Electronics Cooling Final Presentation
Electronics Cooling Final Presentation
Electronics Cooling Final Presentation
Presented
By
V Manoj Kumar
Roll No : s1058705
PhD Scholar (Yuan Ze University, Taiwan)
1.INTRODUCTION
2.ABSTRACT
2.LITERATURE PRESENTATION
3.METHODOLOGY
4.RESULTS
5.CONCLUSIONS
6.REFERENCES
Heat Sink
Heat sink transfers thermal energy from a higher
temperature device to a lower temperature fluid
medium.
Forced convective heat transfer with extended
surfaces is commonly used to cool electronic
devices.
CONVECTION
Convective heat transfer, often referred to simply
as convection, is the transfer of heat from one place
to another by the movement of fluids. Convection is
usually the dominant form of heat transfer in liquids
and gases.
(a) Surface temperature distribution of circular heat sink in C, (b) side view of air flow velocity profile over circular
heat sink in m/s, (c) top view of air flow velocity profile over circular heat sink in m/s and (d) top view of streamline
patterns