Agm 0070WT
Agm 0070WT
APPROVED BY:
( FOR CUSTOMER USE ONLY ) PCB VERSION: DATA:
SALES BY
APPROVED BY
CHECKED BY
PREPARED BY
VERSION
DATE
SUMMARY
2011.07.21
12
Contents
1. Module Classification Information 2. General Specification 3. Block Diagram 4. Electrical Characteristics 5. Absolute Maximum Ratings 6. Interface Pin Function 7. Electro-optical Characteristics 8. Contour Drawing 9. AC Characteristics 10. Data transfer order Setting 11. Register Depiction 12. LED driving conditions
3 30
2.General Specification
Parameter Screen size Display Resolution Active area Dot Pitch Pixel size Surface treatment Color Saturation (NTSC) Pixel Configuration Outline dimension Weight View Angle direction (Gray inversion) Interface Type LCD Type Color Depth Specifications 7(Diagonal) 800 RGB x 480 152.4x91.44 63.5 x 190.5 190.5 x 190.5 Anti-glare 45 RGB Vertical Stripe 165(W) x 104.44(H) x 7.09 (D) TBD 6 oclock TTL TN 262,144 Unit inch pixel mm um um % mm g ---colors
3.Block Diagram
SCAN DRIVER IC
DC/DC
INPUT CONNECTOR
LVDS INPUT/
TIMING CONTROLLER
Control-Board
SSD1963 LDO
DTAA DRIVER IC
VL
LED CONNECTOR
BACKLIGHT UNIT
4.Electrical Characteristics
4-1. ELECTRICAL CHARACTERISTICS OF LCM ITEM
Power supply for logic
SYMBOL
VDD VOH VOL VIH
CONDITION
VDD-DGND Output high voltage
MIN.
3.0 0.8VDD
TYP.
3.3
MAX.
3.6
UNIT
V
Output voltage
VDD=3.3V IAK=160mA
200
260
mA
Brightness
300.0
350.0
cd/m2
7.Electro-optical Characteristics
Definition of viewing angle Note 2: Test equipment setup: After stabilizing and leaving the panel alone at a driven temperature for 10 minutes, the measurement should be executed. Measurement should be executed in a stable, windless, and dark room. Optical specifications are measured by Topcon BM-7 luminance meter 1.0 field of view at a distance of 50cm and normal direction.
Optical measurement system setup Note 3: Definition of Response time: The response time is defined as the LCD optical switching time interval between White state and Black state. Rise time, Tr, is the time between photo detector output intensity changed from 90to 10. And fall time, Tf, is the time between photo detector output Intensity changed from10to 90.
Note 4: Definition of contrast ratio: The contrast ratio is defined as the following expression.
Note 5: White Vi = Vi50 1.5V Black Vi = Vi50 2.0V means that the analog input signal swings in phase with VCOM signal. means that the analog input signal swings out of phase with VCOM signal. The 100% transmission is defined as the transmission of LCD panel when all the input terminals of module are electrically opened. Note 6: Definition of color chromaticity (CIE 1931) Color coordinates measured at the center point of LCD Note 7: Measured at the center area of the panel when all the input terminals of LCD panel are electrically opened.
