LM 117-33 (ST 111733)
LM 117-33 (ST 111733)
LM 117-33 (ST 111733)
June 2004
Features
n Available in 1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable Versions n Space Saving SOT-223 and LLP Packages n Current Limiting and Thermal Protection n Output Current 800mA n Line Regulation 0.2% (Max) n Load Regulation 0.4% (Max) n Temperature Range LM1117 0C to 125C LM1117I 40C to 125C
Applications
n n n n n 2.85V Model for SCSI-2 Active Termination Post Regulator for Switching DC/DC Converter High Efficiency Linear Regulators Battery Charger Battery Powered Instrumentation
Typical Application
Active Terminator for SCSI-2 Bus
10091905
10091928
DS100919
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LM1117/LM1117I
Ordering Information
Package 3-lead SOT-223 Temperature Range 0C to +125C Part Number LM1117MPX-ADJ LM1117MPX-1.8 LM1117MPX-2.5 LM1117MPX-2.85 LM1117MPX-3.3 LM1117MPX-5.0 40C to +125C LM1117IMPX-ADJ LM1117IMPX-3.3 LM1117IMPX-5.0 3-lead TO-220 0C to +125C LM1117T-ADJ LM1117T-1.8 LM1117T-2.5 LM1117T-2.85 LM1117T-3.3 LM1117T-5.0 3-lead TO-252 0C to +125C LM1117DTX-ADJ LM1117DTX-1.8 LM1117DTX-2.5 LM1117DTX-2.85 LM1117DTX-3.3 LM1117DTX-5.0 40C to +125C LM1117IDTX-ADJ LM1117IDTX-3.3 LM1117IDTX-5.0 8-lead LLP 0C to +125C LM1117LDX-ADJ LM1117LDX-1.8 LM1117LDX-2.5 LM1117LDX-2.85 LM1117LDX-3.3 LM1117LDX-5.0 40C to 125C LM1117ILDX-ADJ LM1117ILDX-3.3 LM1117ILDX-5.0 TO-263 0C to +125C LM1117SX-ADJ LM1117SX-2.85 LM1117SX-3.3 LM1117SX-5.0 Packaging Marking N03A N12A N13A N04A N05A N06A N03B N05B N06B LM1117T-ADJ LM1117T-1.8 LM1117T-2.5 LM1117T-2.85 LM1117T-3.3 LM1117T-5.0 LM1117DT-ADJ LM1117DT-1.8 LM1117DT-2.5 LM1117DT-2.85 LM1117DT-3.3 LM1117DT-5.0 LM1117IDT-ADJ LM1117IDT-3.3 LM1117IDT-5.0 1117ADJ 1117-18 1117-25 1117-28 1117-33 1117-50 1117IAD 1117I33 1117I50 LM1117SADJ LM1117S2.85 LM1117S3.3 LM1117S5.0 Transport Media Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Rails Rails Rails Rails Rails Rails Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel TS3B LDC08A TD03B T03B NSC Drawing MP04A
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LM1117/LM1117I
Block Diagram
10091901
Connection Diagrams
SOT-223
TO-263
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Top View
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Top View
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TO-220
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When using the LLP package Pins 2, 3 & 4 must be connected together and Pins 5, 6 & 7 must be connected together
Top View
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Top View
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LM1117/LM1117I
V V
VOUT
Output Voltage
1.782 1.746 2.475 2.450 2.820 2.790 2.790 3.267 3.235 4.950 4.900
1.800 1.800 2.500 2.500 2.850 2.850 2.850 3.300 3.300 5.000 5.000 0.035 1 1
1.818 1.854 2.525 2.550 2.880 2.910 2.910 3.333 3.365 5.050 5.100 0.2 6 6
V V V V V V V V V V V % mV mV
1 1 1
6 6 10
mV mV mV
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LM1117/LM1117I
(Continued) Typicals and limits appearing in normal type apply for TJ = 25C. Limits appearing in Boldface type apply over the entire junction temperature range for operation, 0C to 125C. Parameter Load Regulation (Note 6) Conditions LM1117-ADJ VIN-VOUT = 3V, 10 IOUT 800mA LM1117-1.8 VIN = 3.2V, 0 IOUT 800mA LM1117-2.5 VIN = 3.9V, 0 IOUT 800mA LM1117-2.85 VIN = 4.25V, 0 IOUT 800mA LM1117-3.3 VIN = 4.75V, 0 IOUT 800mA LM1117-5.0 VIN = 6.5V, 0 IOUT 800mA Min (Note 5) Typ (Note 4) 0.2 1 1 Max (Note 5) 0.4 10 10 Units
Symbol VOUT
% mV mV
mV mV mV V V V mA mA mA mA
VIN-V OUT
Dropout Voltage (Note 7) Current Limit Minimum Load Current (Note 8) Quiescent Current
IOUT = 100mA IOUT = 500mA IOUT = 800mA VIN-VOUT = 5V, TJ = 25C LM1117-ADJ VIN = 15V LM1117-1.8 VIN 15V LM1117-2.5 VIN 15V LM1117-2.85 VIN 10V LM1117-3.3 VIN 15V LM1117-5.0 VIN 15V
ILIMIT
5 5 5 0.01 60 75 60
10 10 10 0.1
mA mA mA %/W dB
Thermal Regulation Ripple Regulation Adjust Pin Current Adjust Pin Current Change Temperature Stability Long Term Stability RMS Output Noise Thermal Resistance Junction-to-Case Thermal Resistance Junction-to-Ambient (No air flow)
TA = 25C, 30ms Pulse fRIPPLE =1 20Hz, VIN-VOUT = 3V VRIPPLE = 1VPP 10 IOUT 800mA, 1.4V VIN-VOUT 10V TA = 125C, 1000Hrs (% of VOUT), 10Hz f 10kHz 3-Lead SOT-223 3-Lead TO-220 3-Lead TO-252 3-Lead SOT-223 (No heat sink) 3-Lead TO-220 (No heat sink) 3-Lead TO-252 (Note 9) (No heat sink) 3-Lead TO-263 8-Lead LLP(Note 10)
120 5
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LM1117/LM1117I
V V
VOUT
Output Voltage
3.300 3.300 5.000 5.000 0.035 1 1 0.2 1 1 1.10 1.15 1.20 1200 1.7 5 5 0.01 75 60 0.2 0.5 0.3 0.003 15.0 10 136 92 40
3.333 3.432 5.050 5.200 0.3 10 15 0.5 15 20 1.30 1.35 1.40 1500 5 15 15 0.1
V V V V % mV mV % mV mV V V V mA mA mA mA %/W dB
120 10
