SMT Engineer Level Training Program

Overview
This unit is about operator (level-1) training of Surface Mount Technology PCB assembly process, which covers
the loading of bare PCB to un-loading of assembled product and its operating work details as per SMT
standards.

Unit Title (Task) Operate SMT machine

This OS unit is about the process of full surface mount technology required
for electronics product assembly.
The job responsibilities require to carry out a number of process in product
Description
manufacturing and mentioning the equipment used in the assembly process.
The individual must comply with related occupational health & safety
guidelines while carrying out the work.
Scope This unit/task covers the following:
• Working safely
• Understanding Surface Mount Technology
• Setting machines for assembling operation
1. Vacuum Loader
2. Magazine Loader
3. Un-Loader
4. Screen Printer
5. Pick & Place mounter
6. Reflow Oven
7. AOI/SPI
• Monitoring the PCBA quality
• Managing the full line assembly process
• Maintaining the SMT line machines
• Documentation

Element Element Performance Criteria

The user / individual on the job should be able to:
PC1. work safely at all times, complying with health and safety,
environmental and other relevant regulations and guidelines related to PCB
assembly.
PC2. use appropriate personal protective equipment while carrying out work
PPE: protective head covers, ESD gloves, finger coat, ESD slipper, ESD wrist
bands, aprons, eye protection glasses, first aid kit, warning signs, tapes, etc.
PC3. assess possible risks associated with the work and implement necessary
Working safely safety control measures to prevent injury to self and others
PC4. identify and work in electrostatic protected areas while working with
ESD sensitive parts
PC5. confirm that appropriate ground paths are established to reduce
electrostatic charge generation and accumulation as per relevant
occupational health and safety guidelines.
PC6. comply with electrical safety practices while handling power tools and
equipment.
PC7. verify that static control materials are used while handling assembly
parts.
 The user / individual on the job should be able to understand:
PC1. SMT technique of affixing the SMT components on the surface of PCB.
PC2. all electronics products require more functions with compact size,
hence Surface mount technology has been introduced.
Understanding Surface Mount
Technology PC3. SMT is a method for constructing electronic circuits in which the
components are mounted directly onto the surface of PCB.
PC4. growth history of SMT from 3216 size components to 0402 size
components.
PC5. important advantages and few disadvantages of this technology.
The user / individual on the job should be able to:
PC6. read and calculate the value of Surface mount devices by the part no.
SMD: Resistor, Capacitor, Inductor.
PC7. understand working of other Surface mount devices.
SMD: R-L-C, IC, BGA, Transistor, connector
PC8. recognize and differentiate the SMT defects.
Understanding Basics Defects: missing, short, tilt, excess, shift, wrong polarity, etc.
PC9. identify the different products used in SMT process.
Product Parts: PCB, Solder Paste, UV Bond, stencil mask, squeegee blade, etc.
PC10. Carried-out the incoming Quality check procedure of SMT components,
Checking the condition of material, attaching part details tag on it and store
at their defined places.
PC11. understand the 5S and ESD Measures.
The user / individual on the job should be able to understand:
PC12. different SMT line Configuration
PC13. technique of Bond + Auto Insertion line configuration
Line Configuration: Loader => Dispenser=>Mounter=>Reflow=>AOI=>Un-
loader=>VI
Types of Line Configuration PC14. technique of SMT + AI + Bond line configuration
Line Configuration: Loader => Paste
Printer=>Dispenser=>SPI=>Mounter=>Reflow=>AOI=>Un-loader=>VI
PC15. technique of SMT + SMT line configuration
Line Configuration: Loader => Paste
Printer=>SPI=>Mounter=>Reflow=>AOI=>Un-loader=>VI

Setting machine for assembling

The user / individual on the job should be able to:
operation
PC16. check the packing condition and expiry date of PCB. before loading,
clean the dust on PCB by air and load the PCB on conveyor.
1. Vacuum Loader
PC17. Follow the m/c setting procedure and verify the process of PCB supply
to screen printer.
PC18. place the magazine on the top surface of the machine input.
PC19. press POWER ON button to START the machine & click LOCK button to
2. Magazine Loader change the PITCH, make sure the pitch should not be zero.
PC20. select the Auto mode and verify the process of PCB supply to Screen
Printer from magazine loader.
PC21. check the status of previous stage (Reflow/AOI). Place the magazine on
top surface of the m/c.