8. Contour Drawing
165.000.3 155.300.3 155.00(V A )TP 154.00(A A )TP 152.40(V A ) 84.800.3 1.43 7.15 7.30 7.80 1.45 5.200.3 2.65 2.35 1.72 6.59
TOP 48.870.3
92.44(AA)TP
93.04(VA)TP
91.44(VA)
94.300.3
L EFT
R IG H T
B O T TO M
60.05.0 61.71.0
104.440.3
5.70 7.09M A X
1 27.30 0.300.05
61.000.5 97.50
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 GND VDD NC A0 R/W E DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 CS NC NC RST NC NC
40
CON1 40 1
P0.5*31=15.500
19.5 23.6
P1.0*19=19.0
CON3
32
22
CN-FPC-20P/P1.0 (Up-Side)
94.00
3.00
CON2
20.0
43.300.5
9. AC Characteristics
Conditions: Voltage referenced to VSS VDDD, VDDPLL = 1.2V VDDIO, VDDLCD = 3.3V TA = 25C CL = 50pF (Bus/CPU Interface) CL = 0pF (LCD Panel Interface) 9.1 Clock Timing Table 9-1:Clock Input Requirements for CLK (PLL-bypass) Symbol Parameter Min Max FCLK Input Clock Frequency (CLK) 110 TCLK Input Clock period (CLK) 1/fCLK Table 9-2:Clock Input Requirements for CLK Symbol Parameter Min FCLK Input Clock Frequency (CLK) 2.5 TCLK Input Clock period (CLK) 1/fCLK
Units MHz ns
Max 50
Units MHz ns
Table 9-3:Clock Input Requirements for crystal oscillator XTAL Symbol Parameter Min Max Units FXTAL Input Clock Frequency 2.5 10 MHz TXTAL Input Clock period 1/fXTAL ns
9.2 MCU Interface Timing 9.2.1 Parallel 6800-series Interface Timing Table 9-4: Parallel 6800-series Interface Timing Characteristics (Use CS# as clock) Symbol Parameter Min Typ Max Unit fMCLK System Clock Frequency* 1 110 MHz 1/ fMCLK tMCLK System Clock Period* ns 1.5* tMCLK Control Pulse High Write 13 tPWCSH ns 3.5* tMCLK Width Read 30 1.5* tMCLK Control Pulse Low Write (next write cycle) 13 9* tMCLK tPWCSL Width ns Write (next read cycle) 80 9* tMCLK Read 80 tAS Address Setup Time 2 ns tAH Address Hold Time 2 ns tDSW Data Setup Time 4 ns tDHW Data Hold Time 1 ns tPLW Write Low Time 14 ns tPHW Write High Time 14 ns tPLWR Read Low Time 38 ns tACC Data Access Time 32 ns tDHR Output Hold time 1 ns tR Rise Time 0.5 ns tF Fall Time 0.5 ns * System Clock denotes external input clock (PLL-bypass) or internal generated clock (PLL-enabled)
Figure 9-1: Parallel 6800-series Interface Timing Diagram (Use CS# as Clock)
Table 9-5: Parallel 6800-series Interface Timing Characteristics (Use E as clock) Symbol fMCLK tMCLK Parameter Min Typ Max Unit System Clock Frequency* 1 110 MHz 1/ fMCLK System Clock Period* ns 13 Write (next write cycle) 1.5* tMCLK Control Pulse Low 9* tMCLK tPWCSH ns Write (next read cycle) 80 Width 9* tMCLK Read 80 Control Pulse High Write 13 1.5* tMCLK tPWCSL ns 3.5* tMCLK Width Read 30 tAS Address Setup Time 2 ns tAH Address Hold Time 2 ns tDSW Data Setup Time 4 ns tDHW Data Hold Time 1 ns tPLW Write Low Time 14 ns tPHW Write High Time 14 ns tPLWR Read Low Time 38 ns tACC Data Access Time 32 ns tDHR Output Hold time 1 ns tR Rise Time 0.5 ns tF Fall Time 0.5 ns * System Clock denotes external input clock (PLL-bypass) or internal generated clock (PLL-enabled) Figure9-2: Parallel 6800-series Interface Timing Diagram (Use E as Clock)