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
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LM1117/LM1117I
Note 2: The maximum power dissipation is a function of TJ(max) , JA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)TA)/JA. All numbers apply for packages soldered directly into a PC board. Note 3: For testing purposes, ESD was applied using human body model, 1.5k in series with 100pF. Note 4: Typical Values represent the most likely parametric norm. Note 5: All limits are guaranteed by testing or statistical analysis. Note 6: Load and line regulation are measured at constant junction room temperature. Note 7: The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is measured when the output voltage has dropped 100mV from the nominal value obtained at VIN = VOUT +1.5V. Note 8: The minimum output current required to maintain regulation. Note 9: Minimum pad size of 0.038in2 Note 10: Thermal Performance for the LLP was obtained using JESD51-7 board with six vias and an ambient temperature of 22C. For information about improved thermal performance and power dissipation for the LLP, refer to Application Note AN-1187.
Short-Circuit Current
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10091923
Load Regulation
10091943
10091906
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LM1117/LM1117I
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10091908
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LM1117/LM1117I
(Continued)
10091911
Application Note
1.0 External Capacitors/Stability 1.1 Input Bypass Capacitor An input capacitor is recommended. A 10F tantalum on the input is a suitable input bypassing for almost all applications. 1.2 Adjust Terminal Bypass Capacitor The adjust terminal can be bypassed to ground with a bypass capacitor (CADJ) to improve ripple rejection. This bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency, the impedance of the CADJ should be less than R1 to prevent the ripple from being amplified: 1/(2*fRIPPLE*CADJ) < R1 The R1 is the resistor between the output and the adjust pin. Its value is normally in the range of 100-200. For example, with R1 = 124 and fRIPPLE = 120Hz, the CADJ should be > 11F. 1.3 Output Capacitor The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both minimum amount of capacitance and ESR (Equivalent Series Resistance). The minimum output capacitance required by the LM1117 is 10F, if a tantalum capacitor is used. Any increase of the output capacitance will merely improve the loop stability and transient response. The ESR of the output capacitor should range between 0.3 - 22. In the case of the adjustable regulator, when the CADJ is used, a larger output capacitance (22f tantalum) is required. 2.0 Output Voltage The LM1117 adjustable version develops a 1.25V reference voltage, VREF, between the output and the adjust terminal. As shown in Figure 1, this voltage is applied across resistor R1 to generate a constant current I1. The current IADJ from the adjust terminal could introduce error to the output. But since it is very small (60A) compared with the I1 and very constant with line and load changes, the error can be ignored. The constant current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level. For fixed voltage devices, R1 and R2 are integrated inside the devices.
10091917
FIGURE 1. Basic Adjustable Regulator 3.0 Load Regulation The LM1117 regulates the voltage that appears between its output and ground pins, or between its output and adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the best load regulation, a few precautions are needed. Figure 2, shows a typical application using a fixed output regulator. The Rt1 and Rt2 are the line resistances. It is obvious that the VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances. In this case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground terminal on the negative side.
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LM1117/LM1117I
Application Note
(Continued)
With an extremely large output capacitor (1000 F), and with input instantaneously shorted to ground, the regulator could be damaged. In this case, an external diode is recommended between the output and input pins to protect the regulator, as shown in Figure 4.
10091918
FIGURE 2. Typical Application using Fixed Output Regulator When the adjustable regulator is used (Figure 3), the best performance is obtained with the positive side of the resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with 0.05 resistance between the regulator and load will have a load regulation due to line resistance of 0.05 x IL. If R1 (=125) is connected near the load, the effective line resistance will be 0.05 (1+R2/R1) or in this case, it is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to provide remote ground sensing and improve load regulation.
