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Avalanche Energy Specified BV 500V Fast Switching R 0.85 Simple Drive Requirements I 8.0A

This document describes the BLV840 N-channel enhancement mode power MOSFET. It provides specifications for the device including maximum ratings, thermal characteristics, electrical characteristics, typical characteristics graphs, test circuits, and waveforms. The MOSFET has a drain-source breakdown voltage of 500V, on-resistance of 0.85 ohms, and continuous drain current of 8.0 amps. It is designed for high efficiency switch mode power supplies.

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66 views6 pages

Avalanche Energy Specified BV 500V Fast Switching R 0.85 Simple Drive Requirements I 8.0A

This document describes the BLV840 N-channel enhancement mode power MOSFET. It provides specifications for the device including maximum ratings, thermal characteristics, electrical characteristics, typical characteristics graphs, test circuits, and waveforms. The MOSFET has a drain-source breakdown voltage of 500V, on-resistance of 0.85 ohms, and continuous drain current of 8.0 amps. It is designed for high efficiency switch mode power supplies.

Uploaded by

speaker_john
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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BLV840

N-channel Enhancement Mode Power MOSFET

Avalanche Energy Specified Fast Switching Simple Drive Requirements

BVDSS RDS(ON) ID

500V 0.85 8.0A

Description
This advanced high voltage MOSFET is produced using Bellings proprietary DMOS technology. Designed for high efficiency switch mode power supply.

Absolute Maximum Ratings ( TC=25oC unless otherwise noted )


Symbol VDS VGS ID IDM PD EAS IAR EAR Tj TSDG Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current ( TC=100 oC) Drain Current (pulsed) (Note 1) Power Dissipation Linear Derating Factor Single Pulsed Avalanche Energy (Note2) Avalanche Current Repetitive Avalanche Energy Operating Junction Temperature Range Storage Temperature Range Value 500 + 20 8.0 5.1 32 125 1.0 790 8.0 13 -55 to +150 -55 to +150 Units V V A A A W W/ mJ A mJ
o o

C C

Thermal Characteristics
Symbol Rth j-c Rth j-a Parameter Thermal Resistance, Junction to case Thermal Resistance, Junction to Ambient Max. Max. Value 1.0 62.5 Units / W / W

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BLV840
N-channel Enhancement Mode Power MOSFET

Electrical Characteristics ( TC=25C unless otherwise noted )


Symbol BVDSS BVDSS /TJ RDS(ON) VGS(th) g fs IDSS Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Static Drain-Source On-Resistance Gate Threshold Voltage Forward Transconductance(note3) Drain-Source Leakage Current Drain-Source Leakage Current Tc=125 Gate-Source Leakage Current Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Test Conditions VGS=0V, ID=250uA Reference to 25, ID=1mA VGS=10V, ID=4.8A VDS=VGS, ID=250uA VDS=50V, ID=4.8A VDS=500V, VGS=0V VDS=400V, VGS=0V VGS= 20V VDD=400V ID=8.0A VGS=10V note3 VDD=250V ID=8.0A RG=25 note3 VDS=25V VGS=0V f = 1MHz Min. 500 2 4.9 Typ. 0.78 14 23 49 20 1300 310 120 Max. 0.85 4 1 250 100 63 9.3 32 Units V V/ V S uA uA nA nC nC nC ns ns ns ns pF pF pF

IGSS Qg Qgs Qgd t (on) tr t (off) tf Ciss Coss Crss

Source-Drain Diode Characteristics


Symbol IS ISM VSD trr Qr r Note
(1) Repetitive Rating: Pulse width limited by maximum junction temperature

Parameter

Test Conditions

Min. -

Typ. 460 4.2

Max. 8.0 32 2.0 -

Units A A V ns uC

Continuous Source Diode Forward Current Pulsed Source Diode Forward Current (note1) Forward On Voltage Reverse Recovery Time Reverse Recovery Charge VGS=0V, IS=8.0A VGS=0V, IS=8.0A dIF/dt = 100A/us

(2) L=25mH, Ias=8.0AVdd=50VRg=25staring Tj=25C


(3) Pulse width 300 us; duty cycle 2%

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BLV840
N-channel Enhancement Mode Power MOSFET

Typical Characteristics

Fig 1. Typical Output Characteristics

Fig 2. Typical Output Characteristics

Fig 3. Normalized BVdss vs. Junction Temperature

Fig 4. Normalized On-Resistance vs. Junction Temperature

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BLV840
N-channel Enhancement Mode Power MOSFET

Typical Characteristics continued

Fig 5. On-Resistance Variation vs. Drain Current and Gate Voltage

Fig 6. Body Diode Forward Voltage Variation vs. Source Current and Temperature

Fig 7. Gate Charge Characteristics

Fig 8. Capacitance Characteristics

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BLV840
N-channel Enhancement Mode Power MOSFET

Typical Characteristics continued

Fig 9. Maximum Safe Operating Area

Fig 10. Transient Thermal Response Curve

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BLV840
N-channel Enhancement Mode Power MOSFET

Test Circuit and Waveform

Fig 11. Gate Charge Circuit

Fig 12. Gate Charge Waveform

Fig 13. Switching Time Circuit

Fig 14. Switching Time Waveform

Fig 15. Unclamped Inductive Switching Test Circuit

Fig 16. Unclamped Inductive Switching Waveforms

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