Flip-Chip Packaging Using PES (Printing Encapsulation Systems) and PES Underfill Epoxy Resin

Atsushi Noritaka Oyarna,

Okuno
Nagai,

Koichirou

and

Tsunekazu

H a sh i = i o t o

JAPAN

R E C

CO-,LTD-

5- 1

,~ - C ~ i o m e , D o u ~ h o , T a k a t s u k i - - ~ 1 t y , O s a k a , J A P A N ,
TELFAX-

8 1-726-69-523

8 1 -726-69-5230

ABSTRACT
In recentry,flip-chip this technology s t a g e of have been But very rapidly progressing a t laboratory. industry

INTRODUCTION
Q i t h t h e advance o f small size, light weight, and high f u n c t i o n ot F l e c t r o n i c s in t h e t u t u r e , MCM will spredd rdpidly. Three methods

ot

tli-chip don t progress with s a t i s f a c t o r y . Because it s packaging m a t e r i d s a r e using low viscosity Liquid type undertill epoxy resin, and pdckaging methods a r e using dispenser systems. These systems have many problems t o

ot

mounting

technology of

LSI

chips f o r MCM

a r e as follows;

1 ) Wire bonding method(W8)

This method is using wire and bond with LS1 c h i p

mass production as hllows.

( 1 ) This process needs many times t o underfill epoxy

and s u b s t r a t e using this wire. This need dround of

LS1 chip f o r wire bonding a r e a . 2) T A B method

resin tor flip-c hip.

( 2 ) This epoxy resin
to

must u w low viscositv epoxy resin

LSI,

This method

is forming bump on e l e c t r o d e of

LSI

undertill It
is

under

and tG get

it

can t

contain

much epoxv

chip and bonding t o film ledd. TAB c a n connect a t

tiller.

difficult

low

expansion

a time with many pin count and narrow pitch. But

this need extensive a r e a of mounting dnd price is expeni ive f o r using poiyimide film.
3) Flip-chip method

resin system. It occures delamindtion between L S I

drld underfill epoxy resin a t sometimes.

W e soloved t h e s e problems using our PE> process and PES epoxy resin. At the first step, we developed new type underlill

This

method

is

bonding

with

Circuit
is

board

using

facedown of L S I chip. This method

possible t o

epoxy re5in. This epoxy resins have low expansion, high purity, high adhesive strengh, high Tg, high humidity resistanLe
epoxy

connect with t h e most hiah density using only LS1 chip area.

dnd

high

electric
occured

resistdnc e.
m a t i hirig

This

iindert ill
L\I

The former packaging method o f TAB, and Transfer molding method and dispmser

WH a r e usmg
method. But

rc5in

didn't

miss

between

andboard. At t h e secondary s t e p , w e developed t h e s p w i a l P E 5 for underfill process method tor

t r a n s f e r molding

method rnust

use high expensive rnetdl

is not

die. and M C M having mdny model changing for this method. Dispenser method need

suitable potting Thrs

ot

flip-chip.

We

can
01

get

no

bubble This
+

much

underfill

pachdging

flip-c hip.

times

and

thickness of

packaging is n o t

uniform.

process is tormed of flip-chip bumping --PES printing Vacuum procebs + h e a t curing i t e s t . This process
is

don t t i t tor l a r g e volume production. W e succeed in PES(Printing Encdpsuhtion Systems) dekelopments'

h ) .

very

simple and undertill many LS1 at once time. W e c a n g e t no bubble Ilip-chip packaging and g e t high reliability tllp-chip packdging.

PES

can

solve

the

above-stated

problems a t one time. PES hdve alreddy many application results of COB and TAB.

1240

0569-5503/95/0000-1240 $3.00 1 995 IEEE '

Packaging dispensing

rnethod method.

of

flip-chip

15

using

the epoxy

former resin

A'tfer

Cu-e

Lone

p r e C u r e

zone

R e s i n

Supplier

This flows

low viscosity

/--

around LS1 with di>penser and till-up this epoxy resin a t atmosphere. lintil now, sizs o f

IC dre small and g a p

between IC and circuit board is more than i 0 0 u , and w e c-an underlill t o this gap. But under many
this

n
Vn-Loaarng C u r ! n a Oven
lair C h a m b e r

Screen Printer Loading

method It at

takes

long to This

time

to

fill

epoxy

resin in

Fig.l. PES Process

LSI.

is difficult

underfill don't fit

epoxy large

resin

LS1

time.

volume

productions. 'This must till a t atmosphere and use low viscosity rnacthing resin from and now epoxy resin only.

