HP Gen8 Memory
HP Gen8 Memory
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
HP SmartMemory
Authentication verifies memory qualified on HP ProLiant Gen8 servers Enables HP SmartMemory enhanced memory performance Future manageability support through HP Active Health System
LRDIMMs
Alleviates loading on the memory data bus Allows faster operation speed, higher DIMM counts: (3DPC@1066) 50% greater memory capacity 768GB: 2 socket 3DPC servers
3 Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
DDR3L 1.35V
Now standard for many ProLiant Gen8 servers SKU flexibility: DDR3L supports both 1.35V or1.5V (same performance)
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
HP SmartMemory
Unique technology introduced for ProLiant Gen8 servers that unlocks certain features only available on HP Qualified memory. ProLiant Gen8 systems are able to reliably identify and verify if loaded memory has passed HPs rigorous qualification and test processes. Ideal for customers who want assurance of buying genuine HP qualified memory, optimized on HP ProLiant and capable of future enhanced support through HP Active Health System.
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
HP SmartMemory
Reliable, performance tuned, increased manageability Provide premium and unique HP Qualified Memory features and capabilities extending value in reliability, performance, and manageability
Reliability
Performance
Manageability
Performance tested and tuned for HP ProLiant Enables future premium performance features
Simplified, intelligent and automated messaging through Active Heath Warranty verified
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
HP Development Validation
Continuous Improvement
Sourced only from Tier 1 suppliers
DRAM HP rejects get sold elsewhere Complete testing on HP servers Warranty integrated with HP server
Third Party memory, white box, other OEMs Why Buy HP Qualified Memory:
ftp://ftp.hp.com/pub/c-products/servers/options/Memory_Why_Buy_4AA0-4216ENW.pdf
8 Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Why HP?
Complete testing on every HP server platform to provide maximum compatibility, performance, and reliability. Most third-party memory vendors simply dont do this or arent capable.
HP Qualified Server Memorys stringent requirements specifies only the highest quality components from tier 1 suppliers. DRAM chips that dont meet HP standards get sold elsewhere.
Competitive price with a much higher level of reliability and compatibility with your HP server and HP server management tools Warranty and service integrated with HP ProLiant server
9 Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
LRDIMMs
Intel 2 CPU servers: 768GB: 24 slots 24x32GB quad rank
UDIMMs
Intel 2 CPU servers: 128GB: 16 slots (2DPC max) 16x8GB dual rank
32 3 DIMMs (Intel) 4
2, 4, 8 2 DIMMs (Intel) 4
Yes Yes 4
Yes No 1, 2
DRAM support
DIMM Power Lower cost
x4
x4
x8
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Load Reduction DIMMs (LRDIMMs) Reduced loading achieves 50% higher max capacity (up to 768GB)
647903-B21 HP 32GB 4Rx4 PC3L-10600L-9 Kit (1333; 4Gb)
Unbuffered with ECC DIMMs (UDIMMs); up to128GB UDIMMs offer lower latency and power consumption than RDIMMs, but are limited in capacity.
647905-B21 HP 2GB 1Rx8 PC3L-10600E-9 Kit 647907-B21 HP 4GB 2Rx8 PC3L-10600E-9 Kit 647909-B21 HP 8GB 2Rx8 PC3L-10600E-9 Kit (1333; 2Gb) (1333; 2Gb) (1333; 2Gb)
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Data Width x8 = 8 x4 = 4
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Additional resources
HP Qualified Options Page www.hp.com/go/hpqo Why HPQO? Whats New (videos, podcasts, whitepapers) Options compatibility guide, configuration tools & sizers DDR for Dummies 2nd Edition
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Thank you
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
HP SmartMemory
Authentication during OS pre-boot
HP SmartMemory authentication
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
HP SmartMemory
IML message example
Non HP SmartMemory IML Message: Processor 1, DIMM 1 could not be authenticated a genuine HP SmartMemory. Enhanced and extended HP SmartMemory features will not be active.
21 Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
For detailed memory configuration rules and guidelines, use the Online DDR3 Memory Configuration Tool: www.hp.com/go/ddr3memory-configurator
22 Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
HP SmartMemory advantages:
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DDR3-1333 1.35V RDIMM: 15-20% less power than 3rd party memory at 3DPC (rated at 1.5V) DDR3-1333 LRDIMM: 15-20% less power than 3rd party memory up to 3DPC (rated at 1.5V). DDR3-1333 UDIMM: 25% greater throughput at either 1DPC or 2DPC versus 3rd party memory (DDR3-1066)
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
For optimal performance, balance DIMMs equally across all four channels, starting farthest from the CPUs.
