Operating Instructions

2D Inspection Editor

Data Generation System

NPM-DGS

Model No. NM-EJS9A

Thank you for purchasing the “Panasonic product.”

 Read the operating instructions carefully for proper and safe usage.
 Before placing the machine in service, be sure to read “Safety Precautions.”
 Store the operating instructions carefully.

N7201A394E24 (V10.03)
201711
 NPM-DGS

Original Instructions
“Use of this system:
This system is designed for the purpose of efficiently creating and managing the production data to be used for
placing electric and electronic components.
This system shall be used for this purpose only.

It shall not be used for any other purpose.”

“Operation of the machine:

The machine shall be operated by professional, specially trained operators.

It shall be operated by professional, specially trained operators.

For information regarding available training courses, please contact Panasonic Smart Factory Solutions Co., Ltd.,
Sales company or Sales agent.”

Warning
Do not operate the machine without receiving special training
Risk of injury due to improper operation.

Prohibited
●About training, conduct in your company or contact us.

For machine training in Europe,

you may contact Panasonic Industry Europe:

Panasonic Industry Europe GmbH FA Division

Robert-Koch-Strasse 100, 85521 Ottobrunn Germany
Phone number: 0049-(0)89-453541192

EJS9AE-BP-03N-09 Page 3
 NPM-DGS

 NPM-DGS User License Agreement

 This is the Agreement between the users and us related to Programming Terminal Support System
NPM-DGS. The product includes the software of the computer, relative media, (CD-ROM or floppy
disk, etc.), and the printed materials as instruction manuals.
We regard user’s installation or use of this software as their approval of the restriction based on the
terms and conditions of this Agreement. If you have any disagreement with it, please return the
software to the sales agent where you got it, before use.
The software is reserved by the Copyright Laws, International Copy Right Treaties, etc.
The software is to be permitted, but its right is not transferred to others.

 License Grant and Limitations

The users are permitted to get the following rights in this Agreement.
1. The users can install the software to the only specified computer and use.
For installing it to several computers, it is necessary to get the same number of licenses as them.
2. The software cannot be used for several computers on the same network server at the same time.
For using it for several computers, it is necessary to get the same number of licenses as them.
3. Reverse engineering, disassembling, and decompiling of the software are forbidden.
4. This Agreement also includes the license of other company’s software which is constructed in this
software.
5. The software cannot be divided for using for other computer.
6. The software is to be updated with older version one simultaneously and also used together. The
License of the software is effective in older version software, too.
(The new version software itself does not constitute the granting of the license.)
7. The software cannot be lent nor rented.
8. The License of the software shall not be to apply for lending the instruction manuals.

 Product configuration
This product is configured by the following types of software.
1. Software independently developed by Panasonic Smart Factory Solutions Company of America
and Panasonic Smart Factory Solutions Co., Ltd.
2. SharpZipLib to which GNU General Public License applies.
 Regarding software that a user license is agreed based on the above 2.
For conditions of software use, please see the URL below.
http://www.icsharpcode.net/opensource/sharpziplib/
For conditions of GNU General Public License use, see the URL below.
http://www.gnu.org/licenses/gpl.html
• This software is distributed in the hope that it will be useful by itself, but without warranty of any
kind, either express or implied, including but not limited to any warranties of “merchantability” or
“fitness for a particular purpose”.
• To acquire the source code if this software, access the URL below.
http://www.icsharpcode.net/OpenSource/SharpZipLib/Download.aspx

Page 4 EJS9AE-BP-03N-09
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 Registered trademarks and/or trademarks

Registered trademarks and/or trademarks mentioned herein are as follows.
 Microsoft, Windows, Windows Vista, Windows 7, Windows 8, Windows 8.1 and Windows 10 are
registered trademarks of Microsoft Corporation in the United States and/or other countries.
 The official name of Windows Vista is Microsoft® Windows Vista® operating system.
 The official name of Windows 7 is Microsoft® Windows® 7 operating system.
 The official name of Windows 8 is Microsoft® Windows® 8 operating system.
 The official name of Windows 8.1 is Microsoft® Windows® 8.1 operating system.
 The official name of Windows 10 is Microsoft® Windows® 10 operating system.
 The proper product name of Windows is Microsoft® Windows® operating system.
 Other product and company names mentioned herein may be either registered trademarks or
trademarks of their respective companies.

EJS9AE-BP-03N-09 Page 5
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Organization of manuals

 Organization of instruction manuals

This system includes the following manuals.
Each of those manuals is designed for the purpose of a work. Refer to a manual suit for the
purpose of a work you will perform.

Manual type Explanation

Programming manual This manual explains how to install and how to create the production data
(1/3), (2/3), (3/3) of this system.

Recognition optional data This manual explains how to create component recognition data.

This manual explains how to create each data of post-placement

2D inspection editor inspection, pre-placement inspection and inspection after printing.

This manual explains how to create the inspection data after printing by
Gerber converter using the gerber data.

SP data editor This manual explains how to create the data for a printer.

Offline Camera Unit The manual explains how to create the part recognition data and how to
(Option) perform the part recognition test using an offline camera unit.

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Wording in context

 How to read operating instructions

Description depends on the page; however, it is constructed basically as follows.

2 3
1 2.4.1 PCB Information
1 Choose [Modify]  [Edit Top Side
Panel Information] on the menu bar,
or double-click the PCB.

1
4  The <Edit Top Side Panel Information>
window opens.

 On-screen items may vary according to

5
options etc.

Explanation
 Title
 Operation step number
Corresponds to the arrow number in a red
frame on the screen.
 Actual operation
 Describes the effect produced by the
operation.
 Describes the supplementary explanation.

 Symbols used in this manual

In this manual, the following expressions and symbols are used for description.

Symbol Explanation Symbol Explanation

Shows a reference item.

Shows an operation flow.

This shows the part to be clicked on.

Screen name Shows a screen name.

[Button] Shows a button or a menu.

This shows the part to be double-clicked on. “Message” Shows a message on the screen.

‘Item’ Shows an item text on the screen.

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System requirements

 Hardware
Standards
Item Specifications Class
Main body IBM PC/AT-compatible machine Indispensable
 A desktop PC is strongly recommended.
CPU Intel® Core™ 2 Duo E6700 equivalent or greater
(If it is Ver08.00.00 or later, Intel® Core™ i5-2430
equivalent or greater is recommended)
 When AM-LNB is installed, Intel® Core™ i5-2430
equivalent or greater is necessary
Motherboard Fully compatible with IBM
Serial I/O Fully compatible with IBM
Graphics board SXGA or higher (Display color: 65536 or more)
Desktop area: 1280 x 1024 dots or higher
Memory 2 GB or more
(If it is Ver08.00.00 or later, 4 GB or higher is strongly
recommended.)
 When AM-LNB is installed, 4 GB or higher is
necessary
Internal storage 20 GB or more of available space (NTFS file system)
(If it is Ver08.00.00 or later, an empty capacity of at
least 120 GB is strongly recommended.)
 When AM-LNB is installed, an empty capacity of at
least 120 GB is necessary
Optical drive DVD drive 4x or faster
(Used for installation)
Card slot SD memory card reader (External device available) Recommended
(Necessary when loading production data with the
equipment.)
Keyboard Japanese version: 106 keyboard Indispensable
English version: 101 keyboard
Mouse Supported by your OS as standard
Monitor SXGA or higher ready
Printer Supported by your OS Recommended
PostScript-ready product recommended
Network card 100BASE-T network card Indispensable
 A network card for 1000BASE-T is recommended
for transferring inspection images of the LWS
editor.
Uninterruptible power supply Supported by your OS as standard Recommended
(UPS)

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 Software
Standards
Item Specifications Class
OS Microsoft® Windows® 10 Pro (32 bit / 64 bit version) Indispensable
Microsoft® Windows® 8.1 Pro (32 bit / 64 bit version)
Microsoft® Windows® 8 Pro (32 bit / 64 bit version)
Microsoft® Windows® 7 Professional (32 bit / 64 bit version) SP1 or
later
Microsoft® Windows Vista® Business SP2 (32 bit version) or later
Microsoft® Windows Server® 2012 (32 bit / 64 bit version)
Microsoft® Windows Server® 2012 R2 (64 bit version)
Microsoft® Windows Server® 2008 R2 SP1 (32 bit / 64 bit version) or
later
Support Language English, Chinese, Japanese
Framework Microsoft® .Net Framework 3.5
DBMS Microsoft® SQL Server® 2014 SP1 (32 bit / 64 bit version)
(Data Base Management Microsoft® SQL Server® 2012 SP1 (32 bit / 64 bit version)
System) Microsoft® SQL Server® 2008 R2 SP2 (32 bit / 64 bit version)
Java Runtime Environment Version 5 Updata 22 or later (32 bit / 64 bit version)
(JRE)
Virus check Virus Buster™ Recommended
Program version 7.0 or later

NOTICE
The hardware/OS should be prepared and installed on your own.
 Use the default settings of your OS for font, time, date, color, and others.
A sudden PC-power down may result in data losses. A proper shutdown is
necessary.

 The use environment conforms to that of your hardware.

Software names in the descriptive texts of this document will be expressed as follows;
Expression in the text Software name
Windows 10 Microsoft® Windows® 10 Pro (32 bit / 64 bit version)
Windows 8.1 Microsoft® Windows® 8.1 Pro (32 bit / 64 bit version)
Windows 8 Microsoft® Windows® 8 Pro (32 bit / 64 bit version)
Windows 7 Microsoft® Windows® 7 Professional (32 bit / 64 bit version)
SP1 or later
Windows Vista Microsoft® Windows Vista® Business SP2 or later
Windows Server 2012 Microsoft® Windows® Server® 2012 or later
Windows Server 2008 Microsoft® Windows® Server® 2008 R2 or later
.Net Framework 3.5 Microsoft® .Net Framework 3.5
SQL Server 2014 Microsoft® SQL Server® 2014 SP1 (32 bit / 64 bit version)
SQL Server 2012 Microsoft® SQL Server® 2012 SP1 (32 bit / 64 bit version)
SQL Server 2008 Microsoft® SQL Server® 2008 R2 SP2 (32 bit / 64 bit version)

EJS9AE-BP-03N-09 Page 9
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Specifications

 Basic specifications
Number of machines Maximum: 1000 machines (Number of machines registered
in the system
Maximum: 30 machines per line
Parts library Maximum: 100000 data (number of data registered in the
system)
1
Placement points Maximum: 10000 points per PCB
Maximum: 100000 points per number of PCBs allowed for
optimization (Data creation job)
2
Number of patterns (blocks) Maximum: 1000 patterns per PCB
Number of marks being set Maximum: 1000 data (number of data registered in the
system)
Maximum: 1000 points per PCB (number of bad marks being
3
set)
Number of PCBs allowed for Maximum: 64 PCBs
optimization

1: It includes placement coordinates, recognition mark coordinates bad mark coordinates
and PCB warpage measurement points.
Please consult us for the mixed line with the CM / DT machines.
2: If PCB warpage measurement is included, the maximum shall be 100 patterns per
machines.
3: Master bad marks and group marks are excluded.

 License is required per machine.

 For use environment, it complies with hardware use environment.

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2D Inspection Editor

TABLE OF CONTENTS
 Safety precautions .................................................................................................. S-1

1. 2D INSPECTION EDITOR ............................... 1-1

1.1 Outline of 2D Inspection Editor ............................................................................. 1-2
1.2 Flow of Production Data Edit ................................................................................ 1-4
1.3 Starting the 2D Inspection Editor .......................................................................... 1-7
1.4 Exiting the 2D Inspection Editor ......................................................................... 1-10
1.5 2D Inspection Editor Screen and Basic Operations ........................................... 1-11
1.6 Inspection Head and Placement Head Operation .............................................. 1-18

2. EDITING THE PRODUCTION DATA .............. 2-1

2.1 Outline of Production Data Edit ............................................................................ 2-2
2.2 Preparation for Production Data Edit .................................................................... 2-5
2.2.1 Creating and Downloading the Production Data ................................................................................. 2-5
2.2.2 Acquiring the Image of Production PCB.............................................................................................. 2-6
2.2.3 Creating Solder Inspection Data ......................................................................................................... 2-6

2.3 Loading and Saving the Production Data ............................................................. 2-7

2.4 Component Inspection Setting (Setting Inspection conditions Data) ................... 2-8
2.4.1 Setting the PCB-Common LUT ........................................................................................................... 2-8
2.4.2 Inspection Conditions Data ............................................................................................................... 2-11
2.4.3 Automatic Creation of the Inspection Conditions Initial Data ............................................................ 2-12
2.4.4 How to Copy and Create the Inspection Conditions Data................................................................. 2-20
2.4.5 Inspection Item .................................................................................................................................. 2-27
2.4.6 Setting the Inspection Details ............................................................................................................ 2-30

2.5 Checking Component Inspection........................................................................ 2-75

2.5.1 Debug Inspection (Debug Inspection Mode) ..................................................................................... 2-75
2.5.2 Foreign Matter Skip Setting during Debug Inspection ...................................................................... 2-78
2.5.3 Sample Analysis ................................................................................................................................ 2-79
2.5.4 Library Inspection .............................................................................................................................. 2-83

2.6 Setting Solder Inspection (Setting Solder Judge Library) ................................... 2-84
2.6.1 Setting LUT common to PCBs .......................................................................................................... 2-84
2.6.2 Setting Solder Judge Library ............................................................................................................. 2-87

2.7 Checking Solder Inspection ................................................................................ 2-89

2.7.1 Solder inspection (Solder inspection mode) ..................................................................................... 2-89
2.7.2 Sample Analysis ................................................................................................................................ 2-91

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2D Inspection Editor

2.8 Setting APC Conditions ...................................................................................... 2-95

2.8.1 APC Feedforward ............................................................................................................................. 2-95
2.8.2 APC Feedback ................................................................................................................................. 2-97

2.9 Land Inspection .................................................................................................. 2-98

2.10 Placement Skip Condition Setting (Placement Skip for NG Inspection) ........ 2-100

3. SETTING THE LUT ......................................... 3-1

3.1 Outline of LUT ...................................................................................................... 3-2
3.2 How to Set LUT (Binary)....................................................................................... 3-3
3.3 How to Set LUT (Multiple Values) ........................................................................ 3-5

4. DETAILS OF EDIT SCREEN .......................... 4-1

4.1 Menu Bar .............................................................................................................. 4-2
4.1.1 File (File Operation and Primary Functions)....................................................................................... 4-2
4.1.2 Edit (Data Edit) ................................................................................................................................... 4-2
4.1.3 View (Data View) ................................................................................................................................ 4-3
4.1.4 Configuration (System Configuration) ................................................................................................ 4-4
4.1.5 Maintenance (System Maintenance) .................................................................................................. 4-7
4.1.6 Help .................................................................................................................................................... 4-9

4.2 Pop-up Menu of Teach View .............................................................................. 4-10

4.2.1 Pop-up Menu with Nothing Selected ................................................................................................ 4-10
4.2.2 Pop-up Menu with PCB Selected ..................................................................................................... 4-10
4.2.3 Pop-up Menu with Scan Area Selected............................................................................................ 4-21
4.2.4 Pop-up Menu with Mark Selected .................................................................................................... 4-22
4.2.5 Pop-up Menu with Component Selected .......................................................................................... 4-22
4.2.6 Pop-up Menu with Solder Selected .................................................................................................. 4-28

4.3 Details of Lists .................................................................................................... 4-32

4.3.1 PCB List ............................................................................................................................................ 4-32
4.3.2 Mark List ........................................................................................................................................... 4-34
4.3.3 Mark Library List ............................................................................................................................... 4-34
4.3.4 Component List ................................................................................................................................ 4-35
4.3.5 Component Library List .................................................................................................................... 4-37
4.3.6 Solder List ......................................................................................................................................... 4-38
4.3.7 Solder Judge List .............................................................................................................................. 4-39

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2D Inspection Editor

5. APPENDIX ....................................................... 5-1

5.1 Lighting ................................................................................................................. 5-2
5.1.1 Outline ................................................................................................................................................. 5-2

5.2 Inspection Mechanism .......................................................................................... 5-3

5.2.1 Presence/Absence Inspection............................................................................................................. 5-3
5.2.2 Position Inspection .............................................................................................................................. 5-5
5.2.3 Inspection of Flip-over ......................................................................................................................... 5-9
5.2.4 Polarity Inspection ............................................................................................................................. 5-10
5.2.5 Foreign Body Inspection ................................................................................................................... 5-12
5.2.6 Solder Inspection...............................................................................................................................5-13

EJS9AE-CT-01R-07 Page 13
 NPM-DGS
2D Inspection Editor

= MEMO =

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Safety precautions

Safety precautions Be sure to observe

The precautions that shall be observed in order to prevent an injury to the user or the
other persons, and damage to property, are described as follows.

 The degrees of danger or injury, resulting from incorrect usage owing to failure to read an
indication, are classified and described as follows.

WARNING This indication refers to a situation which is considered that there is a

possibility of death or serious injury.

CAUTION This indication refers to a situation which is considered that there is a

possibility of only injury or physical damage.

 The matters that shall be observed are classified by the symbols shown below, and
described.
(The following are the examples of the symbols.)

This kind of symbol indicates an action that must not be carried out.

This kind of symbol indicates an action that must be carried out.

NOTICE
This part describes the precautions in using NPM-DGS.
As for the personal computer, monitor, etc., observe the precautions described in
their respective manuals.
In addition, for machine operation, see ‘Safety precautions’ described in the machine
instruction manual.

EJS9AE-SF-01N-01 Page S-1

 NPM-DGS
Safety precautions

WARNING

Use the specialized

outlet and breaker
exclusively.

Sharing between machines may

cause fire because of heat
generated.

●Check the rated power

consumption in the
Specification, and consult an
electrical contractor.
M89ESC

Page S-2 EJS9AE-SF-01N-01

 NPM-DGS
Safety precautions

WARNING

Do not operate the machine

without receiving special training

Prohibited

Risk of injury due to improper operation.

●About training, conduct in your company or contact us.

EJS9AE-SF-01N-01 Page S-3

 NPM-DGS
Safety precautions

CAUTION
Do not give a shock to
the electrical
equipment.

There is a risk of an electric

shock, electrical leakage, or
malfunction.

M27SC

Page S-4 EJS9AE-SF-01N-01

 NPM-DGS
Safety precautions

Guidelines on using the machine

1. The machine, LNB, and NPM-DGS are the equipment to be connected

to LAN.
Use them on your company’s LAN (intranet).
From the perspective of product security, use them to be connected to
the robust network.
2. Do not reveal the equipment-operating passwords to others.
We highly recommend that your password is at least 5 characters long.
3. When sending the PC for LNB, NPM-DGS, etc. to a repair shop or
disposing of it, pull out the hard disk or format the hard disk
beforehand.
4. If you used an SD card in the case of emergency operation due to
network troubles, delete its contents when normal operation is
resumed.
5. We highly recommend you update your machine to the latest version of
OS for product security enhancement.

 Failure to comply could result in the leakage of user ID, password, and your production data to a
malicious outsider.

 The information recorded in an SD card may not be completely deleted through the basic
function of the operating system. Therefore, you are recommended to use commercial software
for complete deletion.

 The machine refers to the NPM machine main body.

 LNB is a relay system connecting the machine and NPM-DGS.
 NPM-DGS refers to the production-data generation system.

 For information about how to remove a hard disk from your computer or initialize a hard
disk, refer to its instruction manual or contact the manufacturer.

EJS9AE-SF-01N-01 Page S-5

 NPM-DGS
Safety precautions

= MEMO =

Page S-6 EJS9AE-SF-01N-01

 NPM-DGS
2D Inspection Editor

1. 2D INSPECTION EDITOR

This chapter describes the NPM 2D inspection editor.

EJS9AE-MB-01R-06 Page 1-1

 NPM-DGS
2D Inspection Editor
1.1 Outline of 2D Inspection Editor

1.1 Outline of 2D Inspection Editor

The 2D inspection editor is a data editor that, when the inspection head is installed in the NPM line,
adds the data necessary to inspect the production data for NPM line created by the data creating
system NPM-DGS to enable the inspection.

The NPM machine installed with the inspection head performs mainly three inspection functions.
Function①: The post-placement inspection function that checks whether the placement
condition of a component is normal relative to the component placed to a
board.
Function②: The pre-placement inspection function that checks whether the board
condition of a component mounting location is normal before performing
component placement with the opposite head.
Function③: The post-printing inspection function that checks whether, in addition to the
solder area, the printing position of solder (or the land position of board)
printed by the printing machine is normal.
Specifically, items of the post-placement inspection include:  component presence/absence
inspection,  component position inspection,  flip-over inspection, and  polarity inspection.
For the pre-placement inspection, an item included is:  foreign body (scattered chips) inspection.
The post-printing inspection includes ⑥ solder inspection.
You can select inspection items to be used by the NPM machine and set parameters for each
inspection item on the 2D inspection editor.
In addition, you can configure the APC system (option) in the 2D inspection editor.
For details of the APC system, see the NPM instruction manual.
( Operation manual or production manual in the NPM series)

The 2D inspection editor functions in two ways according to the target production data.

1. The 2D inspection editor started from the LWS editor, intended for the production data being used
in the NPM line
2. The 2D inspection editor started from the PPD editor, intended for the production data (not being
used) stored in the PPD folder

The production data created on NPM-DGS will be accumulated in the PPD folder after
downloaded to LNB.

 This instruction manual describes the following, provided that the post-placement inspection and
the pre-placement inspection are collectively termed as “Component inspection,” and “Solder
inspection” is abbreviated as the post-printing inspection.

Page 1-2 EJS9AE-MB-01R-06

 NPM-DGS
2D Inspection Editor
1.1 Outline of 2D Inspection Editor

NPM-DGS(PPD Editor)＊2

*1
LWS Editor

NPM

LNB

NPM

LNB

1: LWS editor is software that edits production data. The 2D inspection editor is started from the
LWS editor (or PPD editor as a function of NPM-DGS).

2: NPM-DGS (PPD editor) is software that creates production data.

EJS9AE-MB-01R-06 Page 1-3

 NPM-DGS
2D Inspection Editor
1.2 Flow of Production Data Edit

1.2 Flow of Production Data Edit

Shown below is the basic flow for editing the production data (for adding the data necessary for
inspection to the production data).

 For component inspection

1) Create the production (placement) data on DGS.
(The production data is generated after optimization)
Creating the production data
( Instruction manual of the data creation system
NPM-DGS)

1) Start up the 2D inspection editor from the DGS-PPD

Creating the inspection data
manager. ‘1.3 Starting the 2D Inspection Editor’)
2) Additionally register the inspection data to the production
data.
( ‘2.4 Component Inspection Setting’)
( ‘2.4.3 Automatic Creation of the Inspection Conditions
Initial Data’)
3) Save the edited production data.
( ‘1.4 Exiting the 2D Inspection Editor’)

1) Re-optimize the production data using the DGS-PPD

Re-optimizing the production
manager.( Operating Instructions Data Generation
data
System NPM-DGS)

1) Download the production data to NPM line.

Acquiring a PCB image for
( Operating Instructions Data Generation System
production
NPM-DGS)
2) Acquire PCB images to be produced.
( Operation manual or production manual in the NPM
series)

1) Start up the 2D inspection editor from the DGS-LWS/PPD

Adjusting the inspection data manager.
( ‘1.3 Starting the 2D Inspection Editor’)
2) Adjust the inspection data using the acquired PCB image.
( ‘2.4. Component Inspection Setting (Setting
Inspection Conditions Data)’)
3) Check the inspection data using the captured PCB image.
If modification is necessary, return to step 2) and adjust the
inspection data.
( ‘2.5. Checking Component Inspection’)
4) Save the edit production data.
( ‘1.4 Exiting the 2D Inspection Editor’)

Production

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 NPM-DGS
2D Inspection Editor
1.2 Flow of Production Data Edit

 For solder inspection

1) Register the placement data on DGS.

