Lab 1: To Generate Layout For CMOS Inverter Circuit and Simulate It For Verification
Lab 1: To Generate Layout For CMOS Inverter Circuit and Simulate It For Verification
VLSI
LABORATORY
• SCHEMATIC
• LAYOUT DESIGN
• DRC
• LAYOUT Vs SCHEMATIC
• PARASITIC EXTRACTION
• POST LAYOUT SIMULTION
List of Experiments
1. To generate layout for CMOS Inverter circuit and simulate it for verification.
2. To prepare layout for given logic function and verify it with simulations.
3. Introduction to programmable devices (FPGA, CPLD), Hardware Description
Language (VHDL), and the use programming tool.
4. Implementation of basic logic gates and its testing.
5. Implementation of adder circuits and its testing.
6. Implementation of J-K and D Flip Flops and its testing.
7. Implementation 4 to 1 multiplexer and its testing.
8. Implementation of 3 to 8 decoder and its testing.
9. Implementation of sequential adder and its testing.
10. Implementation of BCD counter and its testing.
11. Simulation of CMOS Inverter using SPICE for transfer characteristic.
12. Simulation and verification of two input CMOS NOR gate using SPICE.
13. Introduction to Block Diagram Mathod
14. Design of digital Logic using block diagram.
Project
• Mini Project: VHDL/Verilog based mini project
with emphasis on design and implementation
into the group of maximum 3 students.
Design Abstraction Levels
SYSTEM
MODULE
+
GATE
CIRCUIT
DEVICE
G
S D
n+ n+
Microwind
• Microwind is a tool for designing and
simulating circuits at layout level. The tool
features full editing facilities (copy, cut, past,
duplicate, move), various views (MOS
characteristics, 2D cross section, 3D process
viewer), and an analog simulator
Tools from Microwind
• Microwind
• DSCH
• Microwind3 Editor
• Microwind 2D viewer
• Microwind 3D viewer
• Microwind analog simulator
• Microwind tutorial on MOS devices
• View of Silicon Atoms
Getting Microwind
• Go to the website
http://www.microwind.net/document
• Download the freeware version of the
microwind
• Unzip the files in a Folder
Microwind Downloads
INTRODUCTION THE TOOL
User-friendly and intuitive design
tool for educational use.
Layout
library
The student draws the masks of Editing icons
the circuit layout and performs One dot on the 2D, 3D views
analog simulation grid is 5
lambda, or Simulation
0.175 µm Access to
simulation properties
Palette of layers
Active technology
Ion current
List of model
parameters
for BSIM4
Voltage
cursors
Memory effect due to
source capacitance
Our Approach
MOS DEVICE 1.
Traditional teaching : in-depth
explanation of the potentials, 2.
fields, threshold voltage, and
eventually the expression of the
current Ids
Our approach : step-by-step illustration
of the most important
relationships between layout and
performance.
1. Design of the MOS
2. I/V Simulation
3. 2D view
4. Time domain analysis
3.
4.
Feature Size
• Chips are specified with set of masks
• Minimum dimensions of masks determine transistor
size (and hence speed, cost, and power)
• Feature size f = distance between source and drain
• Set by minimum width of polysilicon
• Feature size improves 30% every 3 years or so
• Normalize for feature size when describing design
Rules
• E.g. λ = 0.090 μm in 0.180 μm process
Layout design rules:
For complex processes, it becomes difficult to
understand the intricacies of the fabrication
process and interpret different photo masks.
They act as interface between the circuit designer
and the process engineer.
Microwind Environment
Menu Command
2D 3D Views
Simulation Properties
Palette of Layers
Work Area
Active Layers
Current Technology
Design Rules
N- Well
r 101 r 102
N - Well
r201 Minimum N+ and P+ diffusion width 4λ
r 201 P+ Diff
N - Well
r 201 N+ Diff
r202 Between two P+ and N+ diffusions 4λ
r 202
P+ Diff
N - Well
r 202
N+ Diff
r203 Extra N-well after P+ diffusion 6λ
r 203
P+ Diff
r 203
N - Well
N+ Diff
r204 Between N+ diffusion and n-well 6λ
P+ Diff
N - Well
r 204
N+ Diff
r210 Minimum diffusion area 16λ2
r 210 P+ Diff
N - Well
r 210 N+ Diff
r301 Polysilicon Width 2λ
Polysilicon
r 301
P+ Diff
N - Well
Polysilicon
r 301
N+ Diff
r302 Polysilicon gate on Diffusion 2λ
Polysilicon
r 302
P+ Diff
N - Well
Polysilicon
r 302
N+ Diff
r307 Extra Polysilicon surrounding Diffusion 3λ
Polysilicon
r 307
P+ Diff
r 307
N - Well
Polysilicon
r 307
N+ Diff
r 307
r304 Between two Polysilicon boxes 3λ
Polysilicon
r 304
P+ Diff
N - Well
Polysilicon
r 304
N+ Diff
r307 Diffusion after Polysilicon 4λ
Polysilicon
r 307 r 307
P+ Diff
N - Well
Polysilicon
r 307 r 307
N+ Diff
r401 Contact width 2λ
Contact
r 401
Polysilicon Contact
Metal/Polysilicon Contact
r404 Extra Poly surrounding contact 1λ
Contact
r 404 r 404
Polysilicon Contact
Metal/Polysilicon Contact
r405 Extra metal surrounding contact 1λ
Contact
Polysilicon Contact
Metal/Polysilicon Contact
r 405 r 405
r403 Extra diffusion surrounding contact 1λ
Polysilicon
r 403
P+ Diff
N - Well
Polysilicon
r 403
N+ Diff
r501 Between two Metals 4λ
Metal 1 Metal 4
r 501
Metal 2 Metal 5
r 501
Metal 3 Metal 6
r510 Minimum Metal area 16λ2
Metal 1 Metal 4
r 510 r 510
Metal 2 Metal 5
r 510 r 510
Metal 3 Metal 6
r 510 r 510
Step 1: Select Foundary
Step 2: Select Foundary
Step 3: n+ Diffussion
Step 4: Polysilicon
Step 5: n+diff and Metal Contact
• This Completes nMOS design