For

it,

this

cause

rnissepoxy if

of

exparision substrate use. This

between

LSI,

low viscosity delanrinations many

and

generate have

LSI
for

method

problems

reliability of LSI.

W e developed

low expansion

epoxy resin, and used our

PES. W e could sucess no delamination and large volume

production process tor flip-chip of LSI. W e r e p o r t e epoxy resin and PES technology in this paper.

Fig.2. Dispenser Process

EXPERIMENT
We
prepared five and underfill expansion using for epoxy resins having different original and viscosity, rpoxy high

Table 2 . Reliability Test Test PCT Humidity Test High Tem.,Storage. Thermal cycles Popcorn Test Test P a r a m e t e r s
121 Zatm, 100%RH, 200hr. 85C,t'85%RH 150t, 1,000hrs -55T t o + 150t, 500cyles 85"clX5%/168hrs+ZZ5~ Reflow

resins

dre

for flip-chip. These tor COB applications

On this time, we

have

reliability

LSI.

moditied these epoxy resin t o flip-chip applications. Properties of these epoxy resins show Table 1 .
W e used sham elements having 0.5 gape between LSl and

RESULT and CONCLUSION

is

circuit substrate. Materidl substrate Methods

IS

BT substrate.
One

ot underfill

used
IS

two

types.

rnrthod

No

Boide

Process

PES, and o t h e r method

dispenser.

W e compered with
Fig.2
Dispenser method draw slowly epoxy r e w i a r o u n d LSI with needle, and ti11 epoxy r e ~ i nunder LSI using a

PE5 and dispenser. Fig.1

shows d i spenser.

shows PF5 process, and

We
high test

performed teriiperature and

thermal ztrordge at

cycling, and

PCT, humidity

popcon test,

testing, hymidity reliability

capillary action. But this method c a n f i l l epoxq resin under

L5I
high

when

it

use low
epoxy

viscosity

resin.

But to

it

it
till

storage

high

temperatur

tor

use

viscosity

resin,

it

14

difhcult
I>

tesr. These t e s t s show Table 2.

up epoxy resin under t o fill up resin

L51 with no voide. It

difticult

with more than one thousand polse of

viscosity. This shows to l a b l e 3.

11

11 1v I3lac I<

\i

PES

method

can

underfill

high

vis(ositv

epoxy

resin

500

700 1,000 1,300 2,000 > 101' 150C

1.5

e a s i l y with Fig.1 process. As

PES use Printinn-*Vacume

pdckaginf: c a n to get hiRh produce. reliability

-Cure voide

process,
is

no

voide

No
of

1.9
3.5

1OOkg/cmL 10 . 0 6 0.3 .

very

important

21 .

25 .

3PPm 5PW

flipchip packaging. Especially a i t e r reflow process.

1.5

0.9
1241

Table 3. Voide o f PES.

Underfill

Resin a f t e r Dispenser and

High

Volurne P r o d u c t i o n __ ~ _ _ _
~

Dispenser method underfill o n e by o n e t o LSI, and drawing using

it

IS

needie

around

LSI.

It

tdke

about

many

t i m e s and

need underfill f o r 1 5 min.

But PES use printing method, arid c a n print many LSI a t

a time. Printing t i m e need about 2'isec a t 150 X 15Omrn

Possibility of low resin
size. you high epoxy and
All

packaging resin dispenser,

thickness a r e uniform.
of

But if are
dl1

expansion _____
Dispenser viscosity resin method epoxy resin large
is

epoxy

use

thicknesb

packagtngs

d i f herent. dilficult to Low underfill expansion filler,

As our PES use magazine t o magazine, a f t e r printing,

as above.
weight

vacuum?

and

curing

process

can

use

magazine,

and

contains taking The

volume

produce large volume flip-chip packaging easily. From now,

MCM

viscosity rapidly.

increasing

filler

content and

increase to

containing

Clip-chip,

TAR

and

wire

limit

of

viscosity

expansion

bonding c a n use PES, and produce l a r g e volume. Table 6 shows d i t f e r e n t of dispenser and PES method.

underfill epoxy resin a r e 1,000poise and 25ppm. It is ditticult t o dispense viscosity more than I ,000poise. The o t h e r side, as PE\ use printing machine, and high viscosity epoxy resin than 1,000poise c a n print easily on arround LSI. The limit of viscosity and expansion by

Table 6. Handling Time of Dispenser and PES.