Population Order: 24 slot server (processor proximity varies by platform):
When one processor is installed, install DIMMs in sequential alphabetical order (A,B,C,D,E,F) and so forth. When two processors are installed, install DIMMs in sequential alphabetical order (P1-A, P2-A, P1-B, P2-B, P1-C, P2-C)
For more recommendations and guidelines visit: Online configuration tool; www.hp.com/go/ddr3memory-configurator
24 Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
For optimal performance, balance DIMMs equally across all four channels, starting farthest from the CPUs.
Population Order: 16 slot server (processor proximity varies by platform):
When one processor is installed, install DIMMs in sequential alphabetical order (A,B,C,D,E,F) and so forth. When two processors are installed, install DIMMs in sequential alphabetical order (P1-A, P2-A, P1-B, P2-B, P1-C, P2-C)
For more recommendations and guidelines visit: Online configuration tool; www.hp.com/go/ddr3memory-configurator
25 Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Ability to determine a systems vulnerability to future memory errors has remained unchanged for over 10 years
New algorithm pinpoints error that may cause uncorrectable errors and unplanned downtime For more information Technology Brief: HP Advanced Memory Error Technology http://h20000.www2.hp.com/bc/docs/support/SupportManual/c02878598/c02878598.pdf
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Lockstep
4 Yes 768GB
Intel Servers:
Online Spares
Spare rank not usable by system memory
Mirroring CPU
Ch 1 & 2 mirror each other
Ch 3 & 4 mirror each other Ch 1 & 2 operate in lockstep Ch 3 & 4 operate in lockstep
Lockstep
CPU
CPU
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
UDIMMs with ECC offer lower latency and power consumption than RDIMMs, but are more limited in capacity. Unbuffered with ECC identified with an E in the manufacturers module name (example PC3-10600E).
RDIMMs also have ECC and offer larger capacities than UDIMMs and include address parity protection. Registered identified with an R in the module manufacturers name (example PC3-10600R).
ECC indicates Error Correct Code capabilities. Can correct single bit errors. Can detect but not correct multi-bit errors. Advanced ECC allows correction of certain multi-bit errors. Speed indicates the data rate of the DRAM chips and the Memory Module that uses those chips. Current Gen8 Memory offers two base speeds;
DDR3-1066 DRAM operates at 1066 Mbits/s. A DIMM with DDR3-1066 DRAM is called PC3-8500 (1066 x 8 Bytes ~= 8500 MBytes/s) DDR3-1333 DRAM operates at 1333 Mbits/s. A DIMM with DDR3-1333 DRAM is called PC3-10600 (1333 x 8 Bytes ~=10600 MBytes/s) DDR3-1600 DRAM operates at 1600 Mbits/s. A DIMM with DDR3-1600 DRAM is called PC3-12800 (1600 x 8 Bytes ~= 12800 MBytes/s)
System realized speeds will depend on how the server is populated with memory.
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Density Describes the number of storage locations in a DRAM chip. DDR3 will launch with 1Gb and 2Gb-based DRAM. No 512Mb in DDR3. Voltage Over time, DDR3 memory will consist of three voltage ratings; Standard at G6 announce (1.5V); G7 launched with Low Voltage (1.35V). Future: Ultra Low Voltage (TBD; ~1.25V)
CAS latency Column Address Strobe latency refers to the DRAM read response time in number of bus clocks from the Column Address to the DRAM providing data on the memory bus. A lower number will yield a performance increase for most applications.
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Balanced performance
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Maximum bandwidth
1333MT/s across 8 channels (to 84.8GB/s^) Up to 2 DPC (16 DIMMs) Capacity: 256GB (w/ 16GB 2R RDIMMs at 1333MT/s) General purpose enterprise workload, virtualization OR 1600MT/s across 8 channels (to 102.4GB/s^) 2 DPC (16 DIMMs) Capacity: 256GB (w/ 16GB 2R RDIMMs at 1600MT/s) HPC technical computing
4x4GB, 4 channels =
Unbalanced performance
Base memory w/16GB
2x8GB 1600MT/s 2 channels (to 25.6GB/s^)
^ - max theoretical bandwidth #s
Ch 1
Ch 2 2x8GB
Ch 4
Ch 3
2x8GB, 2 channels =
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Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Thank you
Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.