3. Un-loader PC22. press POWER ON button to START the machine & click LOCK button to
change the PITCH, make sure the pitch should not be zero.
PC23. select Auto mode and verify the process of assembled PCB supply to
magazine rack.
 PC24. check the stencil is as per model & version with PCB.
PC25. Follow FIFO and expiry date of solder paste, write solder paste opening
time on solder paste container. read data sheet specification provided by
manufacturer.
PC26. set the backup pin position with backup pin position jig.
PC27. Teach the stencil position by auto teaching manual.
PC28. verify the squeegee speed, pressure and separation speed as per setup
chart.
PC29. check first 5 boards printing condition, position, height, amount of paste
and solder spread.
PC30. check auto cleaning setting as per setup chart, every 2 hours check the
paste amount and refill it.
PC31. check the PCB for defects.
4. Solder Paste Printer Defects: Missing solder, No solder, Bridge/Solder short, Shift, Spread, Mis-
print.
PC32. clean the stencil manually if line is stop for more than 20 min. Remove
all solder past on stencil by spatula and clean it by wiper paper and IPA. After
cleaning check 1 PCB and then start production.
PC33. verify that mis-print PCB are cleaned immediately with wiper paper and
IPA. Use clean PCB within 30 min.
PC34. study screen printer setup chart parameters.
Parameters: Program Name, Squeegee speed, Pressure, Snap off, cleaning
frequency, Board Size, Print gap, 2D inspection mode.
PC35. set the machine for production. Follow model changeover procedure
while changeover.
PC36 . check daily, weekly and monthly maintenance as per maintenance
check-sheet.
PC37. different types of pick and place machine and their working.
Types: Gantry type, rotary type, modular type
PC38. understand the types of fiducial mark and defects due to wrong
selection of fiducial mark.
PC39. understand the mounting procedure of rotary and gantry machine.
PC40. check the next production plan and prepare the material as per Bill of
Material (BOM).
PC41. select the mounter program and verify it as per loading sheet.
PC42. check the stencil condition, model, no. of stokes.
5. Pick and Place mounter
PC43. verify screen printer, reflow, AOI/SPI programs are ready.
PC44. load the material in feeders as per loading sheet.
PC45. fill the production report, material change report.
PC46. understand the procedures of part change, drop component use and
model changeover.
PC47 . check daily, weekly and monthly maintenance as per maintenance
check-sheet.
PC48. understand different types of reflow oven and their working
Type: IR (Infra Red) and Blower
PC49. verify the program, model and temperature setting as per setup chart.
PC50. Set the conveyor width with bare PCB
6. Reflow Oven
PC51. verify all the thermo couples are connected properly to the components
on dummy PCB
PC52. take the profile after every shift change or at the time of model change.
PC53. the temperature setting is different for glue, Pb and Pb free solder paste
PC54. use Ramp-Soak-Spike method to set temperature.
PC55. check the PCBA after soldering for defect.
Defects: Solder short, cold solder, Tombstone, solder balls and PCB warpage.
 PC56. set the temperature of reflow oven as per output defects to control
the quality of product.
PC57. understand why profile taking is necessary
PC58. practice the setting of profile as per standard profile provided by
solder paste manufacturer.
PC59. set the temperature by combing ramp and spike temperature
profile.
PC60. set the machine for production. Follow model changeover procedure
while changeover.
PC61. understand the difference of Air reflow oven and N2 reflow oven
temperature setting.
PC62. check daily, weekly and monthly maintenance as per maintenance
check-sheet.
PC63. understand that AOI is used to inspected soldered PCB while SPI is
used to check solder printing condition.
PC64. make defective library of each defect
PC65. Import the Gerber data or scan the sample PCB
PC66. teach fiducial of PCB, mark 1 and mark 2
PC67. make inspection part library Solder short, missing, shift, etc.
PC68. adjust the tolerance for the error point in program, inspect 20 PCB
Automated Optical Inspector/ Solder
PC69. verify there should not be falls call or imitation defects.
Paste Inspector machine
PC70. inform supervisor for debugging of program for falls call.
PC71. fill the report as per result and give on-time feed back to supervisor
for any defects.
PC72. check daily, weekly and monthly maintenance as per maintenance
check-sheet.
The user / individual on the job should be able to:
