3G Event Guideline
3G Event Guideline
3G Event Guideline
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 1
Key Event Assurance Service Overview
Event Preparation
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 2
Event Preparation and Contingency Plan
Pre-event In-event Post-event
• Assess resource • Check the network • Design the network • Formulate emergency • Ensure spare parts • Monitor the network in • Restore the network to its
capacities. health. adjustment plan. plans. allocation. real time. original status.
• Forecast the traffic • Analyze the resource • Adjust the network. • Perform emergency • Ensure proper delivery of • Address on-site • Summarize experience for
volume. load. drills. the project. troubleshooting. sharing.
• Analyze the network
performance. • Arrange remote expert
• Check the disaster attendance.
tolerance (DT) or
backup plans.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 3
3G CONTINGENCY FLOW 1. Execute NPT For Event
2. Activate Feature and Strategic
Optimization
UL Speed
1. Allow CS services preempt the
Improved?
network resources of PS services. 2nd
1. LDR First action to CodeAdj,
2. Optimization in Power Resource, BERateRed
Code Resource, and CE Resource 2. Speed up reselection and IRAT
Admission Algorithms CS (2D2F) to 2G
3. Reduce CPICH 3 dB until reach 5%
4. Speed up reselection and IRAT CS 1. Reduce HSUPA user to 20
(2D2F) to 2G 2. Disable HSUPA 2msTTI
END
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 4
2G AND LTE CONTINGENCY FLOW
2G 1. Execute NPT For Event
2. Activate Feature and Strategic
LTE 1. Execute NPT For Event
2. Activate Feature and Strategic
Optimization
Optimization (ex: Vamos)
Degradation
High UL
CPU Load RRC and ERAB Success
Inteference / Low
Increase Degraded <90%
UL throughput
SDCCH PDCH
TCH Blocking
Blocking Congestion
Increase intra-frequency handover 1. Disable PreAllocation
threshold to 5dB. 2. Disable downlink FSS of eNodeBs in and around the
1. Improve scheduling priority of uplink access signalling
assurance Area.
2. RBG Round Up and Adaptive to save PDCCH resouces.
3. Reduce p0 of PUSCH
3. CCE level Optimization and PDCCH Utilization
1. Change PDCH to TCH 4. Limiting PUSCH RSRP upper limit threshold
1. Add PDCH Improvement
2. Modify CRO to share the load to 4. Increasing the offset for the target SINR in PUCCH
1. Set MINRESTIMETCH to 600 to 2. Speed up PS redirection to 3G
NBR cell power control
reduce SDCCH adjusted to TCH. 5. Optimizing P0 nominal PUCCH
2. Add SDCCH channel Increasing the value of P0NominalPUCCH and Setting
PucchCloseLoopPcType to USE_P0NOMINALPUCCH
6. Increasing the interval between cyclic shifts used for the
PUCCH (DeltaShift)
END END
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 5
Event Preparation :
1. Drivetest/Walktest
2. Assessment
4. KPI Dashboard
6. Parameter/CR Fallback
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 6
1. Drive Test/Walktest for Event Preparation:
