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Integrated Circuits

An integrated circuit (IC) contains both active and passive electronic components fabricated on a single chip of silicon. J.S. Kilby developed the first IC in 1958, and Robert Noyce soon fabricated the first complete IC with interconnections on a single chip. ICs can be classified based on their structure, such as monolithic, thick film, thin film, and hybrid/multichip ICs, or based on their function as linear or digital circuits. Modern ICs can contain millions of components and are widely used in computers and electronic devices due to their small size, low cost, high reliability, and low power consumption.

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Kyle Turco
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208 views22 pages

Integrated Circuits

An integrated circuit (IC) contains both active and passive electronic components fabricated on a single chip of silicon. J.S. Kilby developed the first IC in 1958, and Robert Noyce soon fabricated the first complete IC with interconnections on a single chip. ICs can be classified based on their structure, such as monolithic, thick film, thin film, and hybrid/multichip ICs, or based on their function as linear or digital circuits. Modern ICs can contain millions of components and are widely used in computers and electronic devices due to their small size, low cost, high reliability, and low power consumption.

Uploaded by

Kyle Turco
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PPT, PDF, TXT or read online on Scribd
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WHAT IS AN INTEGRATED

CIRCUIT?
An IC is complete electronic circuit in

which both the active & passive


components are fabricated on a tiny single
chip of SILICON.
Active components are those components
which are able to produce gain.
Passive components are those components
which do not have this ability.

HISTORY
Tremendous changes in

Electronic circuitry starts after


the invention of Triode by L.D
Forest in 1907.
Invention of Transistor in 1948
by W.H Bardeen & I.Bardeen
electronic circuit became
reduced in size.
In early 1960 field of
microelectronic born to meet
the requirement of Military.

CONTD
J.S Kilby was first

person who develop


IC.
Soon after Robert
Noyce fabricate a
complete IC including
interconnection on
single chip.

SCALE OF
INTEGRATION
SSI small scale

integration
MSI medium scale
integration
LSI large scale
integration
VLSI very large scale
integration
ULSI ultra large scale
integration
GSI giga scale
integration

CIRCUITS PER CHIP


SSI < 12 (No. of comp.less than 50)
MSI 12 99 (No. of comp. 50 5000)
LSI 100 9999 (No. of comp. 5000 100000)
VLSI 10000 99999 (No. of comp. 100000

1000000)
ULSI 100000 999999 (No. of comp. 1000000
10000000)
GSI >1000000 (No. of comp. 100000000)

CLASSIFICATION OF ICs
On structure basis
On function basis

ON STRUCTURE BASIS
MONOLITHIC INTEGRATED CIRCUITS
THICK & THIN FILM INTEGRATED

CIRCUITS
HYBRID / MULTICHIP INTEGRATED
CIRCUITS

MONOLLITHIC IC
The word monolithic means SINGLE

STONE or more appropriately Single


solid structure.
In this all circuit all components are
fabricated within single continuous piece of
silicon crystalline material called WAFER
or SUBSTRATE

ADVANTAGES &
DISADVANTAGES OF
MONOLITHIC ICs

These have advantage of lower cost and

high reliability.
However they have poor isolation between
the components, short range of passive
components, no flexibility of circuit design.
INDUCTORS cannot be fabricated.

THICK & THIN FILM IC


The difference between between thick &

thin film are not their relative thickness but


method of depositing film.
These ICs are not formed within single
silicon wafer but surface of an insulating
substrate such as glass or ceramic materials.
Only passive components are formed
through thick or thin film.

THIN FILM IC
Such circuits are constructed by depositing

film of conducting material through a mask


on the surface of substrate made of glass or
ceramic.
Following methods are used to produce thin
film.
VACUUM EVAPORATION
CATHODE SPUTTERING

THICK FILM IC
These are printed thin film circuits.
Silk screen printing techniques are

employed to create the desired circuit


pattern on the surface of substrate

ADVANTAGES &
DISADVANTAGES OF FILM
ICs

These have advantages of forming passive

components of broader range.


High tolerance
Isolation is better
Better high frequency performance.

CONTD
Not able to fabricate active components
Comparatively higher cost
Larger physical size

HYBRID IC
These ICs are formed either by

interconnecting a number of individual


chips or by combination of film &
monolithic ICs
They have chief advantage high flexibility
but too much expensive for mass production
and least reliability.

ON FUNCTION BASIS
LINEAR
DIGITAL

LINEAR ICs (LICs)


These also referred as Analog IC.
They possess much high reliability
Their use is much less as compared to

digital and mostly used in military and


industrial application

USE OF LICs
Operational amp.

Small signal amp.

Power amp.

RF & IF amp.

Microwave amp.

Multipliers

Voltage comparators

Voltage regulators

DIGITAL ICs
About 80% of IC market has been captured

by digital IC which is mostly used in


computer IC
Digital IC contain circuits whose input and
output voltages are limited to 2 possible
level high and low

USES OF DIGITAL ICs


Digital circuits

Calculator chips

Flip flops

Memory chips

Counters

Microprocessors

Clock chips

ADVANTAGES OF ICs
Extremely small physical

size
Very small weight
Reduced cost
Extremely high reliability
Increased response time &
speed
Low power consumption
Easy replacement
Higher yield

DRAWBACK OF ICs
Coils & inductors cannot be fabricated
ICs function are fairly low voltage
They handle only limited amount of power
They are quite delicate and cannot

withstand rough handling or excessive heat

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