Power Igbt
Power Igbt
Silicon Dioxide
Metal
IEPNP
ICNPN
IBNPN
ICPNP
VCC
Leakage Current
Both transistors are OFF
IENPN
IRBE
VCC
NPN Transistor
becomes forward
biased at the BE,
drawing current
from the Base of
the PNP transistor.
RMOD
PNP
electrons
NPN
RBE
Induced Channel
Follows an SCR
characteristic
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11
12
13
14
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Cut-off region
Saturation region
Active region
I) IGBT is a hybrid device which combines the advantages of MOSFET and BJT.
ii) An IGBT is formed by adding a p+ collector layer on the drain drift layer of a Power
MOSFET.
(ii) Punch through IGBT has a thin n+ buffer layer between the p+ collector layer and n-drain
drift layer. They have significantly lower conduction loss.
(iii) The IGBT cell structure embeds a parasitic thyristor in it. Latching up of this thyristor is
prevented by special structuring of the body region and increasing the effectiveness of the
body shorting.
(iv) From the operational point of view an IGBT is a voltage controlled bipolar device.
Characteristics Features
Modes of operation
POWER IGBT
Advantages
Disadvantages
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SUMMARY
1. IGBT is a hybrid device which combines the advantages of MOSFET and BJT.
2. An IGBT is formed by adding a p+ collector layer on the drain drift layer of a Power
MOSFET.
3. Punch through IGBT has a thin n+ buffer layer between the p+ collector layer and ndrain drift layer. They have significantly lower conduction loss.
4. The IGBT cell structure embeds a parasitic thyristor in it. Latching up of this thyristor is
prevented by special structuring of the body region and increasing the effectiveness of the
body shorting.
5. From the operational point of view an IGBT is a voltage controlled bipolar device.
6. The operational equivalent circuit of an IGBT has an n channel MOSFET driving a p-n-p
BJT.
7. Like other semiconductor devices on IGBT can also operate in the cut off active and
saturation regions.
8. When the gate-emitter voltage of an IGBT is below threshold it operates in the cut off
region.
9. For a given load resistance the operating point of an IGBT can be moved from cut off to
saturation through the active region by increasing the gate-emitter voltage.
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