Corrosion and Control
Corrosion and Control
CORROSION
and its CONTROL
CORROSION AND ITS
CONTROL
DEFINITION
Corrosion is defined as the gradual destruction
of metals or alloys by the chemical or
electrochemical reaction with its environment.
CONSEQUENCES OF CORROSION
Due to formation of corrosion product over the
machinery, the efficiency of the machine gets lost.
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NATURE OF OXIDE FILM
Exposed surface
Unstable Metal Oxide
+ O2 Metal oxide
Metal Metal
Metal decomposes Metal +O2
Of air
+ O2 Metal oxide
Metal
Metal volatalizes Metal
Of air
Further Attack
through pores
& cracks continues
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Pilling-Bedworth ratio (P-B ratio)
The P-B ratio, in corrosion of metals, is the ratio of the
volume of a metal oxide to the volume of the metal
exposed (from which the oxide is created).
The P-B ratio is defined as:
n - number of atoms of metal per RPB > 2 : the oxide layer chips off provides no
one molecule of the oxide protective effect (ex. Fe)
2H+ + 2e- H2
Thus the metal ions (from anodic part) and non-metallic ions
(from cathodic part ) diffuse towards each other through
conduction medium and form a corrosion product between
anode and cathode.
a) Hydrogen evolution type corrosion
Metals have negative reduction potential
i.e., below hydrogen reduction potential
value in the electrochemical series get
dissolved in acidic solution with
simultaneous liberation of hydrogen
gas.
ions.
Fe2+ + 2OH- Fe(OH)2 22
Chemical Corrosion Electrochemical Corrosion
It occurs only in dry condition It occurs in the presence of
moisture or electrolyte
It is due to the direct chemical It is due to the set up of a
attack of the metal by the large number of cathodic and
environment anodic areas (Cell)
Even a homogeneous metal Hetergeneous surface or
surface gets corroded bimetallic contact is required
for corrosion
Corrosion products Corrosion occurs at the anode,
accumulate in the same place, while products formed
where corrosion occurs. elsewhere
Chemical corrosion is self- It is continuous process
controlled
It follows adsorption It follows electrochemical
mechanism reaction
Eg. Formation of mild scale on Eg. Rusting of iron in moist 23
iron surface atmosphere
TYPES OF ELECTROCHEMICAL CORROSION
GALVANIC CORROSION
Control measures:
Avoid unfavorable area effect
Selection of metals & alloys
Insulating dissimilar metals
Using inhibitors
Applying cathodic protection
DIFFERENTIAL AERATION CORROSION
This type of corrosion occurs when a metal is
exposed to varying concentration of oxygen or
any electrolyte on the surface of the base metal.
Example
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(a) Pitting Corrosion
Example
The area covered by the drop of H2O acts as an anode due to less
O2 conc., and suffers corrosion.
At anode
Iron is oxidized to Fe2+ ions (Fe Fe2+ +2e-)
At cathode
Oxygen is converted to OH- ions. (1/2 O2 +H2O +2e- 2OH-)
Net reaction is
Fe2+ +2OH- Fe(OH)2 Fe(OH)3
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This type of corrosion is called pitting.
(b) Crevice corrosion
Crevice corrosion occurs at narrow openings or spaces between two
metal surfaces or between metals and nonmetal surfaces.
A concentration cell forms with the crevice being depleted of oxygen.
This differential aeration between the crevice and the external
surface gives the crevice an anodic character. This can contribute to
a highly corrosive condition in the crevice.
This is due to less oxygen with crevice area.
The exposed areas act as the cathode.
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(d) CORROSION ON WIRE-FENCE
A wire fence in which the areas
where the wires cross are less
aerated than the rest of the fence
and hence corrosion occurs at the
wire crossings, which are anodic.
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FACTORS INFLUENCING CORROSION
The rate and extent of corrosion depends
mainly on
i. Nature of the metal
ii. Nature of the environment
Nature of the metal
A) Position in galvanic series
The extent of corrosion depends upon the position
of the metal in the galvanic series.
Greater the oxidation potential, greater is the rate
of corrosion.
When two metals are in electrical contact, the
metal higher (-) ve electrode potential in the
galvanic series becomes anodic and suffers
corrosion.
Further, the rate and severity of corrosion depends
upon the difference in their positions in the
galvanic series.
Greater the difference, faster is the corrosion of
anodic metal.
