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Vlsi Design, Test and Manufacturability: Kalasalingam University-Tessolve

The document discusses VLSI design, test, and manufacturability. It describes the VLSI design and test flow from behavioral description to gate-level design to layout. It also discusses logic and physical design for testability techniques. Manufacturing topics covered include parameter extraction, test pattern generation, fault coverage, and test application. The importance of testing integrated circuits is explained due to decreasing feature sizes and probability of defects. Types of testing at different stages of the design and manufacturing flow are also summarized.

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sivapothi
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92 views21 pages

Vlsi Design, Test and Manufacturability: Kalasalingam University-Tessolve

The document discusses VLSI design, test, and manufacturability. It describes the VLSI design and test flow from behavioral description to gate-level design to layout. It also discusses logic and physical design for testability techniques. Manufacturing topics covered include parameter extraction, test pattern generation, fault coverage, and test application. The importance of testing integrated circuits is explained due to decreasing feature sizes and probability of defects. Types of testing at different stages of the design and manufacturing flow are also summarized.

Uploaded by

sivapothi
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
You are on page 1/ 21

VLSI DESIGN ,TEST AND

MANUFACTURABILITY
KALASALINGAM UNIVERSITY- TESSOLVE

Kalasalingam Academy of Research and


Education

4/12/16

VLSI Design, Test & Manufacturability Flow


Behavioural
Description

Gate

Behavioral
DFT
Synthesis

Technology
Mapping
Layout

RTL Description

Libraries

Parameter
Extraction

Logic
DFT
Synthesis

Libraries
Manufacturing

Gate Description
Product
Test Pattern
Generation

low

Fault
Coverage?

Test Application
high

Kalasalingam Academy of Research and


Education

Good Product

4/12/16

Introduction
Integrated Circuits (ICs) have

grown in size and complexity


since the late 1950s
Small Scale Integration (SSI)
Medium Scale Integration (MSI)
Large Scale Integration (LSI)
Very Large Scale Integration (VLSI)

Moores

Law: scale of ICs


doubles every 18 months
Growing size and complexity poses

many and new testing challenges

Kalasalingam Academy of Research and


Education

VLSI
M LSI

S
S S
I I

4/12/16

Importance of Testing
Moores

Law results from decreasing feature size


(dimensions)
from 10s of m to 10s of nm for transistors and
interconnecting wires
Operating frequencies have increased from 100KHz to
several GHz
Decreasing feature size increases probability of defects
during manufacturing process
A single faulty transistor or wire results in faulty IC
Testing required to guarantee fault-free products

Kalasalingam Academy of Research and


Education

4/12/16

Basic Concept of Testing


Testing: To tell whether a circuit is good or bad
VDD

0
0

0
0

0/
1

Related fields
Verification: To verify the correctness of a design
Diagnosis: To tell the faulty site.
Reliability: To tell whether a good system will work

correctly or not after some time.

Debug: To find the faulty site and try to eliminate the fault.
5

Kalasalingam Academy of Research and


Education

4/12/16

Why Testing?
Economics!
Reduce test cost (enhance profit)
Automatic test equipment (ATE) is extremely
expensive
Shorten time-to-market
Market dominating or sharing
Guarantee IC quality and reliability

Rule of Ten:

Defects detected in Cost


Wafer
0.01 0.1
Packaged chip
0.1 1
Board
1 10
System
10 100
100 1000
Kalasalingam AcademyField
of Research and

Cost to detect faulty


IC increases by an
order of magnitude

Education

4/12/16

Principle of Testing
Input Patterns
-1011
11-00
-0-101--0
0-101

Stored
Correct
Response

Output Response
Circuit
under
Test
(CUT)

1-001
0011-1101
100101-11

Comparator
Test Result

Testing typically consists of


Applying set of test stimuli (input patterns, test vectors) to

inputs of circuit under test (CUT), and


Analyzing output responses
The quality of the tested circuits will depend upon the
thoroughness of the test vectors
7