Creating the production data ( Instruction manual of the data creating system
NPM-DGS)

Creating the solder inspection

data 1) Start up the gerber convertor from the PCB editor.
2) Register the solder data in the production data.
3) Register the APC data in the production data.
4) End the gerber converter.
( Instruction manual of the garber converter)

1) Optimize the production data and output the scrutinized

Optimizing the production data.
data ( Instruction manual of the data creating system
NPM-DGS)

1) Download the production data to the NPM line.

Capturing a PCB image for
( Instruction manual of the data creating system
production
NPM-DGS)
2) Capture PCB image for production.
( Operation manual or production manual in the NPM
series)

1) Start up 2D inspection editor from DGS-LWS/PPD

Setting the solder inspection
manager.
data
( ‘1.3 Starting the 2D Inspection Editor’)
2) Use the captured PCB image to set inspection data.
( ‘2.6Setting Solder Inspection’)
3) Check an inspection. If necessary, go back to 2) and
modify inspection data.
( ‘2.7 Checking Solder Inspection’)
4) Save the edited production data.
( ‘1.4 Exiting the 2D Inspection Editor’)

Production

 In the solder inspection, the solder data, which becomes the criterion for the solder inspection,
cannot be created with the 2D inspection editor. You can only edit the solder data created by
using the tool for creating solder inspection data (gerber converter).

EJS9AE-MB-01R-06 Page 1-5

 NPM-DGS
2D Inspection Editor
1.2 Flow of Production Data Edit

 When the APC system (option) function is used

When the APC system function is used, set the APC conditions.

1) Start up the 2D inspection editor from DGS-LWS/PPD

Setting APC conditions manager.
( ‘1.3 Starting the 2D Inspection Editor’)
2) Set APC conditions.
( ‘2.8 Setting APC Conditions’)
3) Save the edited production data.
( ‘1.4 Exiting the 2D Inspection Editor’)

Production

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 NPM-DGS
2D Inspection Editor
1.3 Starting the 2D Inspection Editor

1.3 Starting the 2D Inspection Editor

Open the main screen (edit screen) of the 2D inspection editor.

A) Editing the current production data (LWS editor)

1 Select the production data to edit.

2 Right-click over the selected

production data. After that, a pop-up
1 2 menu opens. Select [Launch
Inspection Editor For XXX].

 For more information on LWS data editor

basic operation procedures, refer to
‘NPM-DGS programming manual’s 10. LWS
data editor.’

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 NPM-DGS
2D Inspection Editor
1.3 Starting the 2D Inspection Editor

B) Editing the production data saved in the PPD folder (PPD editor)

1 Select the production data to edit.

2 Right-click over the selected

production data. After that, a pop-up
1 menu opens. Select [Launch
Inspection Editor].

 For more information on PPD editor basic

operation procedures, refer to ‘NPM-DGS
programming manual’s 9. PPD manager.’

 The <Select a Lot> screen is displayed.

3 Select a lot, and press [OK].

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 NPM-DGS
2D Inspection Editor
1.3 Starting the 2D Inspection Editor

 The 2D inspection editor main screen (edit

screen) is displayed. At the same time,
<Select Target> screen is displayed. So select
the inspection data to be edited.

1-3006 1-3007

 You cannot select an inspection that is not

allowed to edit.

 Machine information of the NPM line installing

the inspection head is displayed in the list.
Select the machine referring the image data
on Edit of [Solder Inspection] and [Component
Inspection]. Normally a machine which is
appropriate for [Solder Inspection] and
[Component Inspection] is automatically
selected.

 APC conditions can be set by selecting any of

the [Solder Inspection], [Parts Inspection] or
[APC Setting].

EJS9AE-MB-01R-06 Page 1-9

 NPM-DGS
2D Inspection Editor
1.4 Exiting the 2D Inspection Editor

1.4 Exiting the 2D Inspection Editor

1 1 Select [File].

 [Cancel Exit]:
1 It exits without saving the edited data.

 [Save Exit]:
2 It exits after saving the edited data.

1-4001

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 NPM-DGS
2D Inspection Editor
1.5 2D Inspection Editor Screen and Basic Operations

1.5 2D Inspection Editor Screen and Basic Operations

5
2
1
3

8
1-5001

Name
 Title bar
 Menu bar
 Teach view operation
 Teach view
 Menu icon
 Entire PCB map
 List
 Status indication

EJS9AE-MB-01R-06 Page 1-11

 NPM-DGS
2D Inspection Editor
1.5 2D Inspection Editor Screen and Basic Operations

1. Title bar
Application name - Production data name - Operation level is displayed.

2. Menu bar
The commands necessary for operation are arranged for each purpose. Frequently used menu
items are displayed as menu icons separately.

3. Teach view operation

You can change the display magnification and position in the teach view.

1 2 3 5 7

4 6
① Zoom out:
Reduces the magnification of the teach view by one level.

② Magnification:
Specifies the magnification of the teach view. (1% through 400%)

③ Zoom in:
Increases the magnification of the teach view by one level.

④ Same magnification:
Sets the magnification of the teach view to the same magnification (100%)

⑤ PCB size magnification:

Sets the magnification of the teach view so that the entire PCB may be displayed. (The
magnification varies with the PCB size.)

⑥ Component size magnification:

Sets the magnification of the teach view so that the entire component selected may be
displayed. (The magnification varies with the component size.)

⑦ Enable compensation:
Enables/Disables compensation for the current image.
Compensation OFF: Displays the production data at the original coordinates without the
coordinate compensation by mark recognition.
Compensation ON: Displays the production data on the basis of the result of the coordinate
compensation by mark recognition.
The debug inspection is carried out at the coordinates where the
production data is displayed.

4. Teach view
The production data and the image are displayed.
Such as the display position and magnification can be changed. The production data displayed
includes PCB data, mark data, component data and solder data.
Right-clicking a data opens a pop-up menu showing available functions for each data. You can
perform various kinds of operations by choosing the desired function on the pop-up menu.

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 NPM-DGS
2D Inspection Editor
1.5 2D Inspection Editor Screen and Basic Operations

5. Menu icon
Select the [Standard]/[Set] tab.

A) [Standard]

1 3

1-5102

① Sync:
With this icon ON, the data selected on the list is displayed in the teach view synchronously.

② ‘Search’
When you type a data name and press the [Enter] key, the corresponding data is displayed in
the teach view and the list.

③ AUTO (Component inspection data automatic generation):

Press this icon to create the component inspection condition data at a time.

B) [Set]
2

① Password:
You can switch the operation level of the 2D inspection editor.
Production data is edited at the engineer level (operation level 3).

② Save program log:

The operational status of the application software is stored in the program log. If any
malfunctions occur, we may be able to identify the causes by scrutinizing the program log. In
such cases, we may ask you to save the program log.

③ Window layout:
You can switch the layout between the normal one and the one with the enlarged list.
It is used in checking the data at the list.

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 NPM-DGS
2D Inspection Editor
1.5 2D Inspection Editor Screen and Basic Operations

6. Entire PCB map

The entire map of PCB is displayed.
The area displayed in the teach view is displayed in a white frame . The size of the white frame
varies according to the magnification of the teach view. You can display the desired position on
PCB in the teach view by moving this white frame. Clicking the mouse on the entire PCB map
moves the white frame.

7. List
The information of production data is displayed.
Select the desired information using a tab. (PCB, mark, mark library, component, component
library, solder, solder judgment)
 The tab displayed varies depending on the selected target.

A) Synchronizing the teach view with the list

With the sync icon ON, the data selected on the list is displayed in the teach view.

1 To enable the synchronization, select

[Synchronize Image] from the menu
bar or the menu icon.

 If selected from the list, the image selection is

1 also synchronized automatically.

1
1-5102

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 NPM-DGS
2D Inspection Editor
1.5 2D Inspection Editor Screen and Basic Operations

2 Select multiple data targeted for

change from the list, and right-click
and select [Detail Setting].

1-5005

3 Change only the desired items, and

click [OK].

 Explanation of checkbox
Inspection Check this off to carry out
inspection.
Image Check this off to save the
component image into the
inspection box during production.
(Since the hard disk of the
inspection box has limited capacity,
normally leave the checkbox
unchecked.)

 The checkbox for ‘Solder Inspection’ is

selectable only when solder inspection
belonging to the component is enabled. This
item is set in the NPM-DGS, and it cannot be
changed from the 2D inspection editor.
3

1-5006

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 NPM-DGS
2D Inspection Editor
1.5 2D Inspection Editor Screen and Basic Operations

B) Sorting the list

You can sort the list on the basis of the specified column.

1 Click the top of the desired column.

 It is sorted in ascending order, and []

appears.
1

1-5007

2 Click it again.

 It is sorted in descending order, and []

appears.
2

1-5008

3 Click it once again.

 It is unsorted.
3

1-5009

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 NPM-DGS
2D Inspection Editor
1.5 2D Inspection Editor Screen and Basic Operations

8. Status indication
4 1

① Error message
If some errors occur in the application, the error message appears in this area.

② Error history
The history of past errors is listed.

③ Pointer information
When some coordinates (X, Y)  and image loaded are pointed with a mouse in the teach view,
their pixel values  are also displayed. Moreover, dragging with the left mouse button shows the
size (X, Y) .

1 3
2

④ Reset
You can clear the error message displayed in .

EJS9AE-MB-01R-06 Page 1-17

 NPM-DGS
2D Inspection Editor
1.6 Inspection Head and Placement Head Operation

1.6 Inspection Head and Placement Head Operation

 Operation restriction
An inspection head and a placement head operate alternatively.
More specifically, alternative operation is restricted according to the inspection items and placement
priority.
Component inspection and solder inspection do not support independent production mode in the NPM
series.

1. Restriction by inspection items

Operation order for inspection item is as follows. Optimum operation order is automatically
decided.
No. Inspection item Operation order
Component
1
presence/absence
Component A component is inspected by the inspection head after it is placed by
2
position the placement head
3 Flip-over
4 Polarity
A component is checked for foreign bodies (scattered chips). Then it
Foreign body
5 is placed by the placement head.
inspection
If it is judged as NG, the component is unloaded without placement.
The inspection is performed with the inspection head after performing
6 Solder inspection
a solder printing operation with the printing machine.

2. Restriction by placement priority

In an instance of shield components, it is placed after other components are placed.
This is called placement priority order.
No. Inspection item Operation order
If placement priority is selected, the inspection results of all previously
placed components must be OK in order to start placing next
1 All components.
Therefore, if any of previous components results in NG, a PCB is
unloaded without next components.

 There are three types of placement priority order; ‘Simple’, ‘Several sequence’ and ‘Relative
sequence’. Note that for the use of the inspection head, select ‘Relative sequence’. (See
“NPM-DGS in the programming manual” for details.)

3. Corresponding head table

The head compositions corresponding to each of the component and solder inspections are
described as follows.
Front Rear Component Solder
Head Supply Head Supply inspection inspection
2-nozzle head Changing track ○ ○
3-nozzle head Tray feeder ○ ○
Changing track ○ ○
8-nozzle head
Tray feeder ○ ○
2D inspection
head Inspection 12-nozzle head ○
(9μm) box 16-nozzle head ○
(18μm) Light weight Changing tract － ○
16-nozzle head
Dispensing
－
head
No head None ○ ○

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 NPM-DGS
2D Inspection Editor
1.6 Inspection Head and Placement Head Operation

4. Head performance
The table below summarizes the head performance according to each operation.
Target operation Inspection/placement order Restrictions
The solder inspection for The placement starts only if the solder
PCBs is performed in the inspection for PCBs is thoroughly
Placement after the
order, in which the image for completed.
comprehensive solder
the inspection can be taken If any NG location is found in the solder
inspection
in the shortest amount of inspection, no placement is performed for
time. “the entire PCB.”
The placement can be done
in the order which requires
The placement starts only if the solder
the placement for the
Placement in pattern inspection for PCBs is thoroughly
shortest amount of time.
unit after the completed.
There is no correlation
comprehensive solder If any NG location is found in the solder
between the order of the
inspection inspection, no placement is performed for
image taking/solder
“the NG pattern.”
inspection and that of the
placement.
The inspection and the
placement are performed Only the component, the inspection result
alternately. Basically, the of which has been confirmed, can be
Solder inspection
image for the inspection is placed (1).
immediately before
taken between optimized The component at the NG location found in
placement
placement turn operations the solder inspection cannot be placed
(vacant time during the (2).
pickup).

(1) If solder inspection judged in NG, placement for applicable solder becomes standby status
until over-judgment input has been completed. However, an image capture of the inspection
turn before placement can be preceded.
(2) “Solder” that has been judged as NG is fixed on the repair conveyor after PCB loading. So
any components, which are placed with the machines downstream of the repair conveyor,
can be placed.

 Be sure to optimize this option, if changed.

 As for PCBs with 350mm <PCB transportation size ≦ 510mm, there are the following
restrictions.
1. The inspection is a partition inspection (feeding twice).
2. Provision is not made for the reciprocating motion of PCBs.
3. Make sure to select the solder inspection immediately before placement.
4. The function which skips a component of the inspection NG to be placed has the flowing
restrictions.

 Restrictions on partitioned mounting

NG skipping types Restrictions
PCB unit skipping Yes (Not available)
Pattern unit skipping Yes (Not available)
Component unit skipping No (Available)

EJS9AE-MB-01R-06 Page 1-19

 NPM-DGS
2D Inspection Editor
1.6 Inspection Head and Placement Head Operation

 Re-insertion
The purpose of re-insertion is as follows; ‘Re-inspection’ and ‘Re-placement’. Each operation is described
below.
No. Operation Operation order
Repaired PCBs are re-inspected. Basically, selected components are
inspected by all inspection items to prevent from second accidents.
However, the components specified in the priority order are assumed to be
1 Re-inspection those, such as shield components, which are arranged and placed above
the other. Previously placed components cannot be basically captured if
next placed components such as shield components are judged OK, and
thus inspection will be automatically skipped.
Basically it is same condition as the placement head.
If you prepare the re-insertion conveyor, components (judged as NG by the
inspection head) which are possible of re-placement are automatically
searched, and an operator is asked whether to place them by the
placement head or not. He or she checks an image on the screen and
2 Re-placement
makes judgment.
However, if the re-insertion conveyor is not prepared or components are
placed by other than an opposite head of the inspection head, you need to
load PCBs on the first upstream machine from the beginning of the line and
place them by the applicable machine.

 Reloading is allowed only when component inspection is performed at the last machine
 There is no reloading operation in the solder inspection.

Page 1-20 EJS9AE-MB-01R-06

 NPM-DGS
2D Inspection Editor

2. EDITING THE PRODUCTION

DATA

This chapter describes the production data edit that adds the data necessary to inspect the
production data for NPM line created by the data creating system NPM-DGS.

EJS9AE-MB-02R-08 Page 2-1

 NPM-DGS
2D Inspection Editor
2.1 Outline of Production Data Edit

2.1 Outline of Production Data Edit

To enable the inspection by the inspection head in the NPM line, it is required that not only the
data necessary only for placement but also the data necessary for the inspection be set in the
target component data for the inspection. These data are collectively called “inspection
conditions data,” which consist of inspection items (items that carry out inspection for component
presence, component position, etc.), inspection names (inspection method for each inspection
item), inspection details (BOX, LUT, parameters such as criteria, and lighting), and others.
These data are added to the component data in the production data. The component data in the
database of NPM-DGS is updated by importing the component data, to which the inspection
conditions data is added, to NPM-DGS; the component data including the set inspection
conditions data will be used in the next production data creation. If, in that case, all the
component data to be used include the inspection conditions data, it is not necessary to set the
inspection conditions data by using the 2D inspection editor. For usual production data creation,
it is necessary to set the inspection conditions data only to the components to be inspected
newly.
However, as for the solder inspection, you cannot create new data (solder data), which becomes
the criterion for the inspection, using the 2D inspection editor. Only solder data created by using
the tool (gerber converter) for creating solder inspection data can be edited.

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 NPM-DGS
2D Inspection Editor
2.1 Outline of Production Data Edit

 For component inspection

Basic data
Component data • Outer size: Catalog specifications of the component outside
shape
• Recognition reference: Component recognition data
• Feeder arrangement, etc.: Arrangement of feeders to be
installed on the machine and others

Data necessary for inspection

• Inspection conditions

Role of the 2D inspection editor

<Inspection conditions>
Inspection condition name:
Name it. (Then, you can copy the data by calling the specified inspection condition name
from other component data.)

Inspection item:
Select the desired inspection item. Multiple selections are available.

• Component presence
• Component position
• Flip-over
• Polarity
• Foreign body

Setting data for the inspection items to be executed

Component Component Flip-over Polarity Foreign body

presence position
Inspection • 1BOX color • PSM • 1BOX color • 1BOX color • 1BOX color
method extraction matching extraction extraction extraction
(Selection) • 2BOX color
extraction
• 4BOX color
extraction
BOX position Required  Required Required Required
size
Pivot  Position/Size   
LUT PCB (with  Components Components PCB (with
pattern) pattern)
PCB (without PCB (without
pattern) (or, pattern)
component) Solder
Lighting Required Required Required Required Required
Parameters Required Required Required Required Required
such as
criteria

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 NPM-DGS
2D Inspection Editor
2.1 Outline of Production Data Edit

 For solder inspection

Basic data
Solder data • the center position/the gravity center position
• Size/angle/shape of solder
• Associated information with the component data

Data necessary for the inspection

• Inspection conditions

The role of the 2D inspection editor

<Solder size and angle>

The basic data of the solder data is created on gerber converter, however, 2D inspection
editor provides the function to fine adjust the solder size and angle for the angled
components.

<Inspection conditions (solder judge library)>

Set the solder judge library to each solder data set. Also arrange the parameter such as the
judgment value. You can add any solder judge library other than the one set to default.

Inspection item:
the item includes only a single item, the solder inspection. The area, misalignment, irregular
shape and bridge of solder can be inspected collectively by performing the solder
inspection.

The setting data for the solder inspection

Solder inspection Remarks

Inspection method Color extraction －
Opening area Required Set within solder data.
Bridge area width Arbitrary (1) Set within solder data.
Lighting Required Set within solder data.
LUT Solder (2) Set within PCB data or solder judgment library.
Inspection area extended
Required Set within solder judgment library.
size
Parameters including the
Required Set within solder judgment library.
judgment value

1 You are required to set to the solder data of the location, for which the bridge inspection is
needed. If not set, the bridge inspection becomes invalid.
2 LUT of the land is required for performing the land inspection described later.

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 NPM-DGS
2D Inspection Editor
2.2 Preparation for Production Data Edit

2.2 Preparation for Production Data Edit

2.2.1 Creating and Downloading the Production Data
The production data is created on NPM-DGS. Refer to the instruction manual of DGS.
The following shows the basic flow for creating a new production data.
( Instruction manual of the data creating system NPM-DGS)

 For component inspection

Launching DGS

( Instruction manual of the data creating system NPM-DGS 1.3)

Creating a PCB loaded from CAD

( Instruction manual of the data creating system NPM-DGS 5)

Registering the new component data

( Instruction manual of the data creating system NPM-DGS 6.5)

Creating the production data

(After optimization, the field-of-view data
for inspection is created.)

( Instruction manual of the data creating system NPM-DGS 7)

Outputting the production data

( Instruction manual of the data creating system NPM-DGS 7.12.3)

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 NPM-DGS
2D Inspection Editor
2.2 Preparation for Production Data Edit
 For solder inspection

Starting DGS

( Operating manual Data Creation System NPM-DGS 1.3)

CAD read PCB creation

( Operating manual Data Creation System NPM-DGS 5)

New registration for component data

( Operating manual Data Creation System NPM-DGS 6.5)

Creating solder inspection data

( Operating manual Gerber Converter)

Creating production data

( Operating manual Data Creation System NPM-DGS 7)

Output of production data

( Operating manual Data Creation System NPM-DGS 7.12.3)

2.2.2 Acquiring the Image of Production PCB

The image of the production PCB is acquired on the NPM main body. Refer to the instruction
manual of the NPM main body.
( Operation manual or production manual in the NPM series)

2.2.3 Creating Solder Inspection Data

Use the tool (gerber converter) for creating solder inspection data in order to create data used for
solder inspection. For more information, refer to the gerber converter instruction manual.
( Operating manual Gerber Converter)

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 NPM-DGS
2D Inspection Editor
2.3 Loading and Saving the Production Data

2.3 Loading and Saving the Production Data

Load: ( ‘1.3 Starting the 2D Inspection Editor’)
Save: ( ‘1.4 Exiting the 2D Inspection Editor’)

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 NPM-DGS
2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

2.4 Component Inspection Setting (Setting Inspection

conditions Data)
Set the inspection conditions data to the component data.

2.4.1 Setting the PCB-Common LUT

First, set the PCB-common LUT to be used commonly in setting the inspection conditions for
each component data. For explanations of LUT, see ‘3.1 Outline of LUT.’
To be concrete, edit the four kinds of PCB LUT (‘In a pattern,’ ‘Outside a pattern,’ ‘Solder,’ ‘Land’)
to be used for the inspection for component presence.

NOTICE
If the PCB-common LUT has not been set, you need to set the LUT for the inspection
for the presence of all components. This is very irksome when there is a large
amount of component data.

1 In the teach view, click a PCB frame

(the outermost red frame) to select
the PCB data.

2 Select [Set LUT] from the pop-up

menu to be opened by right-clicking.

 Right-clicking on the PCB list also opens the

pop-up menu.

 The <PCB LUT Setting> screen is displayed.

1

2
2-4013

 If some edits or additions are made, they are

retained by the 2D inspection editor. Changes
made will be reflected when using next time.

 The name of LUT can be editable so that set

the name of easy to know the setting color.

Page2-6

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 NPM-DGS
2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 PCB LUT to be used for the inspection for component presence

• PCB color with pattern (Pattern  Resist)
• PCB color without pattern (Resist only)
• Solder (Solder paste)
• Land (Pattern only)

Edit the above four kinds of LUT by using the PCB image before components are placed.

‘LUT-1’ through ‘LUT-6’ is set into each name field of the PCB LUTs No.1 through No.6
respectively in the initial state. The following describes the case in which the above four kinds of
PCB LUTs are set to No.1 through No.4 respectively, and ‘With pattern,’ ‘Without pattern,’
‘Solder’ and ‘Land’ are set to the name fields.

1 Select the ‘In a pattern’ LUT, and click

[LUT Setting].

 The <LUT Setting(2 Value)> screen is

1 displayed.

Page2-7
1

2 Set the LUT, and click [OK].

 For information about setting the LUT, see ‘3.

SETTING THE LUT.’

3 Repeat steps 1–2 for each LUT:

‘Outside a pattern,’ ‘Solder,’ ‘Land.’

2
2-9-E

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 NPM-DGS
2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Simple check of the LUT-based color extraction status

In relation to each piece of configuration data, the color extraction status can be checked on an
actual image at the time of configuring the LUT setting.

1 In LUT Setting, check the check box

for ‘Preview’ in ‘Color Extract Result
Display’.

 In the PCB image displayed in the teach view,

areas that are subject to color extraction
based on the LUT configuration values are
filled in.

2 Select a color extraction display

range from Area Size.

 Selectable size
1 cm × 1 cm
3 cm × 3 cm
2-10(1)-E 1 2 5 cm × 5 cm

2-10(2)-JEC

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 NPM-DGS
2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

2.4.2 Inspection Conditions Data

It is necessary to set the inspection conditions data, if it is not set, to all the component data that
need the inspection.