Galvanic series
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(b) Hydrogen overvoltage:
Hydrogen overvoltage is defined as the potential that
exists between a hydrogen electrode and an electrode of
Metal or alloy in the same electrolyte, at which H + ion
reduced to form H2 gas.
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(g) Stability of the Corrosion Product
If the corrosion product is soluble in the
corroding medium, the corrosion of the
metal will proceed faster.
On the other hand, if the corrosion product
is insoluble, then the protective film formed
will tend to suppress corrosion.
In the electrochemical corrosion, if the
corrosion product is soluble in the
corroding medium, then corrosion proceeds
at a faster rate.
For example: Pb forms insoluble PbSO4 when
it contact with H2SO4, the PbSO4 is protect
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Information to you:
Stannic chloride was used as a chemical weapon in World War I, 43
(A) Temperature
The rate of chemical reaction and
the rate of diffusion of ions increases
with rise in temperature
Hence, corrosion increases with
temperature.
A passive (stable) metal may become
active at a higher temperature.
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(B) Humidity
The rate of corrosion will be more, when
the humidity in the environment is high.
The moisture acts as a solvent for the
oxygen in the air to produce the
electrolyte, which is essential for setting
up a corrosion cell.
Rusting of iron increases when the
relative humidity of air reaches from
60 to 80 percent.
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(C) Effect of pH
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(D) NATURE OF THE ELECTROLYTE
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CORROSION CONTROL
The rate of corrosion can be controlled by either
modifying the metal or the environment.
-
In this method, an impressed
current is applied in the opposite
direction to nullify the corrosion
current and convert the corroding
+
metal from anode to cathode.
DEAREATION
The presence of increased amount of oxygen
is harmful and increase the corrosion rate.
Deareation involves removal of dissolved
oxygen by increase of temperature with
mechanical agitation.
It also removes dissolved CO2 of water.
In a neutral solution, the cathodic reaction is,
H2O + O2 + 2e- 2OH-(aq)
ALKALINE NEUTRALISATION
The acidic character of the corrosive
environment (due to presence of H2S, HCl, CO2,
SO2, etc) can be neutralized by spraying alkaline
neutralizers (like NH3, NaOH, lime etc).
CORROSION INHIBITORS
DEFINITION
A corrosion inhibitors is a substance which when
added in small quantities to the aqueous corrosive
environment effectively decreases the rate of
corrosion of the metal.
INTRODUCTION
Protective coatings are used to protect the
metals from corrosion.
It acts as a physical barrier between the
coated metal surface and the
environment.
They impart some special properties such
as hardness, electrical properties and
thermal insulating properties to the
protected surface.
Protective
coatings
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Metallic coatings
Anodic coating Galvanization:
It is produced by anodic coating metals (Zn, Al,
Cd) on the surface of base metal (Fe) based on
the relative negative electrode potential.
Crack Eozn = -0.76V Zn film
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Cathodic coating:
It is produced by cathodic coating metals (Sn,
Cr, Ni) on Fe surface based on the relative
positive electrode potential of coat metal.
Crac
k
Sn
film
EoSn =
Steel (or) Fe EoFe = -0.14V
-0.44V
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Methods of application of thick metallic coating
Galvanizin
Hot dipping g
Tinning
Metal cladding
Electroplating Cu, Cr, Ni, Au, Ag
Cementation
Vacuum metalizing
Metal spraying
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1. Hot Dipping
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Galvanizing:
Fe or steel is coated with a thin coat of Zn by immersing in
molten Zn to prevent rusting.
NH4Cl flux to
avoid ZnO
formation
Annealing
chamber
250oC
Hot air
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Tinning:
In this process tin is coated over mild steel sheets immersed in molten
tin (Sn).
After coating, the sheet is passed through palm oil to protect from
oxidation
It is used for the coating of steel, Cu and brass sheets that store food
stuffs.
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Process of Tinning
Palm oil
Molten ZnCl2 avoids SnO2 Tinned
formation Steel
Sheet
Steel sheet
Hot rollers
Dil. H2SO4 at
60 90oC
Palm oil
Molten Sn
Acid Pickling
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2. Metal Cladding
corrosion
3. ELECTROPLATING
PRINCIPLE
THEORY
If the anode is made of coating metal itself
in the electrolytic cell, during electrolysis,
the concentration of electrolytic bath
remains unaltered, since the metal ions
deposited from the bath on cathode are
replenished continuously by the reaction of
free anions with the anode. 81
Objectives of electroplating:
Uses of electroplating:
(i) It is often used in electronic industries for
making printed circuit boards, edge connectors,
semiconductor lead-out connection
(ii) It is also used in the manufacture of jewelry,
refrigerator, electric iron etc.
