Top Down Method Photolithography Basics

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TOP DOWN METHOD

PHOTOLITHOGRAPHY
BASICS
LITOGRAFI DALAM PROSES TOP-DOWN -
DASAR-DASAR

Tujuan Pembelajaran
Untuk menentukan litografi
Untuk mengidentifikasi kebutuhan untuk litografi
Untuk menjelaskan proses litografi pada umumnya
Untuk menentukan keterbatasan proses fotolitografi saat ini di
top-down nanomanufacturing
WHAT IS LITHOGRAPHY?
Lithography is a process that uses focused radiant energy and chemical films that are
affected by this energy to create precise temporary patterns in silicon wafers or
other materials.
Lithography is an important part of the top- down manufacturing process, since these
temporary patterns can be used to add or remove material from a given area
WHAT IS LITHOGRAPHY (2)?
Lithography is one of the 4 major processes in the top-down model
 Lithography
 Etching
 Deposition
 Doping

In order to perform the other 3 processes, we must precisely define where to do


them
 Lithography Does This!
LITHOGRAPHY’S KEY ROLE IN THE
PROCESS

With multiple etch, deposition, and doping processes taking place in the fabrication
of a device, the lithography process is repeated many times.
The precision and accuracy of lithography in the manufacturing process controls,
to a first degree, the success in building a device.
OVERVIEW OF THE PHOTOLITHOGRAPHY PROCESS

Photolithography uses light energy


passing through a patterned mask
The light is focused onto the
photosensitive surface
Chemical changes in the surface
coating occur
Subsequent chemical
development creates a
temporary pattern on the surface.

From MATEC Module 40


STEPS IN THE LITHOGRAPHY PROCESS

Silicon wafers are


commonly used
substrates in the top- down
process.
The first step is to coat the
clean surface of the wafer with
a light sensitive chemical
emulsion known as
photoresist Photoresist Dispensing (Spinners)
(MATEC Module 40)
STEPS IN THE LITHOGRAPHY PROCESS

Baking the resist causes it to


form a solid layer.
The chemical properties of the
photoresist define what
wavelengths of light will
affect it.

Photoresist Dispensing (Spinners)


LANGKAH-LANGKAH DALAM PROSES LITOGRAFI (2)

A photomask, typically made


of quartz with a chrome Exposure
plating controls where
the radiant energy will
strike the photoresist.
Photomasks can be made
with electron beam
patterning tools to create fine
features
praktik Pertanyaan

1. Tentukan litografi.
Seni dan ilmu mendefinisikan pola fitur pada wafer.
2. Bagaimana fotografi dan photolithography
serupa?
Kedua proses melibatkan mengekspos gambar ke permukaan
diolah secara kimia. Kedua proses melibatkan menyimpan
bahan kimia di permukaan, mengekspos permukaan untuk
cahaya, dan mengembangkan permukaan untuk
mengungkapkan gambar.
3. Apa tujuan dari photolithography?
Untuk menentukan pola fitur pada wafer dalam persiapan
untuk diproses lebih lanjut.
STEPS IN THE LITHOGRAPHY PROCESS(3) - EXPOSURE

Exposure
Exposure of the
photoresist to the radiant
energy pattern occurs next
There are several ways to do
this
 Contact/proximity printing
 Projection printing (shown
here)
 Projection scanning
HUBUNGI PERCETAKAN

topeng adalah langsung bersentuhan


dengan wafer
Keuntungan
 Sederhana
 Biaya rendah

kekurangan
 Miskin untuk fitur kecil
 Kerusakan masker dapat terjadi dari kontak
 Cacat dari kontaminan masker atau wafer
karena permukaan menghubungi

Dari MATEC Modul 40


PROXIMITY PRINTING

The mask is above the wafer surface


Advantages
 Mask damage is minimal
 Good registration possible

Disadvantages
 Poorer resolution due to distance
from the surface
 Defects from contaminants on mask or
wafer due to contacting surfaces
 Diffraction errors
PROYEKSI PRINTING (1)

Sistem optik memfokuskan sumber cahaya


dan mengurangi gambar topeng untuk
paparan di permukaan
Keuntungan
 resolusi yang lebih tinggi
 sistem lensa mengurangi kesalahan difraksi

kekurangan
 Kesalahan karena fokus dari sistem lensa
dapat terjadi
 faktor pembatas dalam resolusi dapat
disebabkan oleh sistem optik

Dari MATEC Modul 40


PROYEKSI PERCETAKAN (2)

Langkah dan ulangi aligner


 pengurangan lensa
 throughput yang baik tetapi resolusi
terbatas sekitar 0,35 uM

Sistem Cadiotropic
Cermin, lipat prisma dan lensa
rasio 1: 1
Kurang umum daripada
steppers

Dari MATEC Modul 40


LANGKAH DAN SCAN ALIGNER

Menggunakan cermin bulat dan pola


pemindaian
Keuntungan
 peningkatan throughput yang
 sistem lensa penyimpangan
diminimalkan

kekurangan
 sistem gerak yang kompleks diperlukan
untuk keselarasan dan tracing yang
tepat
 Sumber panjang gelombang cahaya
masih merupakan faktor pembatas
ukuran fitur
DIFRAKSI

Sebagai ukuran fitur menyusut


dalam topeng, panjang
gelombang cahaya yang
digunakan sebagai sumber
menjadi faktor.
Menyusut ukuran fitur
memerlukan panjang gelombang
yang lebih pendek dari cahaya
photoresist harus dioptimalkan
untuk mencocokkan sumber
cahaya yang digunakan. Dari MATEC Modul 40
ULTRAVIOLET SOURCES

The traditional mercury vapor


lamp has peaks in certain
ranges.
The intensity of some UV
peaks is low
photoresist harus dioptimalkan
untuk mencocokkan sumber
cahaya yang digunakan.

Dari MATEC Modul 40


Practice Questions

1. Which process puts the mask on the wafer?


Contact lithography.
2. What effect creates a “haze” around a mask
pattern when feature sizes become smaller?
Diffraction

3. Which process uses a lens to reduce mask


feature sizes?
Projection Lithography
4. Besides wavelength, what limits feature sizes?
Numerical Aperture of the lens
REFERENCE
Author’s Note: Significant portions of this work have been reproduced and/or
adapted with permission from material created by the Maricopa Advanced
Technology Education Center, part of the Academic Affairs Division, Maricopa
Community College District.
NaMCATE

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