 Checking the inspection conditions data settings

When the inspection conditions data is set, the inspection conditions data name is displayed on
the component library list. If the inspection conditions data name is ‘---,’ the inspection conditions
are not set.

2-4005

The inspection conditions data is created on PPD inspection editor at a time. Or you can copy
and create the inspection conditions data which has been already created.
(The data which allows copying on the 2D inspection editor is the component inspection
conditions data included in the editing production data.)

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 NPM-DGS
2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

2.4.3 Automatic Creation of the Inspection Conditions Initial Data

 Batch creation
The inspection conditions data is created at a time.
There are three inspection items created using this function; Component Presence, Component
Position and Component Reverse.
In some components, the inspection conditions data may not be created.
This function is available only on the PPD inspection editor, and it is not available on the LWS
inspection editor.

Foreign
Component Component Polarity Component
matters
Presence Position inspection Reverse
inspection
Output ○ ○ × ○ ×

 Check to see if the output inspection data can be inspected normally by PCB inspection. If there
is a wrong judgment result, adjust inspection parameters by debag inspection.

1 Click .

 The <Generate Inspection Condition> screen

1 is displayed.

2-41001

2 Select a desired PCB LUT data.

 If you have already set the PCB LUT, go to

step 6.
2

3 Click [LUT Setting].

3  The <LUT Setting (binarize)> screen is
displayed.

2-41002

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 NPM-DGS
2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

4 Set LUT and click [OK].

 For the LUT setting, see ‘3. LUT Setting’.

 Repeat steps from 2 through 4 to create LUT

of ‘PCB (outside a pattern)’, ‘Solder’, ‘Land’
and ‘White’ colors.

2-41003

5 Select the [Functional class] tab.

6 Select either ‘No Inspection Condition

5 Component’ or ‘All Component’, and
select a component for automatic
generation.

 To set only components that the inspection

data is not set, select ‘No Inspection Condition
6 Component’. To set all components, select
‘All Component’. Your selection list is
displayed.

7 Click [Generate].

6  The inspection conditions initial data is

generated.
2-41004

7  To change the inspection conditions initial

data to be generated, see how to change the
data described in the following pages.

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 NPM-DGS
2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 How to change the inspection conditions initial data to be generated 1

(Functional class)
There are two methods to change the inspection conditions initial data that is automatically
generated. One is to set per functional class, and the other is to set per component.
If you change the setting per functional class, changes will apply to all components belonging to
functional class. If you change the setting per component, changes will apply only to the
component so that they will not apply to other components. If you change the setting to both
functional class and component, changes made for component will apply first.
This section describes how to change the data per functional class.

1 Select [Functional class] tab.

 The Auto Setting (List) per functional class is

displayed.
1
2 Select a desired functional class data
to edit.

2
3 From the pop-up menu list on
right-click, select [Advanced].
3
 The <Advanced Setting> screen is displayed.

 The <Advanced Setting> screen can also be

shown by double-clicking ‘No’ or ‘Functional
class’ field of the functional class list.
2-41005

4 Select the [Component Presence] tab

to edit the presence inspection
parameters.
4
 Editable parameters of presence inspection
are displayed as a list. Set the parameters as
necessary.

2-41006

5 Select the [Component Position] tab

to edit the position inspection
parameters.
5
 Editable parameters of position inspection are
displayed as a list. Set the parameters as
necessary.

2-41007

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

6 Select the [Component Reverse] tab

to edit the reverse inspection
parameters.
6
 Editable parameters of reverse inspection are
displayed as a list. Set the parameters as
necessary.

7 After the settings have been

completed, click [OK].
2-41008

 How to change the inspection conditions initial data to be generated 2

(Component)
This section describes how to change the data per component.

1 Select the [Component] tab.

2 Select a desired component data to

edit.

1
2
3 From the pop-up menu list on
right-click, select [Advanced].

3  The <Advanced Setting> screen is displayed.

 The <Advanced Setting> screen can also be

shown by double-clicking ‘No’, 'Component' or
2-41009 ‘Functional class’ field of the component list.

 The operation procedure of the <Advanced

Setting> screen is as same as the one for
functional class. See the operation procedure
for functional class.

 A check mark is inserted in a box of the

'Special' field of components that changes
have been made.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 How to initialize the inspection conditions initial data to be generated

1. How to initialize all generation conditions

1 Click [Reset Setting].

2-41010

2 In the confirmation dialog box, click

OK.

 The data set per functional class and per

component are all cleared to initialize.
2-41011

2. How to initialize the data of either functional class or component

1 Select the [Functional class] tab or

[Component] tab.

1 2 Select a desired data to edit.

3 From the pop-up menu list on

right-click, select [Reset Setting].
2

2-41012

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Editable inspection condition automatic generation parameters

 Parameters list that can be customized by inspection conditions
Inspection item Description Explanation
Component ‘BOX Position’ Specifies the position of the extraction area (BOX) of a
Presence color.
‘Center’ : Sets BOX to the component center.
‘Lead Side’ : Sets BOX on an electrode / lead.
‘BOX Size’ Specifies size of the extraction area (BOX) of a color.
You can select among from ‘1/2’, ‘1/4’ and ‘1/8’ based
on an arrangement target (Main / Lead (electrode)).
‘Judgment Value[%]’ Specifies threshold to judge component presence
inspection.
You can set a ratio of a color extraction area as a
percentage in relative to the BOX area.
‘Extract color’ Sets attribute of the specified LUT (color).
You can select either ‘PCB color’ or ‘Component color’.
‘Offset BOX The BOX position is decided in relative to a component
coordinates’ position. Thus, when the component position is
corrected, the BOX position must also be corrected.
You can set whether to correct the BOX position based
on the result of the position inspection or not.
You can select either ‘ON’ or ‘OFF’.
‘Use LUT (1 to 6)’ Specifies an extraction color.
You can select from six colors registered as PCB LUT.
Mark the checkboxes for use.
Component ‘Auto Type’ Sets pivot arrangement conditions.
position For details of pivot arrangement conditions, see ‘2.4.6
Setting the Inspection Details 2. Inspection for
component position’.
Component ‘BOX Position’ Specifies the position of the extraction area (BOX) of a
Reverse color for component reverse side.
‘Center’ : Sets BOX to the component center.
‘Lead Side’ : Sets BOX on an electrode / lead.
‘BOX Size’ Specifies size of the extraction area (BOX) of a color
for component reverse side
You can select among from ‘1/2’, ‘1/4’ and ‘1/8’ based
on an arrangement target (Main / Lead (electrode)).
‘Judgment Value[%]’ Specifies threshold to judge component reverse
inspection.
You can set a ratio of a color extraction area as a
percentage in relative to the BOX area.
‘Use LUT (1 to 6)’ Specifies a color of component reverse side.
You can select from six colors registered as PCB LUT.
Mark the checkboxes of your desired ones.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pop-up menu list on right-click of the [Functional class] tab and [Component] tab
Item [Functional class] [Component] Explanation
tab tab
‘Synchronize To ○ － This can change from the functional
Parts Setting’ class list to the component list, and the
representative component is being
selected.
‘Copy’ ○ ○ Selects this when you want to copy the
setting data to another functional class.
The selected functional class is a
source of copy.
‘Paste’ ○ ○ The selected functional class by
‘Paste’ is a destination of copy, and the
data selected by ‘Copy’ is copied to the
destination of copy.
‘Advanced’ ○ ○ Selects this when details of each item
are set. Selecting this opens a setting
dialog box.
‘Reset Setting’ ○ ○ Selects this when you want to reset
advanced settings.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 How to specify the component and generate the inspection conditions

initial data

1 Select the [Component Library] tab.

1
2 Select a desired inspection condition
data to generate.

 You can select several components at once.

When you want to select several components,
select one component and while you hold
down the [Shift] key, select another
component. All components between them
will be selected.
2
3 From the pop-up menu list on
2-41013
3 right-click, select [Auto Set].

 The <Generate Inspection Condition> screen

is displayed.

4 Carry out operation on the <Generate

Inspection Condition> screen to
generate the inspection condition
data.

 The operation procedure on the <Generate

Inspection Condition> screen, see ‘2.4.3.
Automatic Creation of the Inspection
Conditions Initial Data ■Batch creation’.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

2.4.4 How to Copy and Create the Inspection Conditions Data

 How to copy in the list (Component Library)

1 Select [Component Library] tab on the

list.
1

2 Select the source data to copy.

2
3
3 Right-click and select [Copy
Conditions] in the menu.

2-4006

4 Select the component library to copy

to.

4 5 To copy all inspection conditions,

5 right-click and select [Paste
Conditions] in the menu.

 Inspection condition data is registered under

the same name as the source data.

 If inspection condition data has already

registered, the dialogue box appears asking
2-4007 you to overwrite or not. Click [Yes] to
overwrite or click [No] to not to overwrite.

2-4008

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 How to copy (formal selection) in the list (Component Library)

1 Select [Component Library] tab in the

list.
1

2 Select the source data to copy.

2
3 3 Right-click and select [Copy
Conditions] in the menu.

2-4006

4 Select the component library to copy

to.

4 5 To copy a given inspection condition,

display a window by right–clicking,
and then select [Paste Special
5
Conditions] on the window.

 Select the inspection item you want to copy

and the processing method for the same
inspection item, and then click on [OK].

2-4009  Selected inspection condition data is

registered.

 A inspection condition data name varies

depending on copy conditions.

(1) With both ‘All’ and ‘Overwrite’ selected, the

name is registered under the same name
as the source data.
(2) With both ‘All’ and ‘Not overwrite’ selected,
the name is registered as “NoName”.
2-4010 (3) With the specific inspection item selected,
the name is registered as “NoName”.

 “” is four-digit numerical number.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 How to copy data at the settings of inspection condition data

All of the inspection condition data, which is set to component data, can be copied with this
operation.

1 With the sync icon  ON, select the

component data to which you set the
inspection conditions data from the
1 component library list.

 The representative component corresponding

to the selected component data is selected in
1 the teach view.
( ‘1.5 2D Inspection Editor Screen and
Basic Operations’  ‘5. Menu icon’  ‘A)
2 [Standard]’  ‘ Sync’)

2 Right-click in the teach view.

2-4011  The operation of components is displayed.

3 Select [Inspection Condition].

 The <Condition Details> screen is displayed

on the list.
If the inspection conditions data is not set, the
‘Name’ field is blank.

 Enter the size into the ‘Recog. Area Offset’

2-4012
3 field to expand the component search area
during component position inspection.
Normally, enter about 0.050 mm. Entry of
larger values in this parameter increases the
inspection time.

4 Click [Create / Edit Condition].

 The <Modify Inspection Condition> screen is

4 displayed.

 The ‘Component Library Data’ field shows the

list of all the component data to which the
inspection conditions data of this production
data is set.

2-4014

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

5 Select the source component data,

and click [ Copy].

 The <Create Inspection Condition> screen is

displayed.

5
5

6 Enter a new inspection condition

name in the ‘Name of Inspection’ field.

 Typing the same name as the component

data name facilitates the management.

6  Note that inspection will not be carried out

correctly if the direction of the copied
component data is different from that of the
7 source one (e.g. reversed mold size X, Y).

7 Click [OK].

 The confirmation screen is displayed.

8 Click [Yes].

 The new inspection condition name appears

in the ‘Register Inspection Condition’ field.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

9 Click [OK].

 The inspection conditions of the source

component data are copied to the component
data.

10 If no inspection conditions need

editing, click [OK].

 For information about editing the inspection

conditions, see ‘2.4.5 Inspection Item’ and
‘2.4.6 Setting the Inspection Details.’

 The confirmation screen is displayed.

2-4015

10

11 Click [OK].

 This concludes the setting of the inspection

conditions data.

11

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Setting the new inspection conditions data

1 With the sync icon  ON, select the

component data to which you set the
inspection conditions data from the
1 component library list.

 The representative component corresponding

to the selected component data is selected in
1 the teach view.
( ‘1.5 2D Inspection Editor Screen and
Basic Operations’  ‘5. Menu icon’  ‘A)
2 [Standard]’  ‘ Sync’)

2 Right-click in the teach view.

2-4011  The operation of components is displayed.

3 Select [Inspection Condition].

 The <Condition Details> screen is displayed

on the list.
If the inspection conditions data is not set, the
‘Name’ field is blank.

2-4012
3

4 Click [Create / Edit Condition].

 The <Modify Inspection Condition> screen is

displayed.
4  The ‘Parts Library Data’ field shows the list of
all the component data to which the inspection
conditions data of this production data is set.

2-4014

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

5 Click [New].

 The <Create Inspection> screen is displayed.

6 Enter a new inspection condition

name in the ‘Name of Inspection’ field.

 Typing the same name as the component

data name facilitates the management.
6

7 7 Click [OK].

 The new inspection condition name appears

in the ‘Register Inspection Condition’ field.

8 Click [OK].

 The blank inspection conditions data is

created.

 You need to set inspection items, parameters,

and others.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

2.4.5 Inspection Item

Set the inspection items to be executed in the inspection conditions data.

A) Adding the inspection item

If no inspection items are set or if you want to add an inspection item to the copied inspection
conditions data, add the desired inspection items.

1 Click [Add] on the <Inspection

Condition Detail Data> screen.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 The <Add Inspection Category> screen is

displayed.

2 Check off the desired inspection

items, and click [OK].
2  The inspection items are added to the
‘Inspection Category List.’

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

B) Deleting the inspection item

You can delete an unnecessary inspection item from the copied inspection conditions data.

1 Select an unnecessary inspection

item in the ‘Inspection Category List’
field on the <Inspection Condition
Detail Data> screen, and click
[Delete].

 The inspection item is deleted from the

‘Inspection Category List.’
1

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

2.4.6 Setting the Inspection Details

Set the inspection method, BOX, pivot, LUT, parameters, lights and others for each of the target
inspection items set in the inspection conditions data. BOX is the data that frames the position
and range for component inspection. Pivot is the data that shows the contrast features of a
component in order to detect the position of the component displayed in the image for
component position inspection. Parameters are the data that includes criteria necessary for
inspection process. Lighting is the light value data when an image used for inspection is
captured.

1. Inspection for component presence

1 Select ‘Parts Existence’ in the

‘Inspection Category List’ field on the
<Inspection Condition Detail Data>
screen, and click [Detailed Setting].

 The <Inspection Advanced Setting> screen is

displayed.
1

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

① Setting the BOX set

For the inspection for component presence, the inspection method (the inspection name) is
1BOX only.

1 Select the [BOX Setting] tab.

 The BOX appears on the component in the

teach view.

2 Move or scale the BOX using the

1 arrow buttons.

 The position and size information (mm) of the

2 BOX appear in .

 As necessary, change the amount (step

amount) of movement/scaling by one button
2
operation in .

 The position and size (mm) of this BOX are

set.
Colors are extracted in the BOX, and
component presence is detected.
1

3 6

4 5

page2-22-1

 Items described by the lines, corresponding

each number, in the image are as follows.
 Component outside dimension (Design
value)
 Component’s electrode position (Design
value)
 BOX position and size
 Placement angle

: 0
: 90
: 180
: 90

Button Explanation
Moves the BOX position.
Each click moves it by one step.
Scales the BOX.
Each click scales it by one step.
Not used.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

② Setting the LUT

The LUT for the inspection for component presence should be common to PCBs. (Set the
following LUTs: ‘PCB’‘In a pattern,’ ‘PCB’‘Outside a pattern,’ ‘PCB’‘Solder,’ and
‘PCB’‘Land.’)

1 Select the [LUT] tab, and click [Add].

 The <Select Method of Adding LUT> screen is

displayed.

page2-23-1

2 Check off ‘Add Common LUT of

PCB,’ and click [OK].

 The <PCB LUT Setting> screen is displayed.

2

3 Select the ‘PCB’‘In a pattern’ data,

and click [OK].

 The <Inspection Advanced Setting> screen is

3 displayed.

Page2-19

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

4 Repeat the steps 1 to 3 to register the

LUT’s ‘PCB’‘Outside a pattern,’
‘PCB’‘Solder’ and ‘PCB’‘Land’, and
LUT data necessary for component
presence/absence judgment.

 Once the PCB LUT No.1 is registered, ‘PCB1’

is displayed in the Reference List field on the
list illustrated on the left.

page2-24-1

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

③ Setting the parameter

Normally, leave it default.

page2-25-1

Standard Upper-limit Lower-limit

Description Explanation Unit
value value value
‘Judgment Threshold to judge whether it is OK or not can % 50.0 200.0 0.0
Value’ be set.
The rate of the color-extracted part to the area
of the BOX can be set. Algorithm code
described below is used to judge.
‘Algorithm PCB color or ‘component color’ can be set. By PCB  
Code’ ‘PCB Color’: selection Color
A no-component NG occurs if the rate of the
set PCB LUT is equal to or more than the
criterion.
You need to set the PCB color to the LUT.
This is a default setting.
‘Parts Color’:
A no-component NG occurs if the rate of the
set component LUT is equal to or less than
the criterion. You need to set the component
color to the LUT.
‘Offset BOX ‘ON’ or ‘OFF’ can be set. By OFF  
coordinates’ ‘ON’: selection
Box coordinates are offset and inspected
according to the amount of part shift
calculated by position inspection.
It is applicable only when position inspection
is registered.
‘OFF’
Inspection is carried out using BOX
coordinates set in the inspection data.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

④ Setting the lighting

Normally, inspection is carried out with a default setting of ‘Normal Lighting.’
Individual lighting is used only when an image is difficult to recognize with normal lighting.
The individual lighting, when used, should be used as little as possible because it increases the
frequency of the image taking and the processing time.

1 Select [Lighting] tab and click

[Individual Lighting].

 The list to set the four lighting values is

displayed.

page2-26-1

2 Select the box to change the lighting

value and enter the value.

3 After all values are set, click [OK].

 The Inspection Advanced Setting window is

closed.

page2-26-2

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

2. Inspection for component position

1 Select ‘Parts Position’ in the

‘Inspection Category List’ field on the
<Inspection Condition Detail Data>
screen, and click [Detailed Setting].

 The <Inspection Advanced Setting> screen is

displayed.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

① Setting the pivot set

1 Select the [Pivot Setting] tab, and

click [Auto Set].

2 Select [Pivot & Parameter] in the Auto

Set data.
1
 Auto Set Data type has the following three
types;
Pivot & Parameter
Pivot only
Parameter only

3 Select either On or Off for ‘Step

Search’.

 When it is set to On, you can improve the

position search speed.
1
4 Select a desired type from the list and
click [Set].
page2-28-1

 Pivots are arranged on the component in the

teach view.

 Positions, sizes, groups, and pairs of pivots

for rough recognition and precise recognition
are automatically arranged. And the
inspection parameters are set.
4 (See the ‘5.2.2 Position Inspection’ for details
of pivots.)

2-35-1
2 4
3 1 4
 Procedure for the pivot manual setting
Start
2

Select [General] or [Accurate]. 3

 Items described by the lines, corresponding

Determine the size and orientation of pivots. each number, in the image are as follows.
 Component outside dimension (Design
value)
Arrange pivots in the teach view.  Component’s electrode position (Design
value)
 Pivot position and direction
Repeat steps as necessary.  Placement angle

: 0
Group the pivots. : 90
: 180
Finish
: 90

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 1

Pivot setting target Target component
Chip resistance (less or
Electrode
equal to1005)
1) Intended use : use for the chip resistance less than or equal to1005 and a narrow electrode width.
If the electrode width is wide relative to the variable value of the component size, select
“Chip resistance” for Target component.
2) Conditions for automatic generation : a component with two pieces of lead whose direction is two-way.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
2 Y coordinate Individual pivot coord. Group 1
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0
6 Up. limit of contrast 0
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value
1 ‘Offset Judgment Value NG X’ 1
2 ‘Offset Judgment Value NG Y’ 1
3 ‘Offset Judgment Value NG Theta’ 6
4 ‘Size change X min.’ 2
5 ‘Size change X max.’ 2
3
6 ‘Size change Y min.’ 0
Size change (1-axis)
7 ‘Size change Y max.’ 0
8 ‘Algorithm Code’ 4
9 ‘Color Frame’ I&I
10 ‘Search Threshold Value’ 50
11 ‘Search Step XY’ 2
12 ‘Search Step  ’ 1
Group 2
13 ‘Detected Land Judgment Value’ 50
Default search angle for step search
14 0
[°]
Default search threshold for step
15 75
search

1. Offset judgment warning values and offset judgment NG values: Set the following value
based on the component size.
No. Comp. type Judgment value
1 0402 70
2 0603 100
3 1005 170
4 1608 or over 200

2. Size change value: Set the following value based on the component size.
No. Comp. type Size change (max) Size change (min)
1 0402 60 -60
2 0603 100 -100
3 1005 100 -100
4 1608 or over 200 -200

3. Because of only 1-axis change, the size change value (2) should be set to either X or Y, and
set [0] for the other one.
4. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 2

Pivot setting target Target component
Electrode Chip resistance
1) Intended use : use for overall chip resistance.
If the electrode width is narrow relative to the variable value of the component size, select
“Chip resistance (less than or equal to 1005)” for Target component.
2) Conditions for automatic generation : a component with two pieces of lead whose direction is two-way.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
2 Y coordinate Individual pivot coord. Group 1
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0
6 Up. limit of contrast 0
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value
1 ‘Offset Judgment Value NG X’ 1
2 ‘Offset Judgment Value NG Y’ 1
3 ‘Offset Judgment Value NG Theta’ 6
4 ‘Size change X min.’ 2
5 ‘Size change X max.’ 2
6 ‘Size change Y min.’ 2 Size change (2-axes)
7 ‘Size change Y max.’ 2
8 ‘Algorithm Code’ 3
9 ‘Color Frame’ I&I
10 ‘Search Threshold Value’ 50
11 ‘Search Step XY’ 2
12 ‘Search Step  ’ 1
13 ‘Detected Land Judgment Value’ 50 Group 2
Default search angle for step search
14 0
[°]
Default search threshold for step
15 75
search

1. Offset judgment warning values and offset judgment NG values: Set the following value
based on the component size.
No. Comp. type Judgment value
1 0402 70
2 0603 100
3 1005 170
4 1608 or over 200

2. Size change value: Set the following value based on the component size.
No. Comp. type Size change (max) Size change (min)
1 0402 60 -60
2 0603 100 -100
3 1005 100 -100
4 1608 or over 200 -200

3. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 3

Pivot setting target Target component
Electrode Chip condenser
1) Intended use : use for Chip condenser.
2) Conditions for automatic generation : a component with two pieces of lead whose direction is two-way.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
2 Y coordinate Individual pivot coord.
3 Direction Individual pivot angle Group 1
4 Up. limit of brightness 180
5 Low. limit of brightness 0
6 Up. limit of contrast 0
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value
1 ‘Offset Judgment Value NG X’ 1
2 ‘Offset Judgment Value NG Y’ 1
3 ‘Offset Judgment Value NG Theta’ 6
4 ‘Size change X min.’ 2 Size change (2-axes)
5 ‘Size change X max.’ 2
6 ‘Size change Y min.’ 2
7 ‘Size change Y max.’ 2
8 ‘Algorithm Code’ 3
9 ‘Color Frame’ I&I
10 ‘Search Threshold Value’ 50
11 ‘Search Step XY’ 2
Group 2
12 ‘Search Step  ’ 1
13 ‘Detected Land Judgment Value’ 50
Default search angle for step search
14 0
[°]
Default search threshold for step
15 75
search

1. Offset judgment warning values and offset judgment NG values: Set the following value
based on the component size.
No. Comp. type Judgment value
1 0402 70
2 0603 100
3 1005 170
4 1608 or over 200