PC73. check quality data is controlled in PPM not in percentage.
Monitoring the PCBA quality PC74. one point means each component qty (R, L, C, IC, TR, CN, etc.) So in
SMT all data need to be controlled by each point not by PCB qty.
PC75. Avoid quality defects and achieve the highest quality standards
PC76. inform to supervisor in case of any quality accidents (defectives)
The user / individual on the job should be able to:
PC77. Monitor & manages the full line assembly process from loading bare
Managing the full line assembly PCB in loader to screen printer printing, Solder Paste Inspection, Mounting
process of SMD on PCB, Soldering in reflow oven, Soldering inspection in AOI and
un-loading of populated PCB in magazine rack.
PC78. verify defects in process and take immediate corrective action on
any accidents during process.
The user / individual on the job should be able to:
PC79. verify that there should not be any shut down of machine due to
Maintaining the SMT line machines improper maintenance
PC80. Perform regular cleaning & lubrication process and methodology as
prescribed by manufacturer of the machine
The user / individual on the job should be able to:
PC81. maintain properly all the reports like Production, Part change,
Documentation Stencil, Cleaning, Inspection etc.
PC82. Ensure that correct & accurate production qty is entered in the
report.
Knowledge and Understanding (K)
The individual on the job needs to know and understand:
KA1. Company’s policies on: incentives, delivery standards, and
personnel management
KA2. Work flow involved in assembly process of the company
A. Organizational Context KA3. importance of the individual’s role in the workflow
(Knowledge of the company /
KA4. reporting structure, inter-dependent functions, lines and
organization and its processes)
procedures in the work area
KA5. importance of working in clean and safe environment practices
and procedures
KA6. relevant people and their responsibilities within the work area
B. Technical The individual on the job needs to have:
Knowledge KB1. basic knowledge of electronics
KB2. ability to read part code of SMT material.
KB3. ability to calculate RLC value and to read their polarity
KB4. knowledge of Material handling & requirements
KB5. ability to identifying the component locations & type on PCB
KB6. ability to identify the defects
KB7. ability to take corrective action
KB8. knowledge of various parts used in PCB assembly process
KB9. basic knowledge of SMT machines
KB10. ability to perform visual inspection of the soldered PCB
KB11. ability to control material in/out flow
KB12. knowledge of 5S & ESD measures
KB13. ability to monitor entire PCB assembly process
KB14. knowledge and awareness of all safety rules, policies and
procedures, Quality standards to be followed in the process
Skills (S)
A. Core Skills/Generic Skills Reading and Writing Skills
The user/individual on the job needs to know and understand how:
SA1. to read job and specification sheet and technical writing
SA2. to use computers
SA3. to document the completed work in report
SA4. to learn SMT standard language
SA5. to read work instructions, procedures for different product models
Communication Skills
The user/individual on the job needs to know and understand how:
SA6. to effectively communicate, speak clearly and persuasively in
positive or negative situations
SA7. to listen intently to others and provide clear responses
Teamwork and some multitasking
The user/individual on the job needs to know and understand how:
SA8. To share work load as required
SA9. To deliver frame to next work process on time
B. Management Skills The user/individual on the job needs to know and understand how:
SB1. to load Program in machine
SB2. to do set the machine for production
SB3. to do Model changeover
SB4. to do maintenance of machine
C. Professional Skills Reflective thinking
The user/individual on the job needs to know and understand how:
SC1. to improve work processes
SC2. to reduce errors
Using tools and machines
The user/individual on the job needs to know and understand how:
SC3. to operate SMT machines for achieving the required outcome
SC4. to operate tools for machine maintenance
SC5. to use LCR meter for measuring component value
Critical thinking
The user/individual on the job needs to know and understand how:
SC6. To spot process disruptions and delays
SC7. To detect abnormalities in machine performance and prevent major
machine malfunctioning
SC8. To be prompt to respond to machine errors to improve product
quality and enhancement of machine performance