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Electroplating of Cu
On passing current:
Cu + SO42- CuSO4 + 2e- (at anode)
Cu2+ + 2e- Cu (at cathode)
Due to common ion effect, the ionization rate of Cu2+ is controlled and the
deposition process can also be controlled, with a current density of 0.5 83
to 1.5
ampere/dm2.
Electroplating
process
1. CuSO4 Cu2+ + SO42- (At cathode, reduction process)
DC battery
Cu
(Anode) Steel object
+ ve Cu2+ (cathode) (-ve)
Cu2+
Cu2+ SO42-
Cu
deposited
surface
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Factors affecting electroplating
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Thin-Film Coatings
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Deposition techniques
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ION IMPLANTATION
Ion implantation in which ions of a
material can be implanted into
another solid.
Accelerat
or
Ion source
Energies of 1 10 keV is
used to penetrate only few substrat
nanometers of the surface
e
Target 91
chambe
Deposition by Physical Vapour Deposition (PVD)
H2 = 50 sccm
N2 = 15 sccm
Sccm = standard cubic centimeter per minute
Standard condition:Temp : 0 C, Pressure :1.013 bar / 1 atm / 14.69 psi
PVD Chamber
Substrate
Ni film
Heater
Suction
N2
Ni Source valve
(or) 2000oC
H2
To vacuum
pump 92
02/23/17 19:48 92
Nanotechnology
Electron Beam Physical Vapor
Deposition or EBPVD
Tungsten filament is heated electrically.
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In an EBPVD system, the deposition chamber is evacuated to a
pressure of 10-4 Torr.
The material to be evaporated is in the form of ingots.
There are as many as six electron guns, each having a power from tens
to hundreds of kW.
Electron beams can be generated by thermionic emission, field electron
emission or the anodic arc method.
The generated electron beam is accelerated to a high kinetic energy
and focused towards the ingot.
When the accelerating voltage is between 20 kV 25 kV and the beam
current is a few amperes, 85% of the kinetic energy of the electrons is
converted into thermal energy as the beam bombards the surface of
the ingot.
The surface temperature of the ingot increases resulting in the
formation of a liquid melt. Although some of incident electron energy
is lost in the excitation of X-rays and secondary emission, the liquid
ingot material evaporates under vacuum.
The ingot itself is enclosed in a copper crucible, which is cooled by
water circulation. The level of molten liquid pool on the surface of the
ingot is kept constant by vertical displacement of the ingot. The
number of ingot feeders depends upon the material to be deposited. 95
The evaporation rate may be of the order of 10 g/cm sec.
-2 2
Chemical Vapour deposition
process
CVD involves the formation of a solid film on a surface of a heated substrate by
CVD involves the formation of a solid film on a surface of a heated substrate by
means of a chemical reaction in a gas (or in the vapour) phase.
The complex molecule in the vapour state impinges on the hot substrate,
decomposes and forms a thin film. These reactions are promoted by
resistance, RF or infrared radiation heating.
Example: Monds Process
150C
Ni(CO)4 Ni + 4CO
Step 4: Once the deposition is over, the next step is the analysis
of coated thin-films by various techniques. Analysis of thin-films
can be thought of as the final stage process of monitoring but it
is important in all steps of thin-film deposition. 97
Deposition by Chemical Vapour Deposition
(CVD)
H2 = 50 sccm
N2 = 15 sccm
Ni film
Substrate
Pre
Vap Heater
Suction
N2
Solid valve
comple (or)
x
H2
source
400oC To vacuum
pump 98
02/23/17 19:48 Nanotechnology 98
CVD Mechanism
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Preliminary step
-cleaning Solid, liquid, Stages during
Source
vapour, gas thin-film process
Supply rate
vacuum, fluid,
Transport
plasma
Uniformity
Substrate condition
Deposition Reactivity of source material
Energy input
Annealing
Process modification
100
Process of making thin film and further..
H 3C H CH3
C N O C Characterisation
HC Ni CH CVD
C O N C
H 3C H CH3
As deposited
film on Si
Ni complex substrate SEM Image Ni film at 500oC