2. Size change value: Set the following value based on the component size.
No. Comp. type Size change (max) Size change (min)
1 0402 60 -60
2 0603 100 -100
3 1005 100 -100
4 1608 or over 200 -200

3. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 4

Pivot setting target Target component
2-terminal (Aluminum electrolytic
Lead
capacitor)
1) Intended use : use for 2-terminal aluminum electrolytic capacitor.
2) Conditions for automatic generation : a component with two pieces of two-way leads.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 Coordinate X Individual pivot coord. Group 1
2 Coordinate Y Individual pivot coord.
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0
6 Up. limit of contrast 0
7 Low. Limit of contrast 0

② Inspection parameters
No. Item Set value
1 Offset judgment Value NG X 200
2 Offset judgment Value NG Y 200
3 Offset judgment Value NG  6
4 Size change X min -200
5 Size change X max 200
6 Size change Y min -200
7 Size change Y max 200 Size change (2-axes)
8 Algorithm Code 1
9 Color Frame I&I
10 Search Threshold Value 50
11 Search Step XY 2
12 Search Step  1
13 Detected Land Judgment Value 50
Default search angle for step search
14 0
[°]
Group 2
15 Default search threshold for step search 75

1. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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 NPM-DGS
2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 5

Pivot setting target Target component
Lead 2-terminal
1) Intended use : use for 2-terminal lead component. (Diode, etc.)
2) Conditions for automatic generation : a component with two pieces of lead whose direction is two-way.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
Group 1
2 Y coordinate Individual pivot coord.
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0
6 Up. limit of contrast 0
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value
1 ‘Offset Judgment Value NG X’ 200
2 ‘Offset Judgment Value NG Y’ 200
3 ‘Offset Judgment Value NG Theta’ 6
4 ‘Size change X min.’ -200
5 ‘Size change X max.’ 200
6 ‘Size change Y min.’ -200
7 ‘Size change Y max.’ 200 Size change (2-axes)
8 ‘Algorithm Code’ 1
9 ‘Color Frame’ I&I
10 ‘Search Threshold Value’ 50
11 ‘Search Step XY’ 2
12 ‘Search Step  ’ 1
13 ‘Detected Land Judgment Value’ 50
Default search angle for step search
14 0
[°]
15
Default search threshold for step
75
Group 2
search

1. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 6

Pivot setting target Target component
Lead 3-terminal
1) Intended use : use for 3-terminal lead component. (3-terminal transistor, etc)
2) Conditions for automatic generation : a component with three pieces of lead whose direction is two-way.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
2 Y coordinate Individual pivot coord.
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0 Group 1 Group 2
6 Up. limit of contrast 0
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value

Size change
1 ‘Offset Judgment Value NG X’ 200

(2-axes)
2 ‘Offset Judgment Value NG Y’ 200
3 ‘Offset Judgment Value NG Theta’ 6
4 ‘Size change X min.’ -200
5 ‘Size change X max.’ 200 Size change (2-axes)
6 ‘Size change Y min.’ -200
7 ‘Size change Y max.’ 200
8 ‘Algorithm Code’ 1
9 ‘Color Frame’ I&I
10 ‘Search Threshold Value’ 50
11 ‘Search Step XY’ 2
12 ‘Search Step  ’ 1
13 ‘Detected Land Judgment Value’ 50
Default search angle for step search
14 0
[°]
Default search threshold for step
15 75
search

1. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 7

Pivot setting target Target component
Lead 4-terminal & 5-terminal
1) Intended use : use for 4-terminal or 5-terminal lead component.
2) Conditions for automatic generation : a component with four or five pieces of lead whose direction is
two-way.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
2 Y coordinate Individual pivot coord.
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0
6 Up. limit of contrast 0 Group 1
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value
1 ‘Offset Judgment Value NG X’ 200
2 ‘Offset Judgment Value NG Y’ 200
3 ‘Offset Judgment Value NG Theta’ 6
4 ‘Size change X min.’ -200
5 ‘Size change X max.’ 200 Size change (2-axes)
6 ‘Size change Y min.’ -200
7 ‘Size change Y max.’ 200
8 ‘Algorithm Code’ 1
9 ‘Color Frame’ I&I
10 ‘Search Threshold Value’ 50
11 ‘Search Step XY’ 2 Group 2
12 ‘Search Step  ’ 1
13 ‘Detected Land Judgment Value’ 50
Default search angle for step search
14 0
[°]
Default search threshold for step
15 75
search

1. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 8

Pivot setting target Target component
Lead SOP
1) Intended use : use for SOP.
2) Conditions for automatic generation : a component with more than six pieces of lead whose direction is
two-way.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
2 Y coordinate Individual pivot coord.
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0 Group 1
6 Up. limit of contrast 0
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value
1 ‘Offset Judgment Value NG X’ 200
2 ‘Offset Judgment Value NG Y’ 200
3 ‘Offset Judgment Value NG Theta’ 6
4 ‘Size change X min.’ -200
Size change (2-axes)
5 ‘Size change X max.’ 200
6 ‘Size change Y min.’ -200
7 ‘Size change Y max.’ 200
8 ‘Algorithm Code’ 1
9 ‘Color Frame’ I&I
Group 2
10 ‘Search Threshold Value’ 50
11 ‘Search Step XY’ 2
12 ‘Search Step  ’ 1
13 ‘Detected Land Judgment Value’ 50
Default search angle for step search
14 0
[°]
Default search threshold for step
15 75
search

1. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 9

Pivot setting target Target component
Lead QFP
1) Intended use : use for QFP.
2) Conditions for automatic generation : a component whose lead direction is four-way.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
2 Y coordinate Individual pivot coord.
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0
Group 1
6 Up. limit of contrast 0
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value
1 ‘Offset Judgment Value NG X’ 200
2 ‘Offset Judgment Value NG Y’ 200
3 ‘Offset Judgment Value NG Theta’ 3
4 ‘Size change X min.’ -200
5 ‘Size change X max.’ 200
6 ‘Size change Y min.’ -200
7 ‘Size change Y max.’ 200 Size change (2-axes)
8 ‘Algorithm Code’ 1
9 ‘Color Frame’ I&I
10 ‘Search Threshold Value’ 50
11 ‘Search Step XY’ 2
12 ‘Search Step  ’ 0.2
Group 2
13 ‘Detected Land Judgment Value’ 50
Default search angle for step search
14 0
[°]
Default search threshold for step
15 75
search

1. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 10

Pivot setting target Target component
Lead Connector
1) Intended use : use for one-way lead components. (Connector, etc.)
2) Conditions for automatic generation : a component whose lead direction is one-way.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
Group 1
2 Y coordinate Individual pivot coord.
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0
6 Up. limit of contrast 0
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value
1 ‘Offset Judgment Value NG X’ 200
2 ‘Offset Judgment Value NG Y’ 200
3 ‘Offset Judgment Value NG Theta’ 3
4 ‘Size change X min.’ -200
5 ‘Size change X max.’ 200
1
6 ‘Size change Y min.’ 0
7 ‘Size change Y max.’ 0
8 ‘Algorithm Code’ 2
Size
9 ‘Color Frame’ I&I change
10 ‘Search Threshold Value’ 50 (1-axis)
11 ‘Search Step XY’ 2
12 ‘Search Step  ’ 0.2
13 ‘Detected Land Judgment Value’ 50
Default search angle for step search
14 0
[°]
Default search threshold for step
15 75
search
Group 2

1. Because of only 1-axis change, the size change value should be set to either X or Y, and set
[0] for the other one.

2. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 11

Pivot setting target Target component
Main body High-intensity component
1) Intended use : use when recognizing a component’s main body. (a component, the main body of which is
bright relative to a PCB)
2) Conditions for automatic generation : the presence of a component’s main body.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
2 Y coordinate Individual pivot coord.
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0
Group 1
6 Up. limit of contrast 0
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value
1 ‘Offset Judgment Value NG X’ 200
2 ‘Offset Judgment Value NG Y’ 200
3 ‘Offset Judgment Value NG Theta’ 6
4 ‘Size change X min.’ -200
5 ‘Size change X max.’ 200
6 ‘Size change Y min.’ -200
Size change (2-axes)
7 ‘Size change Y max.’ 200
8 ‘Algorithm Code’ 1
9 ‘Color Frame’ I&I
10 ‘Search Threshold Value’ 50
11 ‘Search Step XY’ 2
Group 2
12 ‘Search Step  ’ 1
13 ‘Detected Land Judgment Value’ 50
Default search angle for step search
14 0
[°]
Default search threshold for step
15 75
search

1. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Electrode 2
OFF Electrode

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2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Pivot automatic arrangement 12

Pivot setting target Target component
Main body Low-intensity component
1) Intended use : use when recognizing a component’s main body. (A component, the main body of which is
dark relative to a PCB)
2) Conditions for automatic generation : the presence of a component’s main body.
3) Details of data :
① Pivot property ③ Pivot arrangement and group
No. Item Set value
1 X coordinate Individual pivot coord.
2 Y coordinate Individual pivot coord.
3 Direction Individual pivot angle
4 Up. limit of brightness 180
5 Low. limit of brightness 0
Group 1
6 Up. limit of contrast 0
7 Low. limit of contrast 0

② Inspection parameters
No. Item Set value
1 ‘Offset Judgment Value NG X’ 200
2 ‘Offset Judgment Value NG Y’ 200
3 ‘Offset Judgment Value NG Theta’ 6
4 ‘Size change X min.’ -200
5 ‘Size change X max.’ 200
6 ‘Size change Y min.’ -200
7 ‘Size change Y max.’ 200
Size change (2-axes)
8 ‘Algorithm Code’ 1
9 ‘Color Frame’ I&I
10 ‘Search Threshold Value’ 50
11 ‘Search Step XY’ 2 Group 2
12 ‘Search Step  ’ 1
13 ‘Detected Land Judgment Value’ 50
Default search angle for step search
14 0
[°]
Default search threshold for step
15 75
search

1. Set the following value depending on your selection (ON / OFF) for step search.
Step search Algorism code
ON Outline 2 (Two-way)
OFF Outline (Two-way)

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 NPM-DGS
2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)
 Pivots editing in the inspection detail setting window
Button/Item Explanation
In component position inspection, the component appearance is captured by rough
recognition, and its precise position is detected by precise recognition. By pressing
these buttons, the pivot arrangement display of a teach view can be switched between
the rough recognition and the precise recognition mode. The PSM matching requires
pivots specifically set for both rough recognition and precise recognition, and each
recognition pivot requires the setting.
In component position inspection, if ‘Main’ results in NG, ‘Spare 1’ will be inspected,
and if it results in NG, ‘Spare 2’ will be inspected.
Up to two spares can be registered.
Spare is available by marking the check box of ‘Use spare 1’ or ‘Use spare 2’. Spare 2
is available only if spare 1 is used.
Data editing of Main/Spare1/Spare2 can be switched by selecting from the drop-down
list.
Four pivot sizes are available: large (L), medium (M), small (S) and ultra-small (SS)
Pressing each button switches the pivot sizes.
When the button is switched in a condition with the setup pivot selected, pressing the
button changes the size of the selected pivot.
When you turn ON the desired arrow button and click in the teach view, a pivot
corresponding to the arrow direction is added.
Pivot size is applied the one set by the above size selection.
Setup pivots must be registered in two groups. All pivots must belong to the group.
If you press the Group button with multiple pivots selected, the selected pivots are
registered for group 1 and the unselected pivots for group 2.
And if pressing the Ungroup button with a group selected, the selected group is
ungrouped.
You can undo the last action for pivots.
With the button ON, you can select pivots and groups by clicking or dragging.
With pivots or groups selected, pressing this button will delete them.
With multiple pivots selected, pressing this button will align them in the direction of the
arrow. Alignment of top, bottom, left and right from the left bottom
With pivots selected, pressing this button will move them in the direction of the arrow.
All pivots are selected.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

Button/Item Explanation
You can copy the pivot data.
Press [Copy], and then the pivot copy window will appear. Set your desired copy
function and press [Execute].
(1) To copy within main or spare
Click the radio button of copy within main (Copying within spare 1/copying
within spare 2) and select from the pull-down menu.
‘General->Accurate’: You can copy general pivot data to accurate one.
‘Accurate->General’: You can copy accurate pivot data to general one.
The copied pivot size is specified among [SS], [S], [M] and [L].
For normal case:
Select [S] for ‘General->Accurate’.
Select [M], for ‘Accurate->General’.
(2) To copy between main and spare
Click the radio button of copy between main and spare and select from the
pull-down menu.
Copying to a spare is selectable only if the check box of ‘Use Spare1’ or ‘Use
Spare 2’ is marked. Pivot data of both General and Accurate is copied.
‘Main->Spare 1’ :Copies from main to spare 1.
‘Main -> Spare 2’ : Copies from main to spare 2.
‘Spare 1-> Main’ :Copies from spare 1 to main.
‘Spare 1-> Spare 2’ :Copies from spare 1 to spare 2.
‘Spare 2-> Main’ :Copies from spare 2 to main.
‘Spare 2-> Spare 1’ :Copies from spare 2 to spare 1.

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2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)
 Pivots editing in the teach view
Bottom/Item Description
Align Left You can align all selected multiple pivots to the same coordinate
(horizontal direction only) as the far left pivot of the selected
pivots.
Align Right You can align all selected multiple pivots to the same coordinate
(horizontal direction only) as the far right pivot of the selected
pivots.
Align Top You can align all selected multiple pivots to the same coordinate
(vertical direction only) as the top pivot of the selected pivots.
Align Bottom You can align all selected multiple pivots to the same coordinate
Align/Distribute (vertical direction only) as the bottom pivot of the selected pivots.
Distribute You can place selected multiple pivots at regular intervals in a
Horizontally horizontal direction of the screen.
Distribute Vertically You can place selected multiple pivots at regular intervals in a
vertical direction of the screen.
Rotate Left 90° You can place selected multiple pivots at the coordinate rotating
90 degree to the left.
Rotate Right 90° You can place selected multiple pivots at the coordinate rotating
90 degree to the right.
Flip Horizontally You can flip selected multiple pivots horizontally.
Rotate/Flip Flip Vertically You can flip selected multiple pivots vertically.
Group Pivots you set must be registered in two groups. All pivots must
belong to a group.
Selected multiple pivots will be grouped as group 1 and
unselected pivots as group 2.
Ungroup You can ungroup a selected group.
Group
You can delete selected multiple pivots.

Delete
[Ctrl] key＋[c] key You can have selected multiple pivots memorized internally.
Copy You can copy internally memorized pivot data.
[Ctrl] key＋[v] key
With the pivots selected (multiple selections), pointing the mouse
on the pivot allows the cursor to change to the crosshair cursor
and be in the movement mode. In this state, as you move the
Position movement mouse, with right-clicking it, the selected pivots move
accordingly.

With multiple pivots selected, pointing the mouse to the edge of

the selected pivot allows the cursor to change to the arrow (right
Movement (equal and left/up and down) cursor and be in the equal space
space) movement mode. In this state, move the mouse, with
right-clicking it, the selected pivots move with equal space.

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2D Inspection Editor
2.4 Component Inspection Setting (Setting Inspection conditions Data)

 Set property of pivots.

1 Double-click the pivot.

 Set the property with the arrow button ( )

OFF.

 Pivot property is displayed. Set parameters.

1
2 Select pivots to reflect the set data
from among ‘All’, ‘Group’ and
‘Individual’
‘All’
Apply to all pivots for rough recognition or
precise recognition.

‘Group’
Apply to pivots belonging to the same
group

‘Individual’
Apply to one pivot only.

2 3 3 Click [OK].

 This concludes the pivot property window.

Item Description
Coordinate X X coordinates of pivots. Normally not input here because it is set on the screen.
Coordinate Y Y coordinates of pivots. Normally not input here because it is set on the screen.
Direction Angle of pivots. Normally not input here because it is set on the screen.
When evaluation values of pivots and an image are calculated and the following
condition does not meet the requirement, the calculation will be skipped.
Condition:
The average image value from the center to the tip of all pivots in the group
Brightness Upper
＞ Setting parameter (0 to 225)
Limit
Example:
Pivots are arranged to an electrode for a chip component. By inputting ‘200’ in
this parameter, the false recognition frequency of boundary line between cream
solder around the electrode and a PCB decreases.
Same as above but condition is different.
Brightness Lower Condition:
Limit The average pixel value from the end to the center of all pivots in the group
＞ Setting parameter (0 to 225)
Contrast Upper Limit Unused
When evaluations value of pivots and an image are calculated and the following
condition does not meet the requirement, the calculation will be skipped.
Contrast Lower Limit Condition:
The distribution of pixel value from the end to the tip of all pivots in the group
＞ Setting parameter (0 to 225)

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

② Setting the LUT

No LUT setting is required for the inspection for component position.

③ Setting the parameter

Set the parameters as necessary.

page2-43-1

Standard Upper-limit Lower-limit

Description Explanation Unit
value value value
‘Offset Judgement Threshold value to judge whether it is OK or NG. m 170.0 10000.0 0.0
Value NG X’ If the value is more than threshold, it is judged as
NG.
‘Offset Judgement Threshold value to judge whether it is OK or NG. m 170.0 10000.0 0.0
Value NG Y’ If the value is more than threshold, it is judged as
NG.
‘Offset Judgement Threshold value to judge whether it is OK or NG.  6.0 45.0 0.0
Value NG Theta’ If the value is more than threshold, it is judged as
NG.
‘Size change X min.’ Set the value that reduces X of the set pivots. m -100 500.0 -500.0
Normally minus (reduce) value is set in Xmin and
plus (enlarge) value is set in Xmax. Then an
image is recognized by scaling the shape of the
set pivots.
It is better not to enter larger value since it
increases the recognition process time. You
should enter the smaller value than tolerance.
 To change only one axis, enter 0 for the
unchanged direction.
‘Size change X max.’ Set the value that enlarges X of the set pivots. m 100 500.0 -500.0
Normally minus (reduce) value is set in Xmin and
plus (enlarge) value is set in Xmax. Then an
image is recognized by scaling the shape of the
set pivots.
It is better not to enter larger value since it
increases the recognition process time. You
should enter the smaller value than tolerance.
 To change only one axis, enter 0 for the
unchanged direction.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

Standard Upper-limit Lower-limit

Description Explanation Unit
value value value
‘Size change Y min.’ Set the value that reduces Y of the set pivots. m -100 500.0 -500.0
Normally minus (reduce) value is set in Ymin
and plus (enlarge) value is set in Ymax. Then
an image is recognized by scaling the shape of
the set pivots.
It is better not to enter larger value since it
increases the recognition process time. You
should enter the smaller value than tolerance.
 To change only one axis, enter 0 for the
unchanged direction.
‘Size change Y max.’ Set the value that enlarges Y of the set pivots. m 100 500.0 -500.0
Normally minus (reduce) value is set in Ymin
and plus (enlarge) value is set in Ymax. Then
an image is recognized by scaling the shape of
the set pivots.
It is better not to enter larger value since it
increases the recognition process time. You
should enter the smaller value than tolerance.
 To change only one axis, enter 0 for the
unchanged direction.
‘Algorithm Code’ (1) Electrode/Outline: The base method for Selection Electrode  
component recognition.
(2) **2: Electrode 2/Outline 2
The method to perform step search to
speed up the processing.
(3) **Two-way: Outline (Two-way)/Outline 2
(Two-way)
The method to perform component
recognition without thinking the pivot
direction (bright and dark).
(4) (PAD): Electrode (PAD)/ Electrode 2(PAD)
Unused
‘Color Frame’ Color space information used for rough Selection I&I I&I I&I
recognition and precise recognition.
Display: ◇&△
◇: Color image for rough recognition
△: Color image for precise recognition
These two are shown by ‘’H’’, ‘’S’’ and ‘’I’’.
H: An image of Hue in HSI image
S: An image of Saturation in HSI image
I: An image of Intensity in HSI image
 Select “I” for both rough recognition and
precise recognition.
‘Search Threshold When component position inspection is carried % 50.0 100.0 0.0
Value’ out, certainty is calculated by evaluation
values. Then, component position is decided by
the highest evaluation value.
If the highest value is smaller than the
threshold value, it is judged that no component
exists and the inspection results in NG.
‘Search Step XY’ Be sure to set ‘2’ dot 2.0 2.0 2.0
‘Search Step  ’ Step for the angle search  1.0 45.0 0.0
‘Detected Land Unused % 50 50.0 50.0
Judgment Value’
‘Initialized Search A parameter applied in case step search is  0 3.0 0.0
Angle Value’ selected in Algorithm Code.
([Search angle] of initial search)

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

Standard Upper-limit Lower-limit

Description Explanation Unit
value value value
‘Step Search A parameter applied in case step search is % 75 100.0 0.0
Judgment Value’ selected in Algorithm Code.
([Threshold value] of initial search)

④ Setting the lighting

Normally, inspection is carried out with the default setting of ‘Normal Lighting’
Individual lighting is used only when an image is difficult to recognize with normal lighting.
The individual lighting, when used, should be used as little as possible because it increases the
frequency of image taking and the processing time.

1 Select [Lighting] tab and click

[Individual Lighting].

 The list to set the four lighting values is

displayed.

page2-45-1

2 Select the box to change the lighting

value and enter the value.

3 After all values are set, click [OK].

 The inspection Advanced Setting window is

closed.

page2-45-2

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3. Inspection for flip-over

1 Select ‘Parts Reverse’ in the

‘Inspection Category List’ field on the
<Inspection Condition Detail Data>
screen, and click [Detailed Setting].

 The <Inspection Advanced Setting> screen is

displayed.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

① Setting the BOX set

For the inspection for flip-over, the inspection method (the inspection name) is 1BOX only.

1 Select the [BOX Setting] tab.

 The BOX appears on the component in the

teach view.

2 Move or scale the BOX using the

1 arrow buttons.

 The position and size information (mm) of the

2 BOX appear in .

 As necessary, change the amount (step

2 amount) of movement/scaling by one button
operation in .

 The position and size (mm) of this BOX are

set.
Colors are extracted in the BOX, and flip-over
is detected.
1

3 6

4 5
page2-47-1

 Items described by the lines, corresponding

each number, in the image are as follows.
 Component outside dimension (Design
value)
 Component’s electrode position (Design
value)
 BOX position and size
 Placement angle

: 0
: 90
: 180
: 90

Button Explanation
Moves the BOX position.
Each click moves it by one step.
Scales the BOX.
Each click scales it by one step.
Not used.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

② Setting the LUT

Because the inspection for flip-over targets chip resistors, the PCB-common LUT can be used.

1 Select the [LUT] tab, and click [Add].

 The <Select Method of Adding LUT> screen is

displayed.

page2-48-1

2 Check off ‘Add Common LUT of

PCB,’ and click [OK].

 The <PCB LUT Setting> screen is displayed.

2

3 Select the ‘Component’‘White’ data,

and click [OK].

Page2-35

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

③ Setting the parameter

Normally, leave it default.

page2-49-1

Standard Upper-limit Lower-limit

Description Explanation Unit
value value value
‘Judgement Threshold value to judge whether it is OK % 50.0 200.0 0.0
Value’ or NG.
Judgment value is set by % which is the
rate of the color-extracted part to the area
of the BOX
‘Algorithm Code’ Setting only for ‘component colors.’  Component  
Necessary to set the reverse side color of
a component to LUT

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

④ Setting the lighting

Normally, inspection is carried out with the default setting of ‘Normal Lighting’
Individual lighting is used only when an image is difficult to recognize with normal lighting.
The individual lighting, when used, should be used as little as possible because it increases the
frequency of the image taking and the processing time.

1 Select [Lighting] tab and click

[Individual Lighting].

 The list to set the four lighting values is

displayed.

page2-50-1

2 Select the box to change the lighting

value and enter the value.

