Stick Diagram

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STICK DIAGRAM

EMT251
Schematic vs Layout
VDD

VDD

M2
In Out

M1

Out
In

Inverter circuit

GND
Schematic vs Layout
VDD 2-input NAND gate
VDD

B
A B

Out
A

GND
Stick Diagram
 A stick diagram is a graphical view of a
layout.
 Does show all components/vias (except
possibly tub ties), relative placement.
 Does not show exact placement, transistor
sizes, wire lengths, wire widths, tub
boundaries.
Stick Diagram
 Represents relative positions of transistors
 Stick diagrams help plan layout quickly
 Need not be to scale
 Draw with color pencils or dry-erase markers

VDD VDD

Inverter
NAND2

Out Out

In A B
GND GND
Stick Diagram

Layers
Metal (BLUE)
Polysilicion (RED )
N-Diffusion (Green)
P-Diffusion (Brown)
Contact / Via
How to design?
Logic Graph / Euler Path
X PUN
A
j C
B C

X i VDD
X = C • (A + B)
C
i B j A

A B
PDN
A GND
B
C
Stick Diagram of C • (A + B)
A C B A B C

VDD VDD

X X

GND GND
Consistent Euler Path

X i VDD

B j A

GND A B C
Example
X PUN
A C

B D D C

X VDD
X = (A+B)•(C+D)

C D
B A

A B PDN
A GND
B
C
D
LAYOUT DESIGN
RULES
EMT251
3D View
Design Rules
 Interface between designer and process
engineer
 Guidelines for constructing process masks
 Unit dimension: Minimum line width
scalable design rules: lambda
parameter
absolute dimensions (micron rules)
CMOS Process Layers
Layer Color Representation

Well (p,n) Yellow


Active Area (n+,p+) Green
Select (p+,n+) Green
Polysilicon Red
Metal1 Blue
Metal2 Magenta
Contact To Poly Black
Contact To Diffusion Black
Via Black
Layers in 0.25 m CMOS process
Intra-Layer Design Rules
Same Potential Different Potential

9 2
0
Well or Polysilicon
6
10 2
3 3
Active Metal1
Contact
or Via 2
3 Hole 3
2 2 4
Metal2
Select

3
Transistor Layout
Transistor

3 2

5
Vias and Contacts
2
4
Via
1 1
5
Metal to
Metal to 1 Poly Contact
Active Contact 3 2

2
2
Select Layer
2
Select
3
2

1
3 3

2 5

Well
Substrate
CMOS Inverter Layout

GND In VDD

Out

(a) Layout

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