Make sure we get the right LAC and CI (serving and surrounding Cell)
Check Throughput
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 7
2. Assessment
Check Feature and License
Check Capacity
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 8
Check Feature and License
NodeB Level
DSP LICENSE Operator Index Operator Name License Identifier License Item Allocated
65535 SHARED LQW9ULCE01 UL CE Num 1024
65535 SHARED LQW9DLCE01 DL CE Num 1536
65535 SHARED LQW9HSDPA01 HSDPA Function(per NodeB) 1
65535 SHARED LQW9HDPCK01 HSDPA RRM Package 1(per NodeB) 1
65535 SHARED LQW9HDCODE01 HSDPA Code Number 90
65535 SHARED LQW9HSUPA01 HSUPA Function(per NodeB) 1
65535 SHARED LQW9HU2MS01 HSUPA 2ms TTI Function(per NodeB) 1
65535 SHARED LQW9CCPIC01 CCPIC Function(per NodeB) 1
65535 SHARED LQW9DYNCCE01 Dynamic CE Function(per NodeB) 1
65535 SHARED LQW964QAM01 DL 64QAM Function(per Cell) 6
65535 SHARED LQW9UIC01 IC Function(per Cell) 6
65535 SHARED LQW9DDC01 DC-HSDPA Function(per Cell) 6
65535 SHARED LQW9CEOVER01 CE overbooking(Per NodeB) 1
65535 SHARED LQW9CCPIC201 Control Channel Parallel Interference Cancellation (Phase 2)(Per NodeB) 1
65535 SHARED LQW9FDCDB01 Flexible Dual Carrier HSDPA Function(per NodeB) 1
65535 SHARED LQW9UTIC01 Turbo IC Function(per Cell) 6
65535 SHARED LQW9DPASPL01 HSDPA Scheduler Pool (per NodeB) 1
65535 SHARED LQW9CCPIC301 Control Channel Parallel Interference Cancellation (Phase 3)(per NodeB) 0
65535 SHARED LQW9CEEFF01 CE Efficiency Improvement for HSUPA TTI 2ms (per NodeB) 1
65535 SHARED LQW9ULSHA01 Turbo IC Phase2 (per Cell) 6
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 9
Check Feature and License
Cell Level
DSP ULOCELL
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 10
Check Feature and License
Cell Level
DSP UCELLCHK
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 11
Check Capacity
DSP BRD
DSP BRDMFRINFO
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 12
Check Capacity
DSP BBPTC
DSP BRDMFRINFO
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 13
Check Feature, License and Capacity
Template Assessment Report (Feature)
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 14
Check Feature, License and Capacity
Template Assessment Report (Capacity)
FACH Assessment
CTFC FACH1(Signaling) FACH2(Data)
0 0*168 0*360
1 1*168 0*360
2 2*168 0*360
3 0*168 1*360
- Basicly FACH&PCH use one PhyChId (PhyChId 8), if FACH congested we need to separate between PCH & FACH with add another PhyChId (PhyChId 9).
- Default FACH bandwith is 36 kbps with 4 CTFC (Calculated Transport Format Combination), then we upgrade to 72kbps by adding 3 more CTFC become 7 CTFC.
- FACH Bandwith can get by query counter “VS.CRNC.IUB.FACH.Bandwidth (byte/s)”. If value still 4500 byte it’s mean CTFC still 4 or 36kbps, then if value already 9000 byte it’s mean already 7
CTFC or 72kbps.
HUAWEI
HISILICONTECHNOLOGIES
SEMICONDUCTOR CO., LTD. Page 15
- Make sure & double cek if FACH 200 is enable/ON by checking on command UCELLALGOSWITCH.