3 After all values are set, click [OK].

 The inspection Advanced Setting window is

closed.

page2-50-2

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

4. Inspection for polarity

1 On the <Inspection Condition Detail

Data> screen, click an inspection
name field of ‘Polarity’ in the
‘Inspection Category List’ and select
an inspection type.

 Select an inspection name among from the

following six types.
1BOX
2BOX
4BOX
1 1BOX (Search)
2BOX (Search)
4BOX (Search)

2 Select ‘Polarity’ in the ‘Inspection

Category List’ and click [Detailed
Setting].

 The <Inspection Advanced Setting> screen is

displayed.
2

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

① Setting the BOX set

Select an inspection method (inspection name) among from the 6 types described above.

1 Select the [BOX Setting] tab.

 The BOX appears on the component in the

teach view.

2 If the inspection name is 1BOX

1 (Search), 2BOX (Search) or 4BOX
(Search), select either ‘BOX’ or
2
‘Range’ for a selection target.

 If an inspection name is 1BOX, 2BOX or

4BOX, the selection target is only ‘BOX’ so
3 that there is no selection of such as ‘BOX’ or
‘RANGE’.
2

3 Move, enlarge or reduce the BOX or

the search area using an arrow
1 button.

 The position and size information (mm) of the

BOX appear in .

 As necessary, change the amount (step

amount) of movement/scaling by one button
page2-52-1 operation in .

 The position and size (mm) of this BOX are

For 4BOX set.
Colors are extracted in the BOX, and polarity is
detected.
3

Button Explanation
Moves the whole BOX.
Each click moves it by one step.
Scales the whole BOX.
Each click scales it by one step.
Scales the distance between each BOX.
There may be two kinds of BOX: standard BOX  and other colored BOX. If you want
to change the positional relationship between the standard BOX and other BOX when
the standard BOX is arranged at the position with polarity, pressing this button changes
the relationship.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

② Setting the LUT

For the inspection for polarity, set the color of the polarity mark to the LUT.
If the color is extracted inside the standard BOX frame but not inside the other BOX frame in
2BOX or 4BOX, the polarity is judged correct.

1 Select the [LUT] tab, and click [Add].

 The <Select Method of Adding LUT> screen is

displayed.

page2-53-1

2 Check off ‘Create, Add LUT,’ and click

[OK].

 The <LUT Setting(2 Value)> screen is

displayed.

2
2

3 Set the LUT, and click [OK].

 For information about setting the LUT, see ‘3.

SETTING THE LUT.’

3
2-55-E

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

③ Setting the parameter

 Normal mode (Inspection name: 1BOX, 2BOX, 4BOX)

page2-54-1

 Search mode (Inspection name: 1BOX (Search), 2BOX (Search), 4BOX (Search))

page2-54-2

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

Upper-li Lower-li
Standard
Description Explanation Unit mit mit
value
value value
‘Judgement Threshold value to judge whether it is OK or % 50.0 200.0 0.0
Value’ NG.
Judgment value is set by % which is the rate of
the color-extracted part to the area of the BOX
‘Algorithm You can select between the direct judgment Selection Judge by  
Code’ and comparative judgment. direct
Direct judgment
1 BOX:
If standard BOX frame is equal to or more
than the criterion, it is judged as OK.
2 BOX, 4 BOX:
If standard BOX frame is equal to or more
than the criterion and also other BOX frames
are equal to or less than the criterion, it is
judged as OK.
 You need to set the color of the polarity mark
to the LUT.
Comparative judgment:
1 BOX:
Same as the one in direct judgment
2 BOX, 4 BOX:
The ratio of the two BOXs located diagonally
is calculated and if the standard BOX is the
highest ratio, it is judged as OK.
 You need to set the color of the polarity mark
to the LUT.
‘Search Num You can specify the number of times to move Number of 5 100 1
(X)’ the position within the search area (in X times
direction). (Equal pitch)
‘Search Num You can specify the number of times to move Number of 5 100 1
(Y)’ the position within the search area (in Y times
direction). (Equal pitch)

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

④ Setting the lighting

Normally, inspection is carried out with the default setting of ‘Normal Lighting’
Individual lighting is used only when an image is difficult to recognize with normal lighting.
The individual lighting, when used, should be used as little as possible because it increases the
frequency of the image taking and the processing time.

1 Select [Lighting] tab and click

[Individual Lighting].

 The list to set the four lighting values is

displayed.

page2-55-1

2 Select the box to change the lighting

value and enter the value.

3 After all values are set, click [OK].

 The inspection Advanced Setting window is

closed.

page2-55-2

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

5. Inspection for foreign body

1 Select ‘Foreign object’ in the

‘Inspection Category List’ field on the
<Condition Details> screen, and click
[Advanced].

 The <Inspection Advanced Setting> screen is

displayed.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

① Setting the BOX set

For the inspection for foreign bodies, the inspection method (the inspection name) is 1BOX only.

1 Select the [BOX Setting] tab.

 The BOX appears on the component in the

teach view.

2 Move or scale the BOX using the

arrow buttons.
1
 The position and size information (mm) of the
BOX appear in .
2 5
 As necessary, change the amount (step
amount) of movement/scaling by one button
2 operation in .

 The position and size (mm) of this BOX are

1 set. Colors are extracted in the BOX, and
polarity is detected.

 The foreign-body detection size (m)  is

also set to the BOX. Inspection for foreign
3 bodies is carried out by mesh.
3

3 Select the skip auto-setup button with

a mouse.
page2-61-1
 Set the inspection for component range
arranged under the shield case to be skipped
automatically.

 The skipped mesh is displayed in light yellow.

4 Manually set a mesh to be skipped.

 Select a mesh to be skipped with a mouse.

The selected mesh is displayed in light yellow.
Reselecting the target mesh with a mouse
releases the selected state.

5 Set a target for mesh information.

4  Select either points only or parts.

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Button Explanation
Moves the whole BOX.
Each click moves it by one step.
Scales the whole BOX.
Each click scales it by one step.

Not used.

Sets skip to meshes falling under the area where parts are placed.

Cancels skip to all meshes.

Sets skip to meshes in the circumscribed rectangle if the meshes with skip selected are
arranged in series.

Also sets skip to peripheral meshes with skip selected.

Setting target Explanation

‘Points’ Sets a mesh size and skip information for a mounting point.
‘Parts’ Sets a mesh size and skip information for entire parts.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

② Setting the LUT

The LUT for the inspection for foreign bodies should be common to PCBs.

1 Select the [LUT] tab, and click [Add].

 The <Select Method of Adding LUT> screen is

displayed.

page2-58-1

2 Check off ‘Add Common LUT of

PCB,’ and click [OK].

 The <PCB LUT Setting> screen is displayed.

2

3 Select the desired data, and click

[OK].
To select more than one data, follow the steps
below.
A) Select the desired data with a mouse. Then,
3 select the next desired data while pressing and
holding the Shift key. All the data in between
those data are also selected.
B) Select more than one data while pressing
and holding the Ctrl key. All the data selected in
this way are selected.
Page2-43
 The <Inspection Advanced Setting> screen is
displayed.

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4 Repeat steps 1–3 to register the

multiple LUT data.

page2-59-1

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③ Setting the parameter

page2-60-1

Standard Upper-limit Lower-limit

Description Explanation Unit
value value value
‘Judgement Threshold value to judge whether it is OK % 50.0 200.0 0.0
Value’ or NG.
Judgment value is set by % which is the
rate of the color-extracted part to the area
of the BOX
‘Algorithm Code’ PCB color or foreign body color can be Selection PCB  
set. Color
‘PCB Color’:
A foreign body NG occurs if the rate of
the set PCB LUT is equal to or less than
the criterion.
 You need to set the PCB color to the
LUT.
 This is a default setting.
‘Foreign Body Color’:
A foreign body NG occurs if the rate of
the set PCB LUT is equal to or more than
the criterion.
 You need to set the foreign body color
to the LUT.

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2.4 Component Inspection Setting (Setting Inspection conditions Data)

④ Setting the lighting

Normally, inspection is carried out with the default setting of ‘Normal Lighting’
Individual lighting is used only when an image is difficult to recognize with normal lighting.
The individual lighting, when used, should be used as little as possible because it increases the
frequency of the image taking and the processing time.

1 Select [Lighting] tab and click

[Individual Lighting].

 The list to set the four lighting values is

displayed.

page2-61-1

2 Select the box to change the lighting

value and enter the value.

3 After all values are set, click [OK].

 The inspection Advanced Setting window is

closed.

page2-61-2

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2.5 Checking Component Inspection

2.5 Checking Component Inspection

2.5.1 Debug Inspection (Debug Inspection Mode)
For the component inspection, a single piece of the selected component is inspected and the
detailed result is displayed. The inspection advanced setting can also be arranged.

 How to use the debug inspection

1 Select the desired component, and

select [Debug Mode] on the right-click
menu.

2-5004

 The debug inspection mode is displayed, and

debug inspection is carried out.

4
 The component data information and
inspection results are displayed.
 The inspection results, such as judgment
1 result and measured values, of the currently
selected inspection item (e.g. ‘Component
Presense’ as shown on the screen) are
3 displayed. In the case of inspection NG, they
2
are displayed in red. Table 3
 The step-operation icons are displayed.
Table 1
 The screen icons of the component debug
inspection mode are displayed. Table 2

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Table 1
Icon Name Explanation
Displays the next inspection results of those items currently selected
for inspection. When the inspection item has the information of more
Forward
than one inspection process (step), the information of the next
inspection process is displayed.
Displays the previous inspection results of those items currently
selected for inspection. When the inspection item has the information
Return
of more than one inspection process (step), the information of the
previous inspection process is displayed.
Forward to the Displays the next inspection results of those NG items currently
next NG selected for inspection.
Return to the Displays the previous inspection results of those NG items currently
previous NG selected for inspection.

Table 2
Icon Name Explanation
Exit Exits the debug inspection mode.

Re-inspect Carries out the debug inspection again.

Carries out the inspection of the same library for the selected
Library
component and displays its results.
inspection
The screen for library inspection is displayed.
Edit display The component data frame will be displayed/hidden.
 The function is under development and is not available for use.
Frame for body
The recognition frame for the position inspection of the component
recognition
body will be displayed/hidden.
 The function is under development and is not available for use.
Frame for lead
The recognition frame for the position inspection of the component
recognition
leads will be displayed/hidden.
Used to change the inspection method or adjust the BOX, pivots, LUT
and parameters. ( ‘2.4.6 Setting the Inspection Details’)
Inspection detail
In the debug inspection mode, the [Re-inspect] button in the inspection
setting
detail setting becomes active. Pressing the [Re-inspect] button carries
out the debug inspection again.
Displayed when the supplementary explanations for the inspection
Detail text
process of the currently selected inspection item are provided.
 The function is under development and is not available for use.
Judgment value
The judgment value and measured value will be displayed in a graph.
adjustment
You can adjust the judgment value.
Set the graphic display level for the teach view displayed as a result of
the debug inspection (output level: 0 to 3).
Debug level

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Table 3
Inspection item Name Explanation
Presence Result Displays the following inspection results.
OK / Not yet inspected / No component / inappropriate parameter / System
error
Area ratio [%] Displays the area ratio between the extraction area and BOX.
Position Result Displays the following inspection results.
OK / Not yet inspected / Position gap / Rotation gap / Size variance /
Inappropriate parameter / System error
Position gap X Displays the amount of displacement of the component detected.
[μm] (The amount of displacement of a component at an angle of 0 degree in the X
direction)
Position gap Y Displays the amount of displacement of the component detected.
[μm] (The amount of displacement of a component at an angle of 0 degree in the Y
direction)
Measure angle Displays the amount of shift in the measurement angle of the component
[°] detected.
Size change [μm] Displays the amount of X size error of the detected component.
(The amount of X size error of a component at an angle of 0 degree in the X
direction)
Size change Y Displays the amount of Y size error of the detected component.
[μm] (The amount of Y size error of a component at an angle of 0 degree in the Y
direction)
Evaluation value Displays the matching evaluation value (in the range of 0 to 100).
Position gap X Displays the amount of displacement of the detected component.
(PCB coordinate (The amount of X-directional displacement in the PCB coordinates)
system) [μm]
Position gap Y Displays the amount of displacement of the detected component.
(PCB coordinate (The amount of Y-directional displacement in the PCB coordinates)
system) [μm]
Flip-over Result Displays the following inspection results.
judgment OK / Not yet inspected / Reverse / Inappropriate parameter / System error
Area ratio [%] Displays the area ratio between the extraction area and BOX.
Polarity Result Displays the following inspection results.
OK / Not yet inspected / No polarity / NG polarity / Undeterminable /
Inappropriate parameter / System error
Area ratio Displays the area ratio between the extraction area and BOX1.
(BOX1-based) [%]
Area ration Displays the extraction area and BOX2.
(BOX2) [%] (Displayed when performing a debug inspection by means of 2BOX
inspection or 4BOX inspection)
Area ratio Displays the area ratio between the extraction area and BOX3.
(BOX3) [%] (Displayed when performing a debug inspection by a means of 4BOX
inspection.)
Area ratio Displays the area ratio between the extraction area and BOX4.
(BOX4) [%] (Displayed when performing a debug inspection by a means of 4BOX
inspection.)
(BOX1) / (BOX3) Displays the diagonal BOX.
[%] (Displayed when performing a debug inspection by means of 4BOX
inspection.)
(BOX2) / (BOX4) Displays the diagonal BOX.
[%] (Displayed when performing a debug inspection by means of 4BOX
inspection.)
(BOX1) / (BOX2) Displays the ration between BOX1 and BOX2.
[%] (Displayed when performing a debug inspection by means of 2BOX
inspection.)
Foreign object Result Displays the following inspection results in each mesh.
OK / Not yet inspected / Foreign object existence / Inappropriate parameter
/ System error
Area ratio [%] Displays the area ratio between the extraction area and BOX.

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2.5.2 Foreign Matter Skip Setting during Debug Inspection

ON/OFF of skip is set to an arbitrary mesh during foreign matter inspection.

1 On the debug inspection result list,

right-click a mesh and select a
desired operation from the right-click
menu.

 The setting is configured according to the list

below.

page2-70-1

Menu Description
Sets skip to all meshes which result in NG during debug
Skip ON to NG
inspection.
From the debug inspection result, sets skip to a mesh selected by
Skip ON to selected
the mouse.
From the debug inspection result, cancels skip to a mesh
Skip OFF to selected
selected by the mouse.
Skip OFF to all Cancels skip to all meshes.

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2.5.3 Sample Analysis

The saved component images (sample images) are inspected. A sample image is an image that
is manually saved by choosing the data or is an inspected image automatically saved during
production.

 How to save a sample image

A) Saving an image on the edit screen

To carry out a sample analysis, use the existing production PCB images. A sample image is
saved by choosing [Save Image] on the right-click menu displayed over the desired component.
( ‘4.2.5 Pop-up Menu with Component Selected’)

B) Saving an NG image during production

During production, the inspection BOX automatically saves an image of the component judged
NG as a sample image. It will be saved in the standard condition automatically.
 The inspection BOX, which is a unit connected to the machine’s main unit, is a function that
inspects the images taken on the machine’s main unit.

C) Saving a specified image during production

Every component image that has been specified in advance is saved during production.

1 Check off [Image] in the ‘Inspect’ field

of ‘Detail Setting’ for the component
data to specify the desired component
to save sample images.
( ‘4.2.5 Pop-up Menu with Component
Selected’)

 The <Preparation> screen is displayed.

1
4-2023

2 Before starting the production, check

off ‘Save specified image’ on the
operation preparation screen of the
inspection BOX.

 To perform above operations, the inspection

BOX requires the display and mouse
connected to it.
Every time the machine’s power is turned OFF,
the ‘Save specified image’ checkbox returns to
the default state (unchecked). To save the
specified image, check it off every time after
the power to the machine is turned ON.

2
2-5003

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 How to use the sample analysis

1 Select ‘Sample Analysis’ under ‘Edit’
on the menu.

 The screen changes to the sample analysis

mode, and a list of sample images saved in
the inspection BOX is displayed in the list
view.
4-1003
1
( ‘4.1.2 Edit (Data Edit)’)
( ‘4.2.5 Pop-up Menu with Component
Selected’)

2 Select the desired data, and

right-click it.
a) Read Image
Loads the images of the target data.
b) Debug Mode
Carries out the debug inspection on the loaded
images. The procedure of debug inspection is
the same as that of the inspection on the regular
edit screen. [Component Inspection] carries out
the inspection for multiple data selected in the
2 list view and displays its results on the ‘Result’
column in the list view.
( ‘2.5.1 Debug Inspection (Debug
Inspection Mode)’)
b) c) Delete
2 Deletes the selected sample image. The deleted
a) sample image cannot be restored.
 Sample images will remain saved on the hard
d)
disk of the inspection BOX unless they are
c) deleted. When the available space of the hard
disk is running out, the device cannot be
operated. You are recommended to perform
periodic maintenance.
d) True NG Input
Displays the <True NG enter> screen. The
entered information is displayed on the ‘True
NG’ column in the list view.

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3 Select ‘End Sample Analysis’ under

‘Edit’ on the menu, or click ‘End.’

 This concludes the sample analysis.

3
 The sample image data displayed on the list
view in the sample analysis mode can be set
with ‘Extract Condition.’ Table 1

2-7009

 To delete the sample image data collectively,

set the conditions with ‘Maintenance.’ The
corresponding files will be deleted after
confirming the message showing the number
of files to be deleted. Table 2

2-7010

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Table 1
Item Description
Specifies the name (lot name) of sample image data to be
Data Name Setting
extracted.
Date Setting Specifies the saved date of sample image data to be extracted.
 A function under development, so it is not available.
True NG Entered Specifies the status of true NG information entered in sample
image data to be extracted.
Specifies the component library of sample image data to be
Select Library
extracted.
Used in extracting sample image data from any specific folder
other than the image folder being set by LWS or PPD.
Image Folder
The image folder settings for ‘Extract conditions’ and ‘Maintenance’
are common.

Table 2
Item Description
Specifies the name (lot name) of sample image data to be
Data Name Setting
maintained.
Date Setting Specifies the saved data of sample image data to be maintained.
 A function under development, so it is not available.
True NG Entered Specifies the status of true NG information entered in sample
image data to be maintained.
Specifies the component library of sample image data to be
Select Library
maintained.
Used in maintaining sample image data from any specific folder
other than the image folder being set by LWS or PPD.
Image Folder
The image folder settings for ‘Extract conditions’ and ‘Maintenance’
are common.

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2.5 Checking Component Inspection

2.5.4 Library Inspection

In the debug mode, same components are inspected and the result is displayed.

1 Select the library inspection in the

debug mode
( ‘2.5.1 Debug Inspection (Debug
e) d) c) b) Inspection Mode) ’)

 Same component library is inspected and the

result is displayed.

 Specific component debug can be inspected

a) from the result list. For example, you debug a
component resulted in NG and arrange the
inspection data.

 If debug inspection is carried out from the

library inspection, you cannot re-inspect the
library inspection from the debug inspection.

a) List of library inspection

b) Inspection result
①OK: Shows the list of OK components
②NG: Shows the list of NG components
③OK&NG: Shows the list of both OK and
NG components
c) Debugs components selected in the list
d) Carries out the debug inspection again
e) Exits the debug inspection mode

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2.6 Setting Solder Inspection (Setting Solder Judge Library)

2.6 Setting Solder Inspection (Setting Solder Judge

Library)
Set the solder judge library for solder data.

2.6.1 Setting LUT common to PCBs

Before setting the solder judge library, set the LUT common to PCBs, which is commonly used in
each solder judge library setting. For the description about LUT, refer to ‘3.1 LUT Summary.’
Specifically, edit LUT usually used in the solder inspection.

NOTICE
The use of the LUT common to PCBs for setting the LUT of each solder judge library
allows you to set LUT effectively.

1 Click on the PCB frame (the outmost

frame) in the teach view, and select
PCB data.

2 From the pop-up menu displayed by

right-clicking, select [Set LUT
[Solder].

 The pop-up menu is displayed even by

right-clicking on the PCB list.

1  <LUT Setting for All PCB (Multivalue)> screen

is displayed.

2
2-6001

 If edited or added, the 2D inspection editor

would retain the edits or additions. Changes
made would be reflected, when used next
time.

2-6002

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2.6 Setting Solder Inspection (Setting Solder Judge Library)

 PCB LUT used in the solder inspection

Edit LUT using the image of the PCB on which solder is printed.

1 Select LUT data commonly used in

each solder judge library from the lost,
and then click on [LUT Setting].

 <LUT Setting (Multivalue)> screen is

1 displayed.

2-6002
1

2 Set LUT, and click on [OK].

 For setting LUT, refer to ‘3. Setting LUT.’

2-6003 2

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2.6 Setting Solder Inspection (Setting Solder Judge Library)

 Simplified checking of the LUT color extract condition

Regarding the LUT setting (Multivalue) of the LUT data selected on LUT setting (Multivalue) in
the PCB-Common, you can simply check the color extract condition of the image using the LUT
setting value in the teach view.
This function is used for checking the brief recognition condition (color extract condition) of
solder. If you want to check the detailed condition, carry out “Solder inspection”.
( ‘2.7 Checking Solder Inspection’)

1 Mark the checkbox of ‘Simplified

Color Extract Preview’ on LUT
Settings (Multivalue).

 In the PCB images displaying in the teach

view, the color-extracted parts in LUT Settings
are painted out.

 The Simplified Color Extract Preview is

executable only when the data is the LUT
setting (Multivalue) of the LUT data selected
on LUT Settings (Mlutivalue) in
PCB-Common.
1
 The display range of color-extracted part is 30
mm × 30 mm.
2-6008

2-6009

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2.6 Setting Solder Inspection (Setting Solder Judge Library)

2.6.2 Setting Solder Judge Library

The solder judge library is required to set to all the solder data, which is needed for the
inspection.
To perform the solder inspection for the solder data to which the solder judge library is not set, a
new solder judge library needs to be set.
The solder judge library is ordinarily set to use data created with the gerber converter.

A) Registration of a solder judge library

A judge library set to solder data needs to be registered in the [Solder Judge] tab. Upon initial
start-up, a default solder judge library is registered.

1 Click on the right mouse button on the

[Solder Judge] tab, and select [Add]
from the pop-up list.

 A solder library is added to the list.

 The LUT setting and the advanced setting

should be configured for a solder judge library
added newly. For more information on how to
set, refer to ‘4.3.7 Solder judge list.’

2-6004

2-6005

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2.6 Setting Solder Inspection (Setting Solder Judge Library)

B) Setting to solder data

1 Select solder data, to which the solder

judge library is set, from the [Solder]
tab of the list.

1
2
2 Double-click on ‘Solder Judge Library
Name,’ and select a solder judge
library which is set to solder data.

 The solder judge libraries registered in the

[Solder Judge] tab are displayed in the combo
box of the solder judge library name field.

2-6006

 The solder judge library setting can be

changed through the ‘Solder Details Data’
setting. The solder judge library setting for the
selected solder data can be changed
collectively in the Solder Details Data setting.

2-6007

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2.7 Checking Solder Inspection

2.7 Checking Solder Inspection

2.7.1 Solder inspection (Solder inspection mode)
For the solder inspection, the selected solder is inspected and the detailed result is displayed.
And you can also arrange the judgment value of the solder judge library advanced setting.

 The use of solder inspection

1 After selecting given solder, open the

menu by right-clicking and select
[Solder Inspection].

2-7008

 Switching to the solder inspection mode, the

solder inspection is performed.

 Immediately after performing the solder

inspection, the filled image of the solder area
eventually extracted is displayed. If you check
any process midway through the solder
inspection processing, click on [Return].

