2-ethylhexyl) phthalate (DEHP)
◦ Butyl benzyl phthalate (BBP)
◦ Dibutyl phthalate (DBP)
◦ Diisobutyl phthalate (DIBP)
18
In 1975, he
updated his
prediction to
once every 18-
24 months.
Miniaturization size of
transistor from 10µm
(micron) to submicron.
Nowadays, the smallest
transistor is 45nm
(0.045µm).
1947-1950 Transistor 1 -
1951 -1960 Discrete Component 1 FET, Diode
Silicon Germanium
the most widely used type of used in many early devices from
semiconductor material. radar detection diodes to the first
transistors.
Type of components Active and passive Passive (Resistor & Active and passive
Capacitor)
MOS BiCMOS
PMOS
NMOS
CMOS
VMOS
NPN PNP
Cross section and Symbol Cross section and Symbol
Advantages Of BJT:
i. High switching speed
ii. High durability
iii. High power handling capability
Disadvantages Of BJT:
i. High power dissipation
ii. Large chip size
iii. Temperature sensitive
MOS transistor is known as MOSFET (metal oxide
semiconductor field-effect transistor).
MOSFET is widely used nowadays in electronic
equipment, e.g. mobile phone, computer, medical
electronic equipment, etc.
Examples of MOS technology are:
i. PMOS
ii. NMOS
iii. CMOS
iv. VMOS
PMOS Cross Section PMOS Symbol
+ +
P P
D
BiCMOS is the acronym of bipolar complementary
metal oxide semiconductor , the technology that
combines BJT and CMOS on the same chip to
generate high speed and high concentration circuit.
MOS Advantage Disadvantage
Transistor
Types
i. Low fabrication cost. i. Low circuit performance (slow).
PMOS ii. Simple fabrication method. This is because the hole current mobility
is two times slower than electron.
Mixed signal IC
-IC that contains both
digital and analogue
circuits on the same
Digital chip.
Linear / Analog -Mixed Signal – often
Integrated circuits that operate with
Integrated circuits that operate with used to convert
digital signal at the input and output –
analogue signal at the input and analogue signal to
Discrete square wave signal
output - continuous sine wave signal . digital signal so that
Examples:
Examples: digital devices can
i. Logic gates
i. Op-Amp
ii. Flip-flop process the signal.
ii. Power Amplifier -Example : cell phone
iii. Counter
iii. Multiplier IC, portable
iv. Calculator chips
iv. Comparator technologies ADC.
v. Memory
v. Voltage Regulator
vi. Microprocessor