Check Utilization (IUB,CE, Power and Code)
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 16
3. Parameter Standard Event
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 17
4. KPI Dashboard
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 18
5. Worst Cell Analysis
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 19
User
Cell Planning Method
Experience
1Mbps 500Kbps 500Kbps 30 HSDPA Users in one cell
1Mbps 12 HSDPA Users in one cell
Sample capacity dimensioning
3G Forecast Value Remarks LTE Forecast Value Remarks
Attendance 70,000 Person Attendance 70,000 Person
HSDPA Online Ratio 5,040 30% LTE Online Ratio 560 20%
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 20
3G Feature Dependency
Activity Objective Level Site Criteria Dependency
CE Efficiency Improvement for HSUPA TTI 2ms UL Capacity NodeB WBBPf/UBBPd WBBPf
Turbo IC Phase 2 UL Capacity Cell WBBPf/UBBPd WBBPf/UBBPd
HSDPA Scheduler Pool DL Capacity NodeB at least two WBBPd or WBBPf WBBPf
40 HUSPA user per cell UL Capacity Cell Cell MAX HUSPA USER number <40 WBBPf
DC-HSDPA Throughput RNC/Cell WBBPd/WBBPf/UBBPd
96 HSDPA Users per Cell Throughput Cell NA WBBPf
CE Overbooking UL Capacity RNC/NodeB WBBPb/WBBPd/WBBPf/UBBPd
HSUPA 2ms TTI UL Capacity Cell WBBPb/WBBPd/WBBPf WBBPf
HSUPA 5.74Mbps per User Throughput RNC/NodeB NA WBBPf
HSUPA UL Interference Cancellation RTWP NodeB WBBPb/WBBPd/WBBPf/UBBPd
Control Channel Parallel Interference Cancellation
RTWP NodeB WBBPb/WBBPd/WBBPf/UBBPd
(CCPIC)
Turbo IC RTWP NodeB wbbpF Board WBBPf
HSPA+ Downlink 21Mbps per User Throughput RNC/Cell NA
F3 Only(License, has F3, min 768
Flexible Dual Carrier HSDPA Throughput Cell F3 Only HSDPA User Total in all BBP board
and no WBBPb)
60 HSUPA Users per Cell UL Capacity Cell BDBH HUSPA user max more than 40
• at least 1 UBBP Board
• support inter-board IC in a BBU3900, at least one WBBPd, WBBPf, or UBBPd board
Control Channel Parallel Interference Cancellation must be configured in slot 2 or 3 as a centralized IC board with same UL group
UL Capacity Site CCPIC & CCPIC 2
(Phase 3) • support inter-board IC in a BBU3910, a UBBPd board can be configured in any slot as a
centralized IC board.
• BBU3910A does not support this feature.
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 21
3G Event Requirement For event purposed, suggestion used minimum required of WBBPf4 board &
also 40W(46dBm) RRU per cell.
JKP309HW1_DKHATASSDRMANSTP
+++ JKP309HW1_DKHATASSDRMANSTP 2015-09-08 14:36:34
O&M #132
%%/*5764551*/DSP BRDMFRINFO:CN=0,SRN=80,SN=0;%%
RETCODE = 0 Operation succeeded.
DSP BRDMFRINFO:CN=0,SRN=0,SN=2;
N_JKS760IW1_LAMPSITESTREETGALERYPIM3GIW
+++ C_JKS597IW1_LAMPSITEGANDARIACITYMALL1 2016-05-25 13:01:46
O&M #7709
%%/*63333643*/DSP BRDMFRINFO:CN=0,SRN=0,SN=2;%%
RETCODE = 0 Operation succeeded.
DSP BBPTC:CN=0,SRN=0;
N_JKS760IW1_LAMPSITESTREETGALERYPIM3GIW
+++ C_JKS597IW1_LAMPSITEGANDARIACITYMALL1 2016-05-25 13:01:47
O&M #7711
%%/*63333669*/DSP BBPTC:CN=0,SRN=0;%%
RETCODE = 0 Operation succeeded.
0 0 2 {UMTS: Cell=12; Uplink CE R99 and HSUPA=1024; Downlink R99 CE=1024; HSDPA Capacity=180; LTE(FDD): Cell=6; RRC Connected User=3600; LTE(TDD): Cell=6; RRC Connected User=3600; GSM: GSM Trx=48}
0 0 3
HUAWEI {UMTS: Cell=12;
HISILICON Uplink CE R99 and HSUPA=1024;
TECHNOLOGIES
SEMICONDUCTOR CO., LTD.Downlink R99 CE=1024; HSDPA Capacity=180; LTE(FDD): Cell=6; RRC Connected User=3600; LTE(TDD): Cell=6; RRCPage 22 User=3600; GSM: GSM Trx=48}
Connected
(Number of results = 2)
HUAWEI TECHNOLOGIES
HISILICON CO., LTD.
SEMICONDUCTOR Page 23