 You can also check for the land inspection in

the same way as above stated.

 Information (name) on solder judge library

3 used in the solder inspection displayed is
displayed.
 The inspection result (the measurement
value and judgment value) of solder selected
1 from the solder inspection result list in the
output view is displayed. If the inspection
result exceeds the warning judgment
threshold value, the background is displayed
2 in yellow. If it exceeds the NG judgment
threshold value, the background is displayed
in red. The judgment values can be changed
2-7001
numerically.
Icons on the solder inspection mode screen
are displayed. Table 1

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2.7 Checking Solder Inspection

Table 1
Icon Name Description
Switches information (graphic display) on the inspection processing
process of the inspection items (solder recognition and bridge
Proceed recognition) currently selected. By clicking the button, process
information following the inspection processing process information
currently is displayed.
By clicking the button, process information prior to the inspection
Return
processing process information currently is displayed.
End Ends the solder inspection mode.

Re-inspection Performs the solder inspection again.

Adjusts the LUT setting configured for the ‘Solder Judge Library’
LUT setting which is linked to the solder selected from the solder inspection result
list displayed in the output view. The LUT setting window is displayed.
Edit display Displays or hides the solder frame as an example.
Solder
Displays ‘Solder inspection (solder recognition)’ graphically.
recognition
Bridge
Displays ‘Solder inspection (bridge recognition)’ graphically.
recognition

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2.7 Checking Solder Inspection

2.7.2 Sample Analysis

Inspections are performed on the saved solder images (sample images). The sample image
includes the data manually selected and saved, or the image inspected during production and
then saved automatically.

 How to save the sample image

A) Saving the image on the edit screen

To perform a sample analysis, use the image of the production PCB saved previously. Select
solder, and then select [Image Save] from the right-click menu. The sample image of the
selected solder is saved. ( ‘4.2.6 Pop-up Menu with Solder Selected’)

B) Saving the NG image during production

The Inspection BOX can automatically save a solder image, which was judged as NG during
production, as a sample image. The image is saved automatically in the normal condition.
 The Inspection BOX, composed of a function to inspect the images taken on the machine, is a
unit connected to the machine’s main body.

C) Saving the specified image during production

The solder image, specified in advance by you, can be saved during production each time.

1 To specify the solder, of which the

sample image is saved, check the
check box of [Image] on ‘Inspection’
of ‘Solder Details Data.’

( ‘4.2.6 Pop-up Menu with Solder

Selected’)

4-2029

2 Before starting production, check the

check box of ‘Save Specified Image’
on the Preparation screen of
Inspection Box.

 To perform the above-described operation, a

display and mouse should be connected to
the inspection BOX.
The checkbox status of ‘Save Specified Image’
is restored to the initial status (OFF) by turning
OFF the machine. Configure the setting for
Save Specified Image each time you turn ON
the machine.
2
2-7002

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2.7 Checking Solder Inspection

 How to use the sample analysis

1 Select ‘Sample Analysis’ of ‘Edit’ in
the menu.

 After switching to the sample analysis mode,

the list of the sample images saved in the
Inspection Box is displayed in the list view.

1 ( ‘4.1.2 Edit (Data edit)’)

4-1003
( ‘4.2.6 Pop-up Menu with Solder
Selected’)

2 Select data to be analyzed, click the

right mouse button.

 The pop-up menu is displayed.

a) Read Image
Reads the image of the data portion.
b) Solder Inspection
You can perform the debug inspection on the
2 solder read. The debug inspection is used with
2-7003 the same method as the standard edit screen
inspection. ( ‘2.7.1 Solder inspection
(Solder inspection mode)’)
c) Delete
Deletes the selected sample image. The sample
b) image cannot be restored once deleted.
 The sample image remains in the hard disk of
2 a)
the Inspection BOX unless deleted. If hard disk
c)
free space runs out, the operation cannot be
2-7004
performed. It is recommended that you perform
periodic maintenance.

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2.7 Checking Solder Inspection

3 Select ‘Analysis End’ of ‘Edit’ in the

menu, or click on ‘End.’

3  The sample analysis ends.

 Sample image data displayed in the list view

of the sample analysis mode can be set in
‘Extract Condition.’ Table 1

2-7003

2-7005

 If you want to delete the sample image data

collectively, set the condition in ‘Maintenance.’
So, the number of files to be deleted is
displayed and deleted. Table 2

2-7006

2-7007

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2.7 Checking Solder Inspection

Table 1
Item Description
Specifies the name (lot name) of sample image data to be
Data Name Setting
extracted.
Data Setting Specifies the saved date of sample image data to be extracted.
Used in extracting sample image data from any specific folder
other than the image folders being set by LWS or PPD.
Image Folder
The image folder settings for ‘Extract conditions’ and ‘Maintenance’
are common.

Table 2
Item Description
Specifies the name (lot name) of sample image data to be
Data Name Setting
maintained.
Data Setting Specifies the saved date of sample image data to be maintained.
Used in maintaining sample image data from any specific folder
other than the image folders being set by LWS or PPD.
Image Folder
The image folder settings for ‘Extract conditions’ and ‘Maintenance’
are common.

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2.8 Setting APC Conditions

2.8 Setting APC Conditions

2.8.1 APC Feedforward
When the APC system (option) function is used, APC conditions can be set per PCB or per
placement point.

A) APC condition setting per PCB

To enable mounting by APC feed forward, ‘FF Mount Control’ must be set to ‘ON’.
Also, to enable the part inspection using APC feed forward, set ‘FF Inspection Control’ to ‘ON’.

1 Select the [PCB] tab in the list.

1 2 Select the [Advanced] on the pop-up

menu shown by right-clicking the list.

 The <PCB Details> screen is displayed.

2-8003

3 Select the [APC Data] tab.

3 4 Double-click the Setting Value of ‘FF

Mount Control’ and select ‘ON’.

 To enable part inspection by APC feed

4 forward, set the Setting value of ‘FF
Inspection Control’ to ‘ON’ as well.

5 Click [OK].

 The edit result is reflected and the <PCB

Detail Data> window closes.

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2.8 Setting APC Conditions

B) APC condition setting per placement point

To enable mounting by APC feed forward, ‘FF Mount Control’ must be set to ‘ON’ after selecting
the part to perform ACF feed forward.

1 Select the [Component] tab in the list.

1 2 Select the desired part data to

perform APC feed forward and select
the [Advanced] on the pop-up menu
shown by right-clicking.

 The <Component Detail Data> screen is

2 displayed.

2-8005

3 Select the [APC Data] tab.

3 4 Double-click the Setting Value of ‘FF

Mount Control Direction’ and select
‘ON’.
4
5 Click [OK].

 The edit result is reflected and the

<Component Detail Data> window closes.

2-8006

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2.8 Setting APC Conditions

2.8.2 APC Feedback

When the feedback function of the APC system (option) is used, the print control must be set to
‘ON’.

A) APC condition setting per PCB

To enable mounting by APC feed forward, ‘FF Mount Control’ must be set to ‘ON’.
Also, to enable the part inspection using APC feed forward, set ‘FF Inspection Control’ to ‘ON’.

1 Select the [PCB] tab in the list.

1 2 Select the [Advanced] on the pop-up

menu shown by right-clicking the list.

 The <PCB Details> screen is displayed.

2-8003

3 Select the [APC Data] tab.

3 4 Double-click the Setting Value of ‘FB

Print Control’ and select ‘ON’.

5 Click [OK]

 The edit result is reflected and the <PCB

Detail Data> window closes.

2-8004

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2.9 Land Inspection

2.9 Land Inspection

When APC performs the component mounting with transfer method, inspections are required for
the land of transferring components.
The land inspection can be performed by utilizing the solder inspection scheme.
Create the data with the gerber converter, arranged in accordance with ‘solder data,’ on the land
of transferring components, on which solder is not printed. ( Operating manual Gerber
Converter)
Configure both the solder judge library setting and the setting of the LUT of the land color to
extract the land for the arranged ‘solder data’ as previously explained. By doing so, the land area
and position can be measured.
And also the following settings (confirmation) are required for the land inspection to be
performed properly.

A) Change in Placement Base

Set to ‘Land’ ‘FF Placement Base’ of the setting items listed on [APC Data] tab of ‘Component
Detail Data’ about transfer mount components.

2-8001

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2.9 Land Inspection

B) Confirming Shape Type

Change the ‘Shape Type’ setting on the advanced screen of ‘Solder Data,’ on which the land
inspection is performed, according to the land shape.

2-8002

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2.10 Placement Skip Condition Setting (Placement Skip for NG Inspection)

2.10 Placement Skip Condition Setting (Placement Skip

for NG Inspection)
Configure the setting that controls whether NPM located downstream of inspection
head-mounted equipment skips component placement.

 Component inspection
In component inspection, you can skip placement operations with respect to those components
that have been judged as NG during a foreign body inspection or that priorities have been
assigned to by the relative priority.

No. Component inspection Component being skipped

1 When judged NG by foreign body inspection Skips the component judged as NG by
foreign body inspection
2 When, with respect to a component to which the Skips placement of the component
relative priority is assigned by the placement designated as a component to be placed
priority method, an inspection reveals that the later by the relative priority of the placement
component is NG after placement of the one priority method
being placed earlier than it.

 The placement skip control during a component inspection is intended to be exercised over
equipment downstream of an inspection head-mounted machine. The skip control above can be
exercised over the rear head of an inspection head-mounted machine, regardless of the skip
control setting.

 Solder inspection
In solder inspection, with respect to solder judged as NG in the inspection, you can skip
placement operations on a per-PCB / pattern basis. The basis or unit used for skipping
operations is determined by the operation mode of the applicable solder inspection.

No. Solder inspection mode Skip unit

1 Placement after inspecting all solder Skips placement by the PCB
2 Placement per pattern after inspecting all solder Skips placement by the pattern
3 Solder inspection immediately before placement Skips placement by the component

 Placement skip control setting

When you enable the placement skip option according to the inspection NG result, turn ON the
skip control setting. It is turned ON by default; so, turn if OFF if you do not perform the skip
control.
1 Select the [PCB] tab in the list.

1
2 Select the [Advanced] on the pop-up
menu shown by right-clicking the list.

 The <PCB Details> screen is displayed.

2-87-E

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2.10 Placement Skip Condition Setting (Placement Skip for NG Inspection)

3 Select the [APC Data] tab.

3 4 Double-click the Setting Value option

of ‘FF Skip Control’, and select ‘ON’.

 It is set to ON for both the component and

solder inspections by default.

4
5 Click [OK]

 The edit result is reflected and the <PCB

Detail Data> window closes.

2-88-E

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2.10 Placement Skip Condition Setting (Placement Skip for NG Inspection)

= MEMO =

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3. SETTING THE LUT

This chapter describes how to set the LUT to be used for inspection.

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3.1 Outline of LUT

3.1 Outline of LUT

The HSI color system is used as a color showing method (a color system) in this machine.
The HSI color system represents color with hue (H), saturation (S), and intensity (I).

1. Hue
This is an attribute of “hue,” showing the differences of color such as red, yellow, green, and blue
with values 0–255.
The hue is shaped like a ring, so 0 and 255 show the same color.

0 127 Hue 255

2. Saturation
This shows the vividness of color with values 0–255.
Such colors as white, gray, and black have no vividness, so the saturation is 0.

3. Intensity
This shows the brightness of color with values 0–255.
The highest one is white (255 in intensity), and the lowest one is black (0 in intensity).

255

Intensity

127

255 127 0 127 255

Saturation Saturation

 What is the LUT (Lookup table) of color?

The LUT is to memorize the color of PCBs and components in the range of each value of H, S,
and I.
For instance, for the inspection for component presence, it is necessary to judge whether the
color in the inspection BOX is the PCB color (missing error) or the component color (component
placed, OK). In this instance, preset the LUT of the PCB color; for example, preset H to 145 to 155,
S to 30 to 60, and I to 60 to 120.
During the inspection, all pixels in the inspection BOX are checked to see whether each of H, S,
and I is in this range. When all of H, S, and I are in that range, the pixel is judged to be the PCB
color. If the number of pixels judged to be the PCB color has exceeded the rate set as a criterion
to all the pixels in the inspection BOX, it is judged missing.

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3.2 How to Set LUT (Binary)

3.2 How to Set LUT (Binary)

1 2

3-3(1)-E

① The range to be set to the LUT is displayed for each of H, S, and I.

 The upper limit and the lower limit of the set

range are displayed in a white line.
d
 You can adjust the range by clicking and
c dragging this white line right and left.

b a a Upper limit of range

b Lower limit of range
c Histogram
d Range changeable by clicking and dragging
the white line

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3.2 How to Set LUT (Binary)

 It is possible to display the histogram of the

pixels in the range specified by clicking and
dragging on the image in the teach view.

 You can adjust the upper limit and the lower

limit of the set range using the histogram as
reference.

NOTICE
The color varies slightly with the PCB position and so on. Especially when configuring
the LUT of the PCB color, attempt to click and drag at various locations on PCBs to
display the histogram, and then check to be sure that the upper and lower limits of the
range are proper.

② The range of the set H, S, and I are displayed with colors.

③ The range of the set H, S, and I are displayed with values. It varies with the upper and lower values of
the range .
You can also type the values directly.

④ By checking the ‘Preview’ check box, the area being extracted using the set H, S, and I will be colored
for display. The affected area corresponds to the size you have specified using the pull-down menu
(1cm / 3cm / 5cm) of “Area Size’.

3-4-JEC

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3.3 How to Set LUT (Multiple Values)

3.3 How to Set LUT (Multiple Values)

1 2

4
3-5(1)-E

① The range to be set to the LUT is displayed for each of H, S, and I.

b c  The starting and ending points of the set range

are displayed.

 You can adjust the range by clicking and

e dragging these starting and ending points right
f
and left.

a Gray Start
b 255Start
c 255End
d Gray End
e Histogram
f Starting and ending points are changeable
by clicking and dragging the white circle
near the white line

② The range of the set H, S, and I are displayed with colors. The range from Gray Start to Gray End,
and the one from 255Start to 255End are displayed separately.

③ The range of the set H, S, and I are displayed with values. This range varies working with the Gray
Start, 255Start, 255End and Gray End of the  range. You can also type the values directly.

④ By checking the ‘Simplified Color Extract Preview’ check box, the area being extracted using the set
H, S, and I will be colored for display.

 The LUT of the solder color is set in the solder inspection. The LUT (Multivalue) settings are used
to configure the setting for the intermediate color of solder.

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3.3 How to Set LUT (Multiple Values)

= MEMO =

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4. DETAILS OF EDIT SCREEN

This chapter explains the edit screen in detail.

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4.1 Menu Bar

4.1 Menu Bar

The menu bar on the edit screen is described here.

4-1001

4.1.1 File (File Operation and Primary Functions)

4-1002

[Edit]: Operation
Explanation
Menu name icon
Exits the 2D inspection editor. The changes made on the edited production
[Cancel Exit] –
data will not be reflected.
Saves the changes made on the edited production data and exits the 2D
[Save Exit] –
inspection editor.

4.1.2 Edit (Data Edit)

4-1003

[Edit]: Operation
Explanation
Menu name icon
[Sample Analysis] Enters the sample analysis mode.
[End Analysis] – Exits the sample analysis mode to the usual edit screen.

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4.1 Menu Bar

4.1.3 View (Data View)

4-1005

4-1004

4-1006

[View]: Operation
Explanation
Menu name icon
With this icon ON, the data selected on the list is displayed in the
[Synchronize Image]
teach view synchronously.
Enables/Disables compensation for the current image.
Compensation OFF:
Displays the production data at the original coordinates without the
coordinate compensation by mark recognition.
[Correction] Compensation ON:
Displays the production data on the basis of the result of the
coordinate compensation by mark recognition.
The debug inspection is carried out at the coordinates where the
production data is displayed.
Enables/Disables the display of the capture area of the inspection
[Scan Area Display]
head.
[Scan Area Displays the capture area of the inspection head during
[Auto]
Display Method] production.
[Zoom In] Increases the magnification of the teach view by one level.
[Zoom Out] Reduces the magnification of the teach view by one level.
Sets the magnification of the teach view to the specified
[4x], [2x], [1x], magnification.
[1/2x], [1/4x], – The same magnification means the display where one pixel of the
[1/8x] monitor corresponds to that of the image. Other magnifications are
[Scale] based on the same magnification.
Sets the magnification of the teach view to the same magnification
[1x Image]
(100%).
[PCB Image]
Sets the magnification of the teach view so that the entire PCB
may be displayed. (The magnification varies with the PCB size.)
Sets the magnification of the teach view so that the entire
[Component
Image] component selected may be displayed. (The magnification varies
with the component size.)

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4.1 Menu Bar

4.1.4 Configuration (System Configuration)

4-1007

[Configuration]:Menu Operation
Explanation
name icon
[Machine
Configure the machine setting
Configuration]

1 Configure the respective settings, and

click on [OK].

 Edits are reflected, and then <Machine

Configuration Setting> window is closed.

 For the setting items, see the following table.

4-1008

Setting items for machine configuration

Item Explanation
Machine type Machine type is displayed.
‘Preparation machine’ is the only option and cannot be changed.
Head code Head type is displayed.
‘2D inspection head’ is the only option and cannot be changed.
Set Edit Target Switches edited inspections (‘Inspect parts’ and ‘Solder inspection’).
Unchangeable if either of the two inspections is editable.
When Set Edit Target is ‘APC Setting’, ‘Inspect parts’ is shown and you are not
allowed to change.
Language The language used in the 2D inspection editor is selected.

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 NPM-DGS
2D Inspection Editor
4.1 Menu Bar

[Configuration]:Menu Operation
Explanation
name icon
[Environment Setting] Sets the display color used in the 2D inspection editor.

1 Click on [Color].

 <Color> window is displayed.

4-1009

2 Double-click on the Part to specify, for

which you want to set the color.

4-1010

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 NPM-DGS
2D Inspection Editor
4.1 Menu Bar

 <Edit Colors> window is displayed.

3 Specify the color, and click on [OK].

 <Edit Colors > window is closed.

4-1011

4 Click on [OK].

 Make sure that the color specified in <Colors>

window is reflected on the system, and then
click on [OK].

4-1010
4

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 NPM-DGS
2D Inspection Editor
4.1 Menu Bar

4.1.5 Maintenance (System Maintenance)

4-1012

[Maintenance]: Operation
Explanation
Menu name icon
You can switch the operation level of the 2D inspection editor.
Production data is edited at the engineer level (operation level 2) or higher.
[Password]
Normally, the 2D inspection editor does not require this function.

1. Changing the operation level

1 Type the password of the desired

level, and click [OK].

 If clicking [OK] without typing the password,

1 you enter the operation level 1.

2. Changing the password

2 Check off the desired level, and type

the new password.

3 Type it again for confirmation, and

2 2 2 click [OK].

 You cannot change the password of the level

higher than the current operation level.

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 NPM-DGS
2D Inspection Editor
4.1 Menu Bar

[Maintenance]: Operation
Explanation
Menu name icon
Saves the program log.
The operational status of the application software is stored in the program
[Save Program Logs] log. If any malfunctions occur, we may be able to identify the causes by
scrutinizing the program log. In such cases, we may ask you to save the
program log.

1 Select the log file to save.

 Depending on the problem, you may need to

restart. In such a case, save the log in the last
startup.

1
2 Specify a destination.

2
3 Click [Save].

[Maintenance]: Operation
Explanation
Menu name icon
The history of past errors is listed.
 For the 2D inspection editor, this error will not normally occur.

[Error Log]

The total time spent on using the 2D inspection editor is displayed.

[Hour Meter]

4-1017

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 NPM-DGS
2D Inspection Editor
4.1 Menu Bar

4.1.6 Help

[Help]: Operation
Explanation
Menu name icon
Displays the version information.

[Version Information]

EJS9AE-MB-04R-08 Page 4-9

 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

4.2 Pop-up Menu of Teach View

Right-clicking in the teach view on the edit screen opens the pop-up menu.
The contents of the pop-up menu vary depending on the selected target.

4.2.1 Pop-up Menu with Nothing Selected

When you right-click in the teach view with nothing selected, the [Data Edit] menu opens.
The contents are the same as those of the edit on the menu bar.
( ‘4.1.2 Edit (Data Edit)’)

4-1003

 If Set Edit Target is ‘APC Setting’, the pop-up menu is not shown.

4.2.2 Pop-up Menu with PCB Selected

When you right-click in the teach view with a PCB (clicking the outermost frame) selected, the
[Operations of PCB] menu opens. The menu varies according to the edit target inspection data.

4-2002 4-2003

When the selecting target is When the selecting target is ‘Solder

‘Component inspection’ inspection’

4-2038

When Set Edit Target is ‘APC Setting’

[Operations of PCB]: Operation

Explanation
Menu name icon
Using the PCB image read into the production data being edited, the
[PCB Inspection] inspection is performed on all the components on PCBs or all the solder
joints.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

 Inspect parts view result mode

1 When the confirmation message
appears, click [OK].

 The progress is displayed.

 The screen enters the inspection result

display mode.

 The list of the inspection results is displayed

on the list portion.

a) Selects inspection results you like to

display in the list.
c) b) a) ①OK: Shows the list of OK components
②NG: Shows the list of NG components
③OK&NG: Shows the list of both OK and
NG components
b) Debugs components selected in the
inspection result list
c) Carries out the whole PCB inspection
again

2 Click on the synchronize icon.

 With the synchronize icon turned ON, a

2 component selected in the teach view is
synchronized when you select a component.

 The teach view display is color-coded based

on the inspection result.

OK  Light-blue frame, NG  Red frame

3 Click on (View result mode end).

 The inspection view result mode ends, and it

3 returns to the standard edit screen.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

 Solder inspection view result mode

1 When the confirmation message
appears, click [OK].

 The progress is displayed.

 The screen enters the inspection result

display mode.

a)
 The list of the inspection result is displayed in
the list portion.

NG -> white characters on a red background

Warning -> Black characters on a yellow
background

a) The Inspect the Whole PCB is performed

again.

4-2007

2 Click on the synchronize icon.

 With the synchronize icon turned ON, a solder

2 selected in the teach view is synchronized
when you select solder.

 The teach view display is color-coded

based on the inspection result.

OK -> Light-blue frame

NG -> Red frame
Warning -> Yellow frame

3 Click on (View result mode end).

 The inspection view result mode ends, and it

3 returns to the standard edit screen.

 The result of the solder inspection performed

on the whole PCB is also displayed in the
items of ‘Inspection result’ on the solder data
list.

4-2007

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of PCB]: Operation

Explanation
Menu name icon
Displays the list of PCB image information on production data being edited
[Load Image] –
and loads a PCB image selected.

1 From among PCB image information

displayed on the list, select a PCB
image to be loaded.

 If you select a folder in which a PCB image file

1 is saved, click on [Browse] and select a folder
containing the PCB image file.

 Up to 64 characters can be entered in the

‘Comment’ field for your comment on each
4-2035 image.
2

2 Click [Open].

3 Click [Load].

4-2036

 Progress is displayed.

4-2037

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of PCB]: Operation

Explanation
Menu name icon
[Read Image] Loads the PCB image for the production data being edited.

1 Click [Refer to], and select the stored

image.

2 Click [Reading].
1

 The progress is displayed.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of PCB]: Operation

Explanation
Menu name icon
Saves the loaded image.
[Save Image]
Normally, it is not used.

1 Click [Refer to], and select the

destination.

2
1
2 Type a filename.

3 4 3 Select ‘Type.’

 When you select ‘Compressed,’ the save size

becomes small; however, it will take more
time to save or load.