Dispenser Handling Time
1 Smin./LSI

PES
30sec./LSI LSI Flip-chips on one

PE5 on this t i m e experiment a r e 3,000poise and Sppm.

Expansion
Miss

Sppm

is

near

to

LS1 and s u s t r a t e expansion. between small. at

LS1,

* It

board packaged using Dispenser o r PES.

o t
PES
~

is

times

When

Five

matching resin and

of

expansion are

underfill
4

epoxy these popcorn method

substrate After

Table

shows

Reliability

Method
~

relation.

l6Xhr

85C /S5%
5.

humidity, this,

arid

It's

Epoxy

Resin

test(230"C)
IS

shows

Table

From

PE3
Table 7 shows comparison of dispenser method and PES method. dispenser, PES method get higher reliability can select than high

suitable t o high density VLSI and MCM.

because

PE5

method

Table 4 . Relation of, Underfill Workability

and V i s c o s i t y

viscosityand high filler c o n t e n t epoxy resin. Water absorptions of

the

high

filler

contents

epoxy

resin epoxy

are resin.

Epoxy R e s i n

Viscosity(Poise)

500

Dispenser

II

700
1,000
2,000

1,300

0 a
X

PES

small

than

general

flip-chip

underfill

91.
0

Popcorn t e s t and t h e r m a l cycling c a n g e t good result. From this, PES hdve t h e broad selection

ot packaging

epoxy resin.

T a b l e 5 . Popcon Test a f t e r Reflow.

Table i . R p l i a b i l i t y ol Undcrlill Epoxy R e s i n .

Epoxy reLin
1

Epoxy Resin I

Popcon Test

P,CT
3 20

Huinidity

m
\

N'

63 sec

10 sec 15 sec 20 sec 35 sec

0720
0120

7/20
3/20

Thermal C y c l e s

[I
1 b \

0/20
0120
0120

0120
0120

0120

0120

Time to Popcon a t 225t a f t e r 168hrs, 85C/85%

0120

0120

0120
_______

* PCT:

12 l"c, 1 00'%RH,2001-lrs. FIumidityTest: SSLC/S5%/ 100011rs. Thermal Cycles: -55'c t o 1 SOC.

1242

CONCLUSION
W e t e s t e d comparison of reliability and large volume
production of flip-chip underfill epoxy resin when we

use dispenser method and PES method.

(I)

PES method c a n use low expansion and low w a t e r absorption epoxy resin than dispenser method.

(2) PES process can g e t no voide underfill packaging.

(3)
PES is very suitable the large size prodcutions

than dispenser method. ( 4 ) It of is possible very easily t o produce large volume flip-chip this and wire

MCM
at

packaging

contain if it use

bonding

time

PES and

low

expansion epoxy resin.

REFERENCES
[I]
A.Okuno, New Packaging ot Chip on Board by Unique Printing M e t h o d 4 1 th, ECTC,P.84 3-X47( I99 1 )

[ 21 A.Okuno,

Printing

Encapsulation

SystemdPES) of

Advanced Multichip Module & COB device 42th, ECTC, P. 18 3 - 786( I 99 2)

[ 31 A.Okuno, IEEE Transcation on Components, Hybrids,

arid Manufacturing Tec hnology, Vol. I 5, No. I , P.7 3/7( 1992)

1 4 ) A.Okuno,

IJnique

EpoxyResin

and

Printing

Encapsulation Systems(PE5) tor Advanced Multi Chip Module, TAB, COB, and Flip-chip (1YY3) IEPS, P.506-5 18,

[ 5 ) A.Okuno,

High Reliability M C M Packaging Using

Low Stress Liquid Type Epoxy Resin bv Printing

Encapsulation Systems(PE5) 44th, FCTC.P. 147- 15 I ,
( 1994)

[ 61 A.Okuno,
Mic roc irc uits

The
&

International Electronic

Journal

o f

Packaging,

Vol. 1 /,No.2.

P. 14 3 - 1 5 1 ( 1944)

1243