9.2.2 Parallel 8080-series Interface Timing Table 9-6: Parallel 8080-series Interface Symbol fMCLK tMCLK Parameter Min Typ Max Unit System Clock Frequency* 1 110 MHz 1/ fMCLK System Clock Period* ns Control Pulse High Write 13 1.5* tMCLK tPWCSL ns 3.5* tMCLK Width Read 30 13 Write (next write cycle) 1.5* tMCLK Control Pulse Low 9* tMCLK tPWCSH ns Write (next read cycle) 80 Width 9* tMCLK Read 80 tAS Address Setup Time 1 ns tAH Address Hold Time 2 ns tDSW Write Data Setup Time 4 ns tDHW Write Data Hold Time 1 ns tPWLW Write Low Time 12 ns tDHR Read Data Hold Time 1 ns tACC Access Time 32 ns tPWLR Read Low Time 36 ns tR Rise Time 0.5 ns tF Fall Time 0.5 ns tCS Chip select setup time 2 ns tCSH Chip select hold time to read signal 3 ns * System Clock denotes external input clock (PLL-bypass) or internal generated clock (PLL-enabled) Figure 9-3: Parallel 8080-series Interface Timing Diagram (Write Cycle)
Interface
Cycle
1st 1st
R7
R6
R5
R4
R3
R2
R1 R5
R0 R4
G7 R3
G6 R2
G5 R1
G4 R0
G3 G5
G2 G4
G1 G3
G0 G2
B7 G1
B6 G0
B5 B5
B4 B4
B3 B3
B2 B2
B1 B1
B0 B0
1st 1st
R5 R7 B7 G7
R4 R6 B6 G6
R3 R5 B5 G5
R2 R4 B4 G4
R1 R3 B3 G3 R7 G3
G5 R2 B2 G2 R6 G2
G4 R1 B1 G1 R5 G1
G3 R0 B0 G0 R4 G0 R5 G2
G2 G7 R7 B7 R3 B7 R4 G1 R7 G7 B7
G1 G6 R6 B6 R2 B6 R3 G0 R6 G6 B6
G0 G5 R5 B5 R1 B5 R2 B5 R5 G5 B5
B5 G4 R4 B4 R0 B4 R1 B4 R4 G4 B4
B4 G3 R3 B3 G7 B3 R0 B3 R3 G3 B3
B3 G2 R2 B2 G6 B2 G5 B2 R2 G2 B2
B2 G1 R1 B1 G5 B1 G4 B1 R1 G1 B1
B1 G0 R0 B0 G4 B0 G3 B0 R0 G0 B0
16 bits
12 bits
9 bits
8 bits
2nd 3rd
11 Register Depiction
Please consult the spec of SSD1963 Version 1.2
Pin 1 2 3 4
Symbol X1 Y1 X2 Y2
Function Right electrode - differential analog Bottom electrode - differential analog Left electrode differential analog Top electrode - differential analog
14.Reliability Test
WIDE TEMPERATURE RELIABILITY TEST N ITEM CONDITION O. 1 2 3 4 5 6 High Temp. Storage Low Temp. Storage High Temp. & High Humi. Storage High Temp. Operating Display Low Temp. Operating Display Thermal Shock 80 -30 60 90%RH 70 -20 240 Hrs 240 Hrs 240 Hrs 240 Hrs 240 Hrs STANDARD Appearance without defect Appearance without defect Appearance without defect Appearance without defect Appearance without defect Appearance without defect 10 cycles NOTE
Inspection Provision
1.Purpose The AGT inspection provision provides outgoing inspection provision and its expected quality level based on our outgoing inspection of AGT LCD produces.
The AGT inspection provision is applicable to the arrangement in regard to outgoing inspection and quality assurance after outgoing. 3.Technical Terms 3-1 AGT Technical Terms
4.Outgoing Inspection 4-1 Inspection Method MIL-STD-105E Level Regular inspection 4-2 Inspection Standard Major Defect Dots Solder appearance Cracks Item Opens Shorts Erroneous operation Shorts Loose Display surface cracks AQL(%) Remarks 0.4 Faults which substantially lower the practicality and the initial purpose difficult to achieve
Dimensions Minor Defect Inside the glass Polarizing plate Dots Color tone Solder appearance
External from Dimensions Black spots Scratches, foreign Matter, air bubbles, and peeling Pinhole, deformation Color unevenness Cold solder Solder projections
0.4 0.65 Faults which appear to pose almost no obstacle to the practicality, effective use, and operation
A : Zone Viewing Area B : Zone Glass Plate Outline *Inspection place to be 500 to 1000 lux illuminance uniformly without glaring. The distance between luminous source(daylight fluorescent lamp and cool white fluorescent lamp) and sample to be 30 cm to 50 cm.