Kalasalingam Academy of Research and


Education

4/12/16

Types of Testing
Verification testing, characterization testing
Verifies correctness of design and correctness of test
procedure
May require correction of either or both
Manufacturing testing
Factory testing of all manufactured chips for parametric
and logic faults, and analog specifications
Burn-in or stress testing
Acceptance testing (incoming inspection)
User (customer) tests purchased parts to ensure quality

Kalasalingam Academy of Research and


Education

4/12/16

How to do testing
From designers point of view:
Circuit modeling
Fault modeling

Modeling

Logic simulation
Fault simulation
Test generation

Automatic Test Pattern


Generator(ATPG)

Design for test


Built-in self test

Testable design

Synthesis for testability


9

Kalasalingam Academy of Research and


Education

4/12/16

Wafer Yield (Chip Yield, Yield)


Good Chip
Faulty Chip
Defects
Wafer

Wafer yield = 12/22 = 0.55


10

Kalasalingam Academy of Research and


Education

Wafer yield = 17/22 = 0.77


4/12/16

Testing and Quality


IC
Fabrication

Shipped Parts
Testing
Yield:
Fraction of
good parts

Rejects

Quality:
Defective parts
per million (DPM)

Quality of shipped parts is a function of yield Y and

the test (fault) coverage T


Defect level (DL, reject rate in textbook): fraction of

shipped parts that are defective

11

Kalasalingam Academy of Research and


Education

4/12/16

12

Kalasalingam Academy of Research and


Education

4/12/16

Wafer Testing
Wafer testing is a step performed during semiconductor device

fabrication.
The wafer testing is performed by a piece of test equipment called a
wafer prober. The process of wafer testing can be referred to in several
ways: Wafer Final Test (WFT), Electronic Die Sort (EDS) and Circuit
Probe (CP) are probably the most common.
In-line Parametric Test (a.k.a. wafer electrical test, WET)
In-line test structure
In-line test type
In-line test data explain
In-line test equipment

13

Kalasalingam Academy of Research and


Education

4/12/16

Probe Testing
Wafer probes: Most manufacturers provide wafers already probed to a set of DC
parameters at room temperature to ensure they meet a basic subset of the package-part
specification.
Cold probe testing: Using the latest test equipment and facilities, we are able to eliminate
moisture and ice formation by probing wafers in a dry precision-controlled environment
that lets us analyze die performance under simulated conditions as cold as -65C.
Hot probe testing: The capacity of semiconductors to operate problem-free under adverse
high-temperature conditions is critically important for many high-reliability applications,
especially in the military, aerospace and medical industries. To ensure that components
meet those stringent standards, we can run wafer-probe tests to identify and select those
bare die that perform reliably under high temperatures, even up to 200C.During the tests,
each die is data-logged and characterized.

14

Kalasalingam Academy of Research and


Education

4/12/16

Die Testing

15

Kalasalingam Academy of Research and


Education

4/12/16

16

Kalasalingam Academy of Research and


Education

4/12/16

ASSEMBLY AND PACKAGING

17

Kalasalingam Academy of Research and


Education

4/12/16

18

Kalasalingam Academy of Research and


Education

4/12/16

Kalasalingam University(KLU)- Tessolve

M.Tech. VLSI Design, Testing & Manufacturability(VDTM)


I & II Semester KLU
III Semester: First Half- KLU; Second Half- Tessolve
IV Semester Tessolve

On successful completion of all the semesters, Tessolve


will recruit candidates based on academic performance and
performance in the Technical/Personal interview.

19

Candidates with valid GATE score- Given preference towards Admission

While studying the programme, Stipend will be provided for the meritious students

Kalasalingam Academy of Research and


Education

4/12/16

QUERIES?
20

Kalasalingam Academy of Research and


Education

4/12/16

KALASALINGAM UNIVERSITY
KALASALINGAM
TESSOLVE SEMICONDUCTOR
UNIVERSITY
PVT.LTD

21

Thank you

Kalasalingam Academy of Research and


Education

4/12/16

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