10091915
FIGURE 4. Regulator with Protection Diode 5.0 Heatsink Requirements When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is demonstrated in Figure 5. The heat generated at the device junction flows through the die to the die attach pad, through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a heatsink. RJC (Component Variables) R CA (Application Variables)
10091919
Leadframe Size & Material Mounting Pad Size, Material, & Location No. of Conduction Pins Die Size Die Attach Material Molding Compound Size and Material Placement of Mounting Pad PCB Size & Material Traces Length & Width Adjacent Heat Sources Volume of Air Ambient Temperatue Shape of Mounting Pad
FIGURE 3. Best Load Regulation using Adjustable Output Regulator 4.0 Protection Diodes Under normal operation, the LM1117 regulators do not need any protection diode. With the adjustable device, the internal resistance between the adjust and output terminals limits the current. No diode is needed to divert the current around the regulator even with capacitor on the adjust terminal. The adjust pin can take a transient signal of 25V with respect to the output voltage without damaging the device. When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor will discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the output voltage of the regulator, and rate of decrease of VIN. In the LM1117 regulators, the internal diode between the output and input pins can withstand microsecond surge currents of 10A to 20A.
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LM1117/LM1117I
Application Note
(Continued)
The next parameter which must be calculated is the maximum allowable temperature rise, TR(max): TR(max) = TJ(max)-TA(max) where TJ(max) is the maximum allowable junction temperature (125C), and TA(max) is the maximum ambient temperature which will be encountered in the application. Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient thermal resistance (JA) can be calculated: JA = TR(max)/PD
10091937
FIGURE 5. Cross-sectional view of Integrated Circuit Mounted on a printed circuit board. Note that the case temperature is measured at the point where the leads contact with the mounting pad surface The LM1117 regulators have internal thermal shutdown to protect the device from over-heating. Under all possible operating conditions, the junction temperature of the LM1117 must be within the range of 0C to 125C. A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD , must be calculated: IIN = IL + IG PD = (VIN-VOUT)I L + VINIG Figure 6 shows the voltages and currents which are present in the circuit.
If the maximum allowable value for JA is found to be 136C/W for SOT-223 package or 79C/W for TO-220 package or 92C/W for TO-252 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for JA falls below these limits, a heatsink is required. As a design aid, Table 1 shows the value of the JA of SOT-223 and TO-252 for different heatsink area. The copper patterns that we used to measure these JAs are shown at the end of the Application Notes Section. Figure 7 and Figure 8 reflects the same test results as what are in the Table 1 Figure 9 and Figure 10 shows the maximum allowable power dissipation vs. ambient temperature for the SOT-223 and TO-252 device. Figures Figure 11 and Figure 12 shows the maximum allowable power dissipation vs. copper area (in2) for the SOT-223 and TO-252 devices. Please see AN1028 for power enhancement techniques to be used with SOT-223 and TO-252 packages. *Application Note AN-1187 discusses improved thermal performance and power dissipation for the LLP.
10091916
FIGURE 6. Power Dissipation Diagram TABLE 1. JA Different Heatsink Area Layout 1 2 3 4 5 6 7 8 9 10 11 12 13 0.0123 0.066 0.3 0.53 0.76 1 0 0 0 0 0 0.066 0.175 Copper Area Top Side (in2)* Bottom Side (in2) 0 0 0 0 0 0 0.2 0.4 0.6 0.8 1 0.066 0.175
11
Thermal Resistance (JA,C/W) SOT-223 136 123 84 75 69 66 115 98 89 82 79 125 93 (JA,C/W) TO-252 103 87 60 54 52 47 84 70 63 57 57 89 72
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LM1117/LM1117I
Application Note
Layout 14 15 16
(Continued) TABLE 1. JA Different Heatsink Area (Continued) Copper Area 0.284 0.392 0.5 0.284 0.392 0.5 83 75 70 Thermal Resistance 61 55 53
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12
LM1117/LM1117I
Application Note
(Continued)
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10091913
FIGURE 10. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252
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FIGURE 11. Maximum Allowable Power Dissipation vs. 1oz Copper Area for SOT-223
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10091935
FIGURE 9. Maximum Allowable Power Dissipation vs. Ambient Temperature for SOT-223
FIGURE 12. Maximum Allowable Power Dissipation vs. 2oz Copper Area for TO-252
13
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LM1117/LM1117I
Application Note
(Continued)
10091941
FIGURE 13. Top View of the Thermal Test Pattern in Actual Scale
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14
LM1117/LM1117I
Application Note
(Continued)
10091942
FIGURE 14. Bottom View of the Thermal Test Pattern in Actual Scale
15
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LM1117/LM1117I
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LM1117/LM1117I
(Continued)
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17
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LM1117/LM1117I
Physical Dimensions
unless otherwise noted
inches (millimeters)
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18
LM1117/LM1117I
Physical Dimensions
19
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LM1117/LM1117I
Physical Dimensions
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20
Notes
LIFE SUPPORT POLICY NATIONALS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no Banned Substances as defined in CSP-9-111S2.
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2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.