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How To Avoid EMC Problems in PCB Design

EMC refers to the ability of electronic devices to operate properly in their electromagnetic environment without interfering with other devices. There are three main ways to minimize EMI in PCB design: 1) reducing emissions from signal generators, 2) altering coupling paths between generators and receptors, and 3) improving receptors' immunity. Some key guidelines for EMC-compliant PCB design include using ground and power planes, segregating analog/digital components, properly terminating clock signals, adding decoupling capacitors, shielding, and minimizing crosstalk between traces. Following these guidelines can help ensure electronic devices meet EMC standards and avoid electromagnetic interference issues.

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Chaitali Choudhary
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436 views

How To Avoid EMC Problems in PCB Design

EMC refers to the ability of electronic devices to operate properly in their electromagnetic environment without interfering with other devices. There are three main ways to minimize EMI in PCB design: 1) reducing emissions from signal generators, 2) altering coupling paths between generators and receptors, and 3) improving receptors' immunity. Some key guidelines for EMC-compliant PCB design include using ground and power planes, segregating analog/digital components, properly terminating clock signals, adding decoupling capacitors, shielding, and minimizing crosstalk between traces. Following these guidelines can help ensure electronic devices meet EMC standards and avoid electromagnetic interference issues.

Uploaded by

Chaitali Choudhary
Copyright
© © All Rights Reserved
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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How to Avoid EMC Problems in PCB Design?

EMC Basics
EMC Definition
the ability of devices and systems to operate in their
electromagnetic environment without impairing their
functions

Main elements to EMC


Emissions:
The EMI emissions refer to the generation of unwanted
electromagnetic energy.
These need to be reduced below certain acceptable
limits to ensure they do not cause any disruption to
other equipment.

Susceptibility & immunity:


The susceptibility of an item of electronics to EMI is the
way it reacts to unwanted electromagnetic energy.
The aim of the design of the circuit is to ensure a

Elements of Electromagnetic
interference
A generator is an E/E device
that produces EMI
A receptor is an E/E device
that receives or couples in
EMI
A coupling path allows EMI
from the generator to
produce an undesired
response in the receptor

Three Main Ways to


Minimize
EMI
Reducing the noise from the generator

reducing the generator circuit area


using slower digital logic
reducing the circuit current
filtering, and/or shielding.

Altering the coupling path


moving the receptor away from the generator
or shielding the receptor or generator
Improving the immunity of the receptor
reducing the receptor circuit area
using less susceptible electronic components
changing the impedance of the circuit

Guidelines to address EMC issues


during the PCB design
The following guidelines will describe how hardware
engineers can address EMC issues during the PCB design
1. Ground planes
2. Component Segregation
3. Board Layers
4. Digital Circuits
5. Clock Termination
6. Analog Circuits
7. Decoupling Capacitors
8. Cables
9. Crosstalk
10. Shielding

1.Ground Planes
Maximizing the ground area
on a PCB reduces the
inductance of ground in the
system, which in turn
reduces electromagnetic
emissions and crosstalk.
A poor PCB design is one
where components are
connected randomly to
ground points.
A recommended design
approach is to have a full
ground plane because it

2.Component Segregation
Components on the PCB need
to be grouped according to
their functionality, such as
analog, digital, power supply
sections, low-speed circuits,
high-speed circuits, and so on.
The tracks for each group
should stay in their designated
area
For a signal to flow from one
subsystem to another, a filter
should be used at subsystem
boundaries.

3.Board Layers
If more than two layers are
used, then one complete
layer should be used as a
ground plane.
The layer below the ground
layer should be used as a
power plane.
If a complete layer of
ground is not possible, then
ground grids should be
used.
If a separate power plane is
not used, then ground

4.Digital Circuits
Traces connecting clock and
high speed signals should be
kept as short as possible and
be adjacent to the ground
plane to keep radiation and
crosstalk under control.
These signals must also be
kept away from the power
plane since they can induce
noise on the power plane as
well.
The crystal should also be
kept close to the appropriate
chips.

5.Clock Termination
Traces carrying clock signals
from a source to a device
must have matching
terminations because
whenever there is an
impedance mismatch, a part
of the signal gets reflected.
There are multiple forms of
effective termination,
including source
termination, end
termination, ac termination,
etc

6.Analog Circuits
Traces carrying analog signals
should be kept away from
high-speed or switching
signals and must always be
guarded with a ground signal.
A low-pass filter should
always be used to get rid of
high-frequency noise coupled
from surrounding analog
traces.
The ground plane of analog
and digital subsystems should
not be shared.

7.Decoupling Capacitor
A decoupling capacitor
provides a low-impedance
path for high-frequency
current on the power
plane to ground.
This path should be kept
to a minimum possible
level by placing a
decoupling capacitor very
close to the IC
Multiple capacitors with
low ESL (equivalent series
inductance) should be

8.Cables
Cables carrying digital
signals act as efficient
antenna
Using a twisted-pair cable
helps keep coupling to a
low level by cancelling any
induced magnetic fields
When a ribbon cable is
used, multiple ground
return paths must be
provided
For high-frequency signals,
shielded cable must be
used, where the shielding
is connected to ground

9.Crosstalk
Crosstalk is a function of
mutual inductance &
mutual capacitance
Crosstalk caused by
mutual inductance is
typically larger than the
crosstalk caused by
mutual capacitance.
Mutual inductance can
be reduced by
increasing the spacing
between the two traces
or by reducing the

10.Shielding
A mechanical approach to
reducing EMC
Shield reduces the size of
loop antennas by
absorbing and reflecting
a part of their radiation.
A shield also reduces the
EMI by attenuating both
the E-field and H-field
component of radiating
wave.

Thank You

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