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Future Trends in Microelectronics: Technological University of Philippines College of Engineering

Moore's law predicted that the number of transistors on integrated circuits would double every 12-18 months. While geometric scaling has ended, various techniques have been used to continue increasing transistor density, such as new materials and tri-gate transistors. Future trends in microelectronics include improvements in photolithography, new carbon-based materials, solving overheating issues, spintronics, quantum computing, EUV production, graphene research, and techniques like plasmon energy expansion thermometry (PEET) which allows nanometer-scale temperature mapping.

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Jenelyn Alday
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38 views15 pages

Future Trends in Microelectronics: Technological University of Philippines College of Engineering

Moore's law predicted that the number of transistors on integrated circuits would double every 12-18 months. While geometric scaling has ended, various techniques have been used to continue increasing transistor density, such as new materials and tri-gate transistors. Future trends in microelectronics include improvements in photolithography, new carbon-based materials, solving overheating issues, spintronics, quantum computing, EUV production, graphene research, and techniques like plasmon energy expansion thermometry (PEET) which allows nanometer-scale temperature mapping.

Uploaded by

Jenelyn Alday
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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Future Trends in

Microelectronics
Technological University of
Philippines
College of Engineering
Moore’s Law
 In1965, Intel co-founder Gordon
Moore made an observation that the
number of components in integrated
circuits was doubling every 12 months
or so. Moreover, that the number of
transistors per chip that resulted in the
lowest price per transistor was doubling
every 12 months.
 Problems with the original formulation of
Moore's law became apparent at an early
date. In 1975, with more empirical data
available, Gordon Moore himself updated
the law to have a doubling time of 18 - 24
months rather than the initial 12. Still, for
three decades, simple geometric scaling
steady shrinks and conformed with
Moore's prediction.
 The Semiconductor Industry Association (SIA), a
predominantly North American group founded in
1977 by five microelectronics pioneers Wilfred
Corrigan of Fairchild Semiconductor, Robert
Noyce of Intel Corporation, Jerry Sanders of
Advanced Micro Devices, Charles Sporck of
National Semiconductor Corporation and John
Welty of Motorola, started publishing roadmaps in
1992, and in 1998 the SIA joined up with similar
organizations around the world to produce the
International Technology Roadmap for
Semiconductors. The most recent roadmap was
published in 2015.
 Inthe 2000s, it was clear that this
geometric scaling was at an end, but
various technical measures were
devised to keep pace of the Moore's
law curves. At 90nm, strained silicon
was introduced; at 45nm, new
materials to increase the capacitance
of each transistor layered on the silicon
were introduced. At 22nm, tri-gate
transistors maintained the scaling.
Trends:
 Improvements in photolithography
 New material (Carbon Based)
 Solving Overheating
 Spintronics
 Quantum computing
 EUV production insertion
 Graphene Roadmap
 plasmon energy expansion thermometry,
or PEET (UCLA)
 Ferromagnetic coupling in DMS systems
(UCLA)
 Quantum computing
 The technique, called plasmon energy expansion
thermometry, or PEET, allows temperatures to be
mapped in units as small as a nanometer, a unit of
measure equal to one-billionth of a meter. This
shatters the previous record for thermal imaging
resolution, and it could eventually lead to faster
and more capable electronics. the study reveals —
at the atomic level — how heat moves along a tiny
aluminum wire that is warmed at one end.

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