4 Click [Save].

 The progress is displayed.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of PCB]: Operation

Explanation
Menu name icon
The binary LUT commonly used for the PCB is set.
In the component inspection the LUT of the PCB color is set.
[Set LUT] – The PCB LUT is used for the inspection for component presence or foreign
body.
You can set the LUT by changing the value of the existing one.
The LUT of the multiple values commonly used for the PCB is set.
[PCB LUT Setting
– In the solder inspection the LUT of the solder color is set.
[Solder] ]
This LUT is used for the solder inspection.

1 Select the set PCB LUT, and click

[LUT Setting].

 If necessary, you are free to change the

1 name.

 For [PCB LUT Setting], <LUT Setting

(Binary)> screen is displayed and <LUT
Setting (Multiple values)> screen is for [PCB
Page4-13-1
LUT Setting [Solder]].
1

2 Set the PCB LUT, and click [OK].

 For information about setting the LUT, see ‘3.

SETTING THE LUT.’

2
4-16-E

3 Click [OK] on the <PCB LUT Setting>

screen.

Page4-13-2

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of PCB]: Operation

Explanation
Menu name icon
This is a function to make a memo of lighting values for reference, when you
[Set Lighting] –
set the lighting values to be used in taking images for each component.

 To add a new memo

1 Click [Add], set necessary items to

the added row, and click [OK].

[Operations of PCB]: Operation

Explanation
Menu name icon
[Synchronize List] The PCB data is displayed on the list.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of PCB]: Operation

Explanation
Menu name icon
Sets the data about PCB.

[PCB data]

4-2016

‘Lot Number,’ ‘Lot Name,’ ‘Filter Setting’:

The information of production data is displayed.
 It cannot be changed by the 2D inspection editor.

[Advanced] ‘PCB’ (‘Size,’ ‘Coordinate Offset’), ‘The Origin’:

The information about PCB is displayed.
 It cannot be changed by the 2D inspection editor.

‘Shooting’:
The information about the image capture area is displayed.

‘Resolution’:
The resolution information is displayed.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of PCB]: Operation

Explanation
Menu name icon
[APC data]
Configuration information of the APC function is displayed.

4-2017

‘APC-FF’
‘Mount Control’: This is set to ON when you perform the APC-FF function
with the placement head.
‘Inspection Control’: This is set to ON when you perform the APC-FF
function with the inspection head.
‘Inspection Control (Other AOI)’:
[Advanced] This is set to ON when you perform APC-FF function with
another company’s component inspection machine. *Intended
for use by another companies’ AOI machines compatible with
this function.
‘Correct Mode’: Selects a correct mode.
‘Mean Value Application Shift Threshold in Corrections per Mount (mm)’:
Sets the limit value for the correction amount during corrections
per mount.
If the limit value is exceeded, the mean value will be applied.
‘Pattern Split Board Type’: Select Single Board.

‘APC-FB’
‘Print Control’: This is set to ON when you perform the APC-FB function for
the printer.
*Intended for use by solder paste printers compatible with
this function.

‘APC-MFB’
‘Mount Control’: This is set to ON when you perform the APC-MFB
function.

‘Inspect NG Skip‘
‘Skip Control’: This is set to ON when you perform a placement skip
because you have had a bad (NG) inspection result.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of PCB]: Operation

Explanation
Menu name icon
[Registration Status]:
The data count registered in production data is displayed.
 It cannot be changed by the 2D inspection editor.

4-2018

[Advanced]

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

4.2.3 Pop-up Menu with Scan Area Selected

With the scan area (click on the second-outermost frame) selected in the teach view, the [Scan
Area] menu is displayed by right-clicking. The menu varied depending on the edit target
inspection data.

4-2019 4-2020

When the selecting target is When the selecting target is ‘Solder

‘Component inspection’ inspection’

4-2039

When Set Edit Target is ‘APC Setting’

The description is the same as the Pop-up menu with PCB selected.
( ‘4.2.2 Pop-up Menu with PCB Selected’)

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

4.2.4 Pop-up Menu with Mark Selected

The mark data has no pop-up menu.

4.2.5 Pop-up Menu with Component Selected

When you right-click in the teach view with a component selected, the [Operations of Parts]
menu opens. The menu varies depending on the edit target inspection data.

A) When Inspect Parts is the edit target

4-2021

[Operations of Parts]: Operation

Explanation
Menu name icon
Carries out the inspection of selected components using the loaded PCB
[Debug Mode] image for the production data being edited. The screen enters the
component debug mode.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of Parts]: Operation

Explanation
Menu name icon
[Analyze Sample] Enters the sample analysis mode.

Saves the image of selected component in order to carry out the sample
[Save Image]
analysis.
Selects in the teach view a component whose component library is the same
[Select Same Library] –
as a component being selected.
[Select Same Circuit Selects in the teach view a component whose circuit No. is the same as a
–
No.] component being selected.
Sets the necessary data for inspection to the component data. The screen
enters the inspection condition setting mode.

Inspection condition setting mode:

The <Inspection Condition Detail Data> screen is displayed on the list.
If the ‘Name’ field is blank, no inspection conditions are set to this
component data.

[Inspection
–
Condition]

 For information about setting the inspection conditions, see ‘2.4

Component Inspection Setting (Setting Inspection condition Data)’
[Synchronize List] Lists the information of the components selected in the teach view.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of Parts]: Operation

Explanation
Menu name icon
[Component Details]
Displays the component-related information in the form of a list.

4-2023

‘Comment,’ ‘Component Library,’ ‘Mount Coordinates,’ ‘Mount Angle,’ and

‘Lead Count’: Information regarding mounting components is displayed.
 It cannot be changed by the 2D inspection editor.

‘Inspection’:
With this checked off, the inspection for components is carried out. (ON:
[Advanced]
Inspection executed, OFF: Inspection skipped)

‘Image’:
With this checked off, sample images of the specified component are saved
during production. (ON: Saved, OFF: Not saved)

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of Parts]: Operation

Explanation
Menu name icon
[APC Data]
Configuration information about the APC function is displayed.

4-2024

‘Mount Control Direction’: This is set to ON when you correct placement

coordinates.
‘Mount Control Direction (X /Y /Rotation)‘:
Selects ON/OFF for each correction item.
‘Placement Base‘: Selects the placement base.
‘Measured Target for Correction‘:
[Advanced] Specifies target components for correction amount
calculation.
‘Correct Rate (Electrode Direction /non-Electrode Direction /Angle
Direction)‘: Sets the ratio of the weighting amount to the correction amount.
‘Correction Limit (Electrode Direction /non- Electrode Direction /Angle
Direction)‘: Sets the limit value for the correction amount.
‘Offset (X/Y)‘: Sets the offset for the correction amount.
‘Correction per Mount‘: Sets components to be individually corrected in the
correction per pattern mode as well.
‘Land Measure Mode‘: ‘Standard’ is selected for the circuit pattern in contact
with the land, so that the circuit pattern area is
removed and the land’s center of gravity is corrected.
‘High speed’ is selected when you do not have to take
account of the implications of the circuit pattern, such
as when the circuit pattern is not in contact with the
land.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

[Operations of Parts]: Operation

Explanation
Menu name icon
[APC-MFB Data]
Configuration information about the APC-MFB function is displayed.

4-2024-2

‘Mount Control’: This is set to ON when you perform the APC-MFB function.
‘Measured Target for Correction‘: Specifies target components for correction
amount calculation.

'Precision Monitoring': Specify a component to monitor placement precision.

[Advanced]
[Link Data]
Information of the recognition mark used to perform the component
inspection is displayed.
 Link data is for reference only and is not subject to change.

4-2025

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

B) When the solder inspection is the edit target

4-2026

[Component]: Operation
Explanation
Menu name icon
Selects in the teach view the solder linked to a component being
[Select Link Solder] –
selected.
[Select Solder Linked to Selects in the teach view the solder linked to the same component
–
Same Part] as a component being selected.
Sets automatically the bridge area width of solder linked to a
component being selected. You can perform this operation on
components, such as IC components, which have multiple leads
in the same direction. The bridge area width can be set only if the
number of solder joints linked to components is more than or
equal to four.
[Set Bridge Area Width] –

4-2027

The same as the ‘Advanced’ of ‘A) When Inspect Parts is the edit
[Advanced] target.’
( ‘A) When Inspect Parts is the edit target’)

C) When Set Edit Target is ‘APC Setting’

4-2040

[Operations of part]: Operation

Explanation
Menu name icon
Selects the same part library as the selected part in the teach
[Select Same Library] –
view.
Selects the part having the same circuit number as the selected
[Select Same Circuit No.] –
part in the teach view.
Displays the part information selecting in the teach view in the list
[Synchronize List]
view.
The same as the ‘Advanced’ of ‘A) When Inspect Parts is the edit
[Advanced] target.’
( ‘A) When Inspect Parts is the edit target’)

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

4.2.6 Pop-up Menu with Solder Selected

With solder selected, the [Solder] menu can be displayed if right-clicking in the teach view.

4-2028

[Solder]: Operation
Explanation
Menu name icon
The inspection is performed on the selected solder, using the PCN image
[Solder Inspection] read into production data being edited. The screen transitions to the
solder debug mode.
[Analyze Sample] Transitions to the sample analysis mode.

[Save Image] To analyze the sample, the image of the selected solder is saved,
Information of the solder selected in the teach view is displayed in the list
[Synchronize List]
view.
Information regarding solder is displayed on the list.

[Advanced]

4-2029 4-2030

[Solder Data]
For more information on the setting, refer to the next page.

[Link Data]
Information of the recognition mark used to perform the solder inspection
is displayed.
 The link data is for reference only and is not subject to change.

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2D Inspection Editor
4.2 Pop-up Menu of Teach View

A) Setting Solder Details Data

1 Configure the respective settings, and

click on [OK].

 The editing result is reflected, and then the

<Solder Details Data> window is closed.

 For the setting items, refer to the following

table.

4-2029

Setting items for Solder Details Data

Item Description
(Information Solder No. A serial number of the selected solder
Display)  You cannot edit.
Pattern No. Indicates the pattern No. of components linked to the selected solder.
 You cannot edit.
Solder Name of the selected solder.
Position/Size Center Position The coordinates, size and shape of the selected solder are displayed.
X/Y  The center position cannot be edited.
Gravity Point  To inspect tilted shaped solder bridges, the editing of Size X/Y and
(Relative value) Angle may be required. ( ‘5.2.6 Solder Inspection’)
Size X/Y
Angle
Shape Type
Inspection Area The area of the mask opening section of the selected solder is
(Basic) displayed.
Bridge Area The inspection area, starting from the center position of solder, of the
bridge inspection is displayed.
To perform the bridge inspection, you are required to set any value
larger than half the solder data size in the direction in which the bridge
inspection is performed.
Resolution XY The resolution set to solder data is displayed.
 You cannot edit.
Judge Pattern The solder judgment data set to the selected solder is displayed.
No.
Inspection By turning ON the check button, the solder inspection is performed.
(ON: Start inspection, OFF: Skip inspection)
Image By turning ON the check button, the sample images of the specified
solder is saved during production. (ON: Save, OFF: Not save)
[Inspection (Advanced)] The Inspection screen is displayed by clicking.
[Set Lamp] The Set Lamp screen is displayed by clicking.

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

B) Setting solder inspection

1 Configure the respective settings, and

then click on [OK].

 The editing result is reflected, and the

<Inspection> window is closed.

 For the setting items, refer to the following

table.

4-2031

Setting items for inspection

Item Description
Inspection Area The area of the mask opening section of the selected solder is
(Basic) displayed.
Bridge Area Size The inspection area, starting from the center position of solder, of the
bridge inspection is displayed.
Resolution XY The resolution set to solder data is displayed.
 You cannot edit.
Judge Pattern No. The solder judgment data set to the selected solder is displayed.
Inspection By turning ON the check button, the solder inspection is performed.
(ON: Start inspection, OFF: Skip inspection)
Image By turning ON the check button, the sample images of the specified
solder is saved during production. (ON: Save, OFF: Not save)
[Inspection Solder Area Mask The method of the solder area mask for each side of solder is
(Advanced)] Up/Right/Down/Left displayed.
Select from among OFF/Cut/Filter.
The same mask processing is performed on the bridge inspection
area, which is overlapped with a solder area.
Apply the following processing to the area around solder (designated
area).
• OFF: no mask processing to be performed.
• Cut: Do not perform solder extraction processing.
• Filter: Perform solder extraction processing after smoothing
processing.
Bridge Inspection By turning ON the check button, the solder bridge inspection is
(Direction) performed in the specified direction. (ON: Start inspection OFF: Skip
Top/Right/Bottom/Left inspection)

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 NPM-DGS
2D Inspection Editor
4.2 Pop-up Menu of Teach View

C) Set Lamp
The inspection is usually performed with the default ‘Normal Lighting.’
Only if it is difficult to recognize any image taken by the Normal Lighting, the inspection is
performed by switching to the Individual Lighting.
The individual lighting, when used, should be used as little as possible because it increases the
frequency of the image taking and the processing time.

1 Click [Individual Lighting].

 The list for setting four lighting value is

displayed.

4-2032

2 Double-click the field in the Value to

change the lighting value and enter
the value.

3 After all items are set, click [OK].

 The <Set Lamp> window is closed.

2
4-2033
3

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 NPM-DGS
2D Inspection Editor
4.3 Details of Lists

4.3 Details of Lists

This section explains the lists on the edit screen in detail.

4.3.1 PCB List

When you select the [PCB] tab on the list, the PCB-related data are displayed.
Item Description
Lot No. Displays the lot No.
Lot Name Displays the lot name.
Filter Displays filter specification.
PCB Dim L [mm] Displays PCB L dimension (length).
PCB Dim W [mm] Displays PCB W dimension (width).
PCB Dim T [mm] Displays PCB T dimension (thickness).
Coordinate Off Set X [mm] Displays PCB origin offset (X).
Coordinate Off Set Y [mm] Displays PCB origin offset (Y).
Coordinate Origin Displays a coordinate standard.
(the standard right interior / standard right hand front / standard
left hand front / standard left interior)
Resolution XY in Scan Area Displays the resolution of the inspection head (18μm / 9μm).
[μm]
Scan Area Resolution Z [μm] Fixed at “Capture area synch.”
Scan Area Basic Point X [mm] Displays the coordinate (X) of the capture area base point (upper
left).
Scan Area Basic Point Y [mm] Displays the coordinate (Y) of the capture area base point (upper
left).
Scan Area Dim X [mm] Displays the capture area dimension (X).
Scan Area Dim Y [mm] Displays the capture area dimension (Y).
Pattern Count Displays the number of patterns.
Mark Count Displays the total number of marks (PCB and bad marks).
Solder Count Displays the number of solder pastes.
Component Count Displays the total number of components.
Land Count Displays the number of lands.
Solder Judgment Library Displays the number of solder judgment libraries.
Count
Component Library Count Displays the number of types of components.
Lighting Data Count Not used (always 0).
LUT Data Count Displays the number of entries of LUTs shared by all PCBs and
used for inspecting components.
LUT Data Num (Solder) Displays the number of entries of LUTs shared by all PCBs and
used for inspecting solder.
APC-FF Mount Control Displays APC-FF (a feature to correct placement coordinates
based on solder inspection results) setting status (ON / OFF).
Double-click to set it to ON / OFF.
APC-FF Inspect Control Displays APC-FF (a feature to correct the coordinates used for
inspecting components based on solder inspection results)
setting status (ON / OFF). Double-click to set it to ON / OFF.
APC-FF Inspect Control Displays APC-FF (a feature to correct the coordinates for other
(Other AOI) AOI based on solder inspection results) setting status (ON / OFF).
Double-click to set it to ON / OFF.
APC-FF Correction Mode Displays the coordinate correction mode of the APC-FF control
(Per mount / Per pattern / Per pattern – 2-point correction)
Double-clicking it will allow you to set the coordinate correction
mode.
APC-FF Mean Value Displays a limit value as to whether to apply the correction
Application Shift Threshold in amount calculated by the APC-FF. (Given that the average value
Corrections per Mount of the correction amount obtained per pattern is represented as a
median value, when it is not within the limits of the median value
plus or minus the limit value, the pattern average will be applied.)

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Item Description
APC-FB Control Displays the setting status of the APC-FB (feed-back of solder
inspection results to the printer) control as ON / OFF. Double-click
to set it to ON / OFF.
APC-MFB Mount Control Displays the setting status of the APC-MFB (a feature to correct
the placement coordinates based on component inspection
results) control as ON / OFF. Double-click to set it to ON / OFF.
Skip Control Displays the setting status of the skip control, which is designed
to skip component placement based on solder and component
inspection results, as ON / OFF.
Double-click to set it to ON / OFF.

 Pop-up menu at the PCB list

When you right-click on the list with the [PCB] tab selected, the [Operations of PCB (LIST)] menu
opens. The menu varies depending on the target inspection data to edit.

4-3001 4-3002

When the selecting target is When the selecting target is ‘Solder

‘Component inspection’ inspection’

4-3018

When Set Edit Target is ‘APC Setting’

The description is the same as the pop-up menu with PCB selected in the teach view. (Except for
the list synchronize)
( ‘4.2.2 Pop-up Menu with PCB Selected’)

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4.3.2 Mark List

When you select the [Mark] tab on the list, the mark-related data are displayed.
 The data cannot be added or edited by the 2D inspection editor.

Item Description
Pattern number / Sequence on When ‘Pattern No.’ is ‘PCB’ and ‘Sequence on pattern’ reads
pattern ‘A’/‘B,’ this mark data shows the mark for PCB recognition.
When ‘Pattern No.’ is ‘PCB’ and ‘Sequence on pattern’ reads ‘Bad
mark,’ this mark data shows the bad mark for the entire PCB.
When ‘Pattern No.’ is a pattern number, this mark data shows the
individual recognition mark or the bad mark for the corresponding
pattern only.
Comment The mark name is displayed.
Mark center coordinates X/Y The mark coordinates are displayed.
Link count The count of components or solder where this mark data is used is
displayed.
Misalignment amount X/Y The mark recognition result is displayed.

 Pop-up menu at the mark list

The mark list has no pop-up menu.

4.3.3 Mark Library List

When you select the [Mark Library] tab on the list, the mark-related data are displayed.
 The data cannot be added or edited by the 2D inspection editor.

Item Description
Mark type (L) / Mark type (S) The mark type is displayed.
Reference number The mark recognition reference number is displayed.

 Pop-up menu at the mark library list

The mark library list has no pop-up menu.

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4.3.4 Component List

When you select the [Parts] tab on the list, the component-related data are displayed.
 The data cannot be added by the 2D inspection editor.

Item Description
Pattern No. The pattern number is displayed.
Circuit No. The circuit number is displayed.
Component The corresponding component data name is displayed.
Functional class The corresponding functional class is displayed.
Number of Link Inspection The number of the inspection conditions set to the corresponding
Conditions component data is displayed.
Link Mark Count The number of the recognition marks to be used when the
component is inspected is displayed.
Resolution XY The resolution to capture a component image is displayed.
‘Synchronize capture area’ indicates that this resolution is the
same as that of the PCB capture area.
Inspection This is an execution flag of inspection.
The component unchecked is not targeted for inspection.
If a change has been made to the setting, perform optimizations
with DGS.
Image This is a flag to save the component image for sample analysis
during production.
Mount Coordinate X/Y The component placement coordinates are displayed.
Overall Dim L/W The size information of the corresponding component data is
displayed.
Mount Angle The component placement angle is displayed.
Land Count The land count in the corresponding component data is displayed.
Head The number of the head that places the component is displayed.
Feeder The number of the feeder where the component is located is
displayed.
Example) 20001: table No. 2 and feeder No. 1
Feeder Side Location in the appropriate feeder or tray is displayed.
Nozzle The number of the nozzle that places the component is displayed.
Example) 20001: head No. 2 and nozzle No. 1
APC-FF Mounter Control Switch for APC-FF’s mounting system control function.
ON: valid / OFF：invalid
APC-FF Control Direction The directions that make corrections involved in APC-FF are
-X/-Y/Angle displayed. Any direction of which the check box is checked is
targeted for correction.
APC-FF Placement Base The component placement base for APC-FF is displayed.
APC-FF Select Measured Part for Typical components to be measured when no APC correction per
Correction mount is performed in APC-FF are displayed. Any component of
which the check box is checked is targeted for measurement.
APC-MFB Mount Control Switch for APC-MFB’s mounting system control function.
ON: valid / OFF：invalid
APC-MFB Select Measured Part for Whether the component is targeted for the correction amount
Correction calculation involved in APC-MFB is displayed. Any component of
which the check box is checked is targeted for the calculation.
APC-MFB Precision Monitoring The component that is a target for monitoring placement precision
in APC-MFB is displayed. A component having marked on the
checkbox is a target.
APC-FF Result -X/-Y/Angle The correction result performed by APC-FF is displayed.

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 Pop-up menu at the component list

When you right-click on the list with the [PCB] tab selected, the [Operations of Parts (LIST)]
menu opens. The menu varies depending on the target inspection data to edit.

4-3004

4-3003

When the selecting target is for When the selecting target is for
‘Component inspection’ ‘Solder inspection’

4-3019

When Set Edit Target is ‘APC Setting’

The description is the same as the pop-up menu with components selected in the teach view.
(Except for the list synchronize)
( ‘4.2.5 Pop-up Menu with Component Selected’)

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4.3.5 Component Library List

When you select the [Parts Library] tab on the list, the component-library-related data are
displayed.
 The data cannot be added by the 2D inspection editor.
The component library in the 2D inspection editor means the component data with the necessary
data for inspection.

Item Description
Component The component data name is displayed.
Inspection Conditions Data Name Enter the inspection conditions data name to set for the
component data.
Functional class The functional class is displayed.
Pre-Mount Inspection Skip With this set to ON, pre-mount inspection is skipped.
Post-Mount Inspection Skip With this set to ON, post-mount inspection is skipped.
Presence / Position / Reverse / This is checked when any inspection items are set.
Polarity / Foreign Object
Overall Dim L / W The component data size is displayed.
Total Lead Count / Lead Count The lead count in the component data is displayed.
(Top) / Lead Count (Left) / Lead
Count (Bottom) / Lead Count (Right)
Number of Lead Type The lead type count in the component data is displayed.
Link Count The number of the components corresponding to the component
data is displayed.

 Pop-up menu at the component library list

Right-clicking on the list with [Component Library] tab selected displays [Component Library
(List)] menu.

4-3005

[Component Library
Operation
(List))]: Explanation
icon
Menu name
[Inspection Condition] – The inspection conditions setting for the selected component are applied.

The inspection conditions for the selected component are retained on the
[Copy Conditions] –
clip board.
The inspection conditions retained on the clip board are written over the
[Paste Conditions] –
inspection conditions for the selected component data.
The inspection conditions retained on the clip board are written over the
[Paste Special Conditions] – inspection conditions for the selected component data, specifying the
format.
Batch creation of the inspection conditions for the selected component is
[Auto Set]
started.
The inspection conditions data name of a component that is not
[Reset AutoSetError Flag] – automatically generated is displayed in a red color. By this function (reset
processing), it will return back to a normal display.

 If Set Edit Target is ‘APC Setting’, the pop-up menu is not shown.

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4.3.6 Solder List

When selecting the [Solder] tab on the list, data about solder is displayed.
 Data cannot be added with the 2D inspection editor.

Item Description
Pattern No./Solder name The solder information is displayed.
Inspection result The solder inspection result is displayed
Solder judge library name The solder judgment data name linking to the solder is displayed.
Link mark count The number of recognition marks used for solder inspection is
displayed.
Resolution XY The resolution to take the image of solder is displayed. ‘Scan area
synchronize’ indicates the same resolution as the resolution of the
PCB scan area.
Inspection Flag for the inspection performance.
The inspection is not performed on the solder of which the
checkbox is OFF.
Image Flag designed to save during production the solder image used for
the sample analysis.
Bridge Area The width of the solder bridge area is displayed.
Area The solder opening area is displayed.
Size X/Y The solder size is displayed.
Center Position X/Y The solder center coordinate is displayed.
Gravity X/Y The solder gravity (relative) is displayed.
Rotation Angle The solder rotation angle is displayed.

 Popup menu of the solder list

With the [Solder] tab selected, the [Solder (List)] menu is displayed once you right-click on the
list.

4-3006

The description is the same as the pop-up menu with solder selected in the teach view. (Except
for the list synchronize)
( ‘4.2.6 Pop-up menu with solder selected’)

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4.3.7 Solder Judge List

When selecting [Solder judge] tab on the list, data regarding the solder judge is displayed.

Item Description
Library name The name of the solder judgment data is displayed.
Link solder count The number of solder linking to the solder judgment data is displayed.
Metal mask thickness The design value of the solder height is displayed.
Inspection area extension size The area size (relative) to carry out solder inspection is displayed.
Comment The comment added to the solder judgment data is displayed.

 Pop-up menu of the solder judge list

With the [Solder Judge] tab selected, the [Solder Judge Library (List)] menu is displayed once
you right-click on the list.

4-3007

[Solder Judge Library

Operation
(List))]: Explanation
icon
Menu name
The selected solder judgment data is copied and new solder judgment
[Copy] –
data is created.

[Register] – New solder judgment data is created.

[Delete] The selected solder judgment data is deleted.

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[Solder Judge Library

Operation
(List))]: Explanation
icon
Menu name
[Set LUT] – LUT for the selected solder judgment data is set.

1 Select the [Set LUT] in the pop-up

menu.

1
4-3007
 The <Solder Judge LUT Data> screen is
displayed on the list view.

4-3008

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A) When adding LUT newly

2 Click [Add].

4-3008
 The <Select How to Add LUT> screen is
displayed.

3 Select the method for addition and

click [OK].

 When ‘Add LUT Common for All PCB

[Multivalue]’ is selected, the <LUT Setting for
for All PCB (Multivalue)> screen is displayed.
3

4-3009
3

4 Select the LUT to add and click [OK].

4-3010

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 If selecting ‘Create and Add LUT,’ the <LUT

Settings (Multivalue)> window is displayed.

5 Set the LUT and click [OK].

 About LUT setting, see ‘3. SETTING THE

LUT’.

4-3011
5

 The window returns to the <Solder Judge

Library LUT Data> window. LUT is added to
the LUT.

4-3012

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B) When changing the setting value of the existing LUT

The existing LUT can be changed.

2 Select the LUT to change and click、

[Change].

2
 The <LUT Settings (Mutivalue)> screen is
4-3012 displayed.

3 Set the LUT and click [OK].

 About LUT setting, see ‘3. SETTING THE

LUT’.

4-3013

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 The window returns to the <Solder Judge

Library LUT Data> window. The LUT setting
changes.

4-3014

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C) When deleting the existing LUT

2 Select the LUT to delete and click

[Delete].

4-3015

 The specified LUT is deleted.

4-3016

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[Solder Judge Library

Operation
(List))]: Explanation
icon
Menu name
[Advanced] Detailed settings for the selected solder judgment data is configured.

1 Select the solder judgment data to set

details and select [Advanced].

 The <Solder Judgment Library Details Data>

screen is displayed.

4-3007

2 Configure each setting and click on

[OK].

 Refer to the following table for the setting

items.

4-3017

Setting items for Solder Judgment Library Details Data

Item Description
(Information Lib No. The serial number of selected solder judgment data.
Display)  You are not allowed to edit the data.
Link Num The number of solder data linking to the selected solder judgment data.
 You are not allowed to edit the data.
Lib Name The name of the selected solder judgment data.
Comment The comment adding to the selected solder judge library.
Insp. Imp Area The inspection area expansion size for solder inspection is displayed.
Extend Size
LUT Set Count The number of LUT set in this solder judgment data.
 You are not allowed to edit the data.
Measure Mode The mode for measuring solder is displayed.
You can select either of ‘Area by Outline’ (Standard) or ‘Area by Outline
(Hollow).’
Judge Setting NG of judge information, Warning Lower, Warning Upper, or Judge flag is
displayed. The judge flag, the valid/invalid judgment of which is displayed
with the check box, can be switched by turning ON/OFF the check box.

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5. APPENDIX

This chapter describes mechanism of the lighting and the inspection.

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5.1 Lighting

5.1 Lighting
5.1.1 Outline
This subsection describes the lighting to be used for inspection.

Half mirror

Coaxial lighting 1 (Red)

Coaxial lighting 2 (White)

Inspection head

Lower lighting (White)

This machine has four kinds of lighting (coaxial lighting 1, coaxial lighting 2, middle lighting, and
lower lighting). It is possible to set the brightness for each lighting with values 0–255. When you
set 0 in brightness, this lighting turns OFF.

Normally, when the component is inspected, the view image is captured in RGB by the color
camera with its white LED light. Specifically, use the coaxial lighting 2, middle lighting, and lower
lighting and set 128 in brightness. For the coaxial lighting 1, turn it OFF (0 in brightness).
The light in the combination of white LED light and red LED light is used for solder inspection.
Particularly, the coaxial lighting 1 and the low-angle lighting are used for the light. Brightness of
the coaxial 1 light is set to 30, and the brightness of the low-angle lighting is set to 200. The
coaxial lighting 2 and middle-angle lighting shall be set to OFF (0 in brightness).

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5.2 Inspection Mechanism

Presence/absence inspection, position inspection, flip-over inspection, polarity inspection and
foreign body inspection are described.

5.2.1 Presence/Absence Inspection

Presence/absence inspection is an inspection item to judge whether a component is installed or not.

Components are judged by checking the color, which is previously registered in the inspection
parameter, within the BOX frame (rectangle).

BOX

1. There are two standard colors to extract the color within the BOX frame and
judgment is decided by the standard color.
1) To judge component presence/absence by PCB color
This is a judgment of when ‘PCB color’ is selected on ‘Algorism code’ in the inspection
parameter.
A PCB color is set to LUT (Look Up Table) in the inspection parameter. To set LUT, you shall
use the number registered in PCB LUT or create individual LUT.
Counting the ranges of PCB colors extracted within the BOX frame, a judgment is made.

OK NG
Judgment
PCB area ＜ Threshold PCB area ≧ Threshold

2) To judge component presence/absence by component color

This is a judgment when ‘Component color’ is selected on ‘Algorism code’ in the inspection
parameter.
Component color is set to LUT in the inspection parameter.
You shall create individual LUT to set LUT.
Counting the ranges of components colors extracted within the BOX frame, a judgment is
made.

OK NG
Judgment Component area ＞
Component area ≦ Threshold
Threshold

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2. Offset mode is available for XY coordinates of BOX frame

1) Offset ON mode
If ‘BOX coordinate offset’ in the inspection parameter is ‘ON’, the mode will change to offset
ON.
Based on the result of position inspection, coordinates is corrected so that a positional
relationship of component coordinates and BOX becomes the same. After that, the
component is inspected.
This mode is used in the case of inspection targeting on a color of a given range on a
component.
For example, as to a chip component, if a BOX frame is arranged to an electrode part, the
frame might be outside of the electrode due to component misalignment. To avoid this, turn
the offset mode ON.

BOX

2) Offset OFF mode

If ‘BOX coordinate offset’ in the inspection parameter is ‘OFF’, the mode will change to offset
OFF.
Inspection is carried out by BOX coordinates which has been registered in the inspection data.
This mode is used for the following case ① or ②.
① Inspection of a component, a target range of which is much larger than the BOX frame. In
such a case, even as a component is misaligned, the frame will not be out of the target
range.
② A component inspected by color extraction from a specific range of PCB. Here is an
example; on one hand, a component which body color is black (e.g. package) is difficult to
distinguish from a PCB because it has the same color as a non-resist range of a PCB, but
on the other a PCB has some part which makes it clear to distinguish from a component
with the help of such as a resist existence range and a PAD range of a PCB.

BOX

BOX

Example ① Example ②

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5.2.2 Position Inspection

Position inspection is an inspection item to judge whether placement coordinates and angles are correct
or not.

1. Summary
To find the component on an image, recognition is carried out by the means of the template
matching as a basic method.
Template matching is to register target (component) data that can be picked out of the previously
captured image as a template. Then, the data identical to the template is searched through the
captured image. Whether it is same as a template or not is decided by a evaluation value. The
value is 100% if data is same, whereas it is 0% if it is totally different. The highest evaluation
value among found components will be determined as component existence coordinates.

Template

Captured image

During 2D component inspection, template matching is carried out with considering component
rotation, and then component placement position and angle are decided.

2. Template data
NPM component inspection uses the own template Pivot
matching algorism. (PSM: Parts Shape Matching).
Feature of PSM is in the template data.
While general template matching uses captured
image data to register as template and matching is
carried out for a next captured image, PSM creates
template using the pivot set, which is combination of
several arrow shaped pivots. And making the pivot
set as template tries to increase recognition accuracy Designピボットセット
value of component shape
and decease process time.

3. Pivot
Pivot has length and direction. It is composed of two values providing data to show that a pivot is
brighter from the tip to the middle point while it is darker from the middle point to the end. The
pivot set is created to recognize a component by arranging the pivots to the location where the
boundary line between a component and PCB, and where brightness clearly changes (edge).
For example, in the case of template of chip component, if a chip component placed on the PCB
is captured, an electrode is brighter and the cream solder area under the electrode is darker than
the electrode. For that reason, pivots are arranged on the electrode area.

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4. Search area
Area to search on a component (search area) by moving template is within a range that
‘Component misalignment judgment value’ and ‘Recognition area offset’ are added to the outline
of the component.
Although there are two values for component misalignment judgment (warning value and NG
value), the smaller set value is used.

Search area

Component misalignment
judgment value Y

Recognition area offset

Component misalignment Recognition area offset

judgment value X

5. Search step
Step to move template (search step) is performed, changing in stages.
First of all, the evaluation value of each coordinate is calculated, moving pivots at the set value of
‘Search step XY’ in the inspection parameter.
Secondary, coordinates that have acquired a high evaluation value is determined within search
area, and several search base points are determined as next search coordinates.
Then, the search step is changed to half of the last step and the evaluation values of nine points
around several search base points determined above are calculated. Among all the evaluation
values, coordinates that have acquired a high evaluation value are determined and a number of
the next search base points are determined.
You will repeat this procedure until search step becomes one. Coordinates with the highest
evaluation values (including angle) within search step one will be determined as a component
coordinates.
The illustration below is the case in which the step starts at search step is ‘2’
First of all, the evaluation value is calculated at points. Coordinates with the high evaluation
values are determined, and next search base points are determined.
Next, the evaluation values of coordinates around nine points ( ) are calculated, and A
component placement position and an angle of coordinate with the highest evaluation value
are determined.

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6. Size change
An electric component size changes within tolerance. By inputting the amount of size change in
the inspection parameter to handle this size change, a template size can be scaled according to
the amount of change, and so matching process is carried out.
Specifically, given that all pivots belong to two groups, a component size of a template can be
scaled by changing the distance between these two groups. (The distance between pivots within
the same group and the pivot sizes are not changed.)
Size change is performed by configuring the settings for four inspection parameters; ‘Size
change Xmin’, ‘Size change Xmax’, ‘Size change Ymin’, and ‘Size change Ymax.’

Grouping of pivots divides a template into one adapted for one axis change and the other
adapted for two axes change. However, grouping does not necessarily decide whether a
template is to be one axis or two axes changes. The deciding factor is four parameters. Set 0 to
either ‘Size change Xmin’ and ‘Size change Xmax’ or ‘Size change Ymin’ and ‘Size change
Ymax’ in order to carry out the matching process with one axis change.
Two axes change is recommended, but it depends on components, some of which will be suited
for one axis variation.
Because the vertical and horizontal scaling directions of a template are automatically judged
based on a group central coordinate of grouped pivots, you need to group that the relation
between the two groups makes clear. Be careful with that each group does not move as you
intend if vertical and horizontal directions are not clear.

 Example of grouping for two axis change

Size change direction (Group 2)

Group 2

Pivots

Group 1
Size change direction (Group 1)

 Example of grouping for one axis change

Size change direction (Group 1) Group 2

Pivots

Size change direction (Group 2)

Group 1

 When parameters are set for two axes change, a size may change in a direction the reverse of
the assumed one because it is not clear in scaling process which group moves up or down in a
vertical direction. So, be careful.

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7. Details of pivot creation procedure

1) The pivot set is created by setting the several arrow shape lines called pivots.
2) Pivot is grouped into two. The set pivot must belong to a group.
3) Pivots are arranged to the location where brightness changes on an image.
They are arranged to the component boundary position of the dimension design value. The
center of pivot this time is adjusted to the boundary line.
4) As for a component that the lead part (electrode) can be checked on an image, pivot is
arranged on the lead.
It is because the lead part (electrode) is brighter than other parts while cream solder around it
is darker. It is suitable for recognition. For a component which does not see the lead, pivots are
arranged to the location where brightness is different between a component and PCB.
5) The direction of pivots is based on that an arrow points to a direction that becomes brighter.
This means the pointing direction of the arrow is bright. Note that if you set reversely, you
might fail to recognize an image.
6) Two pivot sets are necessary for one component; one for rough recognition and one for
precise recognition. Difference of these two data is basically pivot length. Normally, pivots
created for rough recognition is copied and used for precise recognition but pivot size of the
one for rough recognition is middle (M) and the one for precise recognition is small (S).
7) Up to three pairs of pivot sets can be registered for rough recognition and precise recognition.
They are registered for the use that component size is changed frequently so that it is hardly
supported for only one shape. How to work is that first of all, a registered shape in the master
is used for recognition, and if the evaluation value is smaller than threshold, the sub 1 or the
sub 2 shape is used for recognition. In case that the sub 1 or the sub 2 data is used frequently,
recognition process time takes longer.
8) Example of data (1005C)

Pivot set for rough recognition Pivot set for precise recognition
(Pivot size: Middle (M) ) (Pivot size: Small (S) )

8. Step Search
Step search performs two –step search during component recognition.
In the first step, a component is searched within the limited search angle. Use ‘Default search
angle for step search’ parameter for limiting a search angle. If a component whether to correctly
placed or not in the first step is judged as OK, search is ended. Use ‘Default search threshold for
step search’ parameter for judging whether a component is correctly placed or not. The higher
value must be set for the default search threshold. If you set the smaller value, a component is
judged as OK even if it is not correctly placed. Therefore, carefully set the value.
Because many components are placed on the correct position, this step search reduces the
inspection time.
Only if a component is not found in the first step, perform the second step that all angles are
searched like original inspection.

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5.2.3 Inspection of Flip-over

Inspection of flip-over is an inspection item to judge whether sides of a component are installed correctly
or not.

Inspection of flip-over is judged by checking the color, which is previously registered in the inspection
parameter, within the BOX frame (rectangle).

BOX

Reverse side color of a component is set to LUT in the inspection parameter.

You shall create individual LUT.
Counting the ranges of the extracted reverse side color of the component within the BOX frame, judgment
is made.

OK NG
Judgment Component reverse area ＜ Component reverse area ≧
Threshold Threshold

BOX coordinates are offset to be always in the same position relation as component coordinates based
on the result of position inspection, and color inspection is carried out after offset.

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5.2.4 Polarity Inspection

Polarity inspection is an inspection item to judge whether a component is installed with correct polarity
or not.

1. Type
There are two inspection methods for polarity inspection.
1) Polarity inspection (standard mode)
2) Polarity inspection (search mode)

1) Polarity inspection (standard mode)

Checking the color of BOX (rectangle) which is registered in the inspection parameters in
advance enables to judge a polarity condition of a part.

 There are three types; 1BOX containing one box frame, 2BOX containing two box frames and 4BOX
containing four box frames. A BOX frame set in the polarity range is set as a standard BOX. If
polarity is extracted inside of the standard BOX, it is judged as correct.

1 BOX 2 BOX 4 BOX

Standard

Standard
Standard

2) Polarity inspection (search mode)

The search mode is that standard mode inspection is performed repeatedly by moving within
the search area and a polarity condition of parts are judged by the maximum value. In the
2BOX and 4BOX, the box frames are moved in such a manner that they are in the same
relative position.

 There are three types; 1BOX (Search) containing one box frame, 2BOX (Search) containing two box
frames and 4BOX (Search) containing four box frames (In the figure below, dotted lines are the
search area).

1BOX (Search) 2BOX (Search) 4BOX (Search)

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2. Judgment method
There are two criteria to make judgment. They are same under standard mode and search mode.
(For search mode, the maximum value is used for judgment.)
1) To judge directly by the area ratio within extract range
This is judgment of when ‘Direct judgment’ is selected on ‘‘Algorism code’ in the inspection
parameter.
2) To judge by the area ratio after calculating the ratio of the extract ranges in two Boxes.
This is judgment of when ‘Comparative judgment’ is selected on ‘‘Algorism code’ in the
inspection parameter.

1. 1 BOX frame
Method OK NG
Polarity
1 Direct Area ＞ Threshold Area ≦ Threshold
undetected
2 Comparative Not used because of only one BOX

2. 2 BOX frame: (Extract area of standard BOX frame as area 1)

Method OK NG
Area1 ≦ Threshold and Polarity
Area 1 ＞ Threshold Area2 ≦ Threshold undetected
1 Direct and
Area2 ≦ Threshold Area1 ＞ Threshold and Judgment
Area2 ＞ Threshold impossible
Area1 ≦ Threshold and
No polarity
Area2 ≦ Threshold
Area1 ＞ Threshold or
Polarity
Area2 ＞ Threshold, and
defect
Area1 ＞ Threshold Area1 ＜ Area2
2 Comparative and Area1 ＞ Threshold or
Area1 ＞ Area2 Judgment
Area2 ＞ Threshold, and
impossible
Area1 ＝ Area2 ≠ 0
Area1 ＞ Threshold or
Area2 ＞ Threshold, and Polarity
undetected
Area1 ＝ Area2 ＝ 0

3. 4BOX frame: (Extract area of standard BOX frame as area 1.Number in a

counterclockwise direction)
Method OK NG
Polarity
All BOX area ≦ Threshold
undetected
Equal to or more than two Judgment
BOXes area ＞ Threshold impossible
Area1 ＞ Threshold and
Area2 ≦ Threshold and Area2 ＞ Threshold and
1 Direct except area 2 ≦ Threshold
Area3 ≦ Threshold and
Area4 ≦ Threshold Area3 ＞ Threshold and Polarity
except area 3 ≦ Threshold defect
Area4 ＞ Threshold and
except area 4 ≦ Threshold
① Area1 ＞ Threshold and ② All BOX area ≦ Threshold Polarity
Area 1 ＞Area 3 and undetected
2 Comparative
(Area 1/Area 3) ＞ Polarity
Other than ① and ②
(Area 2/Area 4) defect

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5.2.5 Foreign Body Inspection

Foreign body inspection is an inspection item to judge whether foreign body (scattered chips) occurs
before components are loaded.

Foreign body (scattered chips) existence is judged by checking the color, which is previously registered
in the inspection parameter, within the BOX frame (rectangle). Judgment is carried out with respect to
each mesh that divides a BOX frame into tiles.

BOX

Mesh

1. There are two standard colors to extract the color within the BOX frame and
judgment is decided by the standard color.
1) To judge component presence by PCB color
This is judgment of when ‘PCB color’ is selected on ‘Algorism code’ in the inspection
parameter.
Judgment is carried out with respect to each mesh.

OK NG
Judgment
PCB area ＜ Threshold PCB area ≧ Threshold

2) To judge foreign body occurrence by foreign body color

This is judgment of when ‘Foreign body color’ is selected on ‘Algorism code’ in the inspection
parameter.
If “Foreign body color” is equal to or larger than “Threshold”, it is judged as NG.

OK NG
Judgment Foreign body area ＞ Foreign body area ≦
Threshold Threshold

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5.2.6 Solder Inspection

Solder inspection is an inspection item to judge whether a printing area, a printing position and a
printing shape are correct, and whether adjacent solder bridge exists or not.

Blur and overflow judgment

The difference (area ratio) between the measurement value of the solder data area (s1) and the
area (s2) is compared with each threshold value. The design value in the set value of the area
(s1) is automatically set by the gerber converter.
Area ratio : s2 ÷ s1 x 100 (%)

s1
s2

Blur
Judge OK NG
Condition Area ratio ＞ Threshold Area ratio ≦Threshold

Overflow
Judgment OK NG
Condition Area ratio ＜ Threshold Area ratio ≧ Threshold

1. Misjudgment
The difference (dx, dy in the figure below) between the solder centriod position of the solder data
and solder centriod measurement result is compared with the threshold value.

dy

dx

Judgment OK NG
Condition dx(dy) ＜ Threshold dx(dy) ≧ Threshold

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2. Abnormal judgment (rectangle size)

Based on the circumscribed rectangle of width (W) and length (L) of the solder data in the
measurement result,
The maximum value calculated by
Equation: ｜(Length (L) － l )｜ × 100 ÷ Length (L) and
Equation: ｜(Width (W) － w)｜ × 100 ÷ Width (W)
is compared with the threshold value.
Length (L)

Width (W)
w

Judgment OK NG
Calculated value ＜ Calculated value ≧
Condition
Threshold value Threshold value

3. Bridge judgment
The tolerance bridge length of the solder data is compared with the measurement result of the
bridge length.

Bridge length

Judgment OK NG
Bridge measurement length Bridge measurement length
Condition
＜ tolerance bridge length ≧ tolerance bridge length

The measurement area is configured around solder data (in all directions from the edge of the
solder data). The range of the measurement area can be extended vertically and horizontally as
far as bridge area widths. If bridge area width in either direction (vertical or horizontal) is smaller
than solder data in size, the measurement area cannot be configured in that direction. Bridge
inspection is used to detect the bridge defect of solder adjacent to the lead part of, for example,
IC. In doing so, the distance (width) to the next solder (lead pitch) should be set to the bridge
area width.

Measurement Bridge area width

area

Lead pitch width

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Because the measurement area is configured on the right, left, top and bottom of solder data, a
bridge is rejected (NG) in bridge inspection if another solder, not subject to measurement, is
included in solder data. To conduct bridge inspection in such a case, you are required to turn
OFF (Bridge inspection in the OFF position) the check button for the ‘NG’ direction in the bridge
inspection (direction) settings for solder inspection settings for solder detailed data settings.

Bridge NG

When a component is placed on PCB in a tilted position, as is the case with the tilted component,
the solder involved is likely to be printed tilted. For this type of solder, the gerber converter is
used to create solder data about the shape circumscribed to tilted solder. In conducting the
bridge inspection of this solder data, any bridge measurement area cannot be set based on tilted
solder, so the adjacent solder may be misdetected as a bridge (Figure A1 below).
To inspect the bridge of tilted solder, adjust the solder data setting for Angle and Size X/Y in tune
with the solder shape (Figures B1 and B2 below). Adjusting the angle and size of solder data
allows you to set the bridge measurement area based on tilted solder and thereby conduct
appropriate bridge inspection.
For more information on the editing of Angle and Size X/Y of solder data, refer to ‘4.2.6 Pop-up
Menu with Solder Selected’.

Solder data

(A1)
Bridge
inspection Bridge NG

(B1)
Angle adjustment

(B2) (B3)
Size X/Y Bridge
adjustment inspection

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= MEMO =

Page 5-16 EJS9AE-MB-05R-04

Notice
The contents of this document are subject to
change without prior notice.

COMMOE-BC-17F-00
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