*Test and measurement are performed under the following conditions, unless otherwise specified. Temperature 20 15 Humidity 65 20%R.H. Pressure 860~1060hPa(mmbar) In case of doubtful judgment, it is performed under the following conditions. Temperature 20 2 Humidity 65 5%R.H. Pressure 860~1060hPa(mmbar)
5.Specification for quality check 5-1-1 Electrical characteristics : NO. 1 2 3 4 Item Non operational Miss operating Contrast irregular Response time Criterion Fail Fail Fail Within Specified value
5-1-2 Components soldering : Should be no defective soldering such as shorting, loose terminal cold solder, peeling of printed circuit board pattern, improper mounting position, etc. 5-2 Inspection Standard for TFT panel 5-2-1 The environmental condition of inspection : The environmental condition and visual inspection shall be conducted as below. (1) Ambient temperature : 255 (2) Humidity : 25~75% RH (3) External appearance inspection shall be conducted by using a single 20W fluorescent lamp or equivalent illumination. (4) Visual inspection on the operation condition for cosmetic shall be conducted at the distance 30cm or more between the LCD panels and eyes of inspector. The viewing angle shall be 90 degreeto the front surface of display panel. (5) Ambient Illumination : 300~500 Lux for external appearance inspection. (6) Ambient Illumination : 100~200 Lux for light on inspection. 5-2-2 Inspection Criteria (1) Definition of dot defect induced from the panel inside a) The definition of dot : The size of a defective dot over 1/2 of whole dot is regarded as one defective dot b) Bright dot : Dots appear bright and unchanged in size in which LCD panel is displaying under black pattern. c) Dark dot : Dots appear dark and unchanged in size in which LCD panel is displaying under pure red, green, blue pattern. d) 2 dot adjacent = 1 pair = 2 dots Picture :
(2) Display Inspection NO. Acceptable Count Random N2 Bright Dot 2 dots adjacent N0 Dot defect Random N3 Dark Dot 2 dots adjacent N1 Total bright and dark dot N4 Functional failure (V-line/ H-line/Cross line etc.) Not allowable It's OK if mura is slight visible through 6% ND filter. (Judged Mura by limit sample if it is necessary) Newton Orbicular of interference fringes is not allowed in the optimum ring (touch contrast within the active area under viewing angle. panel) Item
NO. 1 2 3 4 5 6 7 8
Item Panel Crack Broken CF Non -lead Side of TFT Broken Lead Side of TFT Broken Corner of TFT at Lead Side Burr of TFT / CF Edge Foreign Black / White/Bright Spot Foreign Black / White/Bright Line Color irregular
Standards Not allow. It is shown in Fig.1. The broken in the area of W > 2mm is ignored, L is ignored. It is shown in Fig.2. FPC lead, electrical line or alignment mark can't be damaged. It is shown in Fig.3. FPC lead. electrical line or alignment mark can't be damaged. It is shown in Fig.4. The distance of burr from the edge of TFT / CF, W 0.3mm. It is shown in Fig.5. (1) 0.15 < D 0.5 mm, N 4 ; (2) D 0.15mm, Ignore. It is shown in Fig.6. (1) 0.05<W 0.1 mm, 0.3<L2 mm, N 4. (2) W 0.05mm and L 0.3mm Ignore. It is shown in Fig.7. Not remarkable color irregular.
Fig 1. C rack
Fig 2. w b a D =(a+b)/2 N otes 1.W :W idh 2.L engh 3.D :A verage D iam eter 4.N :C ount 5.A ll the anhle of the broken m ust be larger than 90.It is show n in F ig.8.(R >90) w L
A ctive A rea
A ctive A rea
L Fig 3. w
L ead A rea
Fig 4. w L
BM D ot A rea
BM
Fig 7.
Fig8.
R >90
Fig 5.
Fig 6.
NOTICE: SAFETY 1. If the LCD panel breaks, be careful not to get the liquid crystal to touch your skin. 2. If the liquid crystal touches your skin or clothes, please wash it off immediately by using soap and water. HANDLING 1. Avoid static electricity which can damage the CMOS LSI. 2. Do not remove the panel or frame from the module. 3. The polarizing plate of the display is very fragile. So, please handle it very carefully. 4. Do not wipe the polarizing plate with a dry cloth, as it may easily scratch the surface of plate. 5. Do not use ketonics solvent & Aromatic solvent. Use a soft cloth soaked with a cleaning naphtha solvent. STORAGE 1. Store the panel or module in a dark place where the temperature is 255 and the humidity is below 65% RH. 2. Do not place the module near organics solvents or corrosive gases. 3. Do not crush, shake, or jolt the module. TERMS OF WARRANT 1. Acceptance inspection period The period is within one month after the arrival of contracted commodity at the buyer's factory site. 2. Applicable warrant period The period is within twelve months since the date of shipping